processing apparatus

Abstract

The application discloses a processing equipment, including a shell, a worktable, a processing head, a driving mechanism and a first detection mechanism. The shell is provided with a containing space; the worktable is located in the containing space and is used for carrying a workpiece; the processing head is arranged in the containing space and is oppositely spaced apart from the worktable in a first direction, and is used for processing the workpiece placed on the worktable; the driving mechanism is arranged in the containing space, is connected with the worktable and is used for driving the worktable to move in the first direction; the first detection mechanism is arranged in the shell and is located on one side of the worktable in a second direction, and is arranged corresponding to the region between the processing head and the driving mechanism, the second direction intersects the first direction, and the first detection mechanism is used for detecting the position of the workpiece or the worktable to trigger a deceleration signal of the driving mechanism. The technical scheme of the application can reduce the possibility that the processing head and the worktable or the workpiece placed on the worktable are easily collided.

Description

Technical Field

[0001] This application relates to the field of processing equipment technology, and in particular to a processing equipment. Background Technology

[0002] In related technologies, processing equipment often uses a height-adjustable platform to support workpieces of varying heights. However, because the platform rises rapidly towards the processing head and the distance between them is relatively small, collisions between the processing head and the platform, or between the workpiece placed on it, are likely to occur. Utility Model Content

[0003] The main objective of this application is to provide a processing device that aims to reduce the possibility of collision between the processing head and the stage or the workpiece placed on the stage.

[0004] To achieve the above objectives, the processing equipment proposed in this application includes:

[0005] A housing, wherein an accommodating space is provided inside the housing;

[0006] A stage is located within the accommodating space and is used to support the workpiece.

[0007] A processing head is disposed within the accommodating space and spaced apart from the stage in a first direction. The processing head is used to process the workpiece placed on the stage.

[0008] A driving mechanism, disposed within the accommodating space, is connected to the stage and is used to drive the stage to move along the first direction; and

[0009] A first detection mechanism is disposed inside the housing. The first detection mechanism is located on one side of the stage in the second direction and is disposed in the area between the processing head and the drive mechanism. The second direction intersects with the first direction. The first detection mechanism is used to detect the position of the workpiece or the stage to trigger a deceleration signal to form the drive mechanism.

[0010] Optionally, the first detection mechanism includes a laser assembly and a camera, the laser assembly and the camera being arranged along the first direction, and the laser assembly being positioned closer to the stage than the camera;

[0011] The laser assembly is used to emit laser light toward the area between the stage and the processing head to form a laser beam image on the inner wall of the housing, and the camera is used to acquire the laser beam image.

[0012] Optionally, the housing has four corner areas, including a first corner area and a second corner area, the first detection mechanism is located in the first corner area, and the laser assembly and camera are positioned facing the second corner area, the laser assembly being used to emit a laser towards the second corner area.

[0013] Optionally, the first detection mechanism further includes a mounting carrier, on which the laser assembly is rotatably mounted to adjust the orientation of the laser assembly by rotation.

[0014] Optionally, the mounting carrier is provided with a spherical cavity and a first connecting port, the first connecting port being connected to the spherical cavity;

[0015] One end of the laser assembly is located inside the spherical cavity and has a spherical surface that rotates with the spherical cavity, while the other end extends out from the first communication port.

[0016] Optionally, the laser assembly includes:

[0017] A fixing seat, at least a portion of which is disposed within the spherical cavity and has the spherical surface, the fixing seat further comprising a mounting hole; and

[0018] A laser, which passes through the mounting hole and extends out from the first communication port.

[0019] Optionally, the fixing base includes:

[0020] A spherical head, wherein the spherical head is disposed in the spherical cavity and has the spherical surface; and

[0021] The cylindrical part has one end connected to the ball head and the other end extending from the first communication port. The mounting hole is provided in the ball head and the cylindrical part.

