3D printing platform assembly and 3D printer

Abstract

The application provides a 3D printing platform assembly and a 3D printer. The 3D printing platform assembly comprises: a platform body having a first surface; a printing bearing platform connected to the first surface, and a first cavity formed between the printing bearing platform and the first surface; a printing adhesion surface on a side of the printing bearing platform away from the first cavity; and a heating element arranged in the first cavity and used for heating the printing bearing platform. The heating element is arranged in the first cavity formed by the printing bearing platform and the platform body, so that the heat generated by the heating element is quickly conducted to the printing bearing platform and then to the resin material, the temperature of the resin is quickly raised, the heating efficiency is improved, and the heat loss is reduced due to the existence of the first cavity. Thus, the problems of poor resin flowability and low reaction activity at low temperature are effectively improved, the poor interlayer bonding and printing failure caused by insufficient resin temperature are reduced, and the stability of the light-cured 3D printing in a low-temperature environment is improved.

Description

Technical Field

[0001] This application belongs to the field of 3D printing technology, and more specifically, relates to a 3D printing platform component and a 3D printer. Background Technology

[0002] In the field of photopolymer 3D printing technology, the physical properties of the printing materials have a crucial impact on the printing effect and success rate. Among these, the viscosity of the resin material used in printing is closely related to the ambient temperature. When the ambient temperature is low (e.g., close to or below 0°C), the temperature of high-viscosity resin materials drops significantly, leading to poor flowability and reduced reactivity. This results in problems such as poor interlayer bonding and model failure, severely affecting the stability and reliability of the printing process. Therefore, it is necessary to effectively heat the resin material to maintain its suitable operating temperature.

[0003] Existing heating methods involve heating the container holding the resin, which is inefficient and makes it difficult to quickly and efficiently raise the resin temperature to the target range. Utility Model Content

[0004] The purpose of this application is to provide a 3D printing platform component and a 3D printer to solve the technical problems in the prior art, such as low resin heating efficiency, resulting in poor interlayer bonding and model forming failure.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: Firstly, a 3D printing platform component is provided, comprising: The platform itself is the primary element, representing the first aspect. A printing support platform is connected to the first surface, and a first cavity is formed between the printing support platform and the first surface; the side of the printing support platform facing away from the first cavity is the printing attachment surface; A heating element is disposed within the first cavity and is used to heat the printing carrier platform.

[0006] In one alternative embodiment of the first aspect, the platform body has a second side opposite to the first side, on which a platform handle is integrally formed or detachably connected.

[0007] In an alternative embodiment of the first aspect, a temperature sensor is further included, the detection contact of which is in contact with the heating element or the printing carrier platform or platform body.

[0008] In an optional embodiment of the first aspect, a temperature control module is further included, which is electrically connected to the heating element and the temperature sensor respectively, and the temperature control module is used to adjust the temperature of the heating element.

[0009] In one alternative embodiment of the first aspect, a temperature control switch is also included. The detection contact of the temperature control switch is in contact with the heating element, the printing support platform, or the platform body; The temperature control switch is electrically connected to the temperature control module.

[0010] In one alternative embodiment of the first aspect, the platform handle has a second cavity, and the temperature control module is installed in the second cavity; or, the temperature control module is installed on the platform handle and located outside the second cavity. The platform body has a first through hole along the thickness direction, and the first through hole connects the first cavity and the second cavity; The first cavity, the first through hole, and the second cavity form a channel for the wires between the temperature control module and the heating element, the temperature sensor, and the temperature control switch to pass through.

[0011] In one alternative embodiment of the first aspect, the platform handle has a third surface away from the second surface, the third surface being recessed toward the platform body to form a mounting groove, the temperature control module being installed at the bottom of the mounting groove, and a second through hole for wires to pass through being provided between the bottom of the mounting groove and the second cavity.

[0012] In one alternative embodiment of the first aspect, one side of the mounting groove has an opening, and a sliding groove is provided in the mounting groove, one end of which extends to the opening; the sliding groove is used for sliding connection with a 3D printer.

