A semiconductor double-sided polishing machine with a correction disc fixing device

CN224826046UActive Publication Date: 2026-10-09CORE MICRO SEMICONDUCTOR (LANGFANG) CO LTD
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Patent Information

Application Number
CN202522428200.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-17
Publication Date
2026-10-09
Estimated Expiration
2035-11-17

AI Technical Summary

Technical Problem

但受限于无翻转换面结构,操作人员需先拆卸夹紧组件,将修正盘从固定装置上完整取下,手动完成翻面后再重新对位安装并锁紧,该过程不仅操作繁琐、耗时较长,严重影响整体加工效率;且多次拆卸与重新安装易导致修正盘的定位基准出现偏差,进而影响抛光垫的修正精度,最终对半导体晶圆的加工质量造成不利影响;同时,频繁的拆卸操作还会增加修正盘边缘及固定装置夹紧部件的磨损,降低设备与配件的使用寿命,提升生产维护成本

Benefits of technology

[0016]在本实用新型的方案中:

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Abstract

The utility model belongs to the technical field of polishing machine especially is involved with a kind of correction disc fixing device for semiconductor double-sided polishing machine, including installation frame and clamping mechanism, the clamping mechanism is movably arranged in the inside of installation frame, the clamping mechanism includes first positioning ring and second positioning ring, the first positioning ring and the second positioning ring are all semicircular ring structure;First electric telescopic link, the first electric telescopic link fixed installation is in the left end middle part position of installation frame, and the telescopic end of first electric telescopic link is connected with first positioning ring bearing;Traction mechanism, the traction mechanism includes connecting shaft, convex part and fixed column, and connecting shaft bearing is installed in the right end middle part position of installation frame.The utility model can complete turning over switching without disassembling correction disc, solve the tedious problem that traditional fixing device needs manual disassembly, re-alignment installation, can greatly shorten turning over operation time, improve overall processing efficiency.
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Description

Technical Field

[0001] This utility model belongs to the field of polishing machine technology, and in particular relates to a correction disc fixing device for a semiconductor double-sided polishing machine. Background Technology

[0002] In semiconductor device manufacturing, double-sided polishing machines are the core equipment for achieving high-precision double-sided polishing of wafers. The correction disk, as a key component ensuring the flatness of the polishing pad, directly affects polishing accuracy and processing consistency through its stable installation and fixation. Existing correction disk fixing devices for semiconductor double-sided polishing machines typically consist of a base, clamping components, and positioning pins. The clamping components apply a fixing force to the edge or a specific reference surface of the correction disk, ensuring stable contact between the correction disk and the polishing pad during the polishing operation. This ensures that the correction disk can effectively correct the surface irregularities of the polishing pad, maintain the processing accuracy of the polishing pad, and meet the process requirements of double-sided polishing of semiconductor wafers.

[0003] Existing correction disc fixing devices are designed primarily for stability in a single direction, generally lacking the ability to flip and reposition the disc. Since both working surfaces of the correction disc have polishing pad correction capabilities, in actual processing scenarios, when one working surface reaches a certain level of wear, it is necessary to switch to the other working surface to continue operation. However, due to the lack of a flip-and-reposition structure, operators must first disassemble the clamping components, completely remove the correction disc from the fixing device, manually flip it, and then reposition and lock it. This process is not only cumbersome and time-consuming, severely impacting overall processing efficiency, but repeated disassembly and reassembly can also cause deviations in the positioning reference of the correction disc, thus affecting the correction accuracy of the polishing pad and ultimately adversely affecting the processing quality of semiconductor wafers. Furthermore, frequent disassembly operations increase wear on the edges of the correction disc and the clamping components of the fixing device, reducing the lifespan of equipment and accessories and increasing production and maintenance costs. Therefore, there is an urgent need to improve existing correction disc fixing devices and provide a correction disc fixing device for semiconductor double-sided polishing machines. Utility Model Content

[0004] The purpose of this utility model is to address the shortcomings of the existing technology by providing a reasonable design, simple structure, and flip-over function for fixing a correction disc in a semiconductor double-sided polishing machine, thereby solving the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A correction disc fixing device for a semiconductor double-sided polishing machine, comprising:

[0007] The mounting frame and clamping mechanism are movably located inside the mounting frame. The clamping mechanism includes a first positioning ring and a second positioning ring, both of which are semi-circular ring structures.

