Screen disassembly module

Abstract

The application discloses a screen dismounting module, which comprises a base, a heating platform and at least one suction cup. The base is provided with a plurality of connecting portions for selectively mounting the suction cup, so that the suction cup avoids the area with excessive deformation in the deformed electronic device and cannot be adsorbed. The suction cup is used for adsorbing and fixing the electronic device on the heating platform. The heating platform is used for heating the electronic device. The application provides a screen dismounting module for the deformed electronic device with a screen. Through the cooperation of the adjustable suction cup assembly and the optimized heating platform, the stable fixation and heating of the deformed electronic device are realized, and the operator can effectively complete the screen dismounting operation. The screen dismounting module can effectively solve the problem that the screen cannot be dismounted by using the conventional method due to the deformation of the electronic device, effectively reduces the scrappage rate of the electronic device, and further reduces the resource waste.

Description

Technical Field

[0001] This application relates to the field of electronic device repair technology, and in particular to a screen disassembly module. Background Technology

[0002] Modern electronic devices all have screens. During use, impacts, pressure, and other factors can cause screen deformation, potentially leading to malfunctions such as the device failing to power on, charge, display, or touchscreen becoming unresponsive. In such cases, repair is necessary, which requires screen disassembly. For devices with severely deformed screens, where existing disassembly tools are unsuitable, the device is generally scrapped, or the operator flattens it by pressing before disassembling the screen.

[0003] Currently, screen removal equipment for electronic devices with significant deformation is handled in two ways: scrapping and reshaping. Scrapping leads to resource waste, while reshaping can compress the battery inside the electronic device, easily causing internal short circuits and resulting in a very high risk of spontaneous combustion and smoke, posing a serious safety hazard. Utility Model Content

[0004] This application discloses a screen removal module that can remove deformed electronic devices with screens, effectively reducing the possibility of electronic devices being scrapped due to non-recyclability and reducing resource waste.

[0005] Some embodiments of this application provide a screen removal module for removing the screen of an electronic device. The screen removal module includes a base, a heating platform, and at least one suction cup. The base has multiple connecting parts. The heating platform is connected to the base. The suction cup is connected to one of the multiple connecting parts and is configured to adhere to the side of the electronic device away from the screen, so that the electronic device is adhered to the heating platform.

[0006] The aforementioned screen removal module, through its multi-connector design, allows the suction cup to selectively attach to the base, avoiding areas of significant surface deformation on the electronic device. This not only reduces deformation of the suction cup during adsorption but also ensures a better fit between the suction cup and the device's surface. This design allows deformed electronic devices to be more effectively adsorbed and fixed to the heating platform. Finally, the heating platform heats the electronic device to soften the adhesive, making screen removal easier for operators.

[0007] According to some embodiments of this application, the heating platform has a heating surface configured to contact the side of the electronic device facing away from the screen. The suction cup has an adsorption end configured to contact the electronic device. In its natural state, the adsorption end protrudes from the heating surface, and along the direction in which the adsorption end moves the electronic device toward the heating platform, the distance H between the adsorption end and the heating surface satisfies: 3mm ≤ H ≤ 25mm. Within the range of distance H, the suction cup is adjustablely connected to the connecting portion.

[0008] In the above embodiments, the suction cup is adjustablely connected to the connecting part so that the distance H between the adsorption end and the heating surface satisfies: 3mm≤H≤25mm, thereby enabling the suction cup to effectively adsorb electronic devices with large deformation.

[0009] According to some embodiments of this application, there are multiple suction cups, which are configured to employ independent negative pressure adsorption electronic devices, with each suction cup connected to one of multiple connecting parts.

[0010] In the above embodiments, the independent negative pressure allows each suction cup to operate independently without affecting each other. This reduces the risk that a vacuum break in one suction cup, as is the case with concentrated negative pressure, could cause other suction cups to fail to adhere, thus further enhancing the reliability of the suction cup adsorption electronic device.

[0011] According to some embodiments of this application, the suction cup is a corrugated suction cup.

[0012] When the corrugated suction cup is used to attach electronic devices, the suction cup can extend and retract at different angles, allowing it to adapt to the curved surface of the electronic device and further stabilize the attachment.