[0022] And / or, the mounting base is provided with a through hole communicating with the mounting hole, and the laser assembly further includes a first fastener, which is threadedly connected to the through hole and abuts against the laser to fix the laser to the mounting base;

[0023] Optionally, the mounting carrier includes a first carrier and a second carrier, the first carrier and the second carrier enclosing each other to form the spherical cavity, and the first carrier is provided with the first communication port.

[0024] Optionally, the first detection mechanism further includes a second fastener, which passes through one of the first carrier and the second carrier and is threadedly connected to the other of the first carrier and the second carrier.

[0025] Optionally, the first detection mechanism further includes an enclosing carrier, which is disposed on the side of the mounting carrier opposite to the first communication port and encloses the mounting carrier to form an accommodating cavity;

[0026] The first detection mechanism also includes a circuit board, which is disposed in the accommodating cavity and electrically connected to the driving mechanism;

[0027] The mounting carrier is also provided with a second communication port and an exposure port. The second communication port is connected to the receiving cavity and the spherical cavity. A portion of the laser assembly passes through the second communication port and is electrically connected to the circuit board.

[0028] The camera is located inside the accommodating cavity and electrically connected to the circuit board. The display port is connected to the accommodating cavity and is set corresponding to the camera.

[0029] Optionally, the processing equipment further includes a second detection mechanism, which is located on the processing head and can move with the processing head. The second detection mechanism is used to detect whether the stage or the workpiece has moved into place, so as to trigger a stop signal to form the drive mechanism.

[0030] And / or, the processing head includes at least one of a laser head, a cutting tool head, a pen, and a printing cartridge.

[0031] The processing equipment of this application has a first detection mechanism on one side of the stage in the second direction, and the first detection mechanism is positioned in the area between the processing head and the stage. This allows the drive mechanism to detect the position of the stage or the workpiece placed on it when it drives the stage to move along the first direction intersecting the second direction to approach the processing head. This first detection mechanism triggers a deceleration signal, indicating that the drive mechanism has driven the stage or workpiece to a preset deceleration position. Subsequently, the drive mechanism can decelerate in advance based on this deceleration signal, thereby reducing the speed of the stage. This ensures that the drive mechanism can accurately stop driving the stage and workpiece to the processing position, thus reducing the possibility of collisions between the processing head and the stage or the workpiece placed on it due to excessively high driving speed. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of one embodiment of the processing equipment of this application;

[0034] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0035] Figure 3 for Figure 1 Another perspective diagram of the processing equipment;

[0036] Figure 4 for Figure 3 A magnified view of a section at point B in the middle;

[0037] Figure 5 for Figure 4 A partial cross-sectional schematic diagram of the first testing institution in China.

[0038] Explanation of icon numbers:

[0039] 100. Processing equipment; 10. Stage; 20. Processing head; 30. Drive mechanism; 40. First detection mechanism; 41. Laser assembly; 411. Fixing base; 4111. Spherical head; 4112. Spherical surface; 4113. Columnar part; 4114. Mounting hole; 4115. Through hole; 413. Laser; 4131. Laser beam image; 415. First fastener; 42. Camera; 43. Mounting carrier; 431. Spherical cavity; 432. First carrier; 4321. First connecting port; 433. Second carrier; 4331. Second connecting port; 4332. Exposed port; 44. Second fastener; 45. Enclosing carrier; 46. Receiving cavity; 47. Circuit board; 50. Housing; 50a. Receiving space; 51. Corner area; 511. First corner area; 512. Second corner area; 60. Second detection mechanism; 70. Track device.

[0040] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0042] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0043] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0045] In related technologies, to facilitate the processing of workpieces of different heights, some processing equipment uses a liftable platform to support the workpieces. However, because the platform rises rapidly towards the processing head and the distance between them is relatively small, collisions between the processing head and the platform, or between the workpiece placed on the platform, are likely to occur.

[0046] Therefore, based on the above considerations, in order to solve the technical problem that the processing head is prone to collision with the stage or the workpiece placed on the stage, this application proposes a new type of processing equipment.

