Steel mould for the production of pc boards

Abstract

The utility model discloses a steel mould for PC board production relates to PC board production technical field, including base, the base lower extreme is equipped with support seat, four steel side moulds are slidably installed on the base, be equipped with a plurality of heat dissipation air duct in the steel side mould, be equipped with the drive mechanism for driving steel side mould stripping in the base, still be equipped with the heat dissipation assembly for improving steel side mould heat dissipation in the base, the utility model discloses a plurality of heat dissipation air duct are arranged in the steel side mould inside, and the heat dissipation assembly that the heat dissipation cavity, connecting channel and fan are configured in the base composition, realize the active forced heat dissipation of PC board in steel mould, and the solidification cycle is significantly shortened, and the production efficiency is promoted.

Description

Technical Field

[0001] This utility model relates to the field of PC board production technology, specifically a steel mold for PC board production. Background Technology

[0002] PC boards are widely used in prefabricated buildings due to their advantages such as standardized production and high construction efficiency.

[0003] In the current production process of PC sheets, steel molds are commonly used as the molding carrier. These existing steel molds generally rely on natural convection and radiation under ambient temperature to gradually dissipate internal heat of hydration and external heat. The cooling and curing process takes several hours to over ten hours. Only after the PC sheet reaches the required demolding strength can the mold be opened for demolding, hoisting, and curing. Because the steel mold itself has a large heat capacity, a long heat conduction path, and lacks an active heat exchange structure, the cooling rate is low and the curing cycle is long, severely restricting production cycle and equipment turnover rate.

[0004] Based on this, a steel mold for PC board production is now provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0005] The purpose of this invention is to provide a steel mold for PC board production to solve the problems in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A steel mold for PC board production includes a base with a support seat at the lower end of the base. Four steel side molds are slidably mounted on the base. Several heat dissipation channels are provided inside the steel side molds. A drive mechanism for demolding the steel side molds is provided inside the base. A heat dissipation component for improving the heat dissipation of the steel side molds is also provided inside the base.

[0007] Based on the above technical solutions, this utility model also provides the following optional technical solutions: In one alternative: the base has a base plate in the middle for PC board production, and four symmetrical sliding grooves for installing steel side molds are provided on the outer side of the base. The sliding groove has a first mounting groove on the side near the base plate, a second mounting groove is provided at the lower end of the base plate, and a third mounting groove is provided at the lower end of the second mounting groove. Both the second mounting groove and the third mounting groove are used to install the drive mechanism.

[0008] In one alternative: the lower end of the steel side mold is provided with a sliding seat that is slidably installed in the slide groove, a connecting rod is provided on one side of the slide groove, and a fixed column is provided at one end of the connecting rod.

[0009] In one alternative: the drive mechanism includes a turntable rotatably mounted in a second mounting slot, the turntable having four symmetrically arranged arc-shaped slots, a drive assembly at the lower end of the turntable, and the drive assembly being mounted in a third mounting slot.

[0010] In one alternative embodiment: the drive assembly includes a worm gear fixed to the lower end of the turntable, a worm is meshed with one side of the worm gear, and a handwheel is provided at one end of the worm.

[0011] In one alternative: the connecting rod is slidably installed in the first mounting groove, and the lower end of the fixing column is disposed in the arc-shaped groove.

[0012] In one alternative embodiment: the heat dissipation assembly includes a heat dissipation cavity disposed below the third mounting slot, the upper end of the heat dissipation cavity is provided with a plurality of connecting channels, and the lower end of the heat dissipation cavity is provided with a fan.

[0013] In one alternative: the upper end of the connecting channel is connected to the lower end of the heat dissipation duct.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention achieves active forced cooling of the PC board inside the steel mold by setting several heat dissipation channels inside the steel side mold and configuring a heat dissipation assembly consisting of a heat dissipation cavity, connecting channel and fan in the base, which significantly shortens the curing cycle and improves production efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the heat dissipation component in this utility model.

[0017] Figure 3 This is a schematic diagram of the base structure in this utility model.

[0018] Figure 4 This is a schematic diagram of the steel side mold in this utility model.

[0019] Reference numerals in the attached drawings: 100, base; 101, support seat; 102, base plate; 103, slide groove; 104, first mounting groove; 105, second mounting groove; 106, third mounting groove; 200, steel side mold; 201, heat dissipation duct; 202, sliding seat; 203, connecting rod; 204, fixed column; 300, drive mechanism; 301, turntable; 302, arc groove; 303, worm gear; 304, worm; 305, handwheel; 400, heat dissipation assembly; 401, heat dissipation cavity; 402, connecting channel; 403, fan. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0021] In one embodiment, such as Figures 1-3 As shown, the steel mold used for PC board production includes a base 100, a support base 101 at the lower end of the base 100, and four steel side molds 200 slidably mounted on the base 100. Each steel side mold 200 has several heat dissipation ducts 201. The base 100 also has a drive mechanism 300 for demolding the steel side molds 200. Furthermore, the base 100 has a heat dissipation component 400 to improve the heat dissipation efficiency of the steel side molds 200. In use, the drive mechanism 300 causes the four steel side molds 200 to slide along the base 100 until they are joined together as a whole. Then, the PC board molding material is poured into the four steel side molds 200. Next, the heat dissipation component 400 is activated to achieve forced heat dissipation of the PC board, thereby increasing the molding rate of the PC board.

