Polishing head device of a polishing apparatus and polishing apparatus

Abstract

The utility model discloses a polishing head device and polishing equipment of polishing equipment, and polishing head device of polishing equipment includes: base plate, polishing head subassembly, polishing head subassembly sets up in base plate, drive assembly, drive assembly sets up in base plate, and drive assembly includes drive part and transmission part, and transmission part includes worm wheel spare and worm spare, and worm wheel spare and worm spare meshing drive, and worm spare is connected with drive part transmission, and worm wheel spare is linked with polishing head subassembly. Therefore, through setting up worm wheel spare and worm spare transmission cooperation between drive part and polishing head subassembly of polishing head device, under the premise of realizing the reversing drive function of polishing head device, not only can guarantee the compactness of the structure layout of polishing head device, but also can promote the power transmission stability of polishing head device, thereby the polishing head device of the utility model embodiment can promote the uniformity of wafer polishing and product yield.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a polishing head device and polishing equipment for a polishing apparatus. Background Technology

[0002] Chemical mechanical polishing (CMP) of semiconductor wafers is a core process for achieving global planarization in wafer manufacturing. As the core module of CMP equipment, the polishing unit's rotational accuracy and transmission stability directly determine the uniformity of polishing and product yield.

[0003] In the existing technology, the driving scheme of polishing unit mostly adopts synchronous belt drive or multi-stage gear drive. Among them, synchronous belt is prone to belt wear and tension decay after long-term operation, which leads to a reduction in transmission accuracy. Multi-stage gears have meshing gaps and occupy a large space in the overall structure. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a polishing head device for a polishing apparatus, which not only has a compact structure but also provides smooth power transmission.

[0005] This utility model embodiment further proposes a polishing device.

[0006] The polishing head device of the polishing equipment according to an embodiment of the present utility model includes: a base plate; a polishing head assembly disposed on the base plate; and a driving assembly disposed on the base plate, the driving assembly including a driving member and a transmission member, the transmission member including a worm gear member and a worm member, the worm gear member and the worm member meshing and transmitting power, the worm member being transmittedly connected to the driving member, and the worm gear member being connected to the polishing head assembly.

[0007] Therefore, by setting a worm gear and worm shaft transmission between the drive component and the polishing head assembly of the polishing head device, the structural layout of the polishing head device can be kept compact while realizing the reversing transmission function of the polishing head device. At the same time, the power transmission stability of the polishing head device can also be improved. Thus, the polishing head device of this utility model embodiment can improve the uniformity of wafer polishing and the product yield.

[0008] According to some embodiments of the present invention, the throwing head assembly is disposed on one side of the substrate along a first direction, the driving assembly is disposed on the side of the substrate away from the throwing head assembly along the first direction, and the worm gear member at least partially passes through the substrate and is connected to the throwing head assembly.

[0009] According to some embodiments of the present invention, the rotation axis of the worm gear is perpendicular to the first direction, and the rotation axis of the worm wheel is parallel to the first direction.

[0010] According to some embodiments of the present invention, the worm gear and the driving member are arranged along a second direction, the rotation axis of the worm gear is parallel to the second direction, and the worm wheel is disposed on one side of the worm gear along a third direction and meshes with the worm gear, wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0011] According to some embodiments of the present invention, the polishing head device of the polishing equipment further includes a housing component, the transmission component is disposed inside the housing component, the worm gear component extends at least partially from the housing component and is connected to the driving component, the worm wheel component extends at least partially from the housing component and is connected to the polishing head assembly, and the housing component is connected to the substrate.

[0012] According to some embodiments of the present invention, the drive assembly includes a connector that extends in a first direction, and both ends of the connector are respectively connected to the worm gear and the throwing head assembly.

[0013] According to some embodiments of the present invention, the polishing head device of the polishing equipment further includes a protective cover, the polishing head assembly is spaced apart from the substrate, and the protective cover is disposed on the circumferential outside of the connector and located between the polishing head assembly and the substrate.

