Wire and its polishing apparatus, manufacturing device

Abstract

The embodiments of the present application disclose a wire polishing device, a wire preparation device and a wire prepared based on the same. The polishing device comprises at least one pass-through die, a profiling cavity is arranged in the pass-through die, the pass-through die is used for polishing and positioning the wire passing through the profiling cavity, and the cross-sectional shape of the profiling cavity is at least partially consistent with the cross-sectional shape of the wire.

Description

Technical Field

[0001] This application relates to the field of wire preparation technology, and in particular to a wire and its polishing equipment and preparation apparatus. Background Technology

[0002] In photovoltaic (PV) module applications, to increase module power, high-reflectivity PV ribbons are needed to enhance luminous efficiency through repeated light utilization. One current approach is to improve reflectivity by altering the cross-sectional shape of the PV ribbon, for example, changing the previous circular or flat ribbons to triangular ribbons to increase reflectivity through the triangular shape. However, even triangular ribbons currently available struggle to meet the demand for higher reflectivity in certain scenarios.

[0003] In other similar wire applications besides photovoltaic ribbon, the problem of insufficient wire reflectivity also exists. Therefore, there is an urgent need for a technology to improve wire reflectivity. Utility Model Content

[0004] To address the problems of the prior art, this application provides a wire and polishing equipment, polishing method, preparation apparatus, and preparation method, to provide a solution that can improve the reflectivity of the wire.

[0005] In a first aspect, a wire polishing apparatus is provided, the polishing apparatus comprising: At least one die is provided, wherein the die has a contouring cavity, the die is used to polish and position the wire passing through the contouring cavity, and the cross-sectional shape of the contouring cavity is at least partially consistent with the cross-sectional shape of the wire.

[0006] In some possible implementations, the cross-sectional area of ​​the contoured cavity is not greater than the cross-sectional area of ​​the wire. In some possible implementations, the cross-section of the contoured cavity is non-circular.

[0007] In some possible implementations, the cross-section of the contoured cavity is triangular.

[0008] In some possible implementations, the reduction rate of the die-casting per pass is 0.2% to 5%.

[0009] In some possible implementations, the polishing equipment includes at least three sequentially arranged dies through which the wire passes for polishing.

[0010] In some possible implementations, the surface roughness of the contoured cavity inner surface is Ra 0.01 μm ~ 10 μm.

[0011] In some possible implementations, the mold includes a mold sleeve and a mold core disposed within the mold sleeve, wherein the mold core has the contour cavity.

[0012] In some possible implementations, the concentricity of the mold sleeve and the mold core is no greater than 10 μm.

[0013] In some possible implementations, the concentricity of the mold sleeve and the mold core is no greater than 7 μm. In some possible implementations, the mold sleeve is made of tungsten steel.

[0014] In some possible implementations, the core is polycrystalline diamond or single-crystal natural diamond.

[0015] In some possible implementations, the polishing equipment is a photovoltaic ribbon polishing equipment.

[0016] In a second aspect, a wire preparation apparatus is provided, comprising any of the polishing devices described in the first aspect.

[0017] In some possible implementations, the device further includes: An anti-torsion positioning device is installed in front of the polishing equipment along the direction of the wire preparation process; The anti-torsion positioning device is provided with a contour groove, and the cross-sectional shape of the contour groove is at least partially consistent with the cross-sectional shape of the wire, so as to prevent the wire from twisting and to position it as it passes through the contour groove.

[0018] In some possible implementations, the cross-sectional area of ​​the contour groove is larger than the cross-sectional area of ​​the wire passing through the contour groove.

[0019] In some possible implementations, the contoured groove has a rounded corner at the bend.

[0020] In some possible implementations, the included angle of the arc angle of the contour groove is smaller than the included angle of the arc angle of the wire and / or the arc radius of the arc angle of the wire is smaller than the arc radius of the arc angle of the contour groove.

[0021] In some possible implementations, the contouring groove is a groove that is closed along its own circumference, or the contouring groove has an opening along its own circumference.

[0022] In some possible implementations, the width of the slot is greater than the width of the slot bottom.

[0023] In some possible implementations, the width decreases along the direction from the opening to the bottom of the groove.

[0024] In some possible implementations, the anti-torsion positioning device includes at least one first anti-torsion positioning member and at least one second anti-torsion positioning member disposed on both sides of the wire movement direction, the contour groove being formed on the first anti-torsion positioning member and the contour groove having an opening along its own circumference; the second anti-torsion positioning member is used to apply a force toward the first anti-torsion positioning member to the wire to cause the wire to enter the contour groove.

[0025] In some possible implementations, the first anti-torsion positioning member and the second anti-torsion positioning member are spaced apart and staggered along the direction of wire movement.

[0026] In some possible implementations, at least one of the first anti-torsion positioning element and the second anti-torsion positioning element is a guide wheel.

[0027] In some possible implementations, the contoured groove is V-shaped to fit the wire with a triangular cross-section.

[0028] In some possible implementations, the apparatus further includes: a traction device for traction of the wire; and a drawing device for drawing the wire precursor to form the wire precursor into a wire with a predetermined cross-sectional shape.

