A mark point recognition device of a PCB panel splitter

Abstract

The application provides a MARK point recognition device of a PCB separating machine, and relates to the technical field of PCB processing equipment. The recognition assembly comprises a main camera and a plurality of auxiliary cameras arranged around the main camera. The main camera acquires the overall contour of the MARK point, and the auxiliary cameras capture the detailed features of the MARK point. The light source assembly is movably arranged outside the main camera, and the brightness and irradiation angle of the light source assembly are adjustable. The support adjusting assembly is fixedly connected with the recognition assembly, and drives the recognition assembly to adjust the recognition position along the first direction. The support damping assembly is fixedly connected with the workbench of the PCB separating machine, and is fixedly installed on the top of the support damping assembly. The support adjusting assembly and the to-be-recognized PCB placed on the support damping assembly are damped. The main camera and the auxiliary cameras recognize the overall contour and the detailed features of the MARK point respectively, multi-angle recognition is realized, the brightness and angle of the light source assembly are adjusted to improve the imaging quality, the support damping assembly keeps the recognition assembly and the to-be-recognized PCB relatively stable, and the recognition precision is improved through the synergistic effect.

Description

Technical Field

[0001] This application relates to the field of PCB processing equipment, and more particularly to a MARK point recognition device for a PCB depaneling machine. Background Technology

[0002] The PCB depaneling process is a crucial step in PCB manufacturing, directly impacting the final PCB quality and production efficiency. MARK points, special markers on the PCB used for precise positioning, play an indispensable role in the depaneling process. They provide accurate coordinate references for the depaneling machine, ensuring it can perform depaneling operations based on the MARK points and preventing damage to components due to misalignment. Traditional PCB depaneling machines often use optical sensors or low-resolution cameras for MARK point identification. Limited by the accuracy of these sensors or cameras, the identification accuracy is poor, leading to low overall production efficiency, significantly increased PCB scrap rates, waste of raw materials, and increased production costs.

[0003] Therefore, this application provides a MARK point recognition device for a PCB depaneling machine to improve the accuracy of MARK point recognition by the PCB depaneling machine. Utility Model Content

[0004] The purpose of this application is to address the above problems by providing a MARK point recognition device for a PCB depaneling machine, so as to improve the accuracy of MARK point recognition by the PCB depaneling machine.

[0005] This application provides a MARK point recognition device for a PCB depaneling machine, comprising: The recognition component includes a main camera and a plurality of auxiliary cameras arranged around the main camera. The main camera is used to acquire the overall outline of the MARK point, and the auxiliary cameras are used to capture the detailed features of the MARK point. A light source assembly, which is movably fitted outside the main camera, and whose brightness and illumination angle are adjustable; A support adjustment component is fixedly connected to the recognition component and is used to drive the recognition component to adjust the recognition position along a first direction; A support and vibration damping assembly is fixedly connected to the worktable of the PCB depaneling machine, and a support adjustment assembly is fixedly installed on the top of the support and vibration damping assembly to dampen the vibration of the support adjustment assembly and the PCB to be identified placed on the support and vibration damping assembly.

[0006] According to the technical solutions provided in certain embodiments of this application, the supporting shock absorption component includes: Shock-absorbing rubber pads are laid on the worktable of the PCB depaneling machine; A vibration damping platform is disposed on top of the vibration damping rubber pad. The vibration damping platform includes a support platform for supporting the PCB to be identified, and the support adjustment component is fixedly installed on the support platform. The vibration damping platform is internally provided with a detection component, a position adjustment component, and a vibration damping adjustment component. The detection component is used to detect the displacement and vibration frequency of the vibration damping platform. The position adjustment component is used to adjust the levelness and height of the support platform. The vibration damping adjustment component is used to adjust the damping coefficient.

[0007] According to the technical solutions provided in certain embodiments of this application, the shock absorption platform further includes a first support frame and a second support frame. The first support frame and the second support frame are arranged parallel to each other along a second direction, which is perpendicular to the first direction. The bearing platform is disposed on the second support frame. The shock absorption adjustment component is disposed between the first support frame and the second support frame. The position adjustment component is disposed between the second support frame and the bearing platform. The detection component is disposed at the bottom of the bearing platform.