[0014] According to some embodiments of the present invention, the drive assembly further includes a coupling, and the drive component and the worm gear component are connected by the coupling.

[0015] According to some embodiments of the present invention, the orthographic projection of the substrate in the first direction covers the orthographic projection of the driving assembly and the throwing head assembly in the first direction.

[0016] The polishing equipment according to an embodiment of the present invention includes the polishing head device of the polishing equipment described above.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a partial schematic diagram of the polishing head device of the polishing equipment according to an embodiment of the present utility model; Figure 2 This is a partial exploded view of the polishing head device of the polishing equipment according to an embodiment of the present utility model.

[0019] Figure label: 100. Throwing head device; 10. Substrate; 11. Through-hole; 20. Throwing head assembly; 21. Rotating cross; 30. Drive assembly; 31. Drive component; 32. Transmission component; 321. Connecting shaft; 33. Connecting component; 331. Connecting rod; 332. Connecting disc; 40. Housing components; 50. Protective cover; 60. Coupling components. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below, and the embodiments described with reference to the accompanying drawings are exemplary.

[0021] The following is for reference. Figures 1-2 The present invention describes a polishing head device 100 for a polishing apparatus according to an embodiment of the present invention, which is applicable to a polishing apparatus.

[0022] According to the embodiments of this utility model, in conjunction with Figures 1-2 As shown, the polishing head device 100 of the polishing equipment in this embodiment of the present invention mainly includes: a substrate 10, a polishing head assembly 20, and a driving assembly 30. Specifically, the chemical mechanical polishing process uses chemical etching combined with mechanical polishing to smooth the wafer surface, aiming to ensure the smoothness and flatness of the wafer surface. Chips are composed of multiple layers stacked together. During the stacking process, if extremely small undulations occur on the wafer surface, they may lead to uneven material thickness or defects in subsequent high-temperature processes or thin film deposition. By using the chemical mechanical polishing process to smooth each layer, not only can the photolithography accuracy be ensured to guarantee the clarity of the circuit diagram printed on the wafer, thereby preventing broken or short-circuited circuits inside the chip, but it can also prevent breakage and poor contact in the internal structure of the chip. In addition, when laying metal wires (such as copper interconnects) inside the chip, trenches are usually first etched on the insulating layer, and then copper is filled into the trenches. After copper filling, excess copper material remains on the wafer surface. Chemical mechanical polishing (CMP) can precisely remove this excess copper, leaving only the copper wires in the trenches. This ensures that each wire is insulated from the others, preventing short circuits. Polishing eliminates these microscopic defects, thereby significantly improving the yield of chips on the wafer.

[0023] In an embodiment of this utility model, the drive component 30 is used to provide power to the polishing head component 20 so that the polishing head component 20 rotates at high speed. The polishing head component 20 includes, but is not limited to, a rotating platform and a polishing pad. When polishing a wafer, the wafer is pressed onto the rotating polishing pad by a wafer carrier (including, but not limited to, a vacuum chuck). Polishing liquid is sprayed through a nozzle so that a uniformly flowing film is formed between the wafer surface and the polishing pad. The polishing liquid reacts chemically with the wafer surface. The friction of the polishing pad surface scrapes away the undulations on the wafer surface that have been softened by the chemical reaction layer by layer, thereby achieving wafer surface polishing.

[0024] Furthermore, both the drive assembly 30 and the projectile assembly 20 are disposed on the substrate 10, which allows the drive assembly 30 and the projectile assembly 20 to be stably disposed relative to the substrate 10. This facilitates the stable transmission of power between the drive assembly 30 and the projectile assembly 20 and helps to ensure the rotational smoothness of the projectile assembly 20.