[0013] In an optional embodiment of the first aspect, the temperature control module is provided with contact terminals for electrical connection with the 3D printer, and the contact terminals on the temperature control module are located at the opening; when the 3D printing platform assembly is connected to the 3D printer, the contact terminals on the temperature control module are connected to the contact terminals on the 3D printer.

[0014] In one alternative embodiment of the first aspect, the platform body and the platform handle are sealed together, and the temperature control module and the bottom of the mounting groove are sealed together.

[0015] In one alternative embodiment of the first aspect, the printing carrier platform is sealed to the platform body.

[0016] In an optional embodiment of the first aspect, the heating element is a heating film, and the heating film is attached to one side of the printing carrier platform facing the first cavity.

[0017] In one alternative embodiment of the first aspect, the printing support platform is made of ceramic material.

[0018] In a second aspect, a 3D printer is provided, comprising a 3D printing platform component as described in any one of the first aspects.

[0019] The beneficial effects of this application are as follows: By placing the heating element within the first cavity formed by the printing support platform and the platform body, the heat generated by the heating element is rapidly conducted to the printing support platform and then to the resin material, quickly increasing the resin temperature and improving heating efficiency. Furthermore, the presence of the first cavity reduces heat loss. Therefore, the 3D printing platform assembly of this embodiment effectively improves the problems of poor resin flowability and low reactivity at low temperatures, thereby reducing issues such as poor interlayer bonding and printing failures caused by insufficient resin temperature, and improving the stability of photopolymer 3D printing in low-temperature environments. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the 3D printing platform component provided in the embodiments of this application; Figure 2 An exploded view of the 3D printing platform component provided in the embodiments of this application; Figure 3 A schematic diagram of the 3D printing platform components, cantilever, and lifting mechanism provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of a 3D printer provided in an embodiment of this application.

[0022] The following are the labeling elements in the figure: 100-3D printing platform component, 101-printing support platform, 102-heating element, 103-platform body, 1031-second side, 1032-first through hole, 1033-first groove, 104-temperature control switch, 105-first sealing ring, 106-platform handle, 1061-third side, 1062-mounting groove, 1063-second through hole, 1064-second groove, 1065-slide groove, 1066-opening, 107-second sealing ring, 108-temperature control module, 1081-PCB board, 1082-end cap, 1083-contact terminal, 200-cantilever, 300-lifting mechanism, 400-optical mechanism. Detailed Implementation

[0023] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0024] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two).

[0025] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0026] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0027] It should be understood that in the embodiments of this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil of a printed circuit board (PCB) or wires.

[0028] In the description of the embodiments of this application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments in any suitable manner.

[0032] To address issues such as poor interlayer bonding and model forming failure caused by low resin temperatures, two solutions are currently employed: cartridge heating and cavity heating.

[0033] The cavity heating solution involves installing a heating module and a fan inside the printer cavity. The heating module generates heat, and the fan then diffuses the hot air into the cavity, heating the resin inside through air heat conduction. However, this cavity heating solution relies on air as the heat transfer medium, resulting in low heat transfer efficiency. It is difficult to quickly raise the resin temperature to a suitable range, and the heat tends to disperse easily inside the cavity, leading to low energy utilization.

[0034] The resin box heating scheme involves placing heating elements on the resin box to directly heat the resin inside using the principle of heat conduction. However, in this scheme, the resin box is a frequently replaced or touched component and is therefore a consumable part. The long-term interaction between the heating elements and the resin box can lead to heating failure due to wear and tear on the box, increasing the frequency and cost of equipment maintenance and hindering long-term stable operation.

[0035] Therefore, this embodiment provides a 3D printing platform component 100, see [link to documentation]. Figures 1-2The 3D printing platform component 100 includes: a platform body 103 having a first surface; a printing support platform 101 connected to the first surface, with a first cavity formed between the printing support platform 101 and the first surface, and the side of the printing support platform 101 facing away from the first cavity being the printing attachment surface; and a heating element 102 disposed in the first cavity for heating the printing support platform 101.

[0036] The printing platform component is used to support the printed model that is formed layer by layer.