[0047] Please refer to the reference. Figure 1 , Figure 3 as well as Figure 4In one embodiment of this application, the processing equipment 100 includes a housing 50, a stage 10, a processing head 20, a drive mechanism 30, and a first detection mechanism 40. The housing 50 has a receiving space 50a. The stage 10 is located within the receiving space 50a and is used to carry workpieces. The processing head 20 is located within the receiving space 50a and is spaced apart from the stage 10 in a first direction. The processing head 20 is used to process workpieces placed on the stage 10. The drive mechanism 30 is located within the receiving space 50a, connected to the stage 10, and is used to drive the stage 10 to move along the first direction. The first detection mechanism 40 is located within the housing 50 and on one side of the stage 10 in a second direction, where the second direction intersects the first direction. The first detection mechanism 40 is used to detect the position of the workpiece or the stage 10 to trigger a deceleration signal to the drive mechanism 30.

[0048] The housing 50 forms a accommodating space 50a for mounting the stage 10, processing head 20, drive mechanism 30, and first detection mechanism 40, thereby isolating and protecting these components. The housing 50 may include a shell and a cover, which together enclose the accommodating space 50a. The cover can open and close an opening at one end of the shell to allow for workpiece loading and unloading. In this configuration, the stage 10, processing head 20, drive mechanism 30, and first detection mechanism 40 can all be installed within the bottom shell, ensuring that opening the top cover does not affect these components. Furthermore, when the processing equipment 100 is in normal installation and use, with the ground as a reference, the first direction can be vertical. At this time, on the horizontal projection plane perpendicular to the first direction, the projection of the housing 50 can be rectangular, or it can be square or circular. This application does not limit the shape of the housing 50. In addition, in other embodiments, the first direction can also be a horizontal direction. This application does not limit the specific type of the first direction.

[0049] The stage 10 can be used to provide a placement position for placing a workpiece. On the projection plane perpendicular to the first direction, the stage 10 can be rectangular, square, circular, etc.; this application does not limit the shape of the stage 10. Furthermore, the stage 10 can be a plate structure or a disk structure; this application does not limit the structural type of the stage 10.

[0050] The processing head 20 can be used to process workpieces. The processing head 20 can be one of a laser head, a cutting tool, a drawing tool, and a printing cartridge. Alternatively, the processing head 20 can include at least two of these components to enrich its processing types. This application does not limit the type of processing head 20; it can be adapted to the type of processing equipment 100. For example, when the processing equipment 100 is a laser processing equipment 100, the processing head 20 can correspondingly include at least a laser head. Furthermore, when the first direction is vertical as described above, the processing head 20 can be located above the stage 10.

[0051] The drive mechanism 30 can provide driving force to move the stage 10 closer to or further away from the processing head 20 in a first direction. The drive mechanism 30 can be a lead screw drive. In this case, the drive mechanism 30 may include a motor, a lead screw, and a slide, to which the stage 10 can be connected. Alternatively, the drive mechanism 30 can be a belt drive. In this case, the drive mechanism 30 may include a motor, a pulley, and a belt, to which the stage 10 can be connected. This application does not limit the structural type of the drive mechanism 30. The deceleration signal of the drive mechanism 30 can specifically act on the motor within the drive mechanism 30. Furthermore, the number of drive mechanisms 30 can be one, or two or more, to improve the driving force and stability of the stage 10.

[0052] The first detection mechanism 40 can be located on one side of the stage 10 in the second direction, corresponding to the area between the processing head 20 and the stage 20, to detect the position of the stage 10 or the workpiece placed on the stage 10, triggering a deceleration signal to the drive mechanism 30, indicating that the drive mechanism 30 has driven the stage 10 or the workpiece to a preset deceleration position. Then, the first detection mechanism 40 can transmit the deceleration signal of the drive mechanism 30 to the controller of the processing equipment 100, so that the controller can promptly control the drive mechanism 30 to decelerate based on the deceleration signal. This controller can be used only to control the operation of the drive mechanism 30, or it can be further used to control the operation of other mechanisms in the processing equipment 100, such as the first detection mechanism 40 or the processing head 20. Alternatively, the drive mechanism 30 can be directly integrated with the controller. In this case, the deceleration signal of the drive mechanism 30 triggered by the first detection mechanism 40 can be directly transmitted to the drive mechanism 30. In addition, the first detection mechanism 40 may include a laser assembly 41 and a camera 42 as described below, or it may include a photoelectric sensor or a Hall sensor. This application does not limit the structural type of the first detection mechanism 40.