[0013] According to some embodiments of this application, the connecting part is one of a threaded hole and a threaded post provided in the base, and the suction cup is provided with the other of a threaded hole and a threaded post that are threadedly engaged with the connecting part.

[0014] In the above embodiments, the suction cup is threadedly engaged with the connecting part, and rotating the suction cup can adjust the height of the suction cup relative to the base.

[0015] According to some embodiments of this application, the base is provided with a stop portion located on one side of the heating platform, the stop portion protruding from the side of the heating platform used for contacting electronic equipment.

[0016] In the above embodiments, by blocking the electronic device with the stop part, the possibility of the electronic device detaching from the screen removal module during the adhesive scraping operation can be reduced.

[0017] According to some embodiments of this application, the heating platform is detachably connected to the base.

[0018] In the above embodiments, the heating platform is easier to assemble and disassemble, which is beneficial for adapting to more types of electronic devices by replacing the heating platform, thus improving the versatility of the screen disassembly module.

[0019] According to some embodiments of this application, the heating platform is provided with a recess, which is configured to accommodate a protrusion on the side of an electronic device away from the screen.

[0020] According to some embodiments of this application, the diameter D of the adsorption end satisfies: 40mm≤D≤80mm.

[0021] In the above embodiments, the suction cup is often made of flexible material. The diameter of the suction end of the screen removal module is larger than that of the suction end of conventional screen removal devices. The suction cup has a greater degree of freedom of deformation. When the diameter of the suction end of the suction cup meets the requirement of 40mm≤D≤80mm, it can better fit the deformable surface of the electronic device, thereby enhancing the stability of the suction cup adsorbing the electronic device.

[0022] Some embodiments of this application also propose a screen removal module for removing the screen of an electronic device. The screen removal module includes a base, a heating platform, and at least one suction cup. The heating platform is connected to the base; the suction cup is connected to the base and configured to adsorb the side of the electronic device away from the screen, so that the electronic device is adsorbed onto the heating platform. The diameter D of the adsorption end satisfies: 40mm ≤ D ≤ 80mm.

[0023] In the aforementioned screen removal module, the suction cup is often made of flexible material. The diameter of the suction end of this screen removal module is larger than that of the suction end of conventional screen removal equipment. The suction cup has a greater degree of freedom of deformation. When the diameter of the suction end of the suction cup meets the requirement of 40mm≤D≤80mm, it can better fit the deformable surface of the electronic device, thereby enhancing the stability of the suction cup adsorbing the electronic device and making it easier for the operator to complete the screen separation. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following figures only illustrate certain embodiments of this application and should not be construed as limiting the scope.

[0025] Figure 1 This is a schematic diagram of the structure of a screen disassembly module provided in one embodiment of this application; Figure 2 for Figure 1 The sectional view of the screen disassembly module along line AA shown; Figure 3 for Figure 2 The cutaway view of the screen removal module in its working state is shown. Figure 4 This application provides a schematic diagram of the structure of a screen disassembly module according to another embodiment of the present application; Figure 5 A schematic diagram of a modified electronic device using the screen disassembly module positioning method described in this application; Figure 6 A cross-sectional view of a suction cup provided in an embodiment of this application; Figure 7 This application provides a schematic diagram of the structure of a screen disassembly module according to another embodiment of the present application; Figure 8 This is a schematic diagram of the structure of a heating platform provided in one embodiment of this application; Figure 9 A schematic diagram of the structure of a screen disassembly module provided in another embodiment of this application; Figure 10 This is a schematic diagram of a screen disassembly module provided in another embodiment of this application.

[0026] Explanation of main component symbols: 100, 100a, 100b, 100c, 100d, screen disassembly module; 10, base; 20, heating platform; 30, suction cup; 40, electronic device; 11, connecting part; 12, 12a, stop part; 13, positioning hole; 121, stop block; 21, heating surface; 22, clearance opening; 31, adsorption end; 41, screen; Z, direction. Detailed Implementation

[0027] The implementation of this application will now be described with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] like Figure 1 and Figure 3 As shown, one embodiment of this application provides a screen removal module 100. The screen removal module 100 can be used to remove the screen 41 of an electronic device 40. The screen removal module 100 includes a base 10, a heating platform 20, and at least one suction cup 30.