[0037] The platform body 103 serves as the supporting foundation for the entire platform components, possessing the first aspect ( Figure 2 The middle side (facing the negative Z-axis direction) of the platform body 103 is used to provide a mounting reference for the printing support platform 101 and the heating element 102, while also bearing the mechanical loads during the printing process. Optionally, the platform body 103 is an aluminum substrate.

[0038] See Figure 2 The printing platform 101 has a sheet-like structure. The side of the printing platform 101 facing the negative Z-axis is the model printing attachment surface that directly contacts the printed model. That is, resin material is stacked layer by layer on the printing attachment surface to form a 3D printed model. The side of the printing platform 101 facing the positive Z-axis and the first surface of the platform body 103 form a first cavity. The first cavity provides installation space for the heating element 102 and has the function of concentrating heat and reducing heat loss.

[0039] The printing carrier platform 101 is sealed to the platform body 103. For example, a sealing ring is provided between the printing carrier platform 101 and the platform body 103, or the printing carrier platform 101 is bonded to the platform body 103 by providing sealant at the edge of the printing carrier platform 101.

[0040] The heating element 102 can be fixed on one side of the printing carrier platform 101 facing the positive Z-axis and located in the first cavity. When the heating element 102 is powered on, it can generate heat and conduct the heat to the printing carrier platform 101.

[0041] In this embodiment, by placing the heating element 102 within the first cavity formed by the printing support platform 101 and the platform body 103, the heat generated by the heating element 102 is rapidly conducted to the printing support platform 101 and then to the resin material. This quickly raises the resin temperature, improving heating efficiency, and the presence of the first cavity reduces heat loss. Therefore, the 3D printing platform assembly 100 of this embodiment effectively improves the problems of poor resin flowability and low reactivity at low temperatures, thereby reducing issues such as poor interlayer bonding and printing failures caused by insufficient resin temperature, and improving the stability of photopolymer 3D printing in low-temperature environments.

[0042] As an optional implementation method, see [link to implementation details]. Figure 2 The heating element 102 is a heating film, and the heating film is attached to the printing carrier platform 101.

[0043] Optionally, the heating film can be a PI heating film (i.e., polyimide film) or a PCB aluminum substrate heating film. The size of the heating film can be adapted to the upper surface of the printing carrier platform 101. It is tightly attached to the side of the printing carrier platform 101 facing the first cavity by means of adhesive or mechanical fixation, and is located in the first cavity formed by the printing carrier platform 101 and the platform body 103.

[0044] In this embodiment, the heating element 102 is designed as a heating film and bonded to the printing carrier platform 101. By utilizing the thin sheet structure and large-area bonding characteristics of the heating film, the heat conduction contact area is increased, and the energy loss during the heat transfer process is reduced, thereby improving the heat transfer efficiency from the heating element 102 to the printing carrier platform 101. At the same time, the bonding arrangement makes the heat distribution more uniform, which can drive the overall heating of the printing carrier platform 101 more quickly, thereby accelerating the temperature rise of the resin material.

[0045] In other embodiments, the heating element 102 may also be a heating wire or the like.

[0046] As an optional implementation, the printing carrier platform 101 is made of ceramic material.

[0047] In 3D printing applications, poor model bonding and printing plate falling off are common problems, and the material of the printing support platform 101 has a significant impact on printing plate falling off.

[0048] The printing carrier platform 101 in the existing technical solution is mainly an aluminum platform. However, the aluminum-based printing carrier platform 101 is chemically active and easily reacts with resin materials, making it difficult to remove the resin printed model from the printing carrier platform 101. The surface hardness of aluminum alloy is not enough, and it is easily scratched by sharp objects such as scrapers after long-term scraping work.

[0049] Therefore, the printing support platform 101 in this embodiment is made of ceramic material. Specifically, ceramic material has good thermal conductivity, which can more evenly transfer the heat generated by the heating element 102 in the first cavity to the resin material, reducing local temperature differences. The ceramic surface has suitable roughness and physical properties, which can ensure stable adhesion between the model and the support sheet during the printing process, and also provide a certain degree of convenience for disassembling the model after printing. In addition, the ceramic material has high hardness, and is not prone to surface damage from operations such as removing the model during long-term use, thus extending the service life of the printing support platform 101.