[0008] The first electric telescopic rod is fixedly installed at the middle position of the left end of the mounting frame, and the telescopic end of the first electric telescopic rod is connected to the first positioning ring bearing.

[0009] The traction mechanism includes a connecting shaft, a protrusion, and a fixing post. The connecting shaft bearing is installed at the middle of the right end of the mounting frame. One end of the connecting shaft is fixedly connected to the second positioning ring. The outer wall of the other end of the connecting shaft is fixed with a protrusion. The right side of the protrusion away from the connecting shaft is fixed with a fixing post.

[0010] In a preferred embodiment, support legs are fixedly installed at the bottom of each of the four right angles of the mounting frame.

[0011] In a preferred embodiment, both the inner surfaces of the first positioning ring and the second positioning ring are bonded with anti-slip pads, which are made of elastic rubber and whose outer surfaces are roughened.

[0012] In a preferred embodiment, limit rods are fixed at both ends of the second positioning ring, and the limit rods pass through the first positioning ring and are slidably connected to the first positioning ring.

[0013] In a preferred embodiment, a flipping drive mechanism is also included. The flipping drive mechanism includes a bracket, a second electric telescopic rod, and an adjusting plate. There are two brackets, both of which are fixed to the right side surface of the mounting frame. The second electric telescopic rod is fixedly mounted on the bracket, and the adjusting plate is fixedly mounted on the telescopic end of the second electric telescopic rod.

[0014] In a preferred embodiment, the adjusting plate has a guide groove inside, the longitudinal section of the guide groove is inverted "V" shape, and the end of the fixing column away from the protrusion is guided and slidably located in the guide groove.

[0015] In a preferred embodiment, a controller is further included, fixed to the outer left front wall of the mounting frame, and both the first and second electric telescopic rods are electrically connected to the controller. Compared with the prior art, the advantages of this utility model are:

[0016] In the solution of this utility model:

[0017] In this device, the first electric telescopic rod can drive the first positioning ring to move horizontally along the limiting rod, forming a cooperative clamping effect with the second positioning ring, which can quickly achieve the positioning of the correction disc. The inner surfaces of the first and second positioning rings are both bonded with rubber anti-slip pads, and the outer surface of the anti-slip pads is roughened. This can increase the contact friction between the clamping surface and the correction disc, and also prevent excessive clamping force from damaging the correction disc. It effectively prevents the correction disc from slipping or deflecting during the polishing operation, significantly improves the stability and reliability of clamping and positioning, and provides a basic guarantee for the correction accuracy of the polishing pad.

[0018] By controlling the retraction of the second electric telescopic rod, the adjusting plate can be moved horizontally forward. The inverted "V"-shaped guide groove inside the adjusting plate can guide and squeeze the fixed column, thereby driving the protrusion, connecting shaft, second positioning ring and first positioning ring to rotate 180° synchronously around the connecting shaft. This allows for flipping and switching without disassembling the correction disc, solving the cumbersome problem of manual disassembly and re-alignment of traditional fixing devices. It not only significantly shortens the flipping operation time and improves the overall processing efficiency, but also avoids positioning reference deviation caused by multiple disassemblies, ensuring the consistency of correction accuracy when the correction disc is used on both sides. At the same time, it reduces the wear of the correction disc and clamping components, extends the service life, and reduces production and maintenance costs. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings are described as follows:

[0020] Figure 1 This is a three-dimensional front view structural diagram of the present invention;

[0021] Figure 2 This is a top view of the clamping mechanism of this utility model;

[0022] Figure 3 This is a right-side view of the structure of the second positioning ring and the connecting shaft of this utility model;

[0023] Figure 4 This is a schematic diagram of the clamping mechanism of this utility model in its rotating state.

[0024] In the picture:

[0025] 1. Mounting frame; 2. Supporting legs; 3. First positioning ring; 4. Second positioning ring; 5. Limiting rod; 6. Anti-slip pad; 7. First electric telescopic rod; 8. Connecting shaft; 9. Protrusion; 10. Fixing column; 11. Bracket; 12. Second electric telescopic rod; 13. Adjusting plate; 14. Guide groove; 15. Controller. Detailed Implementation

[0026] The embodiments described below are merely some embodiments of the present invention and do not represent all embodiments consistent with the present invention. Exemplary embodiments will now be described with reference to the accompanying drawings:

[0027] like Figure 1-4 As shown, the correction disc fixing device for a semiconductor double-sided polishing machine of this utility model includes:

[0028] The mounting frame 1 and the clamping mechanism are movably located inside the mounting frame 1. The clamping mechanism includes a first positioning ring 3 and a second positioning ring 4, both of which are semi-circular ring structures.