[0025] Furthermore, the drive assembly 30 includes a drive component 31 and a transmission component 32. The transmission component 32 includes a worm gear component and a worm component, which mesh and transmit power. The worm component is connected to the drive component 31, and the worm gear component is connected to the throwing head assembly 20. Specifically, in the drive component 31, the worm gear component and the worm wheel component are meshed and transmitted to transmit the output power of the drive component 31 to the throwing head assembly 20. The advantages of worm gear and worm shaft meshing transmission are as follows: First, the transmission ratio between worm gear and worm shaft is relatively large. The drive component 31 in this utility model includes, but is not limited to, a servo motor. Through the transmission connection between the worm shaft and drive component 31, the drive component 31 can drive the worm shaft to rotate around its axis. The radial side of the worm shaft is provided with continuous threads for synchronous rotation. After the teeth on the radial side of the worm gear mesh with the threads of the worm shaft, the worm gear rotates around its axis. The throwing head assembly 20 is connected to the central shaft of the worm gear so that the throwing head assembly 20 can rotate together with the worm gear. This enables the high-speed rotation of the throwing head assembly 20. With this configuration, while achieving high-speed rotation of the throwing head assembly 20, the volume and weight of the transmission component 32 can be reduced, thereby improving the structural compactness of the throwing head assembly 20 and reducing the assembly difficulty and subsequent maintenance difficulty of the throwing head assembly 20.

[0026] Furthermore, another advantage of the meshing transmission between the worm gear and the worm is that the radial side of the worm has continuous thread teeth. This makes the engagement and disengagement of the worm gear with and from the worm smooth and continuous. As a result, the power transmitted to the polishing head assembly 20 through the worm gear and the worm is smooth and stable, allowing the polishing head assembly 20 to rotate stably and at high speed. Thus, in the chemical mechanical polishing process, the force applied by the polishing head assembly 20 to the wafer polishing is stable and constant, which can improve the uniformity of wafer polishing and help improve the product yield of the chip.

[0027] Combination Figure 1 As shown, the throwing head assembly 20 is disposed on one side of the substrate 10 along the first direction, the driving assembly 30 is disposed on the side of the substrate 10 away from the throwing head assembly 20 along the first direction, and the worm gear member at least partially passes through the substrate 10 and is connected to the throwing head assembly 20.

[0028] Specifically, the polishing head assembly 20 and the driving assembly 30 are disposed on opposite sides of the substrate 10 along the first direction. This allows the driving assembly 30 to avoid obstruction around the polishing head assembly 20, ensuring unobstructed access and thus guaranteeing the reliability of the polishing head assembly 20 in polishing the wafer. A through-hole 11 is provided on the substrate 10, allowing the worm gear in the driving component 31 to pass through the substrate 10. This connects the worm gear to the polishing head assembly 20, enabling the worm gear to drive the polishing head assembly 20 to rotate at high speed, achieving chemical mechanical polishing of the wafer.

[0029] According to the embodiments of this utility model, in conjunction with Figure 1 and Figure 2 As shown, the rotation axis of the worm gear is perpendicular to the first direction, and the rotation axis of the worm wheel is parallel to the first direction.

[0030] Specifically, in this embodiment of the invention, the throwing head assembly 20 and the driving assembly 30 are respectively disposed on both sides of the substrate 10 along the first direction. In order to transmit the output power of the driving assembly 30 to the throwing head assembly 20, the power needs to be transmitted at least partially along the first direction in the transmission member 32. The worm gear, as a structure connected to the throwing head assembly 20 in the transmission member 32, has its rotation axis parallel to the first direction. This allows the worm gear to transmit power to the throwing head assembly 20 along the first direction, driving the throwing head assembly 20 to rotate around the rotation axis of the first direction.

[0031] Furthermore, when the rotation axis of the worm gear is parallel to the first direction, the rotation axis of the worm is designed to be perpendicular to the first direction. This not only allows the thrust of the worm gear along its axial direction to the worm wheel to be smoothly and efficiently converted into the rotational torque of the worm wheel, reducing the power loss in the drive component 31, thus reducing the power loss of the drive component 30 while ensuring the high-speed rotation of the throwing head assembly 20, but also changes the direction of force transmission between the worm and the worm wheel. This improves the structural compactness of the worm wheel and worm in the drive component 30, reduces the space occupied by the drive component 30 in the throwing head assembly 20, and facilitates the assembly, arrangement, and maintenance of the throwing head assembly 20 in the throwing head device 100.

