Mold structure with local rapid heat dissipation

Abstract

The utility model relates to a mould structure with local quick heat dissipation relates to heat dissipation structure technical field, including mould, mould is equipped with product forming cavity, the mould is fixedly connected with beryllium copper block, the cooling surface of beryllium copper block is located in product forming cavity, and together with product forming cavity participates in product forming work, and the cooling waterway is seted up around product forming cavity in the mould, and the passage of beryllium copper block is seted up and is connected with cooling waterway. The utility model solves the problem that the injection mould in traditional technology is generally designed water cooling or oil cooling pipeline, and for the local thicker product, there is local slow heat dissipation, influences product size precision and surface quality, and the problem that the production efficiency is reduced if the cooling time is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically to a mold structure with localized rapid heat dissipation. Background Technology

[0002] In injection molding, mold temperature directly affects product quality and production efficiency. A suitable mold temperature ensures the fluidity and cooling rate of the plastic within the mold, resulting in good surface quality, dimensional stability, and mechanical properties. This is especially important for automotive parts, where precise mold temperature control is crucial to guarantee dimensional accuracy and surface quality.

[0003] A prior art patent with publication number CN109648796A discloses a solution including a mold base, a mold core, and water-cooling pipes. The mold core is mounted on the mold base; the mold core has an elongated cylindrical structure; the mold core is formed by stacking and connecting multiple flat cylindrical blocks along the axial direction of the mold core; water-cooling pipes are installed inside the mold core; water-cooling grooves for arranging the water-cooling pipes are provided on the cylindrical blocks; the water-cooling grooves include a central groove, an arc-shaped groove, and a straight groove. This invention, through the stacking and splicing of multiple cylindrical blocks and the setting of a three-dimensional water-cooling pipe structure within the mold core, can water-cool the injection-molded product, resulting in good cooling effect, preventing product burns, good injection molding effect, good surface quality, and a simple and reasonable injection mold production method with low manufacturing cost, good processing precision, and the injection mold is not easily deformed and has a long service life.

[0004] As existing devices are used, the shortcomings of this technology have gradually become apparent, mainly in the following aspects:

[0005] Injection molds are generally designed with water-cooling or oil-cooling pipelines. For products with thicker parts, there may be slow heat dissipation in some areas, which will affect the dimensional accuracy and surface quality of the product. Extending the cooling time will lead to a decrease in production efficiency.

[0006] As can be seen from the above, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content

[0007] To address the shortcomings of existing technologies, this utility model provides a mold structure with localized rapid heat dissipation. This solves the problem that traditional injection molds are generally designed with water-cooling or oil-cooling pipelines, which can lead to slow localized heat dissipation for products with thicker sections. This can affect the dimensional accuracy and surface quality of the product, and prolonged cooling time can result in reduced production efficiency.

[0008] To achieve the above objectives, the present invention provides the following technical solution.

[0009] A mold structure with localized rapid heat dissipation includes a mold core, which has a product forming cavity. A beryllium copper block is fixed to the mold core, and the cooling surface of the beryllium copper block is located inside the product forming cavity, participating in the product forming process together with the product forming cavity.

[0010] The mold core has cooling water channels around the product forming cavity, and the beryllium copper block has channels connecting the cooling water channels.

[0011] As an optimized solution, the mold core is provided with a mounting groove that matches the shape of the beryllium copper block, and the beryllium copper block is fixed in the mounting groove.

[0012] As an optimized solution, the channel extends through the opposite sidewalls of the beryllium copper block, and sealing rings covering the channel are respectively provided between the opposite sidewalls of the beryllium copper block and the mounting groove.

[0013] As an optimized solution, the sidewalls of the beryllium copper block are respectively provided with annular grooves coaxial with the channel, and the sealing ring is fitted into the annular grooves.

[0014] As an optimized solution, the beryllium copper block is arranged in a trapezoidal shape, the channel passes through the relative waist of the beryllium copper block, and the bottom of the beryllium copper block is located inside the product molding cavity.