[0029] The first electric telescopic rod 7 is fixedly installed at the middle of the left end of the mounting frame 1, and the telescopic end of the first electric telescopic rod 7 is connected to the bearing of the first positioning ring 3.

[0030] The traction mechanism includes a connecting shaft 8, a protrusion 9, and a fixing post 10. The connecting shaft 8 is mounted on the right side of the mounting frame 1. One end of the connecting shaft 8 is fixedly connected to the second positioning ring 4. The other end of the connecting shaft 8 has a protrusion 9 fixed on its outer wall. The right side of the protrusion 9 away from the connecting shaft 8 has a fixing post 10 fixed on it.

[0031] Based on the above structure, support legs 2 are fixedly installed at the bottom of the four right angles of the mounting frame 1.

[0032] In this embodiment, the support bracket 2 facilitates the positioning and installation of the mounting frame 1.

[0033] Based on the above structure, anti-slip pads 6 are bonded to the inner surfaces of both the first positioning ring 3 and the second positioning ring 4. The anti-slip pads 6 are made of elastic rubber, and the outer surface of the anti-slip pads 6 is roughened.

[0034] In this embodiment, the anti-slip pad 6 can increase the contact friction between the clamping surface and the correction disk, and avoid damage to the correction disk caused by excessive clamping force. This effectively prevents the correction disk from slipping or deflecting during the polishing process, and significantly improves the stability and reliability of clamping and positioning.

[0035] Based on the above structure, limit rods 5 are fixed at both ends of the second positioning ring 4. The limit rods 5 pass through the first positioning ring 3 and are slidably connected to the first positioning ring 3.

[0036] In this embodiment, the limiting rod 5 is used to facilitate the synchronous rotation of the first positioning ring 3 and the second positioning ring 4.

[0037] Based on the above structure, a flipping drive mechanism is also included. The flipping drive mechanism includes a bracket 11, a second electric telescopic rod 12, and an adjustment plate 13. There are two brackets 11, both of which are fixed to the right side surface of the mounting frame 1. The second electric telescopic rod 12 is fixedly installed on the bracket 11, and the adjustment plate 13 is fixedly installed on the telescopic end of the second electric telescopic rod 12.

[0038] In this embodiment, the extension and retraction of the second electric telescopic rod 12 facilitates the horizontal movement of the adjustment plate 13.

[0039] Based on the above structure, the inside of the adjusting plate 13 is provided with a guide groove 14. The longitudinal section of the guide groove 14 is inverted "V" shape, and the end of the fixed column 10 away from the protrusion 9 is guided and slidably located in the guide groove 14.

[0040] In this embodiment, when the control adjustment plate 13 moves horizontally forward, the guide groove 14 inside it can squeeze the fixed column 10, thereby facilitating the control clamping mechanism to rotate 180°, so that the flipping can be completed without disassembling the correction plate.

[0041] Based on the above structure, a controller 15 is also included, which is fixed to the outer wall of the left front of the mounting frame 1. The first electric telescopic rod 7 and the second electric telescopic rod 12 are both electrically connected to the controller 15.

[0042] In this embodiment, the controller 15 is used to facilitate the operation of the first electric telescopic pole 7 and the second electric telescopic pole 12.

[0043] The working principle of this utility model is as follows:

[0044] In use, the correction disc is first placed between the first positioning ring 3 and the second positioning ring 4, and the first electric telescopic rod 7 is activated. This controls the first positioning ring 3 to slide stably along the limiting rod 5 toward the second positioning ring 4, thus forming a cooperative clamping effect with the second positioning ring 4 to achieve positioning of the correction disc. Moreover, the use of the rubber anti-slip pad 6 can increase the contact friction between the first positioning ring 3 and the second positioning ring 4 and the correction disc, and avoid damage to the correction disc caused by excessive clamping force. This effectively prevents the correction disc from slipping or deflecting during the polishing operation, significantly improving the stability and reliability of clamping and positioning, and providing a basic guarantee for the correction accuracy of the polishing pad.

