A package substrate warpage correction device

Abstract

The utility model discloses a kind of packaging substrate warping correction devices, including base, placing groove, side plate, pressing plate and drive mechanism, base is horizontally placed, side plate is vertically fixed in base, side plate is equipped with sliding slot, the side of pressing plate is connected drive mechanism and embedded in sliding slot, drive mechanism drives pressing plate to lift along sliding slot, placing groove is equipped in a supporting plate, supporting plate is detachably installed on base, packaging substrate is fixed in placing groove, drive mechanism drives pressing plate to packaging substrate to realize warping correction with force.The utility model structure is simple, easy to operate, using the pressing plate of liftable to the packaging substrate in the placing groove is corrected, force and stress are more uniform when correcting, can realize nondestructive correction, correction efficiency is high, and placing groove for fixing packaging substrate is separately arranged on a replaceable supporting plate, realize a set of correction device configuration multiple different specifications supporting plate, expand the application range of the correction device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging auxiliary tooling equipment technology, and more specifically to a packaging substrate warpage correction device. Background Technology

[0002] Packaging substrates (such as BGAs and CSPs) are prone to warping during manufacturing or use due to factors such as thermal stress and uneven material shrinkage. This warping can lead to problems such as decreased mounting accuracy and poor soldering. Warping substrates reduce product reliability and may even cause failure. Substrates with excessive warping often enter the production process and are detected during reflow. Because chips have already been mounted and reflow soldered, they are no longer suitable for repair and must be scrapped. This results in a double loss of manpower and raw materials. Therefore, correcting warping on packaging substrates is crucial.

[0003] Existing correction methods lack the ability to adaptively adjust to different degrees of warping, and a highly efficient, non-destructive, and adjustable correction device is needed to solve the above problems. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a packaging substrate warpage correction device that applies force evenly and provides efficient correction, applicable to a wide range of sizes.

[0005] According to one aspect of this utility model, a packaging substrate warpage correction device is provided, including a base, a placement groove, a side plate, a pressure plate, and a driving mechanism. The base is horizontally placed, and the side plate is vertically fixed to the base. The side plate has a sliding groove. The side of the pressure plate is connected to the driving mechanism and embedded in the sliding groove. The driving mechanism drives the pressure plate to move up and down along the sliding groove. The placement groove is used to place the packaging substrate and is positioned above the base. The driving mechanism drives the pressure plate to apply force to the packaging substrate to achieve warpage correction. Thus, the packaging substrate to be corrected is fixed in the placement groove, and the pressure plate is lowered by the driving mechanism. The pressure plate corrects the packaging substrate, resulting in high correction efficiency. Furthermore, the pressure plate applies pressure evenly throughout the entire structure, reducing product damage.

[0006] In some embodiments, the driving mechanism includes a screw and a driving member. The side of the pressure plate is provided with an internal thread adapted to the screw. The screw is vertically disposed in a slide groove, and the end of the screw is connected to the driving member to drive the screw to rotate, causing the pressure plate to move up and down along the slide groove. Thus, the driving member causes the screw to rotate. Due to the restriction of the slide groove, the pressure plate can only move up and down and cannot rotate. The threaded transmission facilitates control of the pressing position of the pressure plate, makes adjustment convenient, and achieves high correction accuracy.

[0007] In some embodiments, there are two side plates symmetrically arranged on both sides of the base, and two sets of drive mechanisms are provided, one on each side of the pressure plate. The inner sides of both side plates are provided with sliding grooves, and the two sides of the pressure plate connecting the drive mechanisms are movably embedded in these grooves. Thus, by using two sets of drive mechanisms, force can be applied simultaneously from both sides, making the force applied to the pressure plate more uniform and better protecting the packaging substrate during correction.

[0008] In some embodiments, the placement slots are located on a tray, which is mounted above the base. This allows for the creation of placement slots for different product models on multiple trays, accommodating various products. By changing the trays, the same device can be used for different products, reducing the need for fixture manufacturing and lowering costs.