[0031] The base 10 has multiple connecting parts 11. The heating platform 20 is mounted on the base 10. There are two suction cups 30 and four connecting parts 11, but not limited to these. The four connecting parts 11 are arranged at intervals on the base 10. Each suction cup 30 can be selectively connected to one of the multiple connecting parts 11. The suction cups 30 are used to adsorb the side of the electronic device 40 away from the screen 41, so that the electronic device 40 is fixed to the heating platform 20.

[0032] The operator places the electronic device 40 on the screen removal module 100. The suction cup 30 is connected to the connection part 11 closest to the area of ​​the electronic device 40 with less deformation, so as to reduce the additional deformation caused by the deformation of the electronic device 40 during the process of the suction cup 30 adsorbing the electronic device 40, thereby improving the adsorption stability of the suction cup 30 adsorbing the electronic device 40.

[0033] The design of the suction cup 30, which can be flexibly installed on any connection part 11, has a stronger adaptability compared to the design of the suction cup 30 being fixed in the position of the base 10, and can adapt to electronic devices 40 with different degrees of deformation.

[0034] It is understood that in other embodiments, the number of connecting parts 11 may also be two, three, five, or other numbers. The number of suction cups 30 may also be one, three, or other numbers. This application does not limit the number of suction cups 30 and connecting parts 11, as long as the number of suction cups 30 is at least one and the number of connecting parts 11 is at least two.

[0035] like Figure 1 As shown in one embodiment of this application, the number of connecting parts 11 is four, and the number of suction cups 30 is two. For example... Figure 4 As shown, one embodiment of this application provides a screen disassembly module 100a, with nine connecting parts 11 and five suction cups 30. Figure 1 and Figure 4 As shown, the arrangement of the connecting part 11 and the selection of the suction cup 30 are both guided by the result that the suction cup 30 can adhere to the electronic device 40.

[0036] Electronic device 40 is placed flat on screen removal module 100. Suction cups 30 are preferentially installed in areas of electronic device 40 that are free from deformation or have minimal deformation. Suction cups 30 are connected to a negative pressure system to adsorb electronic device 40. If suction cups 30 stably adsorb electronic device 40, there is no need to adjust the installation of suction cups 30; otherwise, the position and number of suction cups 30 are adjusted until adsorption is stable.

[0037] like Figure 2 and Figure 3 As shown, the suction cup 30 has an adsorption end 31, which is a geometric plane enclosed by a closed curve formed by the suction cup 30 acting on the electronic device 40. The adsorption end 31 contacts the electronic device 40 when the suction cup 30 adsorbs the electronic device 40. The adsorption end 31 protrudes from the heating platform 20. After adsorbing the electronic device 40, the adsorption end 31 retracts and moves the electronic device 40 toward the heating platform 20 until the electronic device 40 is attached to the heating platform 20.

[0038] For clarity in subsequent explanations, direction Z is defined as the direction parallel to the adsorption end 31, which drives the electronic device 40 to move toward the heating platform 20.

[0039] like Figure 2 As shown, the heating platform 20 is provided with a heating surface 21. The heating surface 21 is the surface of the heating platform 20 used to contact the side of the electronic device 40 away from the screen 41. The heating surface 21 is used to support the electronic device 40. In its natural state, the suction cup 30 has its suction end 31 protruding in the opposite direction of direction Z on one side of the heating surface 21. The distance between the suction end 31 and the heating surface 21 in direction Z is defined as the distance H. The suction cup 30 is adjustablely connected to the connecting part 11, thereby adjusting the distance H. When the distance H satisfies the condition that 3mm ≤ H ≤ 25mm, the suction cup 30 can adsorb the electronic device 40 with a large maximum deformation amount h. For example, when the range of the maximum deformation amount h of the electronic device 40 is 6mm ≤ h ≤ 30mm, the suction cup 30 can stably adsorb the electronic device 40 on the heating platform 20. Figure 3 As shown, when the spacing H is 3mm ≤ H ≤ 25mm, the suction cup 30 can also adsorb undeformed electronic devices 40. For example, when the spacing H is 8mm, the suction cup 30 can stably adsorb electronic devices 40 with a maximum deformation h less than or equal to 20mm.

