An immersed solar silicon wafer cutting device

Abstract

The utility model discloses an immersed solar energy silicon wafer cutting equipment relates to solar energy silicon wafer cutting technical field, the utility model discloses a cutting box, wire cutting machine, the conical bottom of cutting box fixed mounting has the discharge valve, the sliding bracket is slidably installed on the cutting box, the fixed mounting of one side of cutting box has first electric push rod, the sliding bracket is slidably installed in the lifting frame, the bottom fixed mounting of lifting frame has the fixed plate, and the fixed plate is installed with clamping subassembly, the first screw rod is installed in the sliding bracket inner furnace temperature, and the top fixed mounting of first screw rod has the hand wheel, and the fixed frame is fixedly installed on the cutting box, and the wire cutting machine is slidably installed in the fixed frame, and the top fixed mounting of fixed frame has second electric push rod, in the utility model, through the immersed cutting solar energy silicon wafer, has improved the heat dissipation and the cutting slice yield ratio significantly, has prevented the scratch of diamond wire and silicon wafer to the accumulation of powder dust, and moreover has reduced the abrasion of diamond particle on the cutting line.

Description

Technical Field

[0001] This utility model relates to the field of solar silicon wafer cutting technology, specifically to an immersion solar silicon wafer cutting device. Background Technology

[0002] Solar silicon wafers are the core component of photovoltaic cells, and their cutting quality directly affects the cell's efficiency and manufacturing cost. Traditional silicon wafer cutting mainly uses diamond wire cutting technology, which uses a high-speed moving diamond wire to grind and cut the silicon rod.

[0003] However, most existing diamond wire cutting equipment operates in air (dry cutting or with a small amount of coolant spray). During high-speed cutting, a large amount of frictional heat is generated between the diamond wire and the silicon rod, causing a sharp increase in local temperature. This heat accumulation leads to a series of problems: First, it easily causes thermal stress damage to the silicon wafer, producing microcracks or even causing the wafer to break, seriously affecting the yield; second, high temperatures accelerate the oxidation and wear of the diamond abrasive grains, leading to a significant increase in wire life (wire consumption) and driving up production costs; finally, thermal deformation also affects the stability of the cutting process, resulting in quality problems such as uneven wafer thickness and obvious wire marks. Utility Model Content

[0004] In order to solve the problems of poor heat dissipation during the cutting process, low silicon wafer yield, high consumption of cutting wires, and limited cutting accuracy in the existing technology, the purpose of this utility model is to provide an immersion solar silicon wafer cutting device.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: an immersion-type solar silicon wafer cutting device, including a cutting box and a wire cutter. A discharge valve is fixedly installed at the conical bottom of the cutting box. A sliding frame is slidably installed on the cutting box. A first electric push rod is fixedly installed on one side of the cutting box. The output end of the first electric push rod is fixedly connected to the sliding frame. A lifting frame is slidably installed inside the sliding frame. A fixed plate is fixedly installed at the bottom of the lifting frame. A clamping assembly is installed on the fixed plate. A first lead screw is threaded inside the sliding frame, and the bottom end of the first lead screw is rotatably connected to the top end of the lifting frame. A handwheel is fixedly installed at the top end of the first lead screw. A fixed frame is fixedly installed on the cutting box. The wire cutter is slidably installed inside the fixed frame. A second electric push rod is fixedly installed at the top end of the fixed frame, and the output end of the second electric push rod is fixedly connected to the top end of the wire cutter. A support rod is fixedly installed inside the cutting box. A perforated plate is fixedly installed inside the cutting box.

[0006] Preferably, the clamping assembly includes a worm gear rotatably mounted inside a fixed plate. A knob is fixedly mounted on one end of the worm gear. Multiple sliding rods arranged in a ring are slidably mounted inside the fixed plate, and clamping rods are fixedly mounted on each of the sliding rods. Multiple second lead screws arranged in a ring are rotatably mounted inside the fixed plate, and the second lead screws are threaded into the corresponding sliding rods. A worm wheel is rotatably mounted inside the fixed plate and meshes with the worm gear. A first bevel gear is fixedly mounted on one end of each of the multiple second lead screws that is close to each other. A second bevel gear is fixedly mounted on one end of the worm wheel's shaft, and the second bevel gear meshes with the first bevel gear.