[0032] Combination Figure 1 and Figure 2As shown, the worm gear and the drive member 31 are arranged along the second direction, the rotation axis of the worm gear is parallel to the second direction, and the worm wheel is disposed on one side of the worm gear along the third direction and meshes with the worm gear. The first direction, the second direction and the third direction are perpendicular to each other.

[0033] Specifically, the rotation axis of the worm gear is perpendicular to the first direction. The rotation axis of the worm gear is set as the second direction, and the drive member 31 and the worm gear are arranged along the second direction. This arrangement allows the rotation axis of the output shaft of the drive member 31 to be parallel to the rotation axis of the worm gear, thereby allowing the worm gear and the drive member 31 to be directly connected. This reduces the power loss between the drive member 31 and the worm gear, eliminating the need for other transmission structures between the drive member 31 and the worm gear. This not only improves the transmission efficiency between the drive member 31 and the worm gear but also enhances the structural compactness of the drive member 31 and the worm gear.

[0034] Furthermore, when the rotation axis of the worm gear is parallel to the second direction, the thread on the radial side of the worm gear rotates synchronously around the rotation axis of the worm gear. The worm wheel is located on one side of the worm gear along the third direction, and the third direction is perpendicular to the first and second directions. In this way, when the teeth on the radial side of the worm wheel mesh with the thread on the radial side of the worm gear, the rotation axis of the worm wheel can be made perpendicular to the second direction. This arrangement not only improves the transmission efficiency of power in the transmission component 32, but also ensures that the transmission component 32 converts the power from the second direction to the first direction and then transmits it to the throwing head assembly 20.

[0035] Combination Figure 2 As shown, the polishing head device 100 of the polishing equipment also includes a housing 40, a transmission member 32 disposed inside the housing 40, a worm gear member extending at least partially from the housing 40 and connected to the drive member 31, a worm wheel member extending at least partially from the housing 40 and connected to the polishing head assembly 20, and the housing 40 connected to the substrate 10.

[0036] Specifically, both the worm gear and the worm rotate relative to the substrate 10, and the worm gear passes through the substrate 10 at least partially. To ensure that the worm gear passes through the substrate 10 and rotates normally relative to the substrate 10, a housing 40 is provided outside the transmission member 32 in this embodiment of the invention. The housing 40 is used to connect with the substrate 10, and both the worm gear and the worm are disposed inside the housing 40. This allows the transmission member 32 to pass through the through hole 11 on the substrate 10 to transmit power from one side of the substrate 10 to the other side along the first direction, and also protects the worm gear and the worm from colliding with the substrate 10 during rotation, thereby improving the transmission reliability of the worm gear and the worm.

[0037] Furthermore, the worm gear extends at least partially from the housing 40 along the second direction, which facilitates the transmission connection between the worm gear and the drive 31, and the worm wheel extends at least partially from the housing 40 along the first direction, which facilitates the transmission connection between the worm wheel and the throwing head assembly 20.

[0038] Combination Figure 1 and Figure 2 As shown, the drive assembly 30 includes a connector 33 that extends in a first direction, and both ends of the connector 33 are connected to the worm gear and the throwing head assembly 20, respectively.

[0039] Specifically, a connector 33 is provided at one end of the worm gear component near the throwing head assembly 20 along the first direction. The length of the transmission component 32 along the first direction can be increased by the connector 33, which facilitates the connection between the worm gear component and the throwing head assembly 20. With this configuration in this embodiment of the present invention, the worm gear component can be a commonly used part in the prior art. There is no need to make additional mold design and production for the worm gear component with an extended rotation axis. The power transmission between the worm gear component and the throwing head assembly 20 can be realized by the connector 33 alone.

