Polishing device for processing of a grading ring

Abstract

The utility model discloses a kind of polishing treatment devices for equalizing ring processing, including polishing platform, the front side of polishing platform is equipped with control panel, the right side of polishing platform top is equipped with polishing assembly, the left side of polishing platform top is equipped with press-down component, the inside of polishing platform is equipped with positioning mechanism, including: positioning assembly in positioning mechanism, including the positioning slide rail of installation in polishing platform inner chamber bottom, the surface of the positioning slide rail is slidably connected with sliding block, the utility model relates to equalizing ring processing technical field.The polishing treatment device for equalizing ring processing is provided with positioning mechanism, sliding block is driven by driving assembly to slide, positioning slide rail is guided to slide limit to sliding block, to ensure the stable sliding of positioning roller, the position of three groups of positioning rollers is adjusted synchronously, the positioning requirement of different diameter equalizing ring can be self-adapting, so that the polishing treatment device is more practical.

Description

Technical Field

[0001] This utility model relates to the field of pressure equalizing ring processing technology, specifically a polishing device for pressure equalizing ring processing. Background Technology

[0002] The reference patent title is: A Polishing Machine for a Pressure Equalizing Ring (Authorization Announcement No.: CN208514297U, Authorization Announcement Date: 2019.02.19). This device includes a rotating component connected to a rotating mechanism. The rotating component is connected to a polishing component via connecting rods. At least two connecting rods are provided, evenly distributed on the side of the rotating component, for fixing the pressure equalizing ring to be polished. The polishing component includes two semi-circular arc plates, which are bolted together to form a hollow tubular body. A polishing component for polishing is provided inside the tubular body. Due to the presence of the two semi-circular arc plates and their connection to the tubular body, the polishing component is pressed onto the surface to be polished. Furthermore, due to the cooperation between the rotating mechanism and the polishing component, the polishing component moves along the pressure equalizing ring, thereby polishing the pressure equalizing ring.

[0003] Based on the above-mentioned documents: As an important hardware component in power systems, the surface finish of the equalizing ring directly affects its insulation performance and service life. Therefore, polishing is a key process in the processing of equalizing rings. However, equalizing rings are mostly ring structures, and traditional positioning devices are difficult to adapt to different diameter specifications and lack pressing components. They are prone to displacement during the polishing process, resulting in uneven polishing of the equalizing ring surface and affecting the polishing quality. Therefore, this utility model provides a polishing device for processing equalizing rings. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a polishing device for processing equalizing rings, which solves the problems of poor adaptability and unstable positioning of traditional polishing devices, thus affecting polishing quality.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a polishing device for processing equalizing rings, comprising a polishing table, a control panel on the front side of the polishing table, a polishing component on the right side of the top of the polishing table, a pressing component on the left side of the top of the polishing table, and a positioning mechanism inside the polishing table, the positioning mechanism comprising:

[0006] The positioning assembly includes a positioning slide rail installed at the bottom of the inner cavity of the polishing table, a sliding block slidably connected to the surface of the positioning slide rail, a shelf fixedly connected to the top of the sliding block by a connecting rod, and a positioning roller rotatably connected to the top of the shelf.

[0007] The drive assembly, located at the bottom of the polishing table, is used to drive the sliding block to slide along the positioning slide rail, thereby driving the positioning roller to move synchronously.

[0008] Preferably, the drive assembly includes a drive motor mounted on the bottom of the polishing table, the output end of the drive motor extending into the inner cavity of the polishing table and fixedly connected to a drive plate, a drive rod rotatably connected to the surface of the drive plate, and one end of the drive rod rotatably connected to one side of the sliding block.

[0009] Preferably, the top of the polishing table is symmetrically and rotatably connected to multiple sets of guide rollers, which are driven to rotate by a micro motor, which is mounted on the top of the polishing table.