[0053] The processing equipment 100 of this application has a first detection mechanism 40 on one side of the stage 10 in the second direction, and the first detection mechanism 40 is positioned in the area between the processing head 20 and the stage 10. This allows the drive mechanism 30 to detect the position of the stage 10 or the workpiece placed on it when it drives the stage 10 to move along the first direction intersecting the second direction to approach the processing head 20. This first detection mechanism 40 triggers a deceleration signal for the drive mechanism 30. Subsequently, the drive mechanism 30 can decelerate in advance based on this deceleration signal, thereby reducing the movement speed of the stage 10. This ensures that the drive mechanism 30 can accurately stop driving the stage 10 and the workpiece when they reach the processing position, thus reducing the possibility of collisions between the processing head 20 and the stage 10 or the workpiece placed on it due to excessively high driving speed of the stage 10. When the processing head 20 is positioned above the stage 10 as described above, the processing position can be located above a preset deceleration position. Furthermore, since the first detection mechanism 10 is located on one side of the stage 10 in the second direction, the first detection mechanism 10 will not interfere with the movement of the stage 10.

[0054] Please refer to the reference. Figure 3 and Figure 4 In one embodiment of this application, the first detection mechanism 40 includes a laser assembly 41 and a camera 42. The laser assembly 41 is used to emit a laser in the area between the stage 10 and the processing head 20 to form a laser beam image 4131 on the inner wall of the housing 50. The camera 42 is used to acquire the laser beam image 4131.

[0055] When the laser beam emitted by the laser assembly 41 is not obstructed by the stage 10 or the workpiece on the stage 10, the laser beam projection on the inner wall of the housing 50 can have a relatively complete shape, which can be pre-stored as an image template. Later, when the drive mechanism 30 drives the stage 10 closer to the processing head 20, part of the laser beam projection is obstructed by the workpiece or the stage 10, causing the laser beam projection on the inner wall of the housing 50 to break and change its shape. At this time, after the camera 42 acquires the laser beam image 4131 formed by the laser beam projection, it can compare the acquired laser beam image 4131 with the pre-stored image template to identify the break in the laser beam projection, thereby triggering the deceleration signal of the drive mechanism 30.

[0056] In this embodiment, a first detection mechanism 40, including a laser assembly 41 and a camera 42, is provided. The laser assembly 41 emits a laser beam towards the area between the stage 10 and the processing head 20, while the camera 42 captures an image of the laser beam projection 4131. Thus, when the stage 10 is driven by the drive mechanism 30 to move along the first direction and approach the processing head 20, the stage 10 or the workpiece placed on the stage 10 may partially block the laser beam projection 4131, causing the laser beam projection 4131 to break. At this time, the camera 42 can capture an image of the laser beam projection 4131 to identify the broken state and transmit a trigger signal to the drive mechanism 30. This allows the drive mechanism 30 to decelerate in time, reducing the possibility of collision between the processing head 20 and the stage 10 or the workpiece placed on the stage 10. Furthermore, since the laser assembly 41 emits a linear laser, it has a large detection range. It can effectively detect workpieces of different types and sizes placed on the stage 10 by blocking them. This helps to improve the detection effect of the first detection mechanism 40 on the stage 10 or the moving position of the workpiece placed on the stage 10, thereby further reducing the possibility of collision between the processing head 20 and the stage 10 or the workpiece placed on the stage 10.

[0057] Please refer to the reference. Figure 1 and Figure 3 In one embodiment of this application, the housing 50 has four corner areas 51, including a first corner area 511 and a second corner area 512 opposite to each other. The first detection mechanism 40 is disposed in the first corner area 511, and the laser assembly 41 and the camera 42 are disposed facing the second corner area 512. The laser assembly 41 is used to emit lasers to the second corner area 512.