[0029] In some possible implementations, the traction device includes a wire-infeeding device positioned before the anti-twist positioning device and / or a wire-retracting device positioned after the polishing device, along the direction of the wire preparation process; the wire-infeeding device is used to pull the wire precursor and transport it to the device corresponding to the next process; the wire precursor is the raw material of the wire; the wire-retracting device is used to retrieve the wire after it has been polished by the polishing device. In some possible implementations, the cross-sectional area of ​​the wire precursor is 0.01 mm²-0.2 mm²; and / or, the cross-sectional area of ​​the wire formed by the drawing equipment is 0.007 mm²-0.15 mm².

[0030] In some possible implementations, the apparatus is a photovoltaic ribbon fabrication apparatus.

[0031] Thirdly, a method for polishing a wire is provided, applied in the polishing apparatus of any one of the first aspects, comprising: passing the wire through the polishing apparatus to polish and position the wire passing through the contour cavity using a contour cavity of the mold of the polishing apparatus, wherein the cross-sectional shape of the contour cavity is at least partially consistent with the cross-sectional shape of the wire.

[0032] Fourthly, a method for preparing a wire is provided, the method comprising the wire polishing method according to any one of the third aspects, or the method being used in a wire preparation apparatus according to any one of the second aspects, the method comprising: passing the wire through the polishing equipment to polish and position the wire passing through the mold cavity using a contour cavity of the polishing equipment, wherein the cross-sectional shape of the contour cavity is at least partially consistent with the cross-sectional shape of the wire.

[0033] Fifthly, a wire is provided, which is obtained by polishing with the wire polishing equipment described in any one of the first aspects, or by polishing with the wire polishing method described in any one of the third aspects, or by preparing the wire with the wire preparation apparatus described in any one of the second aspects, or by preparing the wire with the wire preparation method described in the fourth aspect.

[0034] In some possible implementations, the wire is a photovoltaic ribbon.

[0035] In some possible implementations, the cross-section of the wire is non-circular.

[0036] In some possible implementations, the twist angle of the wire is less than ±5°.

[0037] In some possible implementations, the wire breakage rate is less than 5%.

[0038] In some possible implementations, the surface scratch rate of the wire is less than 5%.

[0039] In some possible implementations, the reflectivity of the wire is 80%.

[0040] According to the specific embodiments provided in this application, the following technical effects are disclosed: This application creatively proposes a polishing device and method that improves the reflectivity of wires through mechanical polishing. Furthermore, by employing a molded cavity with a shape adapted to the cross-sectional shape of the wire, the polishing accuracy is improved. The molded cavity also prevents twisting and positioning of the wire during polishing, reducing internal structural damage and mechanical property degradation caused by wire twisting. It also reduces problems such as poor polishing effect, high wire breakage rate, and high surface scratch rate caused by mismatch between the wire shape and the molded cavity shape due to wire twisting. Furthermore, by setting the reduction rate of the polishing mold, the high breakage rate and surface scratch rate are reduced, especially for thinner wires such as photovoltaic welding ribbons. Furthermore, this application's technical solution incorporates a multi-pass polishing mold. By setting multiple passes, each pass can be controlled with a lower reduction rate while achieving the required overall reduction rate, thereby reducing the high breakage rate and surface scratch rate.

[0041] This application creatively proposes a wire preparation apparatus and method. In addition to the aforementioned polishing equipment, it also includes an anti-twist positioning device with a contour groove adapted to the wire shape. This device prevents twisting, corrects twisting, and positions the wire as it moves towards the polishing equipment. This reduces internal structural damage and decreased mechanical properties caused by wire twisting, and also mitigates problems such as poor polishing results, high wire breakage rate, and high surface scratch rate caused by mismatch between the wire shape and the contour cavity shape due to twisting. By combining this simple anti-twist positioning device with the aforementioned high-efficiency polishing equipment, high-precision wire processing is achieved.

[0042] Of course, implementing any of the solutions in this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Furthermore, similar numbers in the figures are used to represent similar components, wherein: Figure 1A , 1B 1C and 1C are respectively a perspective view, a side view and a cross-sectional view along the length of a polishing device 1 mold 10 in an embodiment of this application; Figure 2A , 2B2C and 2C are respectively a perspective view, a side view and a cross-sectional view along the length of a mold 10 of another polishing device 1 in the embodiments of this application; Figure 3 This is a perspective view of the mold 10 of another polishing device 1 in the embodiments of this application; Figure 4 This is a schematic diagram of a polishing apparatus 1 with a multi-pass mold 10 according to an embodiment of this application; Figure 5 This is a schematic diagram of the composition of a wire preparation apparatus according to an embodiment of this application; Figure 6 This is a schematic diagram of another wire preparation apparatus in an embodiment of this application; Figure 7A This is a perspective view of an anti-torsion positioning device 4 according to an embodiment of this application; Figure 7B for Figure 7A The front view of the anti-torsion positioning device 4 shown; Figure 8A This is a perspective view of another anti-torsion positioning device 4 in the embodiments of this application; Figure 8B for Figure 8A The front view of the anti-torsion positioning device 4 shown; Figure 8C for Figure 8A A three-dimensional schematic diagram of the anti-torsion positioning device 4 in conjunction with the wire 2; Figure 8D for Figure 8C The front view of the anti-torsion positioning device 4 in conjunction with the wire 2 shown; Figure 9 This is a schematic diagram of the composition of an anti-torsion positioning device 4 in an embodiment of this application; Figure 10 This is a front view of a second anti-torsion positioning member 43 in an embodiment of this application. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] As described in the background section, the reflectivity of current photovoltaic ribbons and other similar wires is insufficient for certain applications. Therefore, a solution to improve wire reflectivity is urgently needed. This application creatively proposes a wire polishing device that uses a mold with a contoured cavity to polish and prevent twisting of the passing wire. This achieves efficient and precise polishing while reducing wire breakage and surface scratch rates, thereby improving the wire reflectivity.