[0007] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0008] 1. In this utility model, by immersion cutting of solar silicon wafers, the cutting fluid can instantly remove the huge heat generated at the cutting point during cutting, avoiding thermal stress damage to the silicon wafer caused by local high temperature, significantly improving heat dissipation and slicing yield. The silicon powder generated during cutting is quickly washed away by the cutting fluid, preventing the accumulation of powder debris from scratching the diamond wire and silicon wafer. Moreover, good cooling and lubrication reduce the wear of diamond particles on the cutting wire, while the clean cutting environment reduces abnormal wire loss.

[0009] 2. In this utility model, by setting a clamping component, the silicon rod used for cutting solar silicon wafers can be clamped and fixed by the clamping component according to the diameter of the silicon rod, which facilitates stable feeding during silicon rod cutting. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0012] Figure 2 This is a schematic diagram of the cross-sectional structure of the cutting box of this utility model;

[0013] Figure 3 This is a schematic diagram of the first cross-sectional structure of the fixing plate of this utility model;

[0014] Figure 4 This is a schematic diagram of the second cross-sectional structure of the fixing plate of this utility model;

[0015] Figure 5 This utility model Figure 4 Enlarged schematic diagram of the structure at point A in the middle.

[0016] In the diagram: 1. Cutting box; 2. Discharge valve; 3. Sliding frame; 4. Fixed frame; 5. First electric actuator; 6. Wire cutting machine; 7. Lifting frame; 8. First lead screw; 9. Handwheel; 10. Second electric actuator; 11. Hollow plate; 12. Support rod; 13. Silicon rod; 14. Fixed plate; 15. Clamping assembly; 1501. Sliding rod; 1502. Second lead screw; 1503. Worm gear; 1504. Knob; 1505. Clamping rod; 1506. First bevel gear; 1507. Second bevel gear; 1508. Worm gear. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Example: Figure 1-5As shown, this utility model provides an immersion-type solar silicon wafer cutting device, including a cutting box 1 and a wire cutter 6. The wire cutter 6 is an existing single-wire wire cutter 6, mainly including: a wire feeding reel: storing unused cutting wire rolls; a wire take-up reel: recycling used cutting wire; diamond cutting wire: a special steel wire with diamond micro powder fixed on its surface, which is the core tool for performing the cutting task; a guide wheel: used for guiding and driving the cutting wire; a tension control system: a crucial part, usually including a tension sensor and a servo feedback mechanism, used to monitor and adjust the tension of the cutting wire in real time to ensure cutting stability and quality. A discharge valve 2 is fixedly installed at the conical bottom end of the cutting box 1, and a sliding frame 3 is slidably installed on the cutting box 1. A first electric push rod 5 is fixedly installed on one side of the cutting box 1. The output end of the first electric push rod 5 is fixedly connected to the sliding frame 3. A lifting frame 7 is slidably installed inside the sliding frame 3. A fixing plate 14 is fixedly installed at the bottom of the lifting frame 7. A clamping assembly 15 is installed on the fixing plate 14. A first lead screw 8 is threaded inside the sliding frame 3, and the bottom end of the first lead screw 8 is rotatably connected to the top end of the lifting frame 7. A handwheel 9 is fixedly installed at the top end of the first lead screw 8. A fixing frame 4 is fixedly installed on the cutting box 1. A wire cutter 6 is slidably installed inside the fixing frame 4. A second electric push rod 10 is fixedly installed at the top end of the fixing frame 4, and the output end of the second electric push rod 10 is fixedly connected to the top end of the wire cutter 6. A support rod 12 is fixedly installed inside the cutting box 1. A perforated plate 11 is fixedly installed inside the cutting box 1. Silicon rods 13, used for cutting solar silicon wafers, can be fixedly mounted on a fixed plate 14 via a clamping assembly 15. Then, the handwheel 9 drives the first lead screw 8 to rotate, causing the lifting frame 7, the fixed plate 14, and the silicon rod 13 to descend into the cutting box 1. This allows the cutting end of the silicon rod 13 to contact the V-groove of the support rod 12, which supports the cutting end. Next, a cutting fluid with a specific formula is injected into the cutting box 1 until the silicon rod 13 is completely submerged. Then, the wire cutter 6 is started. The second electric push rod 10 drives the wire cutter 6 to descend uniformly within the fixed frame 4, cutting the silicon rod 13 into silicon wafers. Silicon wafers can be cut as needed. The thickness is determined by the first electric push rod 5, which drives the sliding frame 3, lifting frame 7, fixed plate 14 and silicon rod 13 to move, and quantitatively feeds the silicon rod 13. The cut silicon wafer falls onto the cut plate 11. During cutting, the cutting fluid can instantly remove the huge heat generated at the cutting point, avoiding thermal stress damage (TTV, line marks, edge chipping, etc.) caused by local high temperature on the silicon wafer, which significantly improves heat dissipation and slicing yield. The silicon powder generated during cutting is quickly washed away by the cutting fluid, preventing the accumulation of powder debris from scratching the diamond wire and silicon wafer. Moreover, good cooling and lubrication reduce the wear of diamond particles on the cutting line. At the same time, the clean cutting environment reduces abnormal wire loss. After cutting, the cutting fluid is discharged through the discharge valve 2.