[0008] According to the technical solutions provided in certain embodiments of this application, the detection component includes: Four displacement sensors are respectively located at the midpoint of the bottom edge of the support platform and fixedly connected to the bottom of the support platform, and are used to detect the displacement of the support platform in the second direction. A vibration sensor is disposed at the center of the bottom of the support platform to detect the vibration frequency of the vibration damping platform.

[0009] According to the technical solutions provided in certain embodiments of this application, the position adjustment component includes four driving mechanisms, which are evenly arranged on the second support frame and their driving ends are fixedly connected to the bottom edge of the support platform.

[0010] According to the technical solutions provided in certain embodiments of this application, the shock absorption adjustment assembly includes a plurality of damping adjustment mechanisms. The damping adjustment mechanisms are evenly distributed along the first support frame, and each mechanism is fixedly connected at one end to the first support frame and at the other end to the second support frame.

[0011] According to the technical solutions provided in certain embodiments of this application, the support adjustment component includes: Mounting plate, which is fixedly connected to the identification component; A guide drive component is slidably connected to the mounting plate and is used to drive the mounting plate to move the identification component along the first direction, and the length of the guide drive component covers all the identification positions of the identification component; A support frame, one end of which is fixedly connected to the top of the shock-absorbing platform, and the other end of which is fixedly connected to the guide drive component.

[0012] According to the technical solutions provided in certain embodiments of this application, the device further includes a camera bracket, the camera bracket comprising: The first connecting part is a plate-shaped structure and extends along a third direction. One end of the first connecting part is fixedly connected to the mounting plate near the mounting plate. The third direction is perpendicular to the plane containing the first direction and the second direction. The second connecting part extends along the second direction, and its side near the first connecting part is fixedly connected to the first connecting part, and its other side is fixedly connected to the main camera; The annular mounting part is fixedly connected to the bottom surface of both the first connecting part and the bottom surface of the second connecting part, and the annular mounting part surrounds the outside of the main camera. Multiple auxiliary camera mounting seats are evenly distributed on the outer wall of the annular mounting part.

[0013] According to the technical solutions provided in certain embodiments of this application, the light source assembly includes: A light source bracket includes a first connecting rod and a second connecting rod. The first connecting rod is rotatably connected to the side wall of the first connecting part. The end of the second connecting rod near the first connecting rod is rotatably connected to the first connecting rod. An LED light source is rotatably connected to the end of the second link away from the first link, so that the LED light source rotates about the axis of the second link.

[0014] According to the technical solutions provided in certain embodiments of this application, the telecentric lens of the main camera has a pixel count greater than 12 million and a frame rate greater than 80fps.

[0015] In summary, this application provides a MARK point recognition device for a PCB depaneling machine, including a recognition component. The recognition component includes a main camera and multiple auxiliary cameras arranged around the main camera. The main camera is used to acquire the overall outline of the MARK point, and the auxiliary cameras are used to capture the detailed features of the MARK point. A light source component is movably fitted outside the main camera, and the brightness and illumination angle of the light source component are adjustable. A support adjustment component is fixedly connected to the recognition component and is used to drive the recognition component to adjust the recognition position along a first direction. A support damping component is fixedly connected to the worktable of the PCB depaneling machine, and the support adjustment component is fixedly installed on top of the support damping component to dampen the vibration of the support adjustment component and the PCB to be recognized placed on the support damping component. By using the main camera in the recognition component to acquire the overall outline of the MARK point and the auxiliary camera to capture local details, multi-angle recognition of the MARK point is achieved, making the feature recognition of the MARK point more complete and avoiding the loss of information from a single perspective. The light source component adjusts the brightness and illumination angle to ensure that the features of the MARK point in the image are clearly distinguishable, thereby improving the image quality. The support and vibration damping component synchronously dampens the recognition component and the PCB to be recognized, keeping them relatively stable and avoiding image blurring or positional shift caused by vibration. Through the synergistic effect of the above components, the accuracy of MARK point recognition is improved in three dimensions: feature integrity, image clarity, and environmental stability, effectively solving the problem of poor recognition accuracy in traditional recognition devices.