[0046] The wires used in the embodiments of this application can be any feasible wires. In some embodiments, the wires are metal wires with good reflectivity, such as copper wires, silver wires, etc. In further embodiments, the wires can be photovoltaic solder ribbons.

[0047] In some embodiments of this application, the wire is prepared by processing the wire precursor (raw material) through some processing steps, such as drawing and forming process, at which time the wire has a preset cross-sectional shape.

[0048] The present application will be illustrated by specific embodiments below.

[0049] Example 1 Embodiment 1 of this application provides a polishing device 1. Figure 1A , 1B 1C and 1C are respectively a perspective view, a side view and a cross-sectional view along the length of a polishing device 1 mold 10 in an embodiment of this application; Figure 2A , 2B 2C and 2C are respectively a perspective view, a side view and a cross-sectional view along the length of a mold 10 of another polishing device 1 in the embodiments of this application; Figure 3 This is a perspective view of the mold 10 of another polishing device 1 in the embodiments of this application; Figure 4 This is a schematic diagram of a polishing apparatus 1 with a multi-pass mold 10 according to an embodiment of this application.

[0050] refer to Figure 1A , 1B 1C, 2A, 2B, 2C and Figure 3 , 4 As shown, the polishing equipment 1 includes a mold 10, and a contour cavity 11 is provided inside the mold 10. The mold 10 is used to polish the wire 2 ( ) passing through the contour cavity 11. Figure 4 Polishing and positioning are performed as shown.

[0051] In this embodiment, the cross-sectional shape of the contoured cavity 11 is at least partially consistent with the cross-sectional shape of the wire 2, so as to polish and position at least a portion of the surface of the wire 2. Taking photovoltaic ribbon as an example, its cross-section can be set to any feasible shape, and correspondingly, the cross-sectional shape of the contoured cavity 11 can be any feasible shape, and this application does not impose any specific limitations on it. As an example and not a limitation, the cross-section of the contoured cavity 11 can be circular, or non-circular such as rectangular or flat. Considering the high reflectivity effect, in some embodiments of this application, the cross-section of the wire 2 is non-circular, and more preferably triangular, such as... Figure 1A , 1B 1C, 2A, 2B, 2C and Figure 3 As shown, the corresponding contour cavity 11 is also triangular at this time.

[0052] Continue to refer to Figure 1A , 1B As shown in 1C, 2A, 2B, and 2C, in some embodiments of this application, the mold 10 includes a mold sleeve 12 and a mold core 13 disposed within the mold sleeve, with a contour cavity 11 formed within the mold core 13. In the embodiments of this application, the mold sleeve 12 and mold core 13 can be formed using any process and any material. As an example, and not a limitation, in one embodiment of this application, the concentricity of the mold sleeve 12 and mold core 13 is no greater than 10 μm, and more specifically no greater than 7 μm, for more stable polishing. As an example, and not a limitation, in one embodiment of this application, the mold sleeve 12 is made of tungsten steel. As an example, and not a limitation, in one embodiment of this application, the mold core 13 is made of polycrystalline diamond or single-crystal natural diamond. In alternative embodiments, such as... Figure 3 As shown, the mold 10 can be integrally molded, such as by injection molding, to form a mold with a contour cavity 11.

[0053] It should be noted that the fact that the cross-sectional shape of the contour cavity 11 is consistent with the cross-sectional shape of the wire 2 does not necessarily mean that their cross-sectional areas are the same. In fact, to achieve polishing, at least one surface of the wire 2 entering the contour cavity 11 needs to be in close contact with the inner wall of the contour cavity 11 to perform a surface reduction operation. To achieve contact between different surfaces or different numbers of surfaces of the wire 2 and the inner wall of the contour cavity 11, the size of the cross-section of the contour cavity 11 needs to be set. In some embodiments of this application, the dimensions of a portion of the cross-section of the contour cavity 11 are smaller than the dimensions of the corresponding sides of the cross-section of the wire 2 to be polished. Taking a rectangle as an example, the width of the cross-section of the contour cavity 11 can be set to be less than or equal to the width of the cross-section of the wire 2 to be polished. This achieves contact between a portion of the surface of the wire 2 to be polished and the inner wall of the contour cavity 11, thereby polishing the contacted surface of the wire 2. In other embodiments of this application, the dimensions of each side of the cross-section of the contour cavity 11 can be set to be less than or equal to the dimensions of each side of the cross-section of the wire 2 to be polished, so as to achieve full contact between the surface of the wire 2 to be polished and the inner wall surface of the contour cavity 11, thereby polishing the entire surface of the wire 2 to be polished.

