A molding die structure with a rapid cooling function

Abstract

The utility model discloses a kind of forming die structures with quick cooling function, it is related to forming die technical field, including upper die, the lower part of upper die is provided with lower die, the outside of lower die is provided with even quick refrigeration mechanism, even quick refrigeration mechanism includes pedestal, the upper surface of pedestal is respectively fixedly connected with storage tank and double-cavity refrigeration box, the outer surface of double-cavity refrigeration box is fixedly connected with controller main body, the outside of pedestal is provided with feed pump, the input end of feed pump is fixedly communicated with transport pipe, the bottom end of transport pipe and the outer surface of storage tank are fixedly communicated, the output end of feed pump and the inner wall of double-cavity refrigeration box are fixedly connected. Through even quick refrigeration mechanism, even refrigeration can be