Blade polishing device based on efficient layout

Abstract

The utility model discloses a kind of blade grinding and polishing device based on efficient layout, including detection device, tray, first processing device, second processing device, bottom plate and manipulator, bottom plate is the plane board placed on ground, detection device, tray, first processing device, second processing device and manipulator are all set on bottom plate, first processing device is surface grinding and polishing device, second processing device is linear grinding and polishing device, first processing device, second processing device, tray and detection device are set around manipulator in C shape, first processing device and second processing device are adjacent, manipulator tray rotation angle is less than or equal to 180 degrees, second processing device is not adjacent with detection device, detection device is optical detection device, the distance from manipulator to tray is less than the distance from detection device to manipulator, the number of second processing device station is set greater than the number of first processing device station.

Description

Technical Field

[0001] This utility model relates to the field of parts processing, and in particular to a blade grinding and polishing device based on an efficient layout. Background Technology

[0002] Currently, my country still relies on traditional manual grinding and polishing methods for blade production, which are time-consuming, have low capacity, and produce low precision. Manual grinding also suffers from poor quality control and high labor intensity. These problems result in low precision, low capacity, and insufficient performance in my country's blade production, severely hindering the industry's development. Compared to traditional processing methods, using industrial robots combined with automatic belt sanders for blade grinding and polishing offers advantages such as strong versatility, easy expansion, high flexibility, and low cost, making it an advanced form of blade processing.

[0003] Since conventional robotic manual positions are often arranged in a ring based on the robotic arm operating position, the center of gravity of the robotic arm will shift significantly under long-term reciprocating rotation, which may cause a decrease in accuracy. At the same time, excessive rotation often reduces the lifespan of the robotic arm.

[0004] Based on the above problems, a blade grinding and polishing device with an efficient layout is needed to solve these problems. Utility Model Content

[0005] This invention addresses the problem that in existing technologies, conventional mechanical manual positions are often arranged in a circular pattern based on the robot's operating position. This leads to a significant shift in the robot's center of gravity during long-term reciprocating rotation, potentially causing reduced accuracy. Furthermore, excessive rotation often reduces the robot's lifespan. The invention provides a blade grinding and polishing device based on an efficient layout, employing a C-shaped arrangement to solve these problems.

[0006] This utility model provides a blade grinding and polishing device based on an efficient layout, including a detection device, a material tray, a first processing device, a second processing device, a base plate, and a robot arm. The base plate is a flat plate placed on the ground, and the detection device, material tray, first processing device, second processing device, and robot arm are all mounted on the base plate. The first processing device is a surface grinding and polishing device, and the second processing device is a linear grinding and polishing device. The first processing device, the second processing device, the material tray, and the detection device are arranged in a C-shape around the robot arm. The first processing device and the second processing device are adjacent to each other. The rotation angle of the robot arm chassis is less than or equal to 180 degrees. The second processing device and the detection device are not adjacent to each other. The detection device is an optical detection device. The distance from the robot arm to the material tray is less than the distance from the detection device to the robot arm. The number of workstations in the second processing device is greater than the number of workstations in the first processing device.

[0007] In a preferred embodiment of the blade polishing device based on a high-efficiency layout described in this utility model, the second processing device consists of a pair of polishing wheels. The polishing wheels are arranged in pairs, and the two polishing wheels have different removal rates. The distance between the polishing wheel with a higher removal rate and the installation position of the robot arm is greater than the distance between the polishing wheel with a lower removal rate and the installation position of the robot arm.

[0008] The blade polishing device based on a high-efficiency layout described in this utility model, in a preferred embodiment, comprises a first processing device consisting of a fixed polishing head, a rotating polishing head, two support columns, and four tensioning wheels. The fixed polishing head is a plate structure, and the rotating polishing head is a roller structure. Both the fixed and rotating polishing heads are located at one end of the support columns, which extend beyond the side line of the support frame. The tensioning wheels are located on both sides of the mounting end of the support columns, symmetrically arranged on the surface of the support frame with the axis of the support columns as the center of symmetry. Two rings of sanding belt are respectively located on the surface of the fixed and rotating polishing heads and are tensioned by the tensioning wheels.

[0009] In the blade polishing device based on a high-efficiency layout described in this utility model, as a preferred embodiment, the number of workstations and the removal rate of the second processing device are both even multiples of the number of workstations and the removal rate of the first processing device.

[0010] The beneficial effects of this utility model are as follows: This device positions the grinding and detection ends at the farthest points of the operating position, using a C-shaped layout to confine the robot's working area to one side. This ensures reduced wear and tear and extends the robot's lifespan, while allowing the operator to effectively observe and monitor the robot, making it easier to identify problems and minimizing the reduction in workpiece precision caused by issues arising from the robot's active operation.

[0011] Simultaneously, based on the number of workstations, linear machining and surface machining, two processes with different intensities, are alternated, ensuring production cycle time while preventing the robotic arm from entering a state of constant fatigue. This mitigates the development of metal fatigue. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a blade grinding and polishing device based on an efficient layout. Figure 2 This is a schematic diagram of the first processing device of a blade grinding and polishing device based on an efficient layout.