[0054] It is understandable that wire 2 is prone to twisting during movement. However, twisting beyond a certain angle can cause damage to the internal structure of the wire and a decrease in mechanical properties. In this embodiment, the contoured cavity 11 used for polishing also serves to prevent the wire 2 from twisting. This is because the shape of the contoured cavity 11 is adapted to the shape of the wire 2, and there are certain limitations on the polishing size. This means that when the wire 2 enters the contoured cavity 11, there is not enough space for it to twist, thus reducing the occurrence of wire twisting, thereby reducing the breakage rate and the surface scratch rate caused by the mismatch between the twisting and the shape of the contoured cavity.

[0055] In some embodiments of this application, the contour cavity 11 is used for polishing along its entire length in the direction through which the wire 2 passes (as shown by arrow A in the figure). Based on this, as... Figure 1A , 1C As shown, along the length of the contoured cavity 11, the cross-sectional area of ​​each part of the contoured cavity 11 can be set to be the same. Considering that the wire 2 is gradually reduced in size within the contoured cavity 11, resulting in a gradual decrease in the cross-sectional area of ​​the wire 2, in another way, the cross-sectional area of ​​the contoured cavity 11 can be set to decrease gradually along the length of the contoured cavity 11, i.e., the direction in which the wire 2 passes.

[0056] In an alternative embodiment, considering the need to facilitate the entry and exit of the wire 2 into and out of the contour cavity 11, the contour cavity 11 can be configured so that only a portion of its length is used for polishing, specifically as follows: Figure 2A , 2BAs shown in Figures 2C and 3, the contouring cavity 11 includes three parts: a wire inlet 111, a polishing area 112, and a wire outlet 113. The wire inlet 111 and wire outlet 113 are used for the entry and exit of the wire 2, respectively, rather than for polishing. The polishing area 112 is the area for polishing the wire 2. To facilitate the entry and exit of the wire 2, the cross-sectional areas of the wire inlet 111 and wire outlet 113 of the contouring cavity 11 can be set to be larger than the cross-sectional area of ​​the polishing area 112. This application embodiment does not specifically limit the relationship between the cross-sectional areas of the wire inlet 111 and wire outlet 113. As an example and not a limitation, the cross-sectional areas of the wire inlet 111 and wire outlet 113 can be set to be the same. In an alternative embodiment, considering that the output wire 2 is reduced in size due to polishing and surface reduction, the cross-sectional area of ​​the wire outlet 113 can be set to be smaller than the cross-sectional area of ​​the wire inlet 111. Based on this, as... Figure 2A , 2B As shown in Figure 2C, along the length of the polishing area 112, i.e., the direction in which the wire 2 passes (as shown by arrow A in the figure), the cross-sectional area of ​​each point in the polishing area 112 can be set to be the same. In another way, considering that the wire 2 is gradually reduced in the polishing area 112, the cross-sectional area of ​​the polishing area 112 can be set to decrease gradually along the length of the polishing area 112.

[0057] It should be noted that, in some embodiments of this application, the entire area of ​​the contour cavity 11 may be designed to match the cross-sectional shape of the wire 2 to be polished. In alternative embodiments, only the cross-sectional shape of the polishing area 112 may be set to match the cross-sectional shape of the wire 2 to be polished, while the cross-sectional shapes of the wire inlet 111 and the wire outlet 113 may be designed to be other shapes, such as... Figure 2A , 2B As shown in Figures 2C and 3, the wire inlet 111 includes a circular cross-section with decreasing diameter and a triangular cross-section with decreasing width along the direction close to the polishing area 112, and the wire outlet 113 includes a triangular cross-section with increasing width and a circular cross-section with increasing diameter along the direction away from the polishing area 112, so as to smoothly introduce or lead the wire 2 into or out of the mold 10 through the circular arrangement.

[0058] To improve the polishing effect and thus increase the reflectivity of wire 2, in some embodiments of this application, the roughness of the inner surface of the contour cavity is set to Ra 0.01μm ~ 10μm.

[0059] Considering that in some scenarios the wire 2 is relatively thin, strong polishing and traction can easily lead to wire 2 breakage and surface scratches. Therefore, in some embodiments of this application, the reduction rate of each pass of the die 10 is set to 0.2%~5% to reduce the high wire breakage rate and other problems caused by a large reduction rate.

[0060] Single-pass polishing has a limited area reduction rate; therefore, in some embodiments of this application, such as... Figure 4 As shown, the polishing equipment 1 includes at least three sequentially arranged dies 10, through which the wire 2 passes sequentially in the direction indicated by arrow A in the figure, thereby performing multiple polishing passes. By setting up multiple dies 10, a better polishing effect can be achieved by stacking multiple passes, while maintaining a low surface area reduction rate and low wire breakage rate each time.

[0061] In some embodiments of this application, in scenarios where multiple passes of die 10 are used, the cross-sectional size of the contour cavity 11 of each pass of die 10 can be the same. In an alternative embodiment, considering that the cross-sectional area of ​​the wire 2 is reduced with each pass of die 10, the cross-sectional area of ​​the contour cavity 11 of a subsequent pass of die 10 can be set to be smaller than that of the contour cavity 11 of a previous pass of die 10, and the difference in cross-sectional area can be set to be related to the reduction rate of the previous pass of die 10; for example, the larger the reduction rate, the larger the area difference.