[0015] As an optimized solution, two screws are inserted side by side on the side wall of the mold core, and the ends of the two screws are respectively connected to the upper bottom thread of the beryllium copper block.

[0016] As an optimized solution, the two screws are located on the upper and lower sides of the channel, respectively.

[0017] As an optimized solution, the cooling water path is arranged in a rectangular shape.

[0018] As an optimized solution, the bottom of the mold core is fixedly connected with an inlet pipe and an outlet pipe that connect the beginning and end of the cooling water circuit.

[0019] As an optimized solution, the bottom of the mold core is vertically provided with a water inlet channel that connects to the beginning of the cooling water circuit, and the water inlet pipe is fixed in the water inlet channel.

[0020] As an optimized solution, the bottom of the mold core is vertically provided with a water outlet channel that connects to the end of the cooling water circuit, and the water outlet pipe is fixed in the water outlet channel.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] Beryllium copper blocks are placed in the thicker parts of different products. By using beryllium copper blocks in the product molding process, the high thermal conductivity of beryllium copper is used to cool the product with cooling water, which quickly removes the heat and achieves rapid heat dissipation. This reduces the local temperature of the mold and solves the problem of slow local heat dissipation caused by uneven product wall thickness.

[0023] It significantly improves the heat dissipation effect of the mold, reduces the local temperature of the mold, ensures the stability of product dimensions, improves product quality, shortens the production cycle, and improves production efficiency. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0025] Figure 1 This is a schematic diagram of the structure of this utility model;

[0026] Figure 2 This is a schematic diagram of the water outlet channel of this utility model;

[0027] Figure 3 This is a three-dimensional structural diagram of the present invention.

[0028] In the diagram: 1-Mold core; 2-Product molding cavity; 3-Beryllium copper block; 4-Cooling water channel; 5-Channel; 6-Sealing ring; 7-Water inlet pipe; 8-Water outlet pipe; 9-Screw; 10-Water outlet channel. Detailed Implementation

[0029] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0030] like Figures 1 to 3 As shown, the mold structure with localized rapid heat dissipation includes a mold core 1, a product forming cavity 2, and a beryllium copper block 3 fixedly attached to the mold core 1. The cooling surface of the beryllium copper block 3 is located inside the product forming cavity 2 and participates in the product forming process together with the product forming cavity 2.

[0031] The mold core 1 has a cooling water channel 4 around the product molding cavity 2, and the beryllium copper block 3 has a channel 5 that connects to the cooling water channel 4.

[0032] The mold core 1 has an installation groove that matches the shape of the beryllium copper block 3, and the beryllium copper block 3 is fixed in the installation groove.

[0033] Channel 5 penetrates the opposite sidewalls of beryllium copper block 3. Sealing rings 6 covering channel 5 are respectively provided between the opposite sidewalls of beryllium copper block 3 and the mounting groove. Sealing rings 6 are used to achieve sealing and prevent liquid from leaking from the mounting groove.

[0034] The side wall of the beryllium copper block 3 is provided with annular grooves that are coaxial with the channel 5, and the sealing ring 6 is fitted into the annular grooves.

[0035] The beryllium copper block 3 is arranged in a trapezoidal shape, and the channel 5 runs through the beryllium copper block 3 relative to the waist. The bottom of the beryllium copper block 3 is located in the product molding cavity 2. The channel 5 can remove the heat of the beryllium copper block 3 and increase the contact area with the product through the bottom.

[0036] Two screws 9 are inserted side by side on the side wall of the mold core 1, and the ends of the two screws 9 are respectively connected to the upper bottom thread of the beryllium copper block 3.

[0037] Two screws, number 9, are located on the upper and lower sides of channel 5.

[0038] The cooling water channel 4 is arranged in a rectangle to allow it to work around the product molding cavity 2.

[0039] The bottom of the mold core 1 is fixedly connected with the inlet pipe 7 and the outlet pipe 8, which connect the beginning and end of the cooling water passage 4.

