A badge heating assembly

Abstract

The utility model discloses a badge heating assembly device relates to badge manufacturing technical field, including frame, set up on the upper die assembly of frame, with the first drive mechanism of upper die assembly drive connection, set up on the lower die assembly of frame, set up in the heating module of lower die assembly, be used for bearing and remove the slider mechanism of mould, be used for inductive device and control system of mould position of inductive mould position, heating module and inductive device all with control system electric connection, the upper die assembly and lower die assembly are opposite and set up, the slider mechanism can be slidably arranged between upper die assembly and lower die assembly. The utility model discloses through integrated heating function, can soften material edge, improve forming effect, and possess quick die change and automatic inductive compression function to effectually promote product quality, production efficiency and equipment versatility.

Description

Technical Field

[0001] This utility model relates to the field of badge manufacturing technology, specifically to a badge heating and assembly device. Background Technology

[0002] Badges, as a common form of identification, typically involve assembling a metal top cover, printed film, backing paper, and metal bottom cover together using a mold. Currently, most badge assembly machines use a method of pressing the upper and lower molds together in parallel. However, several problems exist in actual production: First, due to significant differences in the processes and thicknesses of the film and backing paper used in different badge models, their overall dimensions vary. Traditional molds lack compatibility and cannot adapt to various product specifications; forced assembly easily leads to quality defects such as wrinkles and scratches on the badge edges. Second, existing assembly processes often lack effective means of adjusting process parameters; for example, precise control of assembly temperature is impossible. Film and backing paper are physically rigid at room temperature, making them difficult to deform during pressing and achieving a smooth transition. Finally, traditional assembly equipment is limited in function, mostly operated manually or semi-automatically, resulting in inconsistent product quality, low production efficiency, and cumbersome mold changes and lengthy adjustment times when switching between different badge models, failing to meet the flexible production needs of small batches and multiple varieties. Therefore, there is an urgent need for a badge assembly device that can improve assembly quality, be compatible with different product specifications, and achieve automated and stable production. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a badge heating assembly device. This device integrates heating functions to soften the edges of materials, improve the molding effect, and has quick mold changing and automatic induction pressing functions, thereby effectively improving product quality, production efficiency and equipment versatility.

[0004] To solve the above problems, the technical solution provided by this utility model is as follows:

[0005] A badge heating assembly device includes: a frame, an upper mold assembly mounted on the frame, a first drive mechanism drivenly connected to the upper mold assembly, a lower mold assembly mounted on the frame, a heating module disposed within the lower mold assembly, a slider mechanism for carrying and transferring the mold, a sensing device for sensing the position of the mold, and a control system; the heating module and the sensing device are both electrically connected to the control system; the upper mold assembly and the lower mold assembly are arranged facing each other, and the slider mechanism is slidably disposed between the upper mold assembly and the lower mold assembly.

[0006] The frame, serving as the base and supporting skeleton of the entire device, integrates and fixes all other functional components on a stable platform, ensuring the structural rigidity and operational stability of the device. The upper mold assembly functions to install the upper mold and perform pressing operations; the first drive mechanism provides the power for pressing and separating the upper mold assembly, serving as the core execution component for assembly actions. The lower mold assembly functions to install and fix the lower mold; the heating module, integrated within the lower mold assembly, precisely heats the lower mold, thereby altering the physical properties of the badge material (such as film or backing paper) placed within the mold, softening it for easier molding. The slider mechanism acts as a movable carrier, used to carry, position, and transport the mold (as shown below) back and forth between the assembly station and the loading / unloading station, enabling rapid mold switching and assembly line operation, thus improving production efficiency. The sensing device detects the real-time position of the slider mechanism and the mold and feeds back the signal; the control system receives the signal from the sensing device and logically controls all electrical control components, including the first drive mechanism, heating module, and slider mechanism, to work in a coordinated and orderly manner. The relative positions of the components (facing each other, slidably positioned between...) define the spatial layout of each core component, ensuring the alignment of the pressing, the accuracy of the slider movement path, and the smoothness of the entire workflow.

[0007] Optionally, the heating module is integrated into the lower mold assembly, and the heating module is one of an electric heating tube, a heating rod, or a thermistor.

[0008] "Integrated within the lower mold assembly" emphasizes that the heating module is not external but internally designed. This structure offers advantages such as higher heat conduction efficiency, more uniform heating, more precise temperature control, and space savings, resulting in a more compact device structure. "Heating tubes, heating rods, or thermistors" lists several common, mature, and reliable electronic heating elements for achieving heating functions. These elements offer advantages such as high power density, long lifespan, and ease of procurement and replacement.