[0010] Preferably, the pressing assembly includes a support plate installed on the left side of the top of the polishing table. A drive cylinder is fixedly connected to the center of the top of the support plate. A connecting plate is fixedly connected to the output end of the bottom of the drive cylinder. A pressing plate is fixedly connected to the bottom of the connecting plate. Multiple sets of pressing rollers are rotatably connected to the bottom of the pressing plate.

[0011] Preferably, the top of the connecting plate is fixedly connected with a symmetrical limiting rod, the surface of the limiting rod is slidably connected to the inside of the support plate, and the number of the lower pressure roller and the guide roller are the same and aligned vertically.

[0012] Preferably, the polishing assembly includes a polishing cylinder mounted on the top of the polishing table. The output end of the polishing cylinder is fixedly connected to a disassembly plate, and the top of the disassembly plate is fixedly connected to a polishing plate by bolts. The polishing plate is used to polish the surface of the equalizing ring.

[0013] This invention provides a polishing device for processing equalizing rings. Compared with the prior art, it has the following advantages:

[0014] 1. The polishing device for processing equalizing rings is equipped with a positioning mechanism. The drive component drives the sliding block to slide, and the positioning slide rail guides and limits the sliding of the sliding block, thereby ensuring the stable sliding of the positioning roller. By synchronously adjusting the positions of the three sets of positioning rollers, it can adapt to the positioning requirements of equalizing rings of different diameters, making the polishing device more practical.

[0015] 2. The polishing device for processing equalizing rings, by setting up a pressing component and using the clamping and conveying of the pressing roller and the guide roller, solves the problems of unstable positioning and poor adaptability of traditional equipment, thereby improving the polishing uniformity of the equalizing ring. In addition, the polishing component can be flexibly disassembled and assembled using bolts, thus flexibly adapting to equalizing rings of different sizes. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of the external structure of this utility model from the right side view.

[0017] Figure 2This is a three-dimensional schematic diagram of the external structure of this utility model from the left side.

[0018] Figure 3 This is a three-dimensional schematic diagram of the polishing component of this utility model;

[0019] Figure 4 This is a schematic diagram of the internal structure of the polishing table of this utility model;

[0020] Figure 5 This is a three-dimensional schematic diagram of the pressing component of this utility model.

[0021] In the diagram: 1-Polishing table, 2-Control panel, 3-Polishing assembly, 31-Polishing cylinder, 32-Disassembly plate, 33-Polishing plate, 4-Pressing assembly, 41-Support plate, 42-Drive cylinder, 43-Connecting plate, 44-Pressing plate, 45-Pressing roller, 5-Positioning mechanism, 51-Positioning assembly, 511-Positioning slide rail, 512-Sliding block, 513-Placement plate, 514-Positioning roller, 52-Drive assembly, 521-Drive plate, 522-Drive rod, 6-Guide roller, 7-Micro motor, 8-Limit rod. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-5 This utility model provides a technical solution:

[0024] A polishing apparatus for processing equalizing rings includes a polishing table 1, a control panel 2 on the front side of the polishing table 1, a polishing component 3 on the right side of the top of the polishing table 1, a pressing component 4 on the left side of the top of the polishing table 1, and a positioning mechanism 5 inside the polishing table 1. The positioning mechanism 5 includes:

[0025] The positioning component 51 includes a positioning slide rail 511 installed at the bottom of the inner cavity of the polishing table 1. A sliding block 512 is slidably connected to the surface of the positioning slide rail 511. A shelf 513 is fixedly connected to the top of the sliding block 512 via a connecting rod. A positioning roller 514 is rotatably connected to the top of the shelf 513.

[0026] The drive assembly 52 is located at the bottom of the polishing table 1 and is used to drive the sliding block 512 to slide along the positioning slide rail 511, thereby driving the positioning roller 514 to move synchronously.

[0027] The control panel 2 is electrically connected to the polishing cylinder 31, the drive cylinder 42, the micro motor 7, and the drive motor, and controls their start and stop.