[0019] The clamping assembly 15 includes a worm gear 1503, which is rotatably mounted within a fixed plate 14. A hexagonal knob 1504 is fixedly mounted at one end of the worm gear 1503. Multiple sliding rods 1501 are slidably mounted in a ring within the fixed plate 14, and clamping rods 1505 are fixedly mounted on each of the sliding rods 1501. Multiple second lead screws 1502 are rotatably mounted in a ring within the fixed plate 14, and the second lead screws 1502 are threaded into their corresponding sliding rods 1501. A worm gear 1508 is rotatably mounted within the fixed plate 14 and meshes with the worm gear 1503. A first bevel gear 1506 is fixedly mounted at the end of each of the multiple second lead screws 1502 that is close to each other. A second bevel gear 1507 is fixedly mounted at one end of the shaft of the worm gear 1508, and the second bevel gear 1507 interacts with the first bevel gear 1503. 6. Engagement: Based on the diameter of the silicon rod 13 used for cutting solar silicon wafers, a wrench or Allen wrench is used to rotate the knob 1504. The knob 1504 rotates the worm gear 1503, which in turn rotates the worm wheel 1508. The worm wheel 1508 rotates the second bevel gear 1507, which in turn rotates multiple first bevel gears 1506. The multiple first bevel gears 1506 rotate the corresponding second lead screw 1502, which in turn rotates the corresponding sliding rod 1501, which slides and retracts into the fixing plate 14. The multiple sliding rods 1501 move multiple clamping rods 1505 closer together to clamp and fix one end of the silicon rod 13. All the holes on the fixing plate 14 are equipped with sealing rings to prevent cutting fluid from entering the fixing plate 14 and affecting the transmission of its internal structure.