[0009] Optionally, the heating module also includes a temperature sensor, which is electrically connected to the control system and is used to feed back the detected temperature signal to the control system.

[0010] The temperature sensor monitors the actual temperature of the lower mold assembly (or mold) in real time and converts the non-electrical temperature signal into a measurable electrical signal. Electrically connected to the control system, it provides feedback, forming a closed-loop control system. The control system compares the actual temperature value fed back by the temperature sensor with the user-set target temperature value and dynamically adjusts the power output to the heating element (e.g., via a solid-state relay) using algorithms such as PID control, thereby achieving high-precision constant temperature control (e.g., ±0.5℃). This is crucial for ensuring the quality stability of different batches of products.

[0011] Optionally, the lower mold assembly includes a lower mold fixing seat and a lower mold detachably mounted on the lower mold fixing seat; the upper mold assembly includes an upper mold fixing seat and an upper mold detachably mounted on the upper mold fixing seat.

[0012] The "fixed base" and "detachably mounted...mold" separate the mold (the component that performs the specific product molding task) from the drive and heating components (fixed base). This design allows a single unit to be adapted to badge products of various shapes and sizes by changing different upper and lower molds, greatly improving the equipment's versatility and flexibility, and meeting the needs of small-batch, multi-variety production.

[0013] Optionally, the lower mold fixing seat and the upper mold fixing seat are provided with positioning pins and locking mechanisms for quick positioning and locking of the mold.

[0014] Positioning pins are used for precise positioning during mold installation to ensure accurate relative positioning between the mold and the fixed base, thereby guaranteeing concentricity during pressing and product quality.

[0015] The locking mechanism is a quick and reliable way to secure the mold to the fixed base, preventing the mold from loosening or shifting during the pressing process, thus ensuring operational safety and reliability. Common locking mechanisms include quick-release clamps and wing bolts.

[0016] Optionally, the first driving mechanism is a cylinder, the cylinder body of which is fixed on the frame, and the piston rod of the cylinder is connected to the upper mold assembly.

[0017] A cylinder is a mature, economical, and easy-to-maintain pneumatic actuator that converts the energy of compressed air into the mechanical energy of linear reciprocating motion, providing the required pressure and stroke for pressing actions.

[0018] Optionally, the slider mechanism includes a slide rail, a slider slidably disposed on the slide rail, and a second drive mechanism for driving the slider to move along the slide rail; the slide rail is fixed to the frame and passes through the area between the upper mold assembly and the lower mold assembly.

[0019] The slide rail and slider form a high-precision, low-friction linear motion guide pair, ensuring that the slider carrying the mold can move smoothly and accurately along the predetermined path, and reciprocate accurately between the loading / unloading positions and the assembly position.

[0020] The second drive mechanism provides power for the reciprocating motion of the slider.

[0021] The phrase "through the area between..." defines the arrangement of the slide rails, allowing their movement path to directly pass through the core area of ​​the pressing zone. This is the core layout for realizing the mold transfer function.

[0022] Alternatively, the second drive mechanism may be a cylinder or a servo motor.

[0023] Pneumatic cylinders offer a low-cost, high-speed, and easy-to-maintain pneumatic solution, suitable for scenarios with high cycle time requirements and slightly lower positioning accuracy requirements. Servo motors provide an electric drive solution that allows for precise control of position, speed, and torque. Combined with lead screws or timing belts, they enable precise positioning of any point on the slider, offering greater flexibility and suitability for more complex, multi-station applications.

[0024] Alternatively, the sensing device may be a photoelectric sensor or a proximity switch, which is mounted on the frame and located beside the travel path of the slider mechanism, and is used to sense whether the mold carried on the slider has moved to a preset assembly station.

[0025] Photoelectric sensors / proximity switches are two common non-contact detection elements used to detect the presence or location of objects. They are highly reliable, have a fast response speed, and do not come into contact with the object being detected, thus avoiding wear and interference.

[0026] The sensor's core function is clearly indicated by its placement beside the travel path to sense whether the slider and mold have moved to the preset position—providing the control system with a criterion signal to determine whether the slider and mold are "in place." This is a crucial condition for triggering subsequent pressing actions and serves as the "eyes" for achieving automation.

[0027] Alternatively, the control system may be a PLC controller or a microprocessor.

[0028] A PLC controller is a programmable logic controller designed specifically for industrial environments. It is characterized by extremely high reliability, strong anti-interference ability, convenient programming, and easy expansion of I / O points, making it very suitable as the core controller for such automated equipment.