[0028] The positioning slide rail 511 is used to limit the sliding movement of the sliding block 512;

[0029] The top of the polishing table 1 is provided with a groove, and the connecting rod slides on the inner surface of the groove;

[0030] The height of the shelf 513 is the same as the height of the guide roller 6;

[0031] By setting a positioning mechanism 5, the sliding block 512 is driven to slide by the drive component 52, and the positioning slide rail 511 guides and limits the sliding of the sliding block 512, thereby ensuring the stable sliding of the positioning roller 514. By synchronously adjusting the position of the three sets of positioning rollers 514, the positioning requirements of pressure equalizing rings of different diameters can be adapted, making the polishing device more practical.

[0032] In this embodiment, the drive assembly 52 includes a drive motor installed at the bottom of the polishing table 1. The output end of the drive motor extends into the inner cavity of the polishing table 1 and is fixedly connected to a drive plate 521. A drive rod 522 is rotatably connected to the surface of the drive plate 521. One end of the drive rod 522 is rotatably connected to one side of the sliding block 512.

[0033] The drive motor is a three-phase asynchronous motor and is located at the bottom of the polishing table 1, which is not shown in the attached drawing;

[0034] In this embodiment, the top of the polishing table 1 is symmetrically and rotatably connected to multiple sets of guide rollers 6. The guide rollers 6 are driven to rotate by a micro motor 7, which is installed on the top of the polishing table 1.

[0035] Miniature motor 7 is a servo motor;

[0036] In this embodiment, the pressing component 4 includes a support plate 41 installed on the left side of the top of the polishing table 1. A drive cylinder 42 is fixedly connected to the center of the top of the support plate 41. A connecting plate 43 is fixedly connected to the output end of the bottom of the drive cylinder 42. A pressing plate 44 is fixedly connected to the bottom of the connecting plate 43. Multiple sets of pressing rollers 45 are rotatably connected to the bottom of the pressing plate 44.

[0037] In this embodiment, a symmetrical limiting rod 8 is fixedly connected to the top of the connecting plate 43. The surface of the limiting rod 8 is slidably connected to the inside of the support plate 41. The number of the lower pressure roller 45 is the same as that of the guide roller 6 and they are aligned vertically.

[0038] Limiting rod 8 is used to guide the connecting plate 43 to slide up and down;

[0039] In this embodiment, the polishing assembly 3 includes a polishing cylinder 31 installed on the top of the polishing table 1. The output end of the polishing cylinder 31 is fixedly connected to a disassembly plate 32. The top of the disassembly plate 32 is fixedly connected to a polishing plate 33 by bolts. The polishing plate 33 is used to polish the surface of the equalizing ring.

[0040] Based on the attachment, it can be seen that a material drop groove is provided on the top of the polishing table 1 and below the polishing plate 33;

[0041] By setting up a pressing component 4 and using a pressing roller 45 and a guide roller 6 for clamping and conveying, the problems of unstable positioning and poor adaptability of traditional equipment are solved, thereby improving the polishing uniformity of the pressure equalizing ring. In addition, the polishing component 3 can be flexibly disassembled and assembled using bolts, thus flexibly adapting to pressure equalizing rings of different sizes.

[0042] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0043] During operation, the pressure equalizing ring is first placed on the guide roller 6 and the placement plate 513. Then, the drive motor is started through the control panel 2. The output shaft of the drive motor rotates, causing the drive plate 521 to make a circular motion. The drive plate 521 pulls the drive rod 522 through the pin shaft, converting the circular motion into the linear motion of the sliding block 512 along the positioning slide rail 511. The sliding block 512 drives the placement plate 513 to move synchronously through the connecting rod, so that the positioning roller 514 is close to the outer wall of the pressure equalizing ring, forming a ring-shaped positioning for pressure equalizing rings of different diameters. The positioning roller 514 adopts a rotating structure and can rotate synchronously with the pressure equalizing ring conveyor, avoiding friction damage to the surface of the workpiece.