[0040] Furthermore, in an embodiment of this utility model, the connector 33 includes a connecting rod 331 and a connecting disc 332. The connecting rod 331 extends along a first direction and one end is connected to the worm gear. The connecting disc 332 is disposed at the end of the connecting rod 331 near the polishing head assembly 20 along the first direction. The radial dimension of the connecting disc 332 is larger than the radial dimension of the connector 33, which allows the connecting disc 332 to be adapted to connect with the rotating cross 21 in the polishing head assembly 20 for mounting the polishing head. This increases the contact area between the connector 33 and the polishing head assembly 20, thereby increasing the limit torque transmitted between the connector 33 and the polishing head assembly 20. When the polishing head assembly 20 rotates at high speed, it can prevent relative sliding between the transmission member 32 and the polishing head assembly 20, thereby improving the reliability of the polishing head assembly 20 during the polishing process.

[0041] Combination Figure 1 and Figure 2 As shown, the polishing head device 100 of the polishing equipment also includes a protective cover 50. The polishing head assembly 20 is spaced apart from the substrate 10. The protective cover 50 covers the circumferential outer side of the connector 33 and is located between the polishing head assembly 20 and the substrate 10.

[0042] Specifically, the connector 33 is located at the end of the worm gear member close to the throwing head assembly 20 along the first direction, and the connector 33 passes through the through hole 11 on the substrate 10. Since the connector 33 needs to drive between the worm gear member and the throwing head assembly 20, the connector 33 is also rotatable relative to the substrate 10. In order to ensure power transmission efficiency and reduce power transmission loss, the connector 33 of this utility model is spaced apart from the substrate 10.

[0043] In this embodiment of the invention, a protective cover 50 is provided around the connector 33. The protective cover 50 is disposed between the throwing head assembly 20 and the base plate 10, and the protective cover 50 covers the outside of the connector 33. This can protect the part of the connector 33 that passes through the base plate 10 and is connected to the throwing head assembly 20. This not only prevents foreign objects from touching the connector 33 and causing the connector 33 to jam or tilt, but also prevents foreign objects from falling into the drive member 31 through the through hole 11 on the base plate 10. This arrangement can protect the working safety of the transmission member 32 and ensure smooth power transmission between the drive member 31 and the throwing head assembly 20.

[0044] Combination Figure 2 As shown, the drive assembly 30 also includes a coupling 60, which connects the drive assembly 31 and the worm gear assembly.

[0045] Specifically, the driving component 31 of this utility model includes, but is not limited to, a servo motor. When a servo motor is used as the driving component 31, the motor transmits power through its output shaft. At least one end of the worm gear is provided with a connecting shaft 321 along its rotation axis. The output shaft of the servo motor and the connecting shaft 321 of the worm gear are connected by a coupling 60. This not only facilitates the assembly and connection of the driving component 31 and the worm gear, but also improves the transmission efficiency between the driving component 31 and the worm gear.

[0046] Combination Figure 1 As shown, the orthographic projection of the substrate 10 in the first direction covers the orthographic projection of the drive assembly 30 and the throwing head assembly 20 in the first direction.

[0047] Specifically, the drive assembly 30 and the polishing head assembly 20 are respectively disposed on both sides of the substrate 10 along the first direction, and power is transmitted through the substrate 10. Setting the orthographic projection of the substrate 10 along the first direction to cover the orthographic projections of both the drive assembly 30 and the polishing head assembly 20 in the first direction allows the substrate 10 to provide stable placement positions for both the drive assembly 30 and the polishing head assembly 20. This not only ensures the reliability of the placement of the drive assembly 30 and the polishing head assembly 20 in the polishing head device 100, but also allows the larger the volume of the substrate 10, the greater the rotational torque and load it can bear. This helps maintain the structural stability of the polishing head assembly 20 under high-speed rotation conditions, thereby improving the polishing accuracy of the wafer and increasing the product yield of the chip.