[0009] In some embodiments, the base is provided with a slide rail, and a slide bar is fitted on the slide rail. The tray is detachably connected to the slide bar. Thus, different trays can be configured with the same set of slide bars. When replacing a tray, the tray can be moved along the slide rail, avoiding interference from the pressure plate with the disassembly equipment.

[0010] In some implementations, the slide rails are provided in two sets, with the slide bars on both sets connected by the same support plate. Thus, the bottom of the support plate has two slide rails, resulting in more even force distribution during the correction process.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: The correction device provided by this utility model is designed for the warping correction of the packaging substrate. The correction device has a simple structure and is easy to operate. It uses a liftable pressure plate to correct the packaging substrate located in the placement slot. The pressure plate applies pressure as a whole and simultaneously from both sides. The bottom of the tray with the placement slot is also supported by two sliding strips. The force applied and received during correction is relatively uniform, which can achieve non-destructive correction and high correction efficiency. Furthermore, the placement slot for fixing the packaging substrate is set separately on a replaceable tray, so that one correction device can be configured with multiple trays of different specifications, thus expanding the application range of the correction device. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of one embodiment of a packaging substrate warpage correction device according to the present invention; Figure 2 yes Figure 1 A structural diagram from another perspective; Figure 3 yes Figure 1 A structural diagram from another perspective. Detailed Implementation

[0013] The present invention will be further described below with reference to specific embodiments.

[0014] like Figures 1 to 3As shown, an embodiment of the present invention provides a packaging substrate warpage correction device for correcting warped packaging substrates.

[0015] The correction device includes a base 1, a placement slot 2, side plates 3, a pressure plate 4, and a drive mechanism 5. The base 1 is horizontally placed, and a support foot 10 is installed at the bottom of the base 1. The side plates 3 are vertically fixed on the base 1. In this embodiment, there are two side plates 3, which are respectively located on both sides of the base 1. The drive mechanism 5 also has two sets. Slide grooves 31 are respectively opened on the opposite inner sides of the two side plates 3. The side of the pressure plate 4 is connected to the drive mechanism 5 and embedded in the slide groove 31. The drive mechanism 5 drives the pressure plate 4 to move up and down along the slide groove 31. The placement slot 2 is used to place the encapsulation substrate (not shown in the figure), and the placement slot 2 is positioned above the base 1. The drive mechanism 5 drives the pressure plate 4 to apply force to the encapsulation substrate to achieve warpage correction.

[0016] The drive mechanism 5 includes a screw 51 and a drive element 52. The pressure plate 4 has outwardly protruding side ears 41 on both sides. The outer edge of the side ears 41 is adapted to the slide groove 31, and the interior of the side ears 41 has an internal thread adapted to the screw 51. The screw 51 is vertically mounted within the slide groove 31, and the end of the screw 51 is connected to the drive element 52. The drive element 52 is a motor, which drives the screw 51 to rotate, causing the side ears 41 of the pressure plate 4 to rise or fall along the slide groove 31. When the drive element 52 rotates the screw 51, the pressure plate 4 can only move up and down and cannot rotate due to the restriction of the slide groove 31. The threaded transmission facilitates control of the pressing position of the pressure plate 4, making adjustment convenient and ensuring high accuracy.

[0017] To improve the versatility of the correction device, in this embodiment, the placement slot 2 is not directly set on the base 1, but rather on a support plate 20, which is mounted above the base 1. This allows for the creation of placement slots 2 for different product models on multiple support plates 20, accommodating various products. By changing the support plate 20, the same device can be used for different products, reducing the need for jig manufacturing and lowering costs. If the company's product range is very limited, the placement slot 2 can also be directly set on the base 1.