[0050] Optionally, the printing support platform 101 is made of zirconia toughened alumina ceramic sheet (ZTA), and the thickness of the printing support platform 101 ranges from 1 to 6 mm.

[0051] As an optional implementation, the platform body 103 has a second surface 1031 opposite to the first surface, and a platform handle 106 is integrally formed or detachably connected to the second surface 1031 of the platform body 103. The platform handle 106 is connected to the 3D printer.

[0052] Specifically, the platform body 103 has a first side and a second side 1031 that are opposite to each other, see [link / reference] Figure 2 The first side 1031 is the side of the platform body 103 facing the negative Z-axis, used to mount the printing support platform 101; the second side 1031 is the side of the platform body 103 facing the positive Z-axis. A platform handle 106 is fixed to the second side 1031 using a one-piece molding process or a detachable method such as screw connection. The platform handle 106 has a connection part (such as a groove or screw hole) for connecting to the cantilever 200 of the 3D printer, used to quickly connect or disconnect the 3D printing platform assembly 100 from the cantilever 200 of the 3D printer.

[0053] As an optional implementation, the 3D printing platform assembly also includes a temperature sensor (not shown in the figure), the detection contacts of which are in contact with the heating element or the printing carrier platform or the platform body.

[0054] As an example, the temperature sensor is located in the first cavity and is fixed to the heating element 102 either as a whole or as a detection contact.

[0055] As another example, the temperature sensor is fixed on the printing carrier platform 101, and the detection contact is in contact with one side of the printing carrier platform 101 facing the positive Z-axis direction.

[0056] As another example, the temperature sensor is fixed to the platform body 103 (e.g., fixed to the first or second surface 1031 of the platform body 103), and the detection contact is in contact with the second surface 1031.

[0057] It is easy to understand that the temperature sensor's detection contact point contacts different components, requiring different temperature compensation values ​​to be set, and the actual temperature of the printing carrier platform 101 is obtained after compensation.

[0058] Optionally, the temperature sensor can transmit temperature parameters via wires or via wireless communication.

[0059] As an optional implementation, the 3D printing platform component also includes a temperature control module 108, which is electrically connected to the heating element 102 and the temperature sensor, respectively, and is used to adjust the temperature of the heating element 102.

[0060] Specifically, the temperature control module 108 acquires the temperature of the heating element 102 collected by the temperature sensor, and determines whether the heating element 102 should continue heating or stop heating based on the acquired temperature.

[0061] As an optional implementation, the 3D printing platform assembly also includes a temperature control switch 104, the detection contacts of which are in contact with the heating element 102, the printing support platform 101, or the platform body 103; the temperature control switch 104 is electrically connected to the temperature control module 108.

[0062] Optionally, the temperature control switch 104 can be mounted on the heating element 102, the printing carrier platform 101, or the platform body 103, and the contacts of the temperature control switch 104 can contact the heating element 102, the printing carrier platform 101, or the platform body 103; for example, the temperature control switch 104 is mounted on the second surface 1031 of the platform body 103, and the contacts of the temperature control switch 104 are fixed to the second surface 1031 of the platform body 103 by screws, with the screws passing through the platform body 103 and contacting the heating element 102.

[0063] The temperature control switch 104 is a device that can sense temperature changes and automatically control the on / off state of a circuit. The temperature control switch 104 contains a thermistor (such as a thermistor or thermocouple), whose resistance or potential changes with temperature. When the temperature of the heating element 102 reaches a set value, the thermistor undergoes a physical change, thereby triggering the switch to open.

[0064] The temperature control switch 104 acts as a protective mechanism in the circuit, similar to a main switch. During the temperature adjustment process of the heating element 102, the temperature of the heating element 102 will not normally reach the set temperature of the temperature control switch 104. When a circuit fault occurs, and the temperature sensor detects that the temperature of the heating element 102 has reached the set value of the temperature control switch 104, it triggers the temperature control switch 104 to open. The temperature control module 108 receives the open signal and stops heating the heating element 102, thus providing protection. When the temperature of the heating element 102 is lower than the set value of the temperature control switch 104, it triggers the temperature control switch 104 to close. The temperature control module 108 receives the close signal, and when the temperature sensor detects that the temperature of the heating element 102 is lower than the heating temperature set by the temperature control module 108, the temperature control module 108 controls the heating element 102 to start heating.