[0016] It should be understood that the descriptions of technical features, technical solutions, beneficial effects, or similar language in this application do not imply that all features and advantages can be achieved in any single embodiment. Rather, it is understood that the description of a feature or beneficial effect means that a specific technical feature, technical solution, or beneficial effect is included in at least one embodiment. Therefore, the descriptions of technical features, technical solutions, or beneficial effects in this specification do not necessarily refer to the same embodiment. Furthermore, the technical features, technical solutions, and beneficial effects described in this embodiment can be combined in any suitable manner. Those skilled in the art will understand that embodiments can be implemented without one or more specific technical features, technical solutions, or beneficial effects of a particular embodiment. In other embodiments, additional technical features and beneficial effects may be identified in specific embodiments that do not embody all embodiments. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of a MARK point recognition device for a PCB depaneling machine provided in this application embodiment; Figure 2 This is a schematic diagram of the structure of the shock absorption platform provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the camera bracket provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the light source assembly provided in an embodiment of this application.

[0019] The text labels in the image represent: 1. Recognition component; 11. Main camera; 12. Auxiliary camera; 2. Light source assembly; 21. Light source bracket; 211. First connecting rod; 212. Second connecting rod; 22. LED light source; 3. Support adjustment assembly; 31. Mounting plate; 32. Guide drive component; 33. Support frame; 42. Shock absorption platform; 421. Bearing platform; 422. First support frame; 423. Second support frame; 424. Drive mechanism; 425. Damping adjustment mechanism; 5. Camera bracket; 51. First connecting part; 52. Second connecting part; 53. Circular mounting part; 54. Auxiliary camera mounting base. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The descriptions in this section are merely illustrative and explanatory, and should not be construed as limiting the scope of protection of this application. Specifically, the described embodiments are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort should fall within the scope of protection of this application.

[0021] It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or apparatus.

[0022] As mentioned in the background section, in view of the problems in the prior art, this embodiment provides a MARK point recognition device for a PCB depaneling machine, including: The recognition component 1 includes a main camera 11 and a plurality of auxiliary cameras 12 arranged around the main camera 11. The main camera 11 is used to acquire the overall outline of the MARK point, and the auxiliary cameras 12 are used to capture the detailed features of the MARK point. Light source component 2, which is movably sleeved outside the main camera 11, and whose brightness and illumination angle are adjustable; A support adjustment component 3 is fixedly connected to the recognition component 1 and is used to drive the recognition component 1 to adjust the recognition position along a first direction. A support and vibration damping assembly is fixedly connected to the worktable of the PCB depaneling machine, and a support adjustment assembly 3 is fixedly installed on the top of the support and vibration damping assembly to dampen the vibration of the support adjustment assembly 3 and the PCB to be identified placed on the support and vibration damping assembly.

[0023] For details, please refer to Figure 1 , Figure 3 and Figure 4 The recognition component 1 includes a main camera 11 and multiple auxiliary cameras 12 arranged around the main camera 11. The main camera 11 is used to acquire the overall outline of the MARK point, and the auxiliary cameras 12 are used to capture the detailed features of the MARK point. Through the collaborative work of the main camera 11 and the auxiliary cameras 12, multi-view image data of the MARK point can be acquired, ensuring that both the overall and detailed parts of the MARK point can be recognized, thus improving the recognition accuracy of the MARK point and providing more comprehensive image information for subsequent PCB cutting. The light source component 2 is movably fitted outside the main camera 11 and can adjust its brightness and illumination angle according to the actual situation of the PCB. For example, for MARK points on dark PCBs, the brightness of the white light source can be increased to improve the contrast between the MARK point and the background; for PCB materials with strong reflectivity, the light source angle can be adjusted to reduce the impact of reflection on the recognition of the MARK point, ensuring that the MARK point can be clearly imaged and improving the recognition accuracy. The support adjustment component 3 is fixedly connected to the recognition component 1 and is used to drive the recognition component 1 to adjust its recognition position along a first direction, so that the recognition component 1 can recognize MARK points at multiple recognition positions. The first direction is... Figure 1 In the X-axis direction; the support and vibration damping assembly is fixedly connected to the worktable of the PCB depaneling machine, and the support adjustment assembly 3 is fixedly installed on the top of the support and vibration damping assembly. It is used to dampen the vibration of the support adjustment assembly 3 and the PCB to be identified placed on the support and vibration damping assembly, so as to reduce the relative movement between the support adjustment assembly 3 and the PCB to be identified, making the device more stable when identifying MARK, thereby improving the accuracy of MARK identification.