[0062] Example 2 Embodiment 2 of this application provides a wire preparation apparatus 3. Figure 5 This is a schematic diagram of the composition of a wire preparation apparatus according to an embodiment of this application; Figure 6 This is a schematic diagram of another wire preparation apparatus in an embodiment of this application.

[0063] Reference Figure 5 , 6 As shown, the wire preparation apparatus 3 includes a polishing device 1', which is used to polish the passing wire by means of a contoured cavity. It should be noted that in some embodiments of this application, the polishing device 1' may be the same as or similar to the polishing device 1 in Embodiment 1. In some embodiments, similar to Embodiment 1, the polishing device 1' includes one or more molds 10' with contoured cavities for multi-pass polishing.

[0064] During the feeding of wire 2 from the source (usually the wire feeding device) to the polishing equipment 1', wire 2 is prone to twisting and turning, especially thinner wires. This can lead to damage to the internal structure of wire 2, decreased mechanical properties, and a high breakage rate. Furthermore, when the twisted wire 2 enters the polishing equipment 1', its shape may not match the shape of the contoured cavity, resulting in poor polishing effects, a high breakage rate, and a high surface scratch rate. Therefore, [further details are needed]. Figure 5 , 6 As shown, the wire preparation device 3 also includes an anti-twist positioning device 4, which is set in front of the polishing equipment 1' along the wire 2 preparation process direction, i.e. the moving direction (as shown by arrow A in the figure), and is used to perform anti-twist and twist correction on the wire 2 so that the wire enters the polishing equipment 1' in a non-twisted posture for polishing.

[0065] Except for the anti-torsion positioning device 4, in some embodiments of this application, reference is continued to be made to Figure 6 As shown, the wire preparation device 3 further includes a traction device for pulling the wire 2 along the direction indicated by arrow A in the figure. Specifically, as... Figure 6 As shown, the traction equipment may include a wire feeding device 51 positioned before the anti-torsion positioning device 4 along the wire 2 preparation process direction (i.e., the direction of movement, as indicated by arrow A in the figure), and a wire take-up device 52 positioned after the polishing device 1' along the wire 2 preparation process direction (i.e., the direction of movement, as indicated by arrow A in the figure). The wire feeding device 51 is used to pull the wire precursor to the device corresponding to the next process; wherein the wire precursor is the raw material of the wire 2. The wire take-up device 52 is used to take up the wire 2 after it has been polished by the polishing device 1'.

[0066] In addition to the anti-torsion positioning device 4 and the traction device, in some embodiments of this application, reference is made to... Figure 6 As shown, the wire preparation device 3 further includes a drawing device 6 located after the wire feeding device 51 and before the anti-torsion positioning device 4 along the wire preparation process direction, i.e. the moving direction (as shown by arrow A in the figure), for drawing the wire precursor to form the wire precursor into a wire 2 with a preset cross-sectional shape.

[0067] Except for the anti-torsion positioning device 4 and the traction device and pulling device 6, in some embodiments of this application, reference is made to Figure 6 As shown, the wire preparation apparatus 3 further includes a cooling device 7 located after the polishing device 1' and before the take-up device 52 along the wire preparation process direction, i.e., the moving direction (as shown by arrow A in the figure), for cooling the polished wire 2.

[0068] In one specific embodiment, the wire precursor, after being fed by the wire feeding device 51, is sent to the drawing device 6 for drawing and forming into a wire 2 with a preset cross-sectional shape. The wire 2 is then sent to the polishing device 1' for polishing. During its movement from the drawing device 6 to the polishing device 1', the wire 2 passes through the anti-torsion positioning device 4 and undergoes anti-torsion and twist correction under the action of the anti-torsion positioning device 4, entering the polishing device 1' in the correct posture (a posture adapted to the cross-sectional shape of the contour cavity of the polishing device 1'). After polishing, the wire 2 continues to be cooled in the cooling device 7 and finally taken in by the wire take-up device 52.

[0069] The above is an introduction to the components of the wire preparation apparatus. Next, the anti-torsion positioning device 4 will be described in detail. Figure 7A This is a perspective view of an anti-torsion positioning device 4 according to an embodiment of this application; Figure 7B for Figure 7A The front view of the anti-torsion positioning device 4 shown; Figure 8A This is a perspective view of another anti-torsion positioning device 4 in the embodiments of this application; Figure 8B for Figure 8A The front view of the anti-torsion positioning device 4 shown; Figure 8C for Figure 8A A three-dimensional schematic diagram of the anti-torsion positioning device 4 in conjunction with the wire 2; Figure 8D for Figure 8C The front view of the anti-torsion positioning device 4 in conjunction with the wire 2 shown; Figure 9 This is a schematic diagram of the composition of an anti-torsion positioning device 4 in an embodiment of this application; Figure 10 This is a front view of a second anti-torsion positioning member 43 in an embodiment of this application.

[0070] Further reference Figure 7A , 7B As shown in 8A, 8B, 8C, and 8D, the anti-torsion positioning device 4 is provided with a contour groove 41, and the cross-sectional shape of the contour groove 41 is at least partially consistent with the cross-sectional shape of the wire 2, so as to prevent the wire 2 from twisting and to position it as it passes through the contour groove 41. In some embodiments of this application, the cross-sectional shape of the contour groove 41 is completely consistent with the cross-sectional shape of the wire 2. For example, if the cross-section of the wire 2 is an equilateral triangle, the cross-section of the contour groove 41 is also an equilateral triangle. In some embodiments of this application, the cross-sectional shape of the contour groove 41 is only partially consistent with the cross-sectional shape of the wire 2. For example, if the cross-section of the wire 2 is an equilateral triangle, only the bottom region of the contour groove 41 has an equilateral triangle cross-section, while the top region of the contour groove 41 has a circular cross-section.

