A sapphire processing and cutting machine

Abstract

The utility model provides a kind of sapphire processing cutting machine, it is related to sapphire production and processing device field, solve the technical problem that traditional sapphire single processing mode efficiency and quality are difficult to take into account, including fuselage, movable workbench and wire cutting component;The wire cutting component includes the upper wire holder arm and lower wire holder arm across being arranged on the top of workbench, and the front end of its upper wire holder arm is integrally installed with preprocessing component;The preprocessing component integrates laser cutting component, identification sensor and antifouling mechanism.The detection path of identification sensor and the cutting path of diamond cutting line are aligned in the same direction, which ensures the synchronization accuracy of laser preprocessing and wire cutting from the structure;The antifouling mechanism isolates the cutting fluid and dust splashed in processing by forming air curtain, solves the conflict problem of dry and wet processing environment, the utility model improves the processing efficiency, precision and reliability of hard and brittle materials such as sapphire by integrated composite cutting design.

Description

Technical Field

[0001] This utility model relates to the field of sapphire production and processing equipment, specifically to a sapphire processing and cutting machine. Background Technology

[0002] Sapphire is widely used in high-end manufacturing due to its high hardness and excellent optical properties. However, its dual characteristics of being both hard and brittle pose challenges to traditional precision machining. Currently, the industry mainly uses diamond wire cutting and laser cutting technologies, but both technologies have their own drawbacks when processing sapphire. Diamond wire cutting, as a high-precision cold working method, can ensure good processing quality, but its physical cutting principle determines that the processing speed is relatively slow, making it difficult to meet the cycle time requirements of increasingly large-scale production. Laser cutting, as a high-energy beam processing method, is fast, but it generates a large heat-affected zone, which can easily cause microcracks and residual thermal stress at the edges of heat-sensitive and brittle materials such as sapphire, directly damaging the physical properties of the material and the quality of the finished product, and failing to meet the processing requirements of ultra-high precision. Utility Model Content

[0003] In order to overcome the problems in the prior art, this utility model provides a sapphire processing and cutting machine, which aims to solve the technical problems of poor efficiency or quality of single processing methods in the prior art, as well as the difficulty in accurately aligning the laser and wire cutting paths and mutual contamination of the processing environment in composite processing.

[0004] A sapphire processing and cutting machine includes a machine body, a movable worktable mounted on the machine body, and a wire cutting assembly mounted on the machine body. The wire cutting assembly includes an upper wire support arm and a lower wire support arm spanning above the worktable, and a diamond cutting wire tensioned between the upper and lower wire support arms. A pretreatment assembly is installed at the front end of the upper wire support arm. The pretreatment assembly includes a laser cutting assembly, a recognition sensor, and an anti-fouling mechanism. The detection path of the recognition sensor is aligned in the same direction as the cutting path of the diamond cutting wire.

[0005] Furthermore, the upper and lower support arms are arranged parallel to each other.

[0006] Furthermore, the anti-fouling mechanism includes a blower head connected to an air source, the nozzle of which faces downwards and towards the front end of the laser cutting assembly and the identification sensor to form an air curtain.

[0007] Furthermore, the identification sensor is a CCD camera or a laser micrometer.

[0008] Furthermore, the laser in the laser cutting assembly is an ultrafast laser.

[0009] Furthermore, a lifting mechanism for driving the pretreatment component to move vertically is provided between the upper frame arm and the pretreatment component.

[0010] Furthermore, the worktable is a multi-axis motion platform that can move along at least two horizontal directions, and sapphire clamps can be detachably installed on the worktable.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model realizes a processing mode that efficiently integrates laser pretreatment and diamond wire cutting. By weakening the material through laser pretreatment, the physical resistance of subsequent diamond wire cutting is greatly reduced, which allows the cutting speed to be increased several times. At the same time, due to the significant reduction in cutting force, material damage such as edge chipping and cracking during processing is effectively suppressed, and the quality of finished products is guaranteed. 2. By rigidly mounting the pretreatment component directly onto the upper frame arm of the wire cutting component, the relative positional relationship between the laser path and the wire cutting path is solidified at the physical level, realizing a one-time clamping and same-arm operation mode, eliminating micron-level alignment errors caused by equipment transfer and secondary positioning, and ensuring seamless and precise connection between pretreatment and cutting. 3. This utility model is equipped with a special anti-fouling mechanism. This mechanism creates a clean microenvironment for precision optical components such as laser lenses and sensors by forming a high-pressure air curtain, effectively blocking the intrusion of cutting fluid and dust, so that two completely different processing technologies can work stably and reliably in the same space. Attached Figure Description

[0012] To clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments are explained.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a front structural diagram of the present invention; Figure 3 This is a side view of the structure of this utility model; Figure 4 This is a schematic diagram of the wire cutting assembly structure of this utility model; Figure 5 This is a front view structural diagram of the wire cutting assembly of this utility model; Figure 6 This is a schematic diagram of the pretreatment component structure of this utility model.