[0024] This application achieves multi-angle recognition of MARK points by using a main camera in the recognition component to acquire the overall outline of the MARK point and an auxiliary camera to capture local details. This makes the feature recognition of the MARK point more complete and avoids the loss of information from a single perspective. The light source component adjusts the brightness and illumination angle to ensure that the features of the MARK point in the image are clearly distinguishable, thereby improving the image quality. The support and vibration damping component synchronously dampens the recognition component and the PCB to be recognized, keeping them relatively stable and avoiding image blurring or positional shift caused by vibration. Through the synergistic effect of the above components, the accuracy of MARK point recognition is improved in three dimensions: feature integrity, image clarity, and environmental stability, effectively solving the problem of poor recognition accuracy in traditional recognition devices.

[0025] In a preferred embodiment, the support and damping assembly includes: Shock-absorbing rubber pads are laid on the worktable of the PCB depaneling machine; A vibration damping platform 42 is disposed on top of the vibration damping rubber pad. The vibration damping platform 42 includes a support platform 421 for supporting the PCB to be identified, and the support adjustment component 3 is fixedly installed on the support platform 421. The vibration damping platform 42 is internally provided with a detection component, a position adjustment component, and a vibration damping adjustment component. The detection component is used to detect the displacement and vibration frequency of the vibration damping platform 42. The position adjustment component is used to adjust the levelness and height of the support platform 421. The vibration damping adjustment component is used to adjust the damping coefficient.

[0026] Specifically, such as Figure 1 and Figure 2As shown, the shock-absorbing rubber pad is laid on the worktable of the PCB depaneling machine (not shown in the figure). The shock-absorbing platform 42 is set on top of the shock-absorbing rubber pad. The shock-absorbing platform 42 includes a support platform 421 for supporting the PCB to be identified, and the support adjustment component 3 is fixedly installed on the support platform 421. The shock-absorbing rubber pad isolates the shock-absorbing platform 42 from the worktable of the PCB depaneling machine. By utilizing the elasticity of the shock-absorbing rubber pad itself and its ability to absorb low-frequency vibrations, the low-frequency vibrations generated when the PCB depaneling machine is working (such as the operation of the cutting motor and the movement of the robotic arm) can be weakened, avoiding the direct transmission of the vibration to the shock-absorbing platform 42 and its upper support adjustment component 3, light source component 2, and identification component 1. At the same time, it reduces the positional interference of vibration on the PCB to be identified on the support platform 421, reduces the imaging jitter and MARK point imaging offset caused by vibration, and thus ensures the identification accuracy of the MARK point. The vibration damping platform 42 is internally equipped with a detection component, a position adjustment component, and a vibration damping adjustment component. The detection component is used to detect the displacement and vibration frequency of the vibration damping platform 42, and is not shown in the figure. The position adjustment component is used to adjust the levelness and height of the support platform 421. When the support platform 421 tilts or changes in height due to vibration, it is adjusted to be level. The vibration damping adjustment component is used to adjust the damping coefficient. For example, if the detection component detects low-frequency, large-amplitude vibration (such as the low-frequency impact when the motor of the PCB machine starts), the damping coefficient is reduced, allowing the vibration damping adjustment component to absorb the low-frequency vibration energy through greater deformation; if high-frequency, small-amplitude vibration (such as the high-frequency vibration during high-speed cutting of the PCB machine) is detected, the damping coefficient is increased, allowing the high-frequency vibration energy to be consumed by the resistance inside the vibration damping adjustment component.

[0027] In a preferred embodiment, the shock-absorbing platform 42 further includes a first support frame 422 and a second support frame 423, the first support frame 422 and the second support frame 423 being arranged parallel to each other along a second direction, the second direction being perpendicular to the first direction, the bearing platform 421 being disposed on the second support frame 423, the shock-absorbing adjustment component being disposed between the first support frame 422 and the second support frame 423, the position adjustment component being disposed between the second support frame 423 and the bearing platform 421; and the detection component being disposed at the bottom of the bearing platform 421.

[0028] Specifically, such as Figure 2 As shown, both the first support frame 422 and the second support frame 423 are rectangular and arranged parallel to each other along a second direction, which is perpendicular to the first direction. Figure 1In the Z-axis direction. The support platform 421 is mounted on the second support frame 423, the shock absorption adjustment component is located between the first support frame 422 and the second support frame 423, the position adjustment component is located between the second support frame 423 and the support platform 421; the detection component is located at the bottom of the support platform 421.