[0071] Unlike the polishing equipment 1', the contour groove 41 of the anti-twist positioning equipment 4 is only used for anti-twist and twist correction of the wire 2. The cross-sectional area of ​​the contour groove 41 should not be too large to minimize the twisting and turning of the wire 2 entering it. On the other hand, its cross-section should not be too small to minimize the contact between the wire 2 and the groove surface of the contour groove 41, so as to minimize the wear of the wire 2 surface by the groove surface. In some embodiments of this application, the cross-sectional area of ​​the contour groove 41 may be slightly larger than the cross-sectional area of ​​the wire 2 to limit the twisting of the wire 2, especially the irregular wire 2, and at the same time reduce the wear of the wire 2.

[0072] In this embodiment of the application, taking the cross-section of wire 2 as a triangle as an example, refer to... Figure 7A , 7B As shown, the cross-section of the contour groove 41 is also triangular. In an alternative embodiment, considering that the apex of the triangle is a sharp angle, which is prone to wear, refer to... Figure 8A , 8BAs shown in Figures 8C and 8D, the apex of the cross-section of the contour groove 41 can be designed as a rounded corner (as shown in Figure B) to reduce wear on the wire 2. Correspondingly, in other shape designs, at least one bend (prone to wear) of the contour groove 41 can be designed as a rounded corner to reduce wear on the bend of the wire 2.

[0073] In some embodiments, at least one bend in the wire 2 is also set as a rounded corner, and the radius of the rounded corner of the wire 2 is set smaller than the radius of the corresponding rounded corner of the contouring groove 41, so as to reduce or avoid the outer surface of the rounded corner of the wire 2 touching the inner wall of the rounded corner of the contouring groove 41, causing wear on the wire 2. In some embodiments, the included angle of the rounded corner of the contouring groove 41 is set smaller than the included angle of the corresponding rounded corner of the wire 2, so as to prevent the rounded corner of the wire 2 from completely entering the rounded corner of the contouring groove 41 and touching the top of the rounded corner of the contouring groove 41, causing wear on the rounded corner of the wire 2. In some embodiments, the difference between the included angle of the rounded corner of the contouring groove 41 and the included angle of the rounded corner of the wire 2 is within 2°. For example, the cross-sectional shape of both the wire 2 and the contouring groove 41 is triangular, and the vertices of the triangles of the wire 2 and the contouring groove 41 are both rounded corners.

[0074] In this embodiment, the contouring groove 41 can be configured in various ways as needed, and this application does not impose specific limitations on it. In one embodiment, the contouring groove 41 is a groove that is closed along its own circumference, which means that when the wire 2 enters the contouring groove 41, the wire 2 cannot be pulled out of the contouring groove 41 from the cross-sectional direction. It can be understood that in this case, in order for the wire 2 to enter the contouring groove 41 smoothly, the cross-sectional area of ​​the contouring groove 41 is not less than or greater than the cross-sectional area of ​​the wire 2 entering the contouring groove.

[0075] In alternative embodiments, such as Figure 8A , 8B As shown in Figure 8D, the contour groove 41 has an opening 412 opposite to the bottom 411 along its circumference. In one embodiment, the width of the opening 412 of the contour groove 41 is smaller than the size of the bottom 411. This means that the wider portion of the wire 2 is located at the bottom and the narrower portion is located at the opening 412. Furthermore, this means that once the wire 2 enters the contour groove 41, it cannot exit from the opening 412, i.e., it cannot exit the contour groove 41 along its cross-sectional direction. Understandably, in this case, to allow the wire 2 to smoothly enter the contour groove 41, the cross-sectional area of ​​the contour groove 41 must be no less than or greater than the cross-sectional area of ​​the wire 2 entering the contour groove. In another embodiment, further referring to… Figure 8A , 8B As shown in Figure 8D, the width of the groove opening 412 of the contour groove 41 is greater than the size of the groove bottom 411. Taking the cross-section of wire 2 as a triangle as an example, refer to... Figure 8BAs shown, the cross-section of the contour groove 41 is V-shaped. This means that the wider portion of the wire 2 is located at the groove opening 412, while the narrower portion is located at the groove bottom 411. Furthermore, this means that once the wire 2 enters the contour groove 41, it can easily detach from the groove opening 412. To address the problem of the wire 2 easily detaching from the contour groove 41, in one embodiment of this application, as... Figure 9 As shown, the anti-torsion positioning device 4 includes a component located in the direction of wire movement (e.g., ...). Figure 9 As shown by arrow A), there are at least one first anti-torsion positioning element 42 and at least one second anti-torsion positioning element 43 on both sides. A contour groove 41 is formed on the first anti-torsion positioning element 42. The second anti-torsion positioning element 43 is used to apply a force toward the first anti-torsion positioning element 42 to the wire 2 so that the wire 2 enters the contour groove 41. With the help of the force of the second anti-torsion positioning element 43, the wire 2 is pressed in and stabilized in the contour groove 41 in the cross-sectional direction of the contour groove 41 without coming out.