[0058] In this embodiment, the housing 50 can be square or rectangular on the projection plane perpendicular to the first direction, forming four corner areas 51. The first detection mechanism 40 is positioned in the first corner area 511, and the laser assembly 41 is positioned towards the second corner area 512. This allows the laser beam emitted by the laser assembly 41 to be projected onto the two sidewalls of the housing 50 that enclose the second corner area 512. This ensures that a position signal is triggered when either of the laser beam projections 4131 on the two sidewalls is interrupted, thereby increasing the detection range of the laser assembly 41. The camera 42 is also positioned towards the second corner area 512, facilitating the capture of the laser beam projections 4131 projected onto the two sidewalls of the housing 50 that enclose the second corner area 512.

[0059] Additionally, it should be noted that the first detection mechanism 40 can also be located on one of the two opposing side walls of the housing 50, with the laser assembly 41 and camera 42 facing the other of the two opposing side walls. In this case, the laser beam emitted by the laser assembly 41 can be projected onto the side wall of the housing 50 opposite to the laser assembly 41.

[0060] Please refer to the reference. Figure 3 and Figure 4 In one embodiment of this application, the laser assembly 41 and the camera 42 are arranged along a first direction, and the laser assembly 41 is positioned closer to the stage 10 than the camera 42.

[0061] In this embodiment, arranging the laser assembly 41 and the camera 42 along the first direction allows their orientations to be close or consistent, facilitating a better viewing angle for both towards the second corner area 512. Positioning the laser assembly 41 closer to the stage 10 than the camera 42 allows the camera 42 to be positioned above the laser assembly 41. This ensures that when the projection of the laser beam emitted by the laser assembly 41 onto the housing 50 is blocked or interrupted by the stage 10 or a workpiece placed on the stage 10, the stage 10 or the workpiece will not obstruct the camera 42's image capture, facilitating the camera 42's acquisition of the laser beam image.

[0062] Please refer to the reference. Figures 3 to 5 In one embodiment of this application, the first detection mechanism 40 further includes a mounting carrier 43, on which the laser assembly 41 is rotatably mounted, so as to adjust the orientation of the laser assembly 41 by rotation.

[0063] The mounting carrier 43 provides a mounting position for the laser assembly 41 to be rotated and mounted. It can also connect to the housing 50, enabling the laser assembly 41 to be mounted on the housing 50. The laser assembly 41 can be rotated and mounted via the engagement of a spherical cavity 431 and a spherical surface 4112, as described below, allowing it to rotate in multiple directions. Alternatively, the laser assembly 41 can be rotated and mounted via the engagement of a rotating shaft and a shaft hole, allowing it to rotate in a single direction.

[0064] In this embodiment, the laser assembly 41 is configured to be rotatably mounted on the mounting carrier 43, so that after the laser assembly 41 is mounted on the mounting carrier 43, its orientation can be rotated and adjusted to form the required mounting posture.

[0065] Please refer to the reference. Figure 4 and Figure 5In one embodiment of this application, the mounting carrier 43 is provided with a spherical cavity 431 and a first communication port 4321, the first communication port 4321 being connected to the spherical cavity 431; one end of the laser assembly 41 is disposed in the spherical cavity 431 and has a spherical surface 4112 that rotates with the spherical cavity 431, and the other end extends out from the first communication port 4321.

[0066] In this embodiment, the laser assembly 41 is configured to rotate in conjunction with the spherical cavity 431 via the spherical surface 4112, which makes the rotation direction of the laser assembly 41 more diverse. This enables the horizontal and vertical movement adjustment of the projection of the laser beam emitted by the laser assembly 41 onto the housing 50, so as to perform adaptive positioning detection for different types of workpieces.

[0067] Please refer to the reference. Figure 4 and Figure 5 In one embodiment of this application, the laser assembly 41 includes a mounting base 411 and a laser 413. At least a portion of the mounting base 411 is disposed within a spherical cavity 431 and has a spherical surface 4112. The mounting base 411 is also provided with a mounting hole 4114. The laser 413 passes through the mounting hole 4114 and extends out from the first communication port 4321.