[0029] Microprocessors are a highly integrated and cost-effective embedded control solution. For example, using ARM or microcontroller development boards, they can also achieve functions such as logic control and temperature PID control, making them suitable for cost-sensitive applications.

[0030] Compared with the prior art, the technical solution provided by this utility model has the following advantages:

[0031] Improve product quality: By integrating a heating module and precisely controlling the temperature (e.g., 80°C ± 0.5°C), the edges of the film and backing paper used in the badges are softened by heat, changing their physical properties and enabling smooth shaping during pressing, effectively eliminating defects such as edge wrinkling and scratches.

[0032] Enhanced equipment versatility: The quick-change mold design, combined with a universal slider mold feeding mechanism, allows a single machine to flexibly adapt to various badge products of different sizes and types, greatly improving equipment utilization and production flexibility.

[0033] Achieving automated and stable production: The mold position is automatically detected by a sensing device (such as a photoelectric sensor), and the cylinder is controlled by the control system to automatically perform the pressing action, and the feeding, forming, and unloading steps are completed in a continuous manner, reducing human intervention, ensuring the consistency and stability of product quality, and improving production efficiency. Attached Figure Description

[0034] Figure 1 One perspective of the structural schematic diagram of a badge heating assembly device proposed in an embodiment of this utility model;

[0035] Figure 2 A second perspective of the structural schematic diagram of a badge heating and assembly device proposed for an embodiment of this utility model;

[0036] Figure 3 A schematic diagram of the upper mold assembly of a badge heating and assembly device proposed for an embodiment of this utility model;

[0037] Figure 4 A schematic diagram of an overall badge heating and assembly device provided for an embodiment of this utility model;

[0038] 1. Frame; 2. Upper mold assembly; 3. First drive mechanism; 4. Lower mold assembly; 5. Heating module; 6. Slider mechanism; 7. Sensing device; 8. Control system; 9. Upper mold; 10. Lower mold; 11. Slide rail; 12. Slider; 13. Solenoid valve; 14. Temperature sensor; 15. Lower mold fixing seat; 16. Upper mold fixing seat; 17. Operating table; 18. Guide rod. Detailed Implementation

[0039] To further understand the content of this utility model, a detailed description of this utility model will be provided in conjunction with the accompanying drawings and embodiments.

[0040] Example

[0041] Combined with appendix Figure 1-4 A badge heating assembly device includes: a frame 1, an upper mold assembly 2 mounted on the frame 1, a first drive mechanism 3 drivenly connected to the upper mold assembly 2, a lower mold assembly 4 mounted on the frame 1, a heating module 5 disposed within the lower mold assembly 4, a slider mechanism 6 for carrying and transferring the mold, a sensing device 7 for sensing the position of the mold, and a control system 8; the heating module 5 and the sensing device 7 are both electrically connected to the control system 8; the upper mold assembly 2 and the lower mold assembly 4 are arranged facing each other, and the slider mechanism 6 is slidably disposed between the upper mold assembly 2 and the lower mold assembly 4.

[0042] In practice, the operator places the lower mold 10, with the badge assembly installed, onto the slider mechanism 6. After starting the device, the control system 8 first commands the heating module 5 to start working, heating the lower mold 10 to a preset temperature (e.g., 80°C). Subsequently, the control system 8 commands the power source (e.g., a cylinder) driving the slider mechanism 6 to move precisely to the assembly station, carrying the mold slider 12. At this time, the sensing device 7 (e.g., a photoelectric sensor) detects that the slider 12 is in place and transmits a signal to the control system 8. Upon receiving the signal, the control system 8 immediately triggers the first drive mechanism 3 (e.g., a cylinder) to move the upper mold assembly 2 downwards, closing it with the lower mold to press and assemble the softened badge. After holding the pressure for a period of time, the first drive mechanism 3 drives the upper mold assembly 2 back up, and then the control system 8 controls the slider mechanism 6 to retract, completing one work cycle. The entire process is automated, ensuring consistent product quality and high efficiency.

[0043] The heating module 5 is integrated into the lower mold assembly 4. The heating module 5 is one of an electric heating tube, a heating rod, or a thermistor.

[0044] During the manufacturing of the lower mold assembly 4, corresponding slots are machined inside the lower mold fixing seat 15. Then, a selected heating element (e.g., a standard heating tube) is tightly inserted into or embedded in these slots, and the gaps are filled with thermal grease to ensure good heat conduction. When the control system 8 is powered on, current flows through the heating tube, converting electrical energy into heat energy. This heat is directly transferred to the lower mold fixing seat 15 via thermal conduction, and then to the lower mold 10, thereby heating the workpiece inside the mold.