[0029] In a preferred embodiment, the detection component includes: Four displacement sensors are respectively disposed at the midpoint of the bottom edge of the support platform 421 and fixedly connected to the bottom of the support platform 421, for detecting the displacement of the support platform 421 in the second direction; A vibration sensor is disposed at the center of the bottom of the support platform 421 to detect the vibration frequency of the shock absorption platform 42.

[0030] Specifically, four displacement sensors are respectively located at the midpoint of the bottom edge of the support platform 421 and fixedly connected to the bottom of the support platform 421, used to detect the displacement of the support platform 421 in the second direction. By comparing the displacement data of the four displacement sensors, it can be determined whether the support platform 421 is tilted, providing data support for the subsequent adjustment of the level and height of the support platform 421 by the position adjustment component. The vibration sensor is located at the center of the bottom of the support platform 421, used to detect the vibration frequency of the vibration damping platform 42, providing a basis for adjusting the damping coefficient of the vibration damping adjustment component.

[0031] In a preferred embodiment, the position adjustment assembly includes four drive mechanisms 424, which are evenly arranged on the second support frame 423 and whose drive ends are fixedly connected to the bottom edge of the support platform 421.

[0032] Specifically, such as Figure 2As shown, the position adjustment component includes four drive mechanisms 424. These drive mechanisms 424 are evenly distributed on the second support frame 423, and their drive ends are fixedly connected to the bottom edge of the support platform 421. In this embodiment, the four drive mechanisms 424 are distributed at the four corners of the second support frame 423, but this can be adjusted according to actual conditions; no specific limitation is made here. The drive mechanisms 424 can be drive motors, cylinders, or other mechanisms capable of driving the support platform 421 to adjust its level and height; no specific limitation is made here. Based on the displacement data detected by the four displacement sensors of the detection component, the height of the corresponding position of the support platform 421 is adjusted by one or more drive mechanisms 424 to make the detection values ​​of the four displacement sensors tend to be consistent, thereby calibrating the level of the support platform 421. By synchronously controlling the four drive mechanisms 424 to raise and lower by the same height, the overall height adjustment of the support platform 421 is achieved, ensuring that the relative distance between the support platform 421 and the upper recognition component 1 remains constant, providing a stable reference for MARK point imaging focusing.

[0033] In a preferred embodiment, the shock absorption adjustment assembly includes a plurality of damping adjustment mechanisms 425, which are evenly distributed along the first support frame 422, and each mechanism is fixedly connected at one end to the first support frame 422 and at the other end to the second support frame 423.

[0034] Specifically, such as Figure 2 As shown, the vibration damping adjustment assembly includes multiple damping adjustment mechanisms 425. These mechanisms are evenly distributed along the first support frame 422, with one end fixedly connected to the first support frame 422 and the other end fixedly connected to the second support frame 423. The damping adjustment mechanisms can be either electromagnetic or hydraulic dampers; no specific limitation is made here. When the vibration sensor detects that the vibration frequency of the vibration damping platform 42 exceeds a threshold, the damping adjustment mechanism 425 adjusts the damping accordingly. If it is a high-frequency vibration, the damping coefficient is increased to attenuate the high-frequency vibration energy through internal resistance; if it is a low-frequency vibration, the damping coefficient is decreased to absorb the low-frequency vibration energy through greater deformation.

[0035] In a preferred embodiment, the support adjustment component 3 includes: Mounting plate 31, which is fixedly connected to the identification component 1; A guide drive 32 is slidably connected to the mounting plate 31 and is used to drive the mounting plate 31 to move the identification component 1 along the first direction. The length of the guide drive 32 covers all the identification positions of the identification component 1. The support frame 33 has one end fixedly connected to the top of the shock-absorbing platform 42 and the other end fixedly connected to the guide drive component 32.

[0036] Specifically, such as Figure 1 As shown, the mounting plate 31 is fixedly connected to the identification component 1, and the guide drive 32 is slidably connected to the mounting plate 31. The guide drive 32 is used to drive the mounting plate 31 to move the identification component 1 along the first direction ( Figure 1 The guide drive 32 moves along the X-axis, and its length covers all the recognition positions of the recognition component 1, allowing the recognition component 1 to move directly above any MARK point on the PCB. This meets the recognition requirements for PCBs of different sizes or multiple MARK point distribution scenarios, avoiding missed detections or positioning deviations due to insufficient movement range. One end of the support frame 33 is fixedly connected to the top of the shock-absorbing platform 42, and the other end is fixedly connected to the guide drive 32, ensuring that the guide drive 32 is stably supported above the shock-absorbing platform 42 and that the shock-absorbing effect of the shock-absorbing platform 42 is synchronously transmitted to the guide drive 32 and the recognition component 1. The guide drive 32 can be an electric slide rail, or other options can be selected according to actual conditions; no specific limitation is made here.