[0040] like Figure 5 As shown, when the electronic device 40 is placed flat on a horizontal plane and the screen 41 is located on the side of the electronic device 40 away from the horizontal plane, the distance between the side of the electronic device 40 away from the screen 41 and the horizontal plane at its farthest point is the maximum deformation h of the electronic device 40.

[0041] The spacing H can be adjusted based on the maximum deformation h, with the goal of ensuring that the suction end 31 can ultimately adhere to the electronic device 40. For example, if the suction cup 30 attempts to adhere to the electronic device 40 and finds that the maximum deformation h exceeds 20 mm and the suction end 31 cannot adhere to the electronic device 40, the spacing H can be increased to allow the suction end 31 to adhere to the electronic device 40.

[0042] like Figure 6 As shown, D represents the diameter of the adsorption end 31, and the diameter D of the adsorption end 31 is the diameter of the outer edge of the adsorption end 31.

[0043] In screen removal devices, when multiple suction cups 30 are arranged in an array and the diameter D of the suction end 31 is usually less than or equal to 25mm, it is difficult to adsorb electronic devices 40 with a large maximum deformation.

[0044] In the embodiments of this application, the diameter D of the adsorption end 31 satisfies: 40mm ≤ D ≤ 80mm. For example, the diameter of the adsorption end 31 can be 40mm, 45mm, 50mm, 55mm, 60mm, 65mm, 70mm, 75mm, or 80mm. When the diameter D of the adsorption end 31 is 50mm, the suction cup 30 can stably adsorb electronic devices 40 with a maximum deformation amount h less than or equal to 20mm.

[0045] The suction cup 30 is made of a flexible material, and the larger its diameter, the greater the deformation it produces under negative pressure. When the suction cup 30 deforms, the angle of the suction end 31 relative to the base 10 changes accordingly, thereby enabling it to adaptively fit the electronic device 40, which has a large maximum deformation h.

[0046] like Figure 6 As shown, the suction cup 30 is a corrugated suction cup. The cross-sectional edge of the corrugated suction cup has a wavy or pleated structure, and the suction cup 30 includes at least two pleats. When the suction cup 30 has a corrugated structure, the suction cup 30 adsorbs the electronic device 40. The corrugated structure can extend and retract at varying angles, allowing the suction cup 30 to adaptively conform to the curved surface of the electronic device 40, further stabilizing the adsorption of the electronic device 40.

[0047] In some embodiments of this application, when there are multiple suction cups 30, the multiple suction cups 30 are configured to use independent negative pressure adsorption electronic devices 40. Compared with centralized negative pressure, independent negative pressure allows each suction cup 30 to operate independently without affecting each other. This can reduce the risk that if one suction cup 30 breaks the vacuum in centralized negative pressure, it will cause other suction cups 30 to fail to adsorb, and further enhance the reliability of the suction cup 30 adsorption electronic devices 40.

[0048] In some embodiments of this application, the connecting part 11 is one of the threaded hole and threaded post provided in the base 10, and the suction cup 30 is provided with the other of the threaded hole and threaded post that are threadedly engaged with the connecting part 11. The connecting part 11 is mainly used for connecting the base 10 and the suction cup 30. When it is necessary to add or remove the suction cup 30, the presence of the connecting part 11 facilitates the disassembly and assembly of the suction cup 30.

[0049] In one embodiment of this application, the connecting part 11 is a threaded hole provided in the base 10, and the suction cup 30 is provided with a threaded post that cooperates with the connecting part 11. The threaded post of the suction cup 30 cooperates with the connecting part 11 of the base 10. By rotating the threaded post on the suction cup 30, the height of one side of the suction cup 30 adsorbing the electronic device 40 relative to the base 10 is adjusted, so that the suction cup 30 can move up and down in the direction Z until the suction cup 30 can reach a suitable position to adhere to the electronic device 40, thereby improving the stability of the suction cup 30 adsorbing the electronic device 40.