[0065] Optionally, the heating element 102, temperature sensor, and temperature control switch 104 are electrically connected to the temperature control module 108 via wiring.

[0066] As an optional implementation, the platform handle has a second cavity, and the temperature control module is installed in the second cavity; or, the temperature control module is installed on the platform handle and located outside the second cavity; the platform body has a first through hole along the thickness direction, and the first through hole connects the first cavity and the second cavity; the first cavity, the first through hole, and the second cavity form a channel for the wires between the temperature control module and the heating element, the temperature sensor, and the temperature control switch to pass through.

[0067] As an example, see Figure 2 The temperature control module 108 includes a PCB board 1081 and an end cover 1082, with the end cover 1082 fastened onto the PCB board 1081.

[0068] Optionally, the temperature control module 108 is fixed in the second cavity by means of screws, adhesive, snap-fit ​​connection, etc., or fixed on the platform handle and located outside the second cavity.

[0069] In this embodiment, a temperature control switch 104, a temperature sensor, and a temperature control module 108 are integrated into the 3D printing platform component 100, thereby enabling temperature sensing and temperature regulation of the printing support platform 101 at the 3D printing platform component 100.

[0070] As an optional implementation, the platform handle 106 has a third surface 1061 that is away from the second surface 1031. The third surface 1061 is recessed towards the platform body 103 to form a mounting groove 1062. The temperature control module 108 is installed at the bottom of the mounting groove 1062. A second through hole 1063 for wires to pass through is provided between the bottom of the mounting groove 1062 and the second cavity.

[0071] This embodiment improves the integration of the 3D printing platform components by installing the temperature control module 108 at the bottom of the mounting slot 1062. The arrangement of the first cavity, the first through hole 1032, the second cavity, and the second through hole 1063 optimizes the wire arrangement path, reduces the safety hazards caused by exposed wires, and improves the stability and durability of the circuit connection.

[0072] As an optional implementation, one side of the mounting groove 1062 has an opening 1066, and a sliding groove 1065 is provided in the mounting groove 1062, with one end of the sliding groove 1065 extending to the opening 1066; the sliding groove 1065 is used for sliding connection with the 3D printer.

[0073] After the platform handle 106 is installed on the 3D printer, the temperature control module 108 is covered by the cantilever 200 of the 3D printer, thereby improving aesthetics and safety.

[0074] As an optional implementation, the temperature control module 108 is provided with a contact terminal 1083 for electrical connection with the 3D printer; the contact terminal 1083 on the temperature control module 108 is located at the opening 1066; when the 3D printing platform assembly 100 is connected to the 3D printer, the contact terminal 1083 on the temperature control module 108 is connected to the contact terminal on the 3D printer.

[0075] For details, see Figure 3 When the platform handle 106 of the 3D printing platform assembly 100 is connected to the cantilever 200 of the 3D printer, the contact terminal 1083 on the temperature control module 108 is electrically connected to the contact terminal on the PCB board of the 3D printer. The PCB board on the cantilever 200 is connected to the equipment control motherboard via a combination cable.

[0076] As an optional implementation, the platform body 103 and the platform handle 106 are sealed together, and the temperature control module 108 and the bottom of the mounting groove 1062 are sealed together.

[0077] As an example, a first sealing ring 105 is provided between the platform body 103 and the platform handle 106, and a second sealing ring 107 is provided between the temperature control module 108 and the bottom of the mounting groove 1062.

[0078] Optionally, the first cavity, the first through hole 1032, the second cavity, and the second through hole 1063 form a sealed cavity, thereby reducing the heat leakage generated by the heating element 102.

[0079] Optionally, the first sealing ring 105 and the second sealing ring 107 are made of a high-temperature resistant elastic material (such as silicone rubber). A first groove 1033 adapted to the shape of the first sealing ring 105 is provided on the second surface 1031, and a second groove 1064 for placing the second sealing ring 107 is provided at the bottom of the mounting groove 1062. After the first sealing ring 105 and the second sealing ring 107 are deformed by compression, the second through hole 1063, the second cavity, the first through hole 1032, and the first cavity form a sealed cavity, which can reduce the heat dissipation of the heating element 102 to the outside of the 3D printing platform assembly 100, and also reduce the entry of external impurities into the sealed cavity.