[0045] The heating module 5 also includes a temperature sensor 14, which is electrically connected to the control system 8 and is used to feed back the detected temperature signal to the control system 8.

[0046] A small blind hole is machined on the lower mold fixing base 15 as a temperature measuring hole. The probe end of a PT100 platinum resistance temperature sensor 14 is inserted into this hole and placed flush against the hole wall. Its wires are connected to the analog input module of the control system 8. During system operation, the PT100 detects the temperature in real time and transmits its resistance value change to the control system 8. The PLC program within the control system 8 continuously reads this value and compares it with the set value. If the actual temperature is lower than the set value, the heating output is increased; if it reaches or exceeds the set value, the output is reduced or cut off, thereby achieving precise constant temperature control.

[0047] Combined with appendix Figure 1 , 3The lower mold assembly 4 includes a lower mold fixing seat 15 and a lower mold 10 detachably mounted on the lower mold fixing seat 15; the upper mold assembly 2 includes an upper mold fixing seat 16 and an upper mold 9 detachably mounted on the upper mold fixing seat 16.

[0048] The upper mold fixing seat 16 is bolted to the lower end of the piston rod of the first drive mechanism 3, and the lower mold fixing seat 15 is bolted to the platform of the frame 1. The upper mold 9 and the lower mold 10 are independent parts, with positioning stops and bolt holes designed on them. When a different badge needs to be produced, the operator only needs to use tools to remove the old upper and lower molds 10 from the fixing seats, then align the new mold with the positioning pins on the fixing seats, and tighten the clamping bolts to complete the replacement. The whole process is quick and simple.

[0049] The lower mold fixing seat 15 and the upper mold fixing seat 16 are provided with positioning pins and locking mechanisms for quick positioning and locking of the mold.

[0050] Two protruding locating pins are machined on the mounting surfaces of the upper mold fixing base 16 and the lower mold fixing base 15, respectively. Corresponding upper and lower molds 10 have pin holes that mate with the locating pins. During installation, the mold is first aligned with the pin holes of the locating pins and lowered to achieve initial positioning. Then, the operator operates the handle of the quick-clamp clamp mounted on the side of the fixing base, using a cam or lever principle to firmly press the mold against the base surface of the fixing base, completing the installation. Disassembly is performed by reversing the operation.

[0051] The first drive mechanism 3 is a cylinder, the cylinder body is fixed on the frame 1, and the piston rod of the cylinder is connected to the upper mold assembly 2.

[0052] Select a standard cylinder with a suitable stroke and bore. Securely invert the cylinder body onto the crossbeam at the top of the frame 1 using its built-in mounting accessories (such as flanges). The piston rod of the cylinder extends downwards and is rigidly connected to the upper mold fixing seat 16 of the upper mold assembly 2 via a connector. The control system 8 controls the entry of compressed air into the upper or lower chamber of the cylinder via a solenoid valve 13, thereby driving the piston rod to extend (press) or retract (retract). A guide rod 18 is provided below the crossbeam, which cooperates with the limiting hole of the upper mold 9 to ensure that the pressing trajectory of the upper mold 9 is vertical.

[0053] The slider mechanism 6 includes a slide rail 11, a slider 12 slidably disposed on the slide rail 11, and a second drive mechanism for driving the slider 12 to move along the slide rail 11; the slide rail 11 is fixed to the frame 1 and passes through the area between the upper mold assembly 2 and the lower mold assembly 4. The second drive mechanism is not shown in the embodiment shown in the accompanying drawings. This embodiment uses manual control of the slider mechanism 6, but a second drive mechanism, such as a cylinder, can also be used to control the slider mechanism 6 to move back and forth.

[0054] Two parallel linear slide rails 11 are bolted to the base of the frame 1, extending along their length from the outside of the frame 1 to directly below the upper and lower dies. One or a pair of linear sliders 12 are mounted on the slide rails 11. The cylinder body of the second drive mechanism (such as a cylinder) is fixed to one end of the frame 1, and its piston rod is connected to the bearing block of the slider 12. When the cylinder extends or retracts, it drives the entire slider 12 (and the die it carries) to make precise linear feed and retraction movements along the slide rails 11.

[0055] The second drive mechanism is a cylinder or a servo motor.