[0050] In another embodiment, the connecting part 11 is a threaded post provided on the base 10, and the suction cup 30 is provided with a threaded hole that mates with the threaded post. The threaded post of the base 10 mates with the threaded hole of the suction cup 30. By rotating the suction cup 30, the height of one side of the suction cup 30 adsorbing the electronic device 40 relative to the base 10 is adjusted, so that the suction cup 30 can move up and down in the direction Z until the suction cup 30 can reach a suitable position to adhere to the electronic device 40, thereby improving the stability of the suction cup 30 adsorbing the electronic device 40.

[0051] In some embodiments of this application, the heating platform 20 is a heat-conducting component and is connected to the base 10. The heating platform 20 is connected to a heating structure, such as a heating rod. The heating platform 20 absorbs the heat emitted by the heating structure and transfers the heat to the electronic device 40 in contact with the heating platform 20, softening the adhesive in the electronic device 40 and making it easier for the operator to scrape off the adhesive and remove the screen.

[0052] like Figure 7 As shown, one embodiment of this application provides a screen removal module 100b, in which a heating platform 20 is detachably connected to a base 10. The heating platform 20 can be replaced according to the different sizes of electronic devices 40 and the different structures of the side away from the screen 41, so that the screen removal module 100b can remove the screen 41 of more types of electronic devices 40, thereby improving the versatility of the screen removal module 100b.

[0053] In some embodiments of this application, the heating platform 20 is provided with a recess 22, which is a notch on the heating platform 20. The function of the recess 22 is to avoid the protruding portion of the electronic device 40 on the side opposite to the screen 41. The recess 22 is configured to accommodate the protruding portion of the electronic device 40 on the side opposite to the screen 41, so that the relatively flat portion on the side opposite to the screen 41 contacts the heating platform 20, that is, the electronic device 40 fits the heating platform 20 more closely, thereby achieving a more effective softening of the adhesive in the electronic device 40.

[0054] like Figure 8 As shown, the heating platform 20 has two opposite corners with clearance openings 22. When the electronic device 40 is adsorbed onto the heating platform 20, the clearance openings 22 can avoid the protruding parts of a single corner or opposite corner of the electronic device 40, avoid interference, and effectively improve the heating effect.

[0055] In some embodiments of this application, the base 10 is provided with a stop 12, which is located on one side of the heating platform 20 and protrudes along the Z direction from the side of the heating platform 20 used to contact the electronic device 40. When the operator inserts a scraper into the electronic device 40 on the side of the heating platform 20 away from the stop 12, a pushing force is generated on the electronic device 40; the electronic device 40 moves due to the pushing force, and the stop 12 blocks the electronic device 40, reducing the risk of the electronic device 40 detaching from the screen removal module 100.

[0056] like Figure 1 As shown in one embodiment of this application, the stop portion 12 includes a stop block 121, and the base 10 is provided with a positioning hole 13. The stop block 121 is installed in the positioning hole 13 to form the stop portion 12 of the base 10. When the stop block 121 is placed on the base 10, the height of the stop block 121 in the Z direction is higher than the heating surface 21, which can block the movement of the electronic device 40 during the glue scraping operation, and the stop block 121 is easy to install and remove.

[0057] like Figure 9 As shown, one embodiment of this application provides a screen removal module 100c, in which a portion of the base 10 protruding from one side of the heating surface 21 in the Z direction is a stop portion 12a, which blocks the movement of the electronic device 40 during the adhesive scraping operation. The stop portion 12a is formed on one side of the base 10, eliminating the step of installing the stop portion 12 onto the base 10 when the stop portion 12a is independent of the base 10.

[0058] Some embodiments of this application also propose a screen disassembly module 100d, in which the number of suction cups 30 and connecting parts 11 can be equal, and the position of the suction cups 30 is fixed. Figure 10 As shown, the screen removal module 100d includes a base 10, a heating platform 20, and a suction cup 30. The heating platform 20 is mounted on the base 10. The suction cup 30 is fixed to the base 10. The diameter D of the suction end 31 satisfies: 40mm ≤ D ≤ 80mm.