[0020] Working Principle: In use, this invention allows for the rotation of a knob 1504 using a wrench or Allen wrench, based on the diameter of the silicon rod 13 used for cutting solar silicon wafers. The knob 1504 rotates the worm gear 1503, which in turn rotates the worm wheel 1508. The worm wheel 1508 then rotates the second bevel gear 1507, which in turn rotates multiple first bevel gears 1506. These first bevel gears then rotate the corresponding second lead screws 1502, which in turn rotate the corresponding sliding rods 1501, causing them to slide and retract into the fixing plate 14. The sliding rods 1501 then move multiple clamping rods 1505 closer together to clamp and fix one end of the silicon rod 13, thus installing the silicon rod 13 onto the fixing plate 14. Then, using… Handwheel 9 drives the first lead screw 8 to rotate, and the first lead screw 8 drives the lifting frame 7, the fixed plate 14, and the silicon rod 13 to descend into the cutting box 1, so that the cutting end of the silicon rod 13 contacts the V-groove of the support rod 12. The support rod 12 can be used to support the cutting end of the silicon rod 13. Then, a cutting fluid with a specific formula is injected into the cutting box 1 until the silicon rod 13 is completely submerged. Then, the wire cutter 6 is started. The second electric push rod 10 can be used to drive the wire cutter 6 to descend at a uniform speed in the fixed frame 4 to cut the silicon rod 13 into silicon wafers. The thickness of the silicon wafer can be cut as needed. The first electric push rod 5 drives the sliding frame 3, the lifting frame 7, the fixed plate 14, and the silicon rod 13 to move, and quantitatively feeds the silicon rod 13. The cut silicon wafers fall onto the cut plate 11. After cutting, the cutting fluid is discharged through the discharge valve 2.

[0021] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0022] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. An immersion-type solar silicon wafer cutting device, comprising a cutting box (1) and a wire cutter (6), characterized in that: A discharge valve (2) is fixedly installed at the conical bottom end of the cutting box (1). A sliding frame (3) is slidably installed on the cutting box (1). A first electric push rod (5) is fixedly installed on one side of the cutting box (1). The output end of the first electric push rod (5) is fixedly connected to the sliding frame (3). A lifting frame (7) is slidably installed inside the sliding frame (3). A fixing plate (14) is fixedly installed at the bottom end of the lifting frame (7). A clamping assembly (15) is installed on the fixing plate (14). The sliding frame (3) is threaded with a first lead screw (8), and the bottom end of the first lead screw (8) is rotatably connected to the top end of the lifting frame (7). A handwheel (9) is fixedly installed on the top end of the first lead screw (8). A fixed frame (4) is fixedly installed on the cutting box (1). The wire cutter (6) is slidably installed in the fixed frame (4). A second electric push rod (10) is fixedly installed on the top end of the fixed frame (4), and the output end of the second electric push rod (10) is fixedly connected to the top end of the wire cutter (6).

2. The immersion-type solar silicon wafer cutting equipment as described in claim 1, characterized in that, A support rod (12) is fixedly installed inside the cutting box (1), and a perforated plate (11) is fixedly installed inside the cutting box (1).

3. The immersion-type solar silicon wafer cutting equipment as described in claim 1, characterized in that, The clamping assembly (15) includes a worm gear (1503), which is rotatably mounted in the fixed plate (14), and a knob (1504) is fixedly mounted on one end of the worm gear (1503).

4. The immersion-type solar silicon wafer cutting equipment as described in claim 1, characterized in that, A plurality of sliding rods (1501) are slidably installed in the fixed plate (14) in a ring, and a clamping rod (1505) is fixedly installed on each of the plurality of sliding rods (1501).

5. The immersion-type solar silicon wafer cutting equipment as described in claim 4, characterized in that, The fixed plate (14) is rotatably installed with a plurality of second lead screws (1502) arranged in a ring, and the second lead screws (1502) are threaded into the corresponding sliding rods (1501).

6. The immersion-type solar silicon wafer cutting equipment as described in claim 5, characterized in that, A worm gear (1508) is rotatably mounted inside the fixed plate (14), and the worm gear (1508) meshes with the worm (1503).

7. The immersion-type solar silicon wafer cutting equipment as described in claim 6, characterized in that, Each of the multiple second lead screws (1502) has a first bevel gear (1506) fixedly installed at one end close to each other, and a second bevel gear (1507) is fixedly installed at one end of the shaft of the worm gear (1508), and the second bevel gear (1507) meshes with the first bevel gear (1506).

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