[0014] Reference numerals: 1-Machine body, 2-Workbench, 3-Wire cutting assembly, 31-Upper wire support arm, 32-Lower wire support arm, 33-Diamond cutting wire, 4-Pre-treatment assembly, 41-Laser cutting assembly, 42-Identification sensor, 43-Anti-fouling mechanism, 431-Blowing head, 45-Lifting mechanism. Detailed Implementation

[0015] To make the objectives, technical solutions, and beneficial effects of this utility model clearer, the preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, so as to facilitate the understanding of those skilled in the art.

[0016] See Figure 1 , Figure 2 , Figure 3 This utility model proposes a sapphire processing and cutting machine, including a stable machine body 1, a worktable 2 for supporting and fixing sapphire workpieces, and a wire cutting assembly 3 for cutting. In this embodiment, the worktable 2 is preferably a multi-axis motion platform that can move along two horizontal directions, the X-axis and the Y-axis. It is driven by a servo motor and a precision ball screw to achieve precise positioning and feeding of the workpiece. The upper surface of the worktable 2 is provided with universal threaded holes or T-slots to facilitate the detachable installation of various sapphire-specific fixtures.

[0017] See Figure 4 , Figure 5 The wire cutting assembly 3 is the main structure of this utility model. It is installed on the machine body 1 and includes an upper wire frame arm 31 and a lower wire frame arm 32 that are parallel to each other. The two are straddling the worktable 2 to form a stable frame structure similar to a gantry. The diamond cutting wire 33 circulates in the wire feeding system composed of a wire storage drum, guide wheel, tension wheel, etc. Its effective cutting section is tensioned between the upper wire frame arm 31 and the lower wire frame arm 32 and is driven by the drive mechanism to perform high-speed reciprocating motion. A pre-treatment assembly 4 is integrated at the front end of the upper wire frame arm 31. The pre-treatment assembly 4 and the wire cutting assembly 3 belong to the same large motion unit and work together to complete all processing tasks. The pre-treatment assembly 4 includes a laser cutting assembly 41, an identification sensor 42, and an anti-fouling mechanism 43, so that the pre-treatment and final cutting of the workpiece can be completed in one clamping.

[0018] Specifically, in this embodiment, the identification sensor 42 is selected from at least one high-resolution industrial CCD camera, and its optical axis is precisely adjusted to be aligned with the center line of the diamond cutting line 33 in the Y-axis direction, that is, on the same path. See Figure 6The laser cutting component 41 preferably uses an ultrafast laser with a laser pulse width of picosecond or femtosecond level. Its beam outlet is located on one side of the identification sensor 42. The ultrafast laser can generate a very small heat-affected zone when ablating the material to perform high-quality micromachining. See Figure 4 , Figure 5 , Figure 6 To protect the precision components in the pretreatment assembly 4, an anti-contamination mechanism 43 is provided. This mechanism includes at least two blow heads 431 corresponding to the beam outlets of the identification sensor 42 and the laser cutting assembly 41, respectively. These blow heads 431 are connected to an external clean air source, such as a compressed air compressor. The nozzles of the blow heads 431 are designed below the front end of the laser cutting assembly 41 and the identification sensor 42. During operation, they spray high-speed clean airflow to form a dense air curtain. The air curtain can effectively block the cutting fluid or water droplets splashed during the wire cutting process, as well as the micron-sized dust generated by the laser pretreatment, preventing them from contaminating the focusing lens of the laser cutting assembly 41 and the photosensitive element of the identification sensor 42, thus ensuring the accuracy and stability of the pretreatment and detection. See Figure 4 , Figure 6 In order to achieve precise laser focusing, a lifting mechanism 45 is also provided between the upper frame arm 31 and the pretreatment component 4. The lifting mechanism 45 can be driven by a small servo motor to drive the entire pretreatment component 4 to perform micron-level lifting and lowering adjustments along the vertical direction (Z-axis).