[0068] In this embodiment, the laser assembly 41 is configured to include a mounting base 411 and a laser 413, so that a spherical surface 4112 can be easily formed through the mounting base 411, and the laser 413 is provided with a mounting position through a relatively simple mounting hole 4114, thereby improving the convenience of processing and assembling the laser assembly 41.

[0069] Additionally, it should be noted that in some embodiments, the laser assembly 41 may also consist of only the laser 413.

[0070] Please refer to Figure 5 In one embodiment of this application, the fixing base 411 includes a ball head 4111 and a cylindrical part 4113. The ball head 4111 is disposed in the spherical cavity 431 and has a spherical surface 4112. One end of the cylindrical part 4113 is connected to the ball head 4111, and the other end extends out from the first communication port 4321. The mounting hole 4114 is disposed in the ball head 4111 and the cylindrical part 4113.

[0071] In this embodiment, the mounting base 411 is configured to include a ball head 4111 and a column part 4113, so that a spherical surface 4112 can be formed through the ball head 4111, while the column part 4113 can improve the protection of the laser 413, and at the same time increase the contact area with the laser 413 to improve the stability of the installation of the laser 413.

[0072] Please refer to Figure 5In one embodiment of this application, the mounting base 411 is provided with a through hole 4115 that communicates with the mounting hole 4114. The laser assembly 41 further includes a first fastener 415, which is threadedly connected to the through hole 4115 and abuts against the laser 413 to fix the laser 413 to the mounting base 411.

[0073] In this embodiment, the laser 413 is abutted and limited by the first fastener 415 passing through the fixing base 411, eliminating the need for a connection structure on the laser 413 and thus improving the protection of the laser 413 itself. It also facilitates the removal of the laser 413 from the fixing base 411. The fixing base 411 can have a through hole 4115 on its spherical head 4111, with the spherical head 4111 having a greater thickness than the cylindrical part 4113. This increases the length of the through hole 4115, enhancing the stability of the first fastener 415 connection and accommodating it so that it does not contact the spherical surface 4112, thus preventing interference with the rotation of the laser assembly 41. Alternatively, the through hole 4115 can be provided on the cylindrical part 4113. Furthermore, the first fastener 415 can be a screw.

[0074] Additionally, it should be noted that in some embodiments, the laser 413 may also be glued to the mounting base 411. This application does not limit the mounting method of the laser 413 on the mounting base 411.

[0075] Please refer to Figure 5 In one embodiment of this application, the mounting carrier 43 includes a first carrier 432 and a second carrier 433. The first carrier 432 and the second carrier 433 surround each other to form a spherical cavity 431. The first carrier 432 is provided with a first communication port 4321.

[0076] In this embodiment, the mounting carrier 43 is configured to include a first carrier 432 and a second carrier 433, so that the two can be processed separately and independently, and then assembled together to form a spherical cavity 431, thereby improving the convenience of processing and forming the spherical cavity 431.

[0077] Additionally, it should be noted that in some embodiments, the mounting carrier 43 may also be an integral structure.

[0078] Please refer to Figure 5 In one embodiment of this application, the first detection mechanism 40 further includes a second fastener 44, which passes through one of the first carrier 432 and the second carrier 433 and is threadedly connected to the other of the first carrier 432 and the second carrier 433.

[0079] In this embodiment, the first carrier 432 and the second carrier 433 are connected by a threaded connection using a second fastener 44, which simplifies the connection structure between the two carriers and improves assembly convenience. Simultaneously, the clamping force of the ball head 4111 can be adjusted, improving the stability of the laser assembly 41 after its orientation is properly adjusted. The second fastener 44 can be a screw.

[0080] In addition, it should be noted that in some embodiments, the first carrier 432 and the second carrier 433 may also be connected by snap-fit ​​or adhesive. This application does not limit the connection method between the two.