[0076] In some embodiments of this application, the first anti-torsion positioning member 42 and the second anti-torsion positioning member 43 can each be one; in alternative embodiments, such as... Figure 9 As shown, there can be multiple first anti-torsion positioning elements 42 and multiple second anti-torsion positioning elements 43. In some embodiments, the number of first anti-torsion positioning elements 42 and second anti-torsion positioning elements 43 is the same. In alternative embodiments, the number of first anti-torsion positioning elements 42 and second anti-torsion positioning elements 43 is different. In further embodiments, the number of first anti-torsion positioning elements 42 is greater than the number of second anti-torsion positioning elements 43.

[0077] In some embodiments of this application, the first anti-torsion positioning member 42 and the second anti-torsion positioning member 43 can be positioned in the direction of movement of the wire 2 (e.g., Figure 9 The arrow A shown is symmetrically arranged on both sides, or it can be like... Figure 9 As shown, the wires on both sides of the wire 2 are spaced apart and staggered along the direction of movement of the wire 2.

[0078] In this application, the first anti-torsion positioning member 42 can be selected from any feasible structural configuration. In one embodiment, the first anti-torsion positioning member 42 can specifically be as follows: Figure 8A , 8B As shown in Figures 8C, 8D, and 9, a guide wheel drives the wire 2 through its own motion. A contoured groove 41 is formed on the circumferential surface of the first anti-torsion positioning member 42 in the form of a guide wheel, and the width of the groove opening 412 is greater than the groove bottom 411. Taking a triangle as an example, the groove opening 412 corresponds to the base of the triangle, while the groove bottom 411 corresponds to the apex of the triangle. The wire 2, with a triangular cross-section, is embedded in the contoured groove 41 and anti-torsion positioned. As the guide wheel rotates, the wire 2 can be conveyed to the polishing equipment 1'.

[0079] In this application, the first anti-torsion positioning member 43 can be selected from any feasible structural configuration. In one embodiment, such as... Figure 9 , 10 As shown, the second anti-torsion positioning member 43 is a guide wheel that can drive the wire 2 to move through its own movement. The circumferential surface of the guide wheel-shaped second anti-torsion positioning member 43 is used to contact the wire 2 and apply force to the wire 2. In one embodiment, the circumferential surface of the second anti-torsion positioning member 43 can be a circular surface. In another implementation, such as... Figure 10 As shown, the circumferential surface of the second anti-torsion positioning member 43 can be provided with a force-applying groove 44 that matches the shape of the side of the wire 2 facing the second anti-torsion positioning member 43. For example, when the cross-section of the wire 2 is triangular, and the base of the triangle of the wire 2 faces the second anti-torsion positioning member 43, the second force-applying groove 44 can be provided with a groove bottom 441 with a flat surface and a groove opening 442 with a width greater than the groove bottom 441. By adapting the flat groove bottom 441 to the base of the triangle of the wire 2, force is applied to the base of the triangle of the wire 2 and pressed into the contour groove 41. In an alternative embodiment, the second anti-torsion positioning member 13 applies force to the wire 2 in a non-contact manner, such as by using an air knife to apply force to the wire 2 by blowing air.

[0080] In some embodiments of this application, the cross-sectional area of ​​the wire precursor is 0.01 mm²-0.2 mm². In some embodiments of this application, the cross-sectional area of ​​the wire formed by the drawing equipment is 0.007 mm²-0.15 mm².

[0081] Example 3 Corresponding to Embodiment 1 above, Embodiment 3 of this application provides a wire polishing method. The method is applied in the polishing equipment described in Embodiment 1. The method includes: passing the wire through the polishing equipment, and using the contour cavity of the mold of the polishing equipment to polish and position the wire passing through the contour cavity, wherein the cross-sectional shape of the contour cavity is consistent with the cross-sectional shape of the wire.

[0082] In a further embodiment, the polishing equipment includes a multi-pass die, and the method is used to pass the wire through the multi-pass die sequentially to polish the wire in multiple passes.

[0083] In a further embodiment, the surface reduction rate for each die pass can be controlled to be 0.2% to 5%. Specifically, the surface reduction rate can be controlled by adjusting the running speed of the wire through the polishing equipment and the roughness of the contour cavity.

[0084] Example 4 Corresponding to Embodiment 2 above, Embodiment 4 of this application provides a wire preparation method. The method is applied in the wire preparation apparatus described in Embodiment 2. The method includes: passing the wire through a polishing device, using the contour cavity of the polishing device's mold to polish and position the wire passing through the contour cavity. The cross-sectional shape of the contour cavity is at least partially consistent with the cross-sectional shape of the wire.

[0085] In a further embodiment, the method further includes: The wire is fed into a controlled feeding device, and the wire precursor is shaped by a drawing device. It then moves to an anti-torsion positioning device for twist correction and anti-torsion positioning, followed by a polishing device. After multiple polishing passes, it enters a cooling device for cooling before being wound up. In an alternative embodiment, the cooling process may be omitted.

[0086] Example 5 Corresponding to any of the above embodiments one to four, embodiment five of this application provides a wire.