[0044] Then, the drive cylinder 42 is started through the control panel 2, which pushes the lower pressure plate 44 down, so that the lower pressure roller 45 presses against the upper surface of the pressure equalizing ring, and the limit rod 8 ensures that the lower pressure plate 44 moves vertically.

[0045] Subsequently, the micro motor 7 is started through the control panel 2 to drive the guide roller 6 to rotate. The friction between the guide roller 6 and the lower pressure roller 45 forms a clamping force, which drives the pressure equalizing ring to be conveyed at a uniform speed in the horizontal direction. The upper and lower aligned roller group structure can ensure that the axis of the pressure equalizing ring is stable during the conveying process and avoid polishing deviation.

[0046] Finally, the polishing cylinder 31 adjusts the piston rod extension length according to the diameter of the equalizing ring, pushes the disassembly plate 32 to drive the polishing plate 33 to move laterally, so that the surface of the polishing plate 33 is in close contact with the outer surface of the equalizing ring. When the equalizing ring is conveyed through the polishing area, the polishing plate 33 generates a uniform grinding force on its surface to complete the polishing operation. The polishing plate 33, which is connected by bolts, can be quickly disassembled and assembled to meet the polishing requirements of different roughness requirements.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0048] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A polishing apparatus for processing equalizing rings, comprising a polishing table (1), wherein a control panel (2) is provided on the front side of the polishing table (1), characterized in that: The polishing table (1) has a polishing assembly (3) on the right side of its top, a pressing assembly (4) on the left side of its top, and a positioning mechanism (5) inside the polishing table (1). The positioning mechanism (5) includes: The positioning assembly (51) includes a positioning slide rail (511) installed at the bottom of the inner cavity of the polishing table (1). A sliding block (512) is slidably connected to the surface of the positioning slide rail (511). A shelf (513) is fixedly connected to the top of the sliding block (512) by a connecting rod. A positioning roller (514) is rotatably connected to the top of the shelf (513). The drive assembly (52) is located at the bottom of the polishing table (1) and is used to drive the sliding block (512) to slide along the positioning slide rail (511), thereby driving the positioning roller (514) to move synchronously.

2. The polishing apparatus for processing equalizing rings according to claim 1, characterized in that: The drive assembly (52) includes a drive motor installed at the bottom of the polishing table (1). The output end of the drive motor extends into the inner cavity of the polishing table (1) and is fixedly connected to a drive plate (521). A drive rod (522) is rotatably connected to the surface of the drive plate (521). One end of the drive rod (522) is rotatably connected to one side of the sliding block (512).

3. The polishing apparatus for processing equalizing rings according to claim 1, characterized in that: The top of the polishing table (1) is symmetrically and rotatably connected to multiple sets of guide rollers (6), which are driven to rotate by a micro motor (7) mounted on the top of the polishing table (1).

4. The polishing apparatus for processing equalizing rings according to claim 1, characterized in that: The pressing assembly (4) includes a support plate (41) installed on the left side of the top of the polishing table (1). A drive cylinder (42) is fixedly connected to the center of the top of the support plate (41). A connecting plate (43) is fixedly connected to the output end of the bottom of the drive cylinder (42). A pressing plate (44) is fixedly connected to the bottom of the connecting plate (43). Multiple sets of pressing rollers (45) are rotatably connected to the bottom of the pressing plate (44).

5. The polishing apparatus for processing equalizing rings according to claim 4, characterized in that: The top of the connecting plate (43) is fixedly connected with a symmetrical limiting rod (8), the surface of the limiting rod (8) is slidably connected to the inside of the support plate (41), and the number of the lower pressure roller (45) and the guide roller (6) are the same and aligned vertically.

6. The polishing apparatus for processing equalizing rings according to claim 1, characterized in that: The polishing assembly (3) includes a polishing cylinder (31) installed on the top of the polishing table (1). The output end of the polishing cylinder (31) is fixedly connected to a disassembly plate (32). The top of the disassembly plate (32) is fixedly connected to a polishing plate (33) by bolts. The polishing plate (33) is used to polish the surface of the equalizing ring.

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