[0081] Please refer to the reference. Figure 4 and Figure 5 In one embodiment of this application, the first detection mechanism 40 further includes an enclosing carrier 45, which is disposed on the side of the mounting carrier 43 opposite to the first communication port 4321 and encloses the mounting carrier 43 to form a receiving cavity 46; the first detection mechanism 40 also includes a circuit board 47, which is disposed in the receiving cavity 46 and electrically connected to the driving mechanism 30; the mounting carrier 43 is also provided with a second communication port 4331 and an exposure port 4332, the second communication port 4331 is connected to the receiving cavity 46 and the spherical cavity 431, a portion of the laser assembly 41 passes through the second communication port 4331 and is electrically connected to the circuit board 47; the camera 42 is disposed in the receiving cavity 46 and electrically connected to the circuit board 47, the exposure port 4332 is connected to the receiving cavity 46 and is provided corresponding to the camera 42.

[0082] In this embodiment, the enclosure carrier 45 and the mounting carrier 43 form a receiving cavity 46, which can provide shelter and protection for the circuit board 47 and the camera 42. By extending the laser 413 from the laser assembly 41 into the receiving cavity 46, the camera 42 and the laser 413 can share a single circuit board 47, reducing the number of components. When the mounting carrier 43 includes a first carrier 432 and a second carrier 433 as described above, the second carrier 433 may have a second communication port 4331 and an exposure port 4332, and the enclosure carrier 45 and the second carrier 433 enclose the receiving cavity 46.

[0083] Please refer to the reference. Figure 1 and Figure 2 In one embodiment of this application, the processing equipment 100 further includes a second detection mechanism 60. The second detection mechanism 60 is disposed on the processing head 20 and can move with the processing head 20. The second detection mechanism 60 is used to detect whether the stage 10 or the workpiece placed on the stage 10 has moved into place, so as to trigger a stop signal to form the drive mechanism 3.

[0084] In this embodiment, the second detection mechanism 60 can further detect the movement of the workpiece on the detection platform 10 or the workpiece placed on the platform 10 into position, that is, when it reaches the processing position described above. At this time, when the first detection mechanism 40 detects that the workpiece on the detection platform 10 has reached the processing position, the processing equipment 100 can control the drive mechanism 30 to stop in a timely manner. In this way, the drive mechanism 30 can decelerate in advance during the process of driving the platform 10 to rise, and then stop in a timely and accurate manner when it reaches the processing position, thereby improving and reducing the possibility of collision between the processing head 20 and the platform 10 or the workpiece placed on the platform 10.

[0085] Furthermore, since the initial total distance between the stage 10 and the processing head 20 is preset and fixed when the stage 10 is in its initial position, after the second detection mechanism 60 detects that the workpiece has moved into place, the height of the workpiece can be obtained by subtracting the upward distance of the stage 10 and the workpiece driven by the drive mechanism 30 from the initial total distance, thereby realizing the detection of the workpiece height by the processing equipment 100.

[0086] Please refer to the reference. Figure 1 and Figure 2 In one embodiment of this application, the second detection mechanism 60 is a touch switch and protrudes from the processing head 20 on the side facing the stage 10.

[0087] In this embodiment, the second detection mechanism 60 is configured as a touch switch, enabling position detection to be performed by direct contact with the stage 10 or a workpiece placed on the stage 10, thereby improving detection accuracy. Currently, in other embodiments, the second detection mechanism 60 may also be an infrared sensor; this application does not limit the type of the second detection mechanism 60.

[0088] Please refer to the reference. Figure 1 and Figure 2 In one embodiment of this application, the processing equipment 100 may further include a track device 70, which is disposed inside the housing 50, and the processing head 20 may be mounted on the track device 70.

[0089] In this embodiment, the track device 70 can be used to provide driving force to drive the laser processing device to move and process. The track device 70 may include a motor, pulleys, and a belt; alternatively, it may include a motor, a lead screw, and a slide. This application does not limit the structural type of the track device 70.