[0037] In a preferred embodiment, the device further includes a camera bracket 5, the camera bracket 5 comprising: The first connecting part 51 is a plate-shaped structure and extends along a third direction. One end of the first connecting part 51 near the mounting plate 31 is fixedly connected to the mounting plate 31. The third direction is perpendicular to the plane containing the first direction and the second direction. The second connecting part 52 extends along the second direction, and its side near the first connecting part 51 is fixedly connected to the first connecting part 51, and its other side is fixedly connected to the main camera 11. The annular mounting part 53 is fixedly connected to the bottom surface of the first connecting part 51 and the bottom surface of the second connecting part 52, and the annular mounting part 53 surrounds the outside of the main camera 11. A plurality of auxiliary camera mounting seats 54 are evenly distributed on the outer wall of the annular mounting part 53.

[0038] Specifically, such as Figure 3 As shown, the first connecting part 51 is a plate-shaped structure, and the first connecting part 51 extends along a third direction. One end of the first connecting part 51 near the mounting plate 31 is fixedly connected to the mounting plate 31. The third direction is perpendicular to the plane containing the first direction and the second direction. Figure 1The second connecting part 52 extends along the second direction, which is the Z-axis direction in the figure. Its side near the first connecting part 51 is fixedly connected to the first connecting part 51, and its other side is fixedly connected to the main camera 11. The annular mounting part 53 is fixedly connected to the bottom surface of both the first connecting part 51 and the bottom surface of the second connecting part 52, and the annular mounting part 53 surrounds the outside of the main camera 11. Multiple auxiliary camera mounting seats 54 are evenly distributed on the outer wall of the annular mounting part 53 for mounting the auxiliary camera 12. The fixed connection can be a bolt connection or other fixed connection methods; no specific limitation is made here.

[0039] In a preferred embodiment, the light source assembly 2 includes: The light source bracket 21 includes a first connecting rod 211 and a second connecting rod 212. The first connecting rod 211 is rotatably connected to the side wall of the first connecting part 51. The end of the second connecting rod 212 near the first connecting rod 211 is rotatably connected to the first connecting rod 211. LED light source 22, the LED light source 22 is rotatably connected to the end of the second link 212 away from the first link 211, so that the LED light source 22 rotates about the axis of the second link 212.

[0040] Specifically, such as Figure 4 As shown, the light source bracket 21 includes a first connecting rod 211 and a second connecting rod 212. The first connecting rod 211 is rotatably connected to the side wall of the first connecting part 51. The end of the second connecting rod 212 near the first connecting rod 211 is rotatably connected to the first connecting rod 211, causing the overall structure to lift upwards or extend downwards. The LED light source 22 is rotatably connected to the end of the second connecting rod 212 away from the first connecting rod 211, so that the LED light source 22 rotates around the axis of the second connecting rod 212, thereby adjusting the illumination angle of the LED light source 22.

[0041] In a preferred embodiment, the telecentric lens of the main camera 11 has a resolution of more than 12 million pixels and a frame rate of more than 80fps.

[0042] Specifically, the main camera 11 uses a telecentric lens to reduce image distortion and improve the accuracy of MARK point recognition. Furthermore, the telecentric lens has more than 12 million pixels and a frame rate of more than 80fps, which further improves the accuracy of MARK point recognition.

[0043] This application uses a main camera to capture the overall outline of the MARK points and an auxiliary camera to capture detailed characteristics, recording the features of the PCB's MARK points from multiple angles and in all directions. This results in more complete feature recognition of the MARK points and completely avoids information loss from a single perspective. The light source component adjusts brightness and illumination angle to precisely adapt to the material and environment of the MARK points, ensuring clarity and significant contrast of the MARK points in the image, thereby improving image quality. The support and vibration damping component synchronously dampens the recognition component and the PCB to be recognized, maintaining a relatively stable spatial state and effectively avoiding imaging blurring or positional shift caused by vibration. Through the complementary synergistic effect of these components, the recognition accuracy of MARK points is improved from three dimensions: feature completeness, image clarity, and environmental stability, solving the problem of insufficient recognition accuracy in traditional recognition devices.