[0045] When it is necessary to control the changing of the correction disc, the second electric telescopic rod 12 can be retracted to move the adjusting plate 13 horizontally forward. The inverted "V" shaped guide groove 14 inside the adjusting plate 13 can squeeze the fixed column 10, thereby driving the protrusion 9, the connecting shaft 8 and the clamping mechanism to rotate 180° around the connecting shaft 8. This allows the correction disc to be flipped without disassembling it, solving the cumbersome problem of manual disassembly and re-alignment of traditional fixing devices. It not only greatly shortens the flipping operation time and improves the overall processing efficiency, but also avoids the positioning reference deviation caused by multiple disassemblies, ensuring the consistency of correction accuracy when the correction disc is used on both sides. At the same time, it reduces the wear of the correction disc and clamping parts, extends the service life and reduces production and maintenance costs.

[0046] It should be noted that this device is powered by an external power source. The first electric telescopic rod 7, the second electric telescopic rod 12, and the controller 15 in this solution are all existing electrical appliances. Their specific structures, control principles, and operation methods are all mature and widely used existing technologies, so they will not be described in detail.

[0047] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any equivalent changes, modifications, substitutions, and variations made by those skilled in the art based on the concept of this utility model and on the basis of existing technology through logical analysis, reasoning, or limited experiments shall be within the scope of protection defined by the claims.

Claims

1. A correction disc fixing device for a semiconductor double-sided polishing machine, characterized in that, include: The mounting frame (1) and the clamping mechanism are movably located inside the mounting frame (1). The clamping mechanism includes a first positioning ring (3) and a second positioning ring (4). Both the first positioning ring (3) and the second positioning ring (4) are semi-circular ring structures. The first electric telescopic rod (7) is fixedly installed at the middle position of the left end of the mounting frame (1), and the telescopic end of the first electric telescopic rod (7) is connected to the bearing of the first positioning ring (3). The traction mechanism includes a connecting shaft (8), a protrusion (9), and a fixing column (10). The connecting shaft (8) is mounted on the right side of the mounting frame (1). One end of the connecting shaft (8) is fixedly connected to the second positioning ring (4). The other end of the connecting shaft (8) has a protrusion (9) fixed on its outer wall. The right side of the protrusion (9) away from the connecting shaft (8) has a fixing column (10) fixed.

2. The correction disc fixing device for a semiconductor double-sided polishing machine according to claim 1, characterized in that: The mounting frame (1) has support brackets (2) fixedly installed at the bottom of each of the four right angles.

3. The correction disc fixing device for a semiconductor double-sided polishing machine according to claim 1, characterized in that: The inner surfaces of both the first positioning ring (3) and the second positioning ring (4) are bonded with anti-slip pads (6), which are made of elastic rubber and have a roughened outer surface.

4. The correction disc fixing device for a semiconductor double-sided polishing machine according to claim 1, characterized in that: Both ends of the second positioning ring (4) are fixed with limit rods (5), which pass through the first positioning ring (3) and are slidably connected to the first positioning ring (3).

5. The correction disc fixing device for a semiconductor double-sided polishing machine according to claim 1, characterized in that: It also includes a flipping drive mechanism, which includes a bracket (11), a second electric telescopic rod (12) and an adjustment plate (13). There are two brackets (11) and both are fixed to the right side surface of the mounting frame (1). The second electric telescopic rod (12) is fixedly installed on the bracket (11) and the adjustment plate (13) is fixedly installed on the telescopic end of the second electric telescopic rod (12).

6. The correction disc fixing device for a semiconductor double-sided polishing machine according to claim 5, characterized in that: The adjusting plate (13) has a guide groove (14) inside. The longitudinal section of the guide groove (14) is inverted "V" shape. The end of the fixed column (10) away from the protrusion (9) is guided and slidably located in the guide groove (14).

7. The correction disc fixing device for a semiconductor double-sided polishing machine according to claim 6, characterized in that: It also includes a controller (15) fixed to the outer wall of the left front of the mounting frame (1), and the first electric telescopic rod (7) and the second electric telescopic rod (12) are both electrically connected to the controller (15).