[0090] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A processing equipment, characterized in that, include: A housing, wherein an accommodating space is provided inside the housing; A stage is located within the accommodating space and is used to support the workpiece. A processing head is disposed within the accommodating space and spaced apart from the stage in a first direction. The processing head is used to process the workpiece placed on the stage. A drive mechanism is disposed within the accommodating space. The drive mechanism is connected to the stage and is used to drive the stage to move along the first direction. as well as A first detection mechanism is disposed inside the housing. The first detection mechanism is located on one side of the stage in the second direction and is disposed in the area between the processing head and the drive mechanism. The second direction intersects with the first direction. The first detection mechanism is used to detect the position of the workpiece or the stage to trigger a deceleration signal to be generated by the drive mechanism.

2. The processing equipment as described in claim 1, characterized in that, The first detection mechanism includes a laser assembly and a camera, the laser assembly and the camera are arranged along the first direction, and the laser assembly is positioned closer to the stage than the camera; The laser assembly is used to emit laser light toward the area between the stage and the processing head to form a laser beam image on the inner wall of the housing, and the camera is used to acquire the laser beam image.

3. The processing equipment as described in claim 2, characterized in that, The housing has four corner areas, including a first corner area and a second corner area. The first detection mechanism is located in the first corner area, and the laser assembly and the camera are positioned facing the second corner area. The laser assembly is used to emit laser light into the second corner area.

4. The processing equipment as described in claim 2, characterized in that, The first detection mechanism further includes a mounting carrier, on which the laser assembly is rotatably mounted, so that the orientation of the laser assembly can be adjusted by rotation.

5. The processing equipment as described in claim 4, characterized in that, The mounting carrier is provided with a spherical cavity and a first connecting port, the first connecting port being connected to the spherical cavity; One end of the laser assembly is located inside the spherical cavity and has a spherical surface that rotates with the spherical cavity, while the other end extends out from the first communication port.

6. The processing equipment as described in claim 5, characterized in that, The laser assembly includes: A fixing seat, at least a portion of which is disposed within the spherical cavity and has the spherical surface, the fixing seat further comprising a mounting hole; and A laser, which passes through the mounting hole and extends out from the first communication port.

7. The processing equipment as described in claim 6, characterized in that, The fixing base includes: A spherical head, wherein the spherical head is disposed in the spherical cavity and has the spherical surface; and A cylindrical part, one end of which is connected to the ball head, and the other end of which extends out from the first communicating port; the mounting hole is provided in the ball head and the cylindrical part. And / or, the mounting base is provided with a through hole communicating with the mounting hole, and the laser assembly further includes a first fastener, which is threadedly connected to the through hole and abuts against the laser to fix the laser to the mounting base.

8. The processing equipment as described in claim 5, characterized in that, The mounting carrier includes a first carrier and a second carrier, the first carrier and the second carrier together form the spherical cavity, and the first carrier is provided with the first communication port.

9. The processing equipment as described in claim 8, characterized in that, The first detection mechanism further includes a second fastener, which passes through one of the first carrier and the second carrier and is threadedly connected to the other of the first carrier and the second carrier.

10. The processing equipment as described in claim 5, characterized in that, The first detection mechanism further includes an enclosing carrier, which is disposed on the side of the mounting carrier opposite to the first communication port and encloses the mounting carrier to form a receiving cavity; The first detection mechanism also includes a circuit board, which is disposed in the accommodating cavity and electrically connected to the driving mechanism; The mounting carrier is also provided with a second communication port and an exposure port. The second communication port is connected to the receiving cavity and the spherical cavity. A portion of the laser assembly passes through the second communication port and is electrically connected to the circuit board. The camera is located inside the accommodating cavity and electrically connected to the circuit board. The display port is connected to the accommodating cavity and is set corresponding to the camera.

11. The processing equipment according to any one of claims 1 to 10, characterized in that, The processing equipment also includes a second detection mechanism, which is located on the processing head and can move with the processing head. The second detection mechanism is used to detect whether the stage or the workpiece has moved into place, so as to trigger a stop signal to form the drive mechanism. And / or, the processing head includes at least one of a laser head, a cutting tool head, a pen, and a printing cartridge.

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