[0022] In one embodiment, such as Figure 3 As shown, the base 100 has a base plate 102 for PC board production in the middle. The outer side of the base 100 has four symmetrical sliding grooves 103 for installing the steel side mold 200. The sliding groove 103 has a first mounting groove 104 on the side near the base plate 102. The lower end of the base plate 102 has a second mounting groove 105. The lower end of the second mounting groove 105 has a third mounting groove 106. The second mounting groove 105 and the third mounting groove 106 are both used to install the drive mechanism 300. In use, the drive mechanism 300 drives the steel side mold 200 to slide along the sliding groove 103 to realize the mold closing and demolding of the steel side mold 200.

[0023] In one embodiment, such as Figure 4 As shown, the lower end of the steel side mold 200 is provided with a sliding seat 202 that is slidably installed in the slide groove 103. A connecting rod 203 is provided on one side of the slide groove 103, and a fixed column 204 is provided at one end of the connecting rod 203. In use, the connecting rod 203 and the sliding seat 202 are driven by the driving mechanism 300 to move the sliding seat 202 along the slide groove 103.

[0024] In one embodiment, such as Figure 4As shown, the drive mechanism 300 includes a turntable 301 rotatably mounted in the second mounting groove 105. Four arc-shaped grooves 302 are symmetrically arranged on the turntable 301. A drive assembly is provided at the lower end of the turntable 301. The drive assembly is installed in the third mounting groove 106. The drive assembly includes a worm gear 303 fixed at the lower end of the turntable 301. A worm 304 is meshed with one side of the worm gear 303. A handwheel 305 is provided at one end of the worm 304. A connecting rod 203 is slidably mounted in the first mounting groove 104. The lower end of the fixed column 204 is set in the arc-shaped groove 302. In use, the worm 304 is driven to rotate by rotating the handwheel 305. At the same time, the turntable 301 is driven to rotate by the meshing transmission between the worm gear 303 and the worm 304. The fixed column 204 is driven by the arc-shaped groove 302 to move the steel side mold 200 along the slide groove 103.

[0025] In one embodiment, such as Figure 3 As shown, the heat dissipation assembly 400 includes a heat dissipation cavity 401 disposed below the third mounting groove 106. The upper end of the heat dissipation cavity 401 is provided with several connecting channels 402, and the lower end of the heat dissipation cavity 401 is provided with a fan 403. The upper end of the connecting channels 402 is connected to the lower end of the heat dissipation duct 201. In use, when the steel side mold 200 is closed, the upper end of the connecting channels 402 will be connected to the lower end of the heat dissipation duct 201. After the PC board is poured, the fan 403 is started, and the heat conducted from the PC board to the steel side mold 200 is extracted through the heat dissipation duct 201 and the connecting channels 402.

[0026] The above embodiment discloses a steel mold for PC board production. In use, the steel side mold 200 is first driven by the drive mechanism 300 to slide along the slide groove 103 to achieve the mold closing of the steel side mold 200. Then, the PC board is poured. Next, the fan 403 is started. The heat conducted from the PC board to the steel side mold 200 by the fan 403 is extracted through the heat dissipation duct 201 and the connecting channel 402, thereby improving the forming rate of the PC board. After the PC board is formed, the drive mechanism 300 drives the steel side mold 200 to slide in the opposite direction along the slide groove 103 to achieve the demolding of the steel side mold 200.

[0027] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A steel mold for PC board production, comprising a base (100), wherein a support seat (101) is provided at the lower end of the base (100), characterized in that, Four steel side molds (200) are slidably mounted on the base (100). The steel side molds (200) are provided with a number of heat dissipation ducts (201). The base (100) is provided with a drive mechanism (300) for demolding the steel side molds (200). The base (100) is also provided with a heat dissipation component (400) for improving the heat dissipation of the steel side molds (200).

2. The steel mold for PC board production according to claim 1, characterized in that, The base (100) has a base plate (102) for PC board production in the middle. The base (100) has four symmetrical grooves (103) for installing steel side molds (200) on the outer side. The groove (103) has a first mounting groove (104) on the side near the base plate (102). The base plate (102) has a second mounting groove (105) at the lower end. The second mounting groove (105) has a third mounting groove (106) at the lower end. The second mounting groove (105) and the third mounting groove (106) are both used to install the drive mechanism (300).

3. The steel mold for PC board production according to claim 1, characterized in that, The lower end of the steel side mold (200) is provided with a sliding seat (202) that is slidably installed in the slide groove (103). A connecting rod (203) is provided on one side of the slide groove (103), and a fixing column (204) is provided at one end of the connecting rod (203).

4. The steel mold for PC board production according to claim 1, characterized in that, The drive mechanism (300) includes a turntable (301) rotatably mounted in a second mounting slot (105). The turntable (301) is symmetrically provided with four arc-shaped slots (302). The lower end of the turntable (301) is provided with a drive assembly, which is installed in a third mounting slot (106).

5. The steel mold for PC board production according to claim 4, characterized in that, The drive assembly includes a worm gear (303) fixed at the lower end of the turntable (301), a worm (304) meshing with one side of the worm gear (303), and a handwheel (305) at one end of the worm (304).

6. The steel mold for PC board production according to claim 3, characterized in that, The connecting rod (203) is slidably installed in the first mounting groove (104), and the lower end of the fixing column (204) is set in the arc groove (302).

7. The steel mold for PC board production according to claim 1, characterized in that, The heat dissipation assembly (400) includes a heat dissipation cavity (401) disposed below the third mounting slot (106), the upper end of the heat dissipation cavity (401) is provided with a plurality of connecting channels (402), and the lower end of the heat dissipation cavity (401) is provided with a fan (403).

8. The steel mold for PC board production according to claim 7, characterized in that, The upper end of the connecting channel (402) is connected to the lower end of the heat dissipation duct (201).

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