[0013] Figure label: 1. Detection device; 2. Material tray; 3. First processing device; 31. Fixed polishing head; 32. Rotating polishing head; 33. Support column; 34. Tensioning wheel; 4. Second processing device; 5. Base plate; 6. Robot arm. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0015] Example 1 like Figure 1 As shown, a blade grinding and polishing device based on an efficient layout includes a detection device 1, a material tray 2, a first processing device 3, a second processing device 4, a base plate 5, and a robot arm 6. The base plate 5 is a flat plate placed on the ground. The detection device 1, material tray 2, first processing device 3, second processing device 4, and robot arm 6 are all mounted on the base plate 5. The first processing device 3 is a surface grinding and polishing device, and the second processing device 4 is a linear grinding and polishing device. The first processing device 3, the second processing device 4, the material tray 2, and the detection device 1 are arranged in a C-shape around the robot arm 6. The first processing device 3 and the second processing device 4 are adjacent to each other. The rotation angle of the chassis of the robot arm 6 is less than or equal to 180 degrees. The second processing device 4 is not adjacent to the detection device 1. The detection device is an optical detection device 1. The distance from the robot arm 6 to the material tray 2 is less than the distance from the detection device 1 to the robot arm 6. The number of workstations in the second processing device 4 is greater than the number of workstations in the first processing device 3.

[0016] The second processing device 4 consists of a pair of polishing wheels. The two polishing wheels have different removal rates. The distance between the polishing wheel with a higher removal rate and the installation position of the robot arm is greater than the distance between the polishing wheel with a lower removal rate and the installation position of the robot arm.

[0017] like Figure 2 As shown, the first processing device 3 consists of a fixed polishing head 31, a rotating polishing head 32, two support columns 33, and four tensioning wheels 34. The fixed polishing head 31 is a plate structure, and the rotating polishing head 32 is a roller structure. Both the fixed polishing head 31 and the rotating polishing head 32 are located at one end of the support column 33. The support column 33 extends out of the side line of the bracket and is located on the bracket. The tensioning wheels 34 are located on both sides of the mounting end of the support column 33 and are symmetrically arranged on the surface of the bracket with the axis of the support column 33 as the center of symmetry. The two rings of sanding belt are respectively located on the surface of the fixed polishing head 31 and the rotating polishing head 32 and are tightened by the tensioning wheels 34.

[0018] The number of workstations and the removal rate of the second processing device 4 are both even multiples of the number of workstations and the removal rate of the first processing device 3.

[0019] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A blade grinding and polishing device based on a high-efficiency layout, characterized in that: The system includes a detection device (1), a material tray (2), a first processing device (3), a second processing device (4), a base plate (5), and a robot arm (6). The base plate (5) is a flat plate placed on the ground. The detection device (1), the material tray (2), the first processing device (3), the second processing device (4), and the robot arm (6) are all mounted on the base plate (5). The first processing device (3) is a surface polishing device, and the second processing device (4) is a linear polishing device. The first processing device (3), the second processing device (4), the material tray (2), and the detection device (1) are arranged in a C-shape around the robot (6). The first processing device (3) and the second processing device (4) are adjacent to each other. The rotation angle of the chassis of the robot (6) is less than or equal to 180 degrees. The second processing device (4) and the detection device (1) are not adjacent to each other. The detection device is an optical detection device (1). The distance from the robot (6) to the material tray (2) is less than the distance from the detection device (1) to the robot (6). The number of workstations of the second processing device (4) is greater than the number of workstations of the first processing device (3).

2. The blade polishing device based on a high-efficiency layout according to claim 1, characterized in that: The second processing device (4) is a pair of polishing wheels. The polishing wheels are arranged in pairs. The two polishing wheels have different removal rates. The distance between the polishing wheel with the higher removal rate and the installation position of the robot (6) is greater than the distance between the polishing wheel with the lower removal rate and the installation position of the robot (6).

3. The blade grinding and polishing device based on a high-efficiency layout according to claim 1, characterized in that: The first processing device (3) consists of a fixed polishing head (31), a rotating polishing head (32), two support columns (33), and four tensioning wheels (34). The fixed polishing head (31) is a plate structure, and the rotating polishing head (32) is a roller structure. Both the fixed polishing head (31) and the rotating polishing head (32) are located at one end of the support column (33). The support column (33) extends out of the side line of the bracket and is located on the bracket. The tensioning wheels (34) are located on both sides of the mounting end of the support column (33) and are symmetrically arranged on the surface of the bracket with the axis of the support column (33) as the center of symmetry. The two rings of sanding belt are respectively located on the surface of the fixed polishing head (31) and the rotating polishing head (32) and are tightened by the tensioning wheels (34).

4. The blade grinding and polishing device based on a high-efficiency layout according to claim 1, characterized in that: The number of workstations and the removal rate of the second processing device (4) are both even multiples of the number of workstations and the removal rate of the first processing device (3).

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