A pre-embedded insert and sandwich structure unequal thickness forming device

CN224827838UActive Publication Date: 2026-10-09CHANGHE AIRCRAFT INDUSTRIES CORPORATION
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Patent Information

Application Number
CN202520168542.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-24
Publication Date
2026-10-09
Estimated Expiration
2035-01-24

AI Technical Summary

Technical Problem

[0003]预埋嵌入件若选用与夹层结构不等厚时,预埋嵌入件需用膨胀胶膜拼接,膨胀胶膜的用量及方法较难控制,导致嵌入件可能出现偏离、滑移,周边胶膜填充不实、拼接缝过大及凹陷等问题

Benefits of technology

本申请采用蜂窝分步预成型、局部稳定化加强的方式,提高了蜂窝拼接质量,且加强了蜂窝高倒角区的抗压能力,解决了大曲率变厚度高倒角蜂窝夹层结构件嵌入件出现偏离、滑移,周边胶膜填充不实、拼接缝过大及凹陷等问题,成型后零件表面平整,外形满足设计要求。

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Abstract

The application provides a pre-embedded embedded part and a device for forming a sandwich structure with unequal thickness, which is composed of a cover plate, a first stop block, a second stop block, a main mold body and a positioning pin; wherein the main mold body is attached to the sandwich structure profile, the cover plate is pressed against the outer surface of the sandwich structure, the first stop block, the second stop block and the main mold body are used to ensure the periphery of the sandwich structure, meanwhile, the pre-embedded embedded part and the sandwich structure are positioned by the positioning pin and the main mold body, thereby ensuring the relative accurate position of the embedded part and the sandwich structure; the application adopts a honeycomb step-by-step preforming and local stabilization strengthening mode, which improves the honeycomb splicing quality and strengthens the compression resistance of the honeycomb high chamfer area, and solves the problems of deviation and slippage of the embedded part of the large-curvature variable-thickness high-chamfer honeycomb sandwich structure, incomplete filling of the peripheral adhesive film, excessively large splicing seam and concave and other problems.
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Description

Technical Field

[0001] This application belongs to the field of aerospace composite material molding technology, and in particular relates to a molding device for pre-embedded inserts and sandwich structure parts with unequal thickness. Background Technology

[0002] Embedded components are essential parts used in aircraft or other aerospace equipment. They are typically made of metal and are used to fix and connect other parts, providing structural support and load transfer. Embedded components also serve special functions such as support, protection, insulation, shielding, and corrosion resistance, providing reliable assurance for aircraft performance and safety. When embedded components are used in conjunction with other components and cured together, they are called pre-embedded components. Pre-embedded components are generally embedded in sandwich structures (honeycomb / sandwich structure components), and their pre-embedding strength determines the connection strength of subsequent components.

[0003] If the embedded part is selected with a thickness that is not equal to that of the sandwich structure, the embedded part needs to be spliced ​​with an expanding film. The amount and method of using the expanding film are difficult to control, which may lead to problems such as deviation, slippage, incomplete filling of the surrounding film, excessive splicing seam and depression. Utility Model Content

[0004] The purpose of this utility model is to address the following issues: when the thickness of the embedded part is different from that of the sandwich structure, the embedded part needs to be spliced ​​with an expanding film. The amount and method of using the expanding film are difficult to control, which can lead to deviation and slippage of the embedded part, incomplete filling of the surrounding film, excessive splicing seams and depressions. This invention aims to improve the relative positional accuracy of the embedded part.

[0005] This application provides a device for forming pre-embedded inserts and sandwich structure parts with unequal thicknesses. The device consists of a cover plate, a first stop block, a second stop block, a main mold body, and positioning pins. The main mold body fits into the surface of the sandwich structure, the cover plate presses against the outer surface of the sandwich structure, and the sandwich structure is protected by the first stop block, the second stop block, and the main mold body. Meanwhile, the embedded parts and sandwich structure parts are positioned by the positioning pins and the main mold body, thereby ensuring the relative and accurate position of the embedded parts and the release structure parts.

[0006] Preferably, the cover plate is disassembled through the mold opening seam between the cover plate and the first and second stops.

[0007] Preferably, the first and second blocks are disassembled through the first block, the second block, and the mold opening seam of the main mold body.

[0008] Preferably, the sandwich structure is removed through the mold opening seam between the sandwich structure and the main mold body.

[0009] Preferably, the device further includes: Expanding adhesive film: Wrap the formed pre-embedded part with expanding adhesive film, and use fixing pins to fix the pre-embedded part.

[0010] Preferably, after placing the sandwich structure, if it is found that the sandwich structure is slightly higher than the embedded part, an expanding adhesive film is used to fill and level it.