[0019] To enable the coordinated operation of the above components, this utility model also includes a control system, which can be a CNC numerical control system based on an industrial computer. It is connected to the drive motor of the worktable 2, the drive mechanism of the wire cutting assembly 3, and the laser cutting assembly 41, the identification sensor 42, the anti-fouling mechanism 43 and the lifting mechanism 45 in the pretreatment assembly 4 via a data bus or electrical connection. The control system can receive and process workpiece path information from the identification sensor 42. Based on the path information and the pre-calibrated fixed positional relationship between the identification sensor 42 and the diamond cutting wire 33, it generates motion trajectory instructions for the worktable 2. According to the preset working sequence, it coordinates the start and stop of the laser cutting component 41, the switch of the anti-fouling mechanism 43, the lifting action of the lifting mechanism 45, and the start and stop of the cutting of the wire cutting component 3, thereby automatically completing the entire processing flow from path identification, laser pretreatment to final wire cutting.

[0020] It should be understood that the improvement of this utility model lies in the wire cutting component 3 which integrates the pre-treatment function. Therefore, other conventional wire cutting structures that are not described in detail but are well known to those skilled in the art, such as wire storage drums, wire feeding and tensioning mechanisms for supplying and recovering diamond cutting wire 33, as well as replenishment mechanisms, filtration and recovery mechanisms and cooling mechanisms for supplying and recovering cutting fluid, are all included in the overall structure of this utility model. They can be implemented using existing mature technologies. This application also includes other structures of these conventional cutting machines.

[0021] Work process: Workpiece clamping and path recognition: The sapphire workpiece to be processed is fixed on the worktable 2 using a fixture. The control system drives the worktable 2 to move in the X and Y axis directions, so that the area to be processed on the workpiece passes under the fixed recognition sensor 42 in sequence. The recognition sensor 42 (CCD camera) scans and takes pictures of the workpiece, and the precise coordinate data of the cutting path in the machine tool coordinate system is identified and recorded through image and focus processing algorithms. Laser pretreatment: The control system drives the worktable 2 to move according to the recorded path coordinates, so that the workpiece passes precisely along the predetermined path under the fixed laser cutting component 41; before this, the lifting mechanism 45 has adjusted the height of the pretreatment component 4 to make the laser accurately focus, and at the same time, the blowing head 431 of the anti-fouling mechanism 43 is activated to form a protective air curtain, and the laser cutting component 41 emits laser to complete the scribing or internal modification on the moving workpiece. Cutting alignment: After laser pretreatment, since the identification sensor 42, laser cutting component 41, and diamond cutting line 33 are all fixed on the same upper structure, their precise positional relationship remains constant. The control system only needs to drive the worktable 2 to make a precise translation based on this pre-calibrated fixed offset to completely align the starting point of the laser pretreatment path with the cutting point of the diamond cutting line 33. Diamond wire cutting: After alignment, the cutting fluid supply mechanism starts working, and the diamond cutting wire 33 starts high-speed reciprocating motion. The control system drives the worktable 2 to feed along the planned cutting path at the set speed, thereby completing the final cutting of the sapphire workpiece. Processing complete: After the cutting is finished, all systems stop working and the processed workpiece is removed.

[0022] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A sapphire processing and cutting machine, characterized in that, The device includes a body (1), a movable worktable (2) mounted on the body (1), and a wire cutting assembly (3) mounted on the body (1). The wire cutting assembly (3) includes an upper wire frame arm (31) and a lower wire frame arm (32) spanning above the worktable (2), and a diamond cutting wire tensioned between the upper wire frame arm (31) and the lower wire frame arm (32). A pre-processing assembly (4) is installed at the front end of the upper wire frame arm (31). The pre-processing assembly (4) includes a laser cutting assembly (41), an identification sensor (42), and an anti-fouling mechanism (43). The detection path of the identification sensor (42) is aligned in the same direction as the cutting path of the diamond cutting wire (33).

2. The sapphire processing and cutting machine according to claim 1, characterized in that: The upper wire arm (31) and the lower wire arm (32) are arranged in parallel to each other.

3. The sapphire processing and cutting machine according to claim 1 or 2, characterized in that: The anti-fouling mechanism (43) includes a blower head (431) connected to an air source, the nozzle of which faces downward toward the front end of the laser cutting assembly (41) and the identification sensor (42) to form an air curtain.

4. The sapphire processing and cutting machine according to claim 1, characterized in that: The identification sensor (42) is a CCD camera or a laser micrometer.

5. The sapphire processing and cutting machine according to claim 1, characterized in that: The laser in the laser cutting assembly (41) is an ultrafast laser.

6. The sapphire processing and cutting machine according to claim 1, characterized in that: A lifting mechanism (45) for driving the pretreatment component (4) to move vertically is also provided between the upper frame arm (31) and the pretreatment component (4).

7. The sapphire processing and cutting machine according to claim 1, characterized in that: The worktable (2) is a multi-axis motion platform that can move along at least two horizontal directions, and a sapphire fixture can be detachably installed on the worktable (2).

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