[0044] To facilitate understanding by those skilled in the art, the workflow of the MARK point recognition device for the PCB depaneling machine provided in this application is as follows: The PCB to be identified is placed on the support platform 421 of the shock-absorbing platform 42 (the support platform 421 is set on the second support frame 423); the guide drive component 32 is fixedly installed on the top of the shock-absorbing platform 42 through the support frame 33, and it is slidably connected to the mounting plate 31. The length of the guide drive component 32 covers all the identification positions of the identification component 1. Under the drive of the guide drive component 32, the mounting plate 31 slides along the first direction. Since the identification component 1 is fixedly connected to the mounting plate 31 through the camera bracket 5, it is driven to reach the target identification position; light source component In the light source bracket 21 of the 2, the first connecting rod 211 is rotatably connected to the side wall of the first connecting part 51 of the camera bracket 5, the first connecting rod 211 is rotatably connected to the second connecting rod 212, and the LED light source 22 is rotatably connected to the end of the second connecting rod 212 away from the first connecting rod 211. By adjusting the relative rotation angle between the first connecting rod 211 and the first connecting part 51, the relative rotation angle between the first connecting rod 211 and the second connecting rod 212, and the rotation angle of the LED light source 22 around the axis of the second connecting rod 212, the illumination angle of the LED light source 22 can be adjusted, and the LED light source can be adjusted simultaneously. The brightness is 22; the main camera 11 (using a telecentric lens with more than 12 million pixels and a frame rate greater than 80fps) acquires the overall outline of the MARK point; multiple auxiliary camera mounts 54 evenly distributed on the outer wall of the annular mounting part 53 are mounted on auxiliary cameras 12, which surround the main camera 11 to synchronously capture the detailed features of the MARK point; four displacement sensors detect the displacement of the support platform 421 in the second direction, and vibration sensors capture the vibration frequency of the shock absorption platform 42; if the displacement sensors detect a horizontal offset of the support platform 421, the second support frame is set to... The driving ends of the four evenly distributed driving mechanisms 424 between the frame 423 and the support platform 421 push the bottom edge of the support platform 421 to adjust and restore the levelness of the support platform 421. If the vibration sensor detects vibration in the body of the PCB depaneling machine, the vibration damping rubber pads laid between the PCB depaneling machine worktable and the vibration damping platform 42 perform initial vibration damping. At the same time, multiple damping adjustment mechanisms 425, which are set between the first support frame 422 and the second support frame 423 and are evenly distributed along the first support frame 422, counteract the vibration by adjusting the damping coefficient.

[0045] This application achieves multi-angle recognition of MARK points by using a main camera in the recognition component to acquire the overall outline of the MARK point and an auxiliary camera to capture local details. This makes the feature recognition of the MARK point more complete and avoids the loss of information from a single perspective. The light source component adjusts the brightness and illumination angle to ensure that the features of the MARK point in the image are clearly distinguishable, thereby improving the image quality. The support and vibration damping component synchronously dampens the recognition component and the PCB to be recognized, keeping them relatively stable and avoiding image blurring or positional shift caused by vibration. Through the synergistic effect of the above components, the accuracy of MARK point recognition is improved in three dimensions: feature integrity, image clarity, and environmental stability, solving the problem of poor recognition accuracy in traditional recognition devices.

[0046] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of written expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this application, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.

Claims

1. A MARK point recognition device for a PCB depaneling machine, characterized in that, include: The recognition component (1) includes a main camera (11) and a plurality of auxiliary cameras (12) arranged around the main camera (11). The main camera (11) is used to acquire the overall outline of the MARK point, and the auxiliary cameras (12) are used to capture the detailed features of the MARK point. The light source assembly (2) is movably sleeved outside the main camera (11), and the brightness and illumination angle of the light source assembly (2) are adjustable; A support adjustment component (3) is fixedly connected to the recognition component (1) and is used to drive the recognition component (1) to adjust the recognition position along a first direction; The support and shock absorption assembly is fixedly connected to the worktable of the PCB depaneling machine, and the support adjustment assembly (3) is fixedly installed on the top of the support and shock absorption assembly for shock absorption of the support adjustment assembly (3) and the PCB to be identified placed on the support and shock absorption assembly.