[0087] The specific wire can be prepared by polishing using the wire polishing equipment of Example 1 or the wire polishing method of Example 3.

[0088] Specifically, the wire can be prepared using the wire preparation apparatus of Example 2 or the wire preparation method of Example 4.

[0089] In some embodiments of this application, the wire is a photovoltaic welding ribbon.

[0090] In some embodiments of this application, the cross-section of the wire is not circular, but specifically triangular.

[0091] In some embodiments of this application, the twist angle of the wire is less than ±5°.

[0092] In some embodiments of this application, the wire breakage rate is less than 5%.

[0093] In some embodiments of this application, the surface scratch rate of the wire is less than 5%.

[0094] In some embodiments of this application, the reflectivity of the wire is 80%.

[0095] It should be noted that relevant parts in different embodiments of this application can be referred to each other, and repeated parts will not be described again in this application.

[0096] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. Furthermore, those skilled in the art will recognize that, based on the ideas of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A wire polishing device, characterized in that, The polishing equipment includes: At least one die is provided, wherein the die has a contouring cavity, the die is used to polish and position the wire passing through the contouring cavity, and the cross-sectional shape of the contouring cavity is at least partially consistent with the cross-sectional shape of the wire.

2. The wire polishing equipment according to claim 1, characterized in that, The cross-sectional area of ​​the contoured cavity is not greater than the cross-sectional area of ​​the wire passing through the contoured cavity.

3. The wire polishing equipment according to claim 2, characterized in that, The cross-section of the contoured cavity is triangular.

4. The wire polishing equipment according to claim 1, characterized in that, The reduction rate of the die set for each pass is 0.2% to 5%; And / or, The polishing equipment includes at least three sequentially arranged dies for the wire to pass through sequentially for polishing.

5. The wire polishing equipment according to claim 1, characterized in that, The surface roughness of the inner surface of the contoured cavity is Ra0.01μm ~10μm.

6. The wire polishing equipment according to claim 1, characterized in that, The mold includes a mold sleeve and a mold core disposed within the mold sleeve, wherein the mold core is provided with the contour cavity.

7. The wire polishing equipment according to claim 6, characterized in that, The concentricity of the mold sleeve and the mold core is no greater than 10 μm. and / or, The mold sleeve is made of tungsten steel. and / or, The core is made of polycrystalline diamond or single-crystal natural diamond.

8. A wire preparation apparatus, characterized in that, The apparatus includes the wire polishing equipment according to any one of claims 1 to 7.

9. The wire preparation apparatus according to claim 8, characterized in that, The device further includes: An anti-torsion positioning device is installed in front of the polishing equipment along the direction of the wire preparation process; The anti-torsion positioning device is provided with a contour groove, and the cross-sectional shape of the contour groove is at least partially consistent with the cross-sectional shape of the wire, so as to prevent the wire from twisting and to position it as it passes through the contour groove.

10. The wire preparation apparatus according to claim 9, characterized in that, The cross-sectional area of ​​the contour groove is larger than the cross-sectional area of ​​the wire passing through the contour groove.

11. The wire preparation apparatus according to claim 9, characterized in that, The contour groove has a rounded corner at the bend.

12. The wire preparation apparatus according to claim 9, characterized in that, The contouring groove is a groove that is closed along its own circumference, or the contouring groove has an opening along its own circumference.

13. The wire preparation apparatus according to claim 9, characterized in that, The anti-torsion positioning device includes at least one first anti-torsion positioning component and at least one second anti-torsion positioning component disposed on both sides of the wire moving direction. The contour groove is formed on the first anti-torsion positioning component and the contour groove has a groove opening along its own circumference. The second anti-torsion positioning member is used to apply a force toward the first anti-torsion positioning member to the wire so that the wire enters the contour groove.

14. The wire preparation apparatus according to claim 13, characterized in that, The first anti-torsion positioning member and the second anti-torsion positioning member are spaced apart and staggered along the moving direction of the wire; And / or, At least one of the first anti-torsion positioning component and the second anti-torsion positioning component is a guide wheel.

15. The wire preparation apparatus according to claim 9, characterized in that, The contoured groove is V-shaped to fit the wire with a triangular cross-section.

16. The wire preparation apparatus according to any one of claims 9 to 15, characterized in that, The device further includes: A traction device for moving the wire on the wire preparation device; A drawing device installed before the anti-torsion positioning device is used to draw the wire precursor to form the wire precursor into a wire with a preset cross-sectional shape.

17. The wire preparation apparatus according to claim 16, characterized in that, The cross-sectional area of ​​the wire precursor is 0.01 mm²-0.2 mm²; And / or, The cross-sectional area of ​​the wire formed by the drawing equipment is 0.007 mm²-0.15 mm².

18. A wire, characterized in that, The wire is prepared by the wire polishing equipment according to any one of claims 1 to 7; or, The wire is prepared by the wire preparation apparatus according to any one of claims 8 to 17.

19. The wire according to claim 18, characterized in that, The wire is a photovoltaic welding ribbon; And / or, The cross-section of the wire is non-circular; And / or, The twist angle of the wire is less than ±5°; And / or, The wire breakage rate is less than 5%; And / or, The surface scratch rate of the wire is less than 5%; and / or The reflectivity of the wire is 80%.

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