[0048] On the other hand, the substrate 10 can completely separate the drive assembly 30 and the polishing head assembly 20. This can prevent the material on the wafer that is ground off in the polishing head assembly 20 from falling into the drive component 31 and the transmission component 32, thereby reducing the wear and corrosion of the drive assembly 30 by the material and minimizing the wear of the drive component 31 and the transmission component 32 under long-term operation. This can extend the service life of the drive assembly 30 and ensure the smooth transmission of power in the polishing head device 100 even after a long period of use.

[0049] According to an embodiment of this utility model, a polishing head device 100 is configured within the polishing equipment. In the polishing head device 100, the cooperation of the worm gear and worm shaft makes the power transmitted within the device more stable. Thus, the polishing equipment equipped with the polishing head device 100 allows for more uniform wafer polishing, further improving the surface smoothing accuracy of each layer of the wafer. This better ensures the clarity of the photolithographic circuitry on the wafer and reduces the probability of internal chip breakage, short circuits, and poor contact. Furthermore, this low-disturbance transmission characteristic allows for more precise removal of excess copper layers outside the trenches on the wafer surface, leaving only the metal wires within the trenches after polishing, thereby ensuring insulation and short-circuit protection between the wires. The polishing equipment in this embodiment can better eliminate microscopic defects on the wafer surface, effectively improving the uniformity of wafer polishing and product yield.

[0050] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "circumferential", "radial", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0052] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A polishing head device for a polishing equipment, characterized in that, include: base(10); A projectile head assembly (20) is disposed on the substrate (10); A drive assembly (30) is disposed on the substrate (10). The drive assembly (30) includes a drive member (31) and a transmission member (32). The transmission member (32) includes a worm gear member and a worm member. The worm gear member and the worm member mesh and transmit power. The worm member is connected to the drive member (31) and the worm gear member is connected to the throwing head assembly (20).

2. The polishing head device of the polishing equipment according to claim 1, characterized in that, The throwing head assembly (20) is disposed on one side of the substrate (10) along a first direction, the driving assembly (30) is disposed on the side of the substrate (10) away from the throwing head assembly (20) along the first direction, and the worm gear member at least partially passes through the substrate (10) and is connected to the throwing head assembly (20).

3. The polishing head device of the polishing equipment according to claim 2, characterized in that, The rotation axis of the worm gear is perpendicular to the first direction, and the rotation axis of the worm wheel is parallel to the first direction.

4. The polishing head device of the polishing equipment according to claim 3, characterized in that, The worm gear and the drive member (31) are arranged along the second direction, the rotation axis of the worm gear is parallel to the second direction, and the worm wheel is disposed on one side of the worm gear along the third direction and meshes with the worm gear, wherein the first direction, the second direction and the third direction are perpendicular to each other.

5. The polishing head device of the polishing equipment according to claim 2, characterized in that, It also includes a housing (40), the transmission member (32) is disposed in the housing (40), the worm member extends at least partially from the housing (40) and is connected to the drive member (31), the worm wheel member extends at least partially from the housing (40) and is connected to the throwing head assembly (20), and the housing (40) is connected to the base plate (10).

6. The polishing head device of the polishing equipment according to claim 2, characterized in that, The drive assembly (30) includes a connector (33) extending in a first direction, the two ends of which are connected to the worm gear and the throwing head assembly (20), respectively.

7. The polishing head device of the polishing equipment according to claim 6, characterized in that, It also includes a protective cover (50), the projectile assembly (20) is spaced apart from the substrate (10), the protective cover (50) covers the circumferential outside of the connector (33) and is located between the projectile assembly (20) and the substrate (10).

8. The polishing head device of the polishing equipment according to claim 1, characterized in that, The drive assembly (30) further includes a coupling (60), which connects the drive assembly (31) and the worm gear assembly.

9. The polishing head device of the polishing equipment according to claim 1, characterized in that, The orthographic projection of the substrate (10) in the first direction covers the orthographic projection of the drive assembly (30) and the throwing head assembly (20) in the first direction.

10. A polishing device, characterized in that, The polishing head device of the polishing apparatus according to any one of claims 1-9.

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