[0059] In screen removal devices, when multiple suction cups 30 are arranged in an array, and the diameter D of the suction end 31 is typically less than or equal to 25 mm, the suction cups struggle to adsorb electronic devices 40 with a large maximum deformation. However, the diameter of the suction end 31 in the screen removal module 100d is greater than or equal to 40 mm, resulting in a larger adsorption range for the suction cups 30. The suction cups 30 are made of flexible material; the larger their adsorption range and diameter, the greater the deformation under negative pressure. When the suction cups 30 deform, the angle of the suction end 31 relative to the base 10 changes accordingly, thus adaptively fitting the electronic device 40 with a larger maximum deformation h.

[0060] When the electronic device 40 is placed in the screen removal module 100d, the electronic device 40 comes into contact with the suction cup 30. The suction cup 30 can adapt to the deformation of the electronic device 40 through deformation. The large diameter design of the suction cup 30 provides a larger deformation compensation range, so that the suction cup 30 can adsorb and fix the deformed electronic device 40.

[0061] The adhesive-containing part of the electronic device 40 is adsorbed onto the heating platform 20. The heating platform 20 softens the adhesive in the electronic device 40 by heating the electronic device 40, making the screen 41 easy to separate from the electronic device 40.

[0062] When the screen is removed, the adhesive in the electronic device 40 softens, and the operator can use a scraper to cut the adhesive, allowing the screen 41 to be separated from the electronic device 40.

[0063] The structure inside the electronic device 40 with the screen 41 removed can be recycled as needed, reducing resource waste.

[0064] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and substance of the technical solutions of this application.

Claims

1. A screen removal module for removing the screen of an electronic device, characterized in that, The screen disassembly module includes: The base has multiple connecting parts; A heating platform is connected to the base; and At least one suction cup is connected to one of the plurality of connecting parts, and the suction cup is configured to adhere to the side of the electronic device away from the screen, so that the heating platform heats the electronic device.

2. The screen disassembly module according to claim 1, characterized in that, The heating platform is provided with a heating surface, which is configured to contact and heat the electronic device; the suction cup is provided with an adsorption end, which is configured to adsorb the electronic device. In its natural state, the suction cup has its adsorption end protruding from the heating surface and moving in the direction that drives the electronic device toward the heating platform. The distance H between the adsorption end and the heating surface satisfies: 3mm≤H≤25mm. Within the range of distance H, the suction cup is adjustablely connected to the connecting part.

3. The screen disassembly module according to claim 1, characterized in that, The number of suction cups is multiple, and the multiple suction cups are configured to independently adsorb the electronic device using negative pressure. Each suction cup is connected to one of the multiple connecting parts.

4. The screen disassembly module according to any one of claims 1 to 3, characterized in that, The suction cup is a corrugated suction cup.

5. The screen disassembly module according to any one of claims 1 to 3, characterized in that, The connecting part is one of the threaded hole and the threaded post provided on the base, and the suction cup is provided with the other of the threaded hole and the threaded post that are threadedly engaged with the connecting part.

6. The screen disassembly module according to any one of claims 1 to 3, characterized in that, The base is provided with a stop part, which is located on one side of the heating platform and is higher than the heating platform.

7. The screen disassembly module according to any one of claims 1 to 3, characterized in that, The heating platform is detachably connected to the base.

8. The screen disassembly module according to any one of claims 1 to 3, characterized in that, The heating platform is provided with a recess, which is configured to accommodate a protrusion on the side of the electronic device away from the screen.

9. The screen disassembly module according to claim 1 or 3, characterized in that, The suction cup is provided with an adsorption end, which is configured to contact the electronic device; the diameter D of the adsorption end satisfies: 40mm≤D≤80mm.

10. A screen removal module for removing the screen of an electronic device, characterized in that, The screen disassembly module includes: Base; A heating platform is connected to the base; and At least one suction cup is connected to the base. The suction cup has an adsorption end configured to contact the side of the electronic device away from the screen, so that the electronic device is adsorbed onto the heating platform. The diameter D of the adsorption end satisfies: 40mm≤D≤80mm.

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