[0056] If a cylinder is used, its working principle is the same as above. If a servo motor is used, it is mounted at the end of the frame 1 and connected to a ball screw via a coupling. The rotational motion of the servo motor is converted into the linear motion of the slider 12 through the ball screw nut. The control system 8 sends pulse signals to the servo driver to precisely control the rotation angle and speed of the motor, thereby achieving precise control of the position of the slider 12.

[0057] The sensing device 7 is a photoelectric sensor or proximity switch, mounted on the frame 1 and located beside the travel path of the slider mechanism 6. It is used to sense whether the mold carried on the slider 12 has moved to the preset assembly position. A diffuse reflection type photoelectric sensor is selected and mounted on the frame 1 via a bracket. Its light spot alignment area is set to the position of the side of the slider 12 when it reaches the assembly position. When the slider 12 moves into position, blocking or reflecting the light beam emitted by the sensor, the sensor's output state changes (e.g., from normally open to closed). This switching signal is transmitted to the PLC input point of the control system 8. After detecting this signal, the PLC program knows that the mold has been accurately positioned and then executes the next pressing command.

[0058] The control system 8 is a PLC controller or microprocessor. A small to medium-sized PLC module (such as the Siemens S7-1200 series) is selected. Its digital input points (DI) connect to the signal lines of the sensing device 7 (such as a photoelectric sensor); digital output points (DO) control the first cylinder solenoid valve 13 via intermediate relays or solid-state relays; analog output points (AO) control the power controller of the heating module 5; and analog input points (AI) receive signals from the temperature sensor 14. Technicians write the control program using ladder diagrams or structured text language and burn it into the PLC. After power-on, the PLC scans the input states cyclically according to the preset program logic, executes logical operations, drives the output components, and coordinates the automatic operation of the entire device. If a microprocessor is used, the basic principle is similar, but more hardware and low-level software design is required at the circuit board level.

[0059] Combined with appendix Figure 4 The entire device is installed on the operating table 17.

[0060] The present invention and its embodiments have been described above illustratively. This description is not restrictive, and the figures shown are only one embodiment of the present invention; the actual structure is not limited thereto. Therefore, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A badge heating assembly device, characterized in that, include: The machine includes a frame, an upper mold assembly mounted on the frame, a first drive mechanism drivenly connected to the upper mold assembly, a lower mold assembly mounted on the frame, a heating module disposed within the lower mold assembly, a slider mechanism for carrying and transferring the mold, a sensing device for sensing the mold position, and a control system; the heating module and the sensing device are both electrically connected to the control system; the upper mold assembly and the lower mold assembly are arranged facing each other, and the slider mechanism is slidably disposed between the upper mold assembly and the lower mold assembly.

2. The badge heating assembly device according to claim 1, characterized in that, The heating module is integrated into the lower mold assembly, and the heating module is one of an electric heating tube, a heating rod, or a thermistor.

3. The badge heating assembly device according to claim 2, characterized in that, The heating module also includes a temperature sensor, which is electrically connected to the control system and is used to feed back the detected temperature signal to the control system.

4. The badge heating assembly device according to claim 1, characterized in that, The lower mold assembly includes a lower mold fixing seat and a lower mold detachably mounted on the lower mold fixing seat; the upper mold assembly includes an upper mold fixing seat and an upper mold detachably mounted on the upper mold fixing seat.

5. The badge heating assembly device according to claim 4, characterized in that, The lower mold fixing seat and the upper mold fixing seat are equipped with positioning pins and locking mechanisms for quick positioning and locking of the mold.

6. The badge heating assembly device according to claim 1, characterized in that, The first driving mechanism is a cylinder, the cylinder body of which is fixed on the frame, and the piston rod of the cylinder is connected to the upper mold assembly.

7. The badge heating assembly device according to claim 1, characterized in that, The slider mechanism includes a slide rail, a slider slidably disposed on the slide rail, and a second drive mechanism for driving the slider to move along the slide rail; the slide rail is fixed to the frame and passes through the area between the upper mold assembly and the lower mold assembly.

8. The badge heating assembly device according to claim 7, characterized in that, The second drive mechanism is a cylinder or a servo motor.

9. The badge heating assembly device according to claim 1, characterized in that, The sensing device is a photoelectric sensor or a proximity switch, which is mounted on the frame and located beside the travel path of the slider mechanism, and is used to sense whether the mold carried on the slider has moved to the preset assembly station.

10. The badge heating assembly device according to any one of claims 1 to 9, characterized in that, The control system is a PLC controller or a microprocessor.

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