[0011] The beneficial technical effects of this application are as follows: This application adopts a step-by-step pre-forming and local stabilization reinforcement method for honeycomb, which improves the quality of honeycomb splicing and enhances the compressive strength of the high chamfered area of ​​the honeycomb. It solves problems such as deviation and slippage of the embedded parts of the honeycomb sandwich structure with large curvature and variable thickness and high chamfer, incomplete filling of the surrounding film, excessive splicing seam and depression. After molding, the surface of the part is flat and the shape meets the design requirements. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the molding device of this utility model; Figure 2 This is a schematic diagram of the cover plate of the molding device of this utility model; Figure 3 This is a schematic diagram of the main mold body of the molding device of this utility model; Figure 4 This is a schematic diagram of the sandwich structure of this utility model; Figure 5 This is a schematic diagram of the insert structure of this utility model; Figure 6 This is a schematic diagram of the insert and sandwich structure of this utility model placed into the main mold body; Among them, 1-cover plate, 2-main mold body, 3-first stop block, 4-second stop block, 5-positioning pin, 6-layer structure. Detailed Implementation

[0013] Combined with appendix Figure 1 -Appendix Figure 6 The specific embodiments of this utility model will be described in further detail below: Technical solution: A device for forming pre-embedded inserts and sandwich structure components with unequal thicknesses. The forming device of this utility model consists of a cover plate, a first stop block, a second stop block, a main mold body, and a positioning pin.

[0014] The main mold body fits into the surface of the sandwich structure, and the cover plate presses against the outer surface of the sandwich structure. The sandwich structure is protected by the first stop block, the second stop block, and the main mold body. At the same time, the embedded parts and sandwich structure parts are positioned by the positioning pins and the main mold body, thereby ensuring the accurate relative position of the embedded parts and the sandwich structure parts.

[0015] Furthermore, the cover plate is disassembled through the mold opening joints of the cover plate and the first and second stops. Furthermore, the first stop block, the second stop block, and the mold opening seam of the main mold body are disassembled. The first stop block and the second stop block are disassembled.

[0016] Furthermore, the sandwich structure is removed from the mold opening seam between the sandwich structure and the main mold body.

[0017] In other embodiments of this application, the steps for using a pre-embedded insert and sandwich structure component unequal thickness forming device are as follows: Step 1: Based on the sandwich structure and the position of the insert, ensure that the side of the insert that is flush with the surface of the part is used as the film-applying surface of the molding tooling. Step 2: Wrap the pre-embedded insert with expansion film, place it in the fixture and fix it with fixing pins, and then place the sandwich structure component into the fixture together. Step 3: After placing the sandwich structure component, it was found that the sandwich structure component was slightly higher than the embedded component. Expanding adhesive film was used to fill and level it. Step 4: Place the cover plate to ensure that the expanded adhesive film is stabilized during the high-temperature curing process.

[0018] Step 5: Trim the parts to ensure the relative theoretical shape of the sandwich structure. This invention employs a step-by-step pre-forming and localized stabilization reinforcement method for honeycomb, improving the quality of honeycomb splicing and enhancing the compressive strength of the high-beveled areas. It solves problems such as misalignment and slippage of inserts in honeycomb sandwich structures with large curvature and varying thickness, inadequate filling of the surrounding adhesive film, excessively large splicing seams, and depressions. The resulting parts have a smooth surface and meet design requirements. This method is detailed, highly operable, and has low manufacturing costs.

[0019] In other embodiments of this application, a method for forming pre-embedded inserts and sandwich structure parts with unequal thicknesses is provided, wherein a forming mold is manufactured according to the shape of the digital model theory to ensure that the mold surface matches the part.

[0020] Next, wrap the formed embedded part with expansion film, and fix the embedded part with fixing pins according to the drawing; Further, the sandwich structure is placed into the molding mold to ensure the surface matches, and the uneven thickness is filled with expanding film until it is roughly flush. Furthermore, the cover plate of the molded mold is fixed with screws and pins, and a vacuum bag is made and sent into the curing oven for curing. Furthermore, the increased temperature causes the expanding adhesive film to foam, fully filling areas of uneven thickness and ensuring a match with the part's surface.

Claims

1. A device for forming pre-embedded inserts and sandwich structure components with unequal thicknesses, characterized in that, The device consists of a cover plate, a first stop block, a second stop block, a main mold body, and positioning pins; The main mold body fits into the surface of the sandwich structure, the cover plate presses against the outer surface of the sandwich structure, and the sandwich structure is protected by the first stop block, the second stop block, and the main mold body. Meanwhile, the embedded parts and sandwich structure parts are positioned by the positioning pins and the main mold body, thereby ensuring the relative and accurate position of the embedded parts and the release structure parts.

2. The apparatus according to claim 1, characterized in that, The cover plate is removed through the mold opening seam between the cover plate and the first and second stops.

3. The apparatus according to claim 1, characterized in that, The first and second blocks are disassembled through the mold opening seam of the first block, the second block, and the main mold body.

4. The apparatus according to claim 1, characterized in that, The sandwich structure component is removed through the mold opening seam between the sandwich structure component and the main mold body.

5. The apparatus according to claim 1, characterized in that, The device further includes: Expanding adhesive film: Wrap the formed pre-embedded part with expanding adhesive film, and use fixing pins to fix the pre-embedded part.

6. The apparatus according to claim 5, characterized in that, After placing the sandwich structure component, it was found that the sandwich structure component was slightly higher than the embedded component. Expanding adhesive film was used to fill and level it.