[0040] The bottom of the mold core 1 is vertically provided with a water inlet channel 5 that connects to the beginning of the cooling water circuit 4, and the water inlet pipe 7 is fixed inside the water inlet channel 5.

[0041] The bottom of the mold core 1 is vertically provided with a water outlet channel 10 that connects to the end of the cooling water circuit 4, and the water outlet pipe 8 is fixed inside the water outlet channel 10.

[0042] All four cooling water channels are formed by drilling, and the inlet ends of the drilled holes are connected with sealing bolts.

[0043] The working principle of this device is as follows:

[0044] According to different products, beryllium copper blocks 3 are set in the thicker parts. By using beryllium copper blocks 3 to participate in the product molding process, the high thermal conductivity of beryllium copper is used to cool the product with cooling water, and the heat is quickly carried away to achieve rapid heat dissipation, reduce the local temperature of the mold, and solve the problem of slow local heat dissipation caused by uneven product wall thickness.

[0045] It significantly improves the heat dissipation effect of the mold, reduces the local temperature of the mold, ensures the stability of product dimensions, improves product quality, shortens the production cycle, and improves production efficiency.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A mold structure with localized rapid heat dissipation, characterized in that: The device includes a mold core (1), which has a product forming cavity (2). A beryllium copper block (3) is fixedly attached to the mold core (1). The cooling surface of the beryllium copper block (3) is located inside the product forming cavity (2) and participates in the product forming process together with the product forming cavity (2). The mold core (1) has a cooling water channel (4) around the product forming cavity (2), and the beryllium copper block (3) has a channel (5) connecting the cooling water channel (4).

2. The mold structure with localized rapid heat dissipation according to claim 1, characterized in that: The mold core (1) has an installation groove that matches the shape of the beryllium copper block (3), and the beryllium copper block (3) is fixed in the installation groove.

3. The mold structure with localized rapid heat dissipation according to claim 2, characterized in that: The channel (5) penetrates the opposite sidewall of the beryllium copper block (3), and a sealing ring (6) covering the channel (5) is provided between the opposite sidewall of the beryllium copper block (3) and the mounting groove.

4. The mold structure with localized rapid heat dissipation according to claim 3, characterized in that: The beryllium copper block (3) has annular grooves on its side wall that are coaxial with the channel (5), and the sealing ring (6) is fitted into the annular grooves.

5. The mold structure with localized rapid heat dissipation according to claim 1, characterized in that: The beryllium copper block (3) is arranged in a trapezoidal shape, and the channel (5) passes through the relative waist of the beryllium copper block (3). The bottom of the beryllium copper block (3) is located in the product forming cavity (2).

6. The mold structure with localized rapid heat dissipation according to claim 5, characterized in that: Two screws (9) are inserted side by side on the side wall of the mold core (1), and the ends of the two screws (9) are respectively connected to the upper bottom thread of the beryllium copper block (3).

7. The mold structure with localized rapid heat dissipation according to claim 6, characterized in that: The two screws (9) are located on the upper and lower sides of the channel (5).

8. The mold structure with localized rapid heat dissipation according to claim 1, characterized in that: The cooling water channel (4) is arranged in a rectangular shape.

9. The mold structure with localized rapid heat dissipation according to claim 8, characterized in that: The bottom of the mold core (1) is fixedly connected with an inlet pipe (7) and an outlet pipe (8) that connect the beginning and end of the cooling water passage (4).

10. The mold structure with localized rapid heat dissipation according to claim 9, characterized in that: The bottom of the mold core (1) is vertically provided with an inlet channel (5) that connects to the beginning of the cooling water passage (4), and the inlet pipe (7) is fixed in the inlet channel (5); the bottom of the mold core (1) is vertically provided with an outlet channel (10) that connects to the end of the cooling water passage (4), and the outlet pipe (8) is fixed in the outlet channel (10).

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