[0018] The specific installation structure of the tray 20 is as follows: Two slide rails 11 are fixed on the base 1, and each slide rail 11 is equipped with a slide bar 12. The two slide bars 12 are connected by the same tray 20. The tray 20 is detachably connected to the slide bar 12 by screws. Different trays 20 can be configured with the same set of slide bars 12. When replacing the tray 20, the tray 20 can be moved along the slide rail 11, and part of the tray 20 is deviated from the slide rail 11 to avoid the pressure plate 4 interfering with the disassembly operation of the equipment.

[0019] In this embodiment, two sets of driving mechanisms 5 are respectively located on both sides of the pressure plate 4. The two sets of driving mechanisms 5 achieve simultaneous force application from both sides, making the force applied to the pressure plate 4 more uniform and better protecting the packaging substrate during correction, thus achieving non-destructive correction. The bottom of the support plate 20 has two slide rails 11, which makes the force more uniform during the correction process.

[0020] In practical applications, a set of drive mechanisms 5 can also be used, and the bottom of the tray 20 can also be a single set of slide rails 11 and slide bars 12.

[0021] When using the packaging substrate warpage correction device proposed in this application for correction, the packaging substrate to be corrected is fixed in the placement groove 2 of the tray 20, and the pressure plate 4 is driven down by the drive mechanism 5 to correct the packaging substrate.

[0022] The correction device has a simple structure and is easy to operate. It uses a liftable pressure plate 4 to correct the encapsulated substrate located in the placement slot 2. The pressure plate 4 applies pressure as a whole and forces from both sides at the same time. The bottom of the support plate 20 in the placement slot 2 is also supported by two slide bars 12. The force applied and received during correction is relatively uniform, which can achieve non-destructive correction and high correction efficiency.

[0023] The above descriptions are merely some embodiments of this utility model. It should be noted that those skilled in the art can make other modifications and improvements without departing from the inventive concept of this utility model, and these all fall within the protection scope of this utility model.

Claims

1. A device for correcting warpage of a packaging substrate, characterized in that, The package includes a base (1), a placement slot (2), a side plate (3), a pressure plate (4), and a drive mechanism (5). The base (1) is placed horizontally, and the side plate (3) is vertically fixed to the base (1). The side plate (3) is provided with a sliding groove (31). The side of the pressure plate (4) is connected to the drive mechanism (5) and embedded in the sliding groove (31). The drive mechanism (5) drives the pressure plate (4) to move up and down along the sliding groove (31). The placement slot (2) is used to place the package substrate and is placed above the base (1). The drive mechanism (5) drives the pressure plate (4) to apply force to the package substrate to achieve warpage correction.

2. The packaging substrate warpage correction device according to claim 1, characterized in that, The driving mechanism (5) includes a screw (51) and a driving member (52). The side of the pressure plate (4) is provided with an internal thread that is adapted to the screw (51). The screw (51) is vertically arranged in the slide groove (31). The end of the screw (51) is connected to the driving member (52) to drive the screw (51) to rotate so that the pressure plate (4) moves up and down along the slide groove (31).

3. The packaging substrate warpage correction device according to claim 2, characterized in that, The side plate (3) has two pieces and is symmetrically arranged on both sides of the base (1). The drive mechanism (5) has two sets, and the two sets of drive mechanisms (5) are arranged on both sides of the pressure plate (4). The inner side of the two side plates (3) is provided with a sliding groove (31). The pressure plate (4) is connected to the two sides of the drive mechanism (5) and can be movably embedded in the sliding groove (31).

4. The packaging substrate warpage correction device according to any one of claims 1 to 3, characterized in that, The placement slot (2) is located on a tray (20), which is mounted above the base (1).

5. The packaging substrate warpage correction device according to claim 4, characterized in that, The base (1) is provided with a slide rail (11), and the slide rail (11) is provided with a slide bar (12). The tray (20) is detachably connected to the slide bar (12).

6. The packaging substrate warpage correction device according to claim 5, characterized in that, The slide rail (11) is provided in two sets, and the slide bars (12) on the two sets of slide rails (11) are connected by the same support plate (20).

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