2. The MARK point recognition device for a PCB depaneling machine according to claim 1, characterized in that, The supporting damping component includes: Shock-absorbing rubber pads are laid on the worktable of the PCB depaneling machine; The vibration damping platform (42) is located on top of the vibration damping rubber pad. The vibration damping platform (42) includes a support platform (421) for supporting the PCB to be identified, and the support adjustment component (3) is fixedly installed on the support platform (421). The vibration damping platform (42) is provided with a detection component, a position adjustment component, and a vibration damping adjustment component. The detection component is used to detect the displacement and vibration frequency of the vibration damping platform (42). The position adjustment component is used to adjust the levelness and height of the support platform (421). The vibration damping adjustment component is used to adjust the damping coefficient.

3. The MARK point recognition device for a PCB depaneling machine according to claim 2, characterized in that, The shock absorption platform (42) further includes a first support frame (422) and a second support frame (423). The first support frame (422) and the second support frame (423) are arranged parallel to each other along a second direction, which is perpendicular to the first direction. The bearing platform (421) is disposed on the second support frame (423). The shock absorption adjustment component is disposed between the first support frame (422) and the second support frame (423). The position adjustment component is disposed between the second support frame (423) and the bearing platform (421). The detection component is disposed at the bottom of the bearing platform (421).

4. The MARK point recognition device for a PCB depaneling machine according to claim 3, characterized in that, The detection component includes: The displacement sensors, comprising four sensors, are respectively disposed at the midpoint of the bottom edge of the support platform (421) and fixedly connected to the bottom of the support platform (421), and are used to detect the displacement of the support platform (421) in the second direction; A vibration sensor is disposed at the center of the bottom of the support platform (421) to detect the vibration frequency of the shock-absorbing platform (42).

5. The MARK point recognition device for a PCB depaneling machine according to claim 3, characterized in that, The position adjustment assembly includes four drive mechanisms (424), which are evenly arranged on the second support frame (423) and their drive ends are fixedly connected to the bottom edge of the support platform.

6. The MARK point recognition device for a PCB depaneling machine according to claim 3, characterized in that, The shock absorption adjustment assembly includes multiple damping adjustment mechanisms (425), which are evenly distributed along the first support frame (422), and each mechanism is fixedly connected at one end to the first support frame (422) and at the other end to the second support frame (423).

7. The MARK point recognition device for a PCB depaneling machine according to claim 3, characterized in that, The support adjustment component (3) includes: Mounting plate (31), which is fixedly connected to the identification component (1); A guide drive (32) is slidably connected to the mounting plate (31) for driving the mounting plate (31) to move the identification component (1) along the first direction, and the length of the guide drive (32) covers all the identification positions of the identification component (1); The support frame (33) is fixedly connected at one end to the top of the shock-absorbing platform (42) and at the other end to the guide drive (32).

8. The MARK point recognition device for a PCB depaneling machine according to claim 7, characterized in that, The device also includes a camera bracket (5), which comprises: The first connecting part (51) is a plate-shaped structure and extends along a third direction. One end of the first connecting part (51) near the mounting plate (31) is fixedly connected to the mounting plate (31). The third direction is perpendicular to the plane containing the first direction and the second direction. The second connecting part (52) extends along the second direction, and its side near the first connecting part (51) is fixedly connected to the first connecting part (51), and its other side is fixedly connected to the main camera (11). The annular mounting part (53) is fixedly connected to the bottom surface of the first connecting part (51) and the bottom surface of the second connecting part (52), and the annular mounting part (53) surrounds the outside of the main camera (11). Multiple auxiliary camera mounting seats (54) are evenly distributed on the outer wall of the annular mounting part (53).

9. The MARK point recognition device for a PCB depaneling machine according to claim 8, characterized in that, The light source assembly (2) includes: The light source bracket (21) includes a first connecting rod (211) and a second connecting rod (212). The first connecting rod (211) is rotatably connected to the side wall of the first connecting part (51). The end of the second connecting rod (212) near the first connecting rod (211) is rotatably connected to the first connecting rod (211). LED light source (22), the LED light source (22) is rotatably connected to the end of the second link (212) away from the first link (211) so that the LED light source (22) rotates about the axis of the second link (212).

10. The MARK point recognition device for a PCB depaneling machine according to claim 9, characterized in that, The telecentric lens of the main camera (11) has a resolution of more than 12 million pixels and a frame rate of more than 80fps.

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