[0080] See Figure 3 and Figure 4This embodiment also discloses a 3D printer, which includes: a cantilever 200, a lifting mechanism 300, a photomechanical engine 400, and the 3D printing platform assembly 100 described in the above embodiment. The cantilever 200 is mounted on the lifting mechanism 300 and is driven by the lifting mechanism 300 to rise or fall. The slide rail of the 3D printing platform assembly 100 is installed on the slide rail of the cantilever 200 and can be fixed to the cantilever 200 by hand-tightening screws or a locking mechanism, moving up and down with the cantilever 200. The 3D printing platform assembly 100 can be configured as described in the previous embodiment; the photomechanical engine 400 controls the light projection to achieve the stacking of printing layers.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A 3D printing platform component, characterized in that, include: The platform itself is the primary element, representing the first aspect. A printing support platform is connected to the first surface, and a first cavity is formed between the printing support platform and the first surface; The side of the printing support platform that is away from the first cavity is the printing attachment surface; A heating element is disposed within the first cavity and is used to heat the printing carrier platform.

2. The 3D printing platform component as described in claim 1, characterized in that, The platform body has a second side opposite to the first side, and a platform handle is integrally formed or detachably connected to the second side.

3. The 3D printing platform component as described in claim 2, characterized in that, It also includes a temperature sensor, the detection contact of which is in contact with the heating element or the printing carrier platform or the platform body.

4. The 3D printing platform component as described in claim 3, characterized in that, It also includes a temperature control module, which is electrically connected to the heating element and the temperature sensor respectively, and is used to adjust the temperature of the heating element.

5. The 3D printing platform component as described in claim 4, characterized in that, It also includes a temperature control switch, The detection contact of the temperature control switch is in contact with the heating element, the printing support platform, or the platform body; The temperature control switch is electrically connected to the temperature control module.

6. The 3D printing platform component as described in claim 5, characterized in that, The platform handle has a second cavity, and the temperature control module is installed in the second cavity; or, the temperature control module is installed on the platform handle and located outside the second cavity. The platform body has a first through hole along the thickness direction, and the first through hole connects the first cavity and the second cavity; The first cavity, the first through hole, and the second cavity form a channel for the wires between the temperature control module and the heating element, the temperature sensor, and the temperature control switch to pass through.

7. The 3D printing platform component as described in claim 6, characterized in that, The platform handle has a third surface away from the second surface. The third surface is recessed towards the platform body to form a mounting groove. The temperature control module is installed at the bottom of the mounting groove. A second through hole for wires to pass through is provided between the bottom of the mounting groove and the second cavity.

8. The 3D printing platform component as described in claim 7, characterized in that, One side of the mounting groove has an opening, and a sliding groove is provided inside the mounting groove, with one end of the sliding groove extending to the opening; the sliding groove is used for sliding connection with the 3D printer.

9. The 3D printing platform component as described in claim 8, characterized in that, The temperature control module is provided with contact terminals for electrical connection with the 3D printer, and the contact terminals on the temperature control module are located at the opening; when the 3D printing platform assembly is connected to the 3D printer, the contact terminals on the temperature control module are connected to the contact terminals on the 3D printer.

10. The 3D printing platform component as described in claim 7, characterized in that, The platform body and the platform handle are sealed together, and the temperature control module is sealed together with the bottom of the mounting slot.

11. The 3D printing platform component as claimed in claim 1, characterized in that, The printing support platform is sealed to the platform body.

12. The 3D printing platform component according to any one of claims 1-11, characterized in that, The heating element is a heating film, and the heating film is attached to one side of the printing carrier platform facing the first cavity.

13. The 3D printing platform component as described in any one of claims 1-11, characterized in that, The printing platform is made of ceramic.

14. A 3D printer, characterized in that, Includes the 3D printing platform components as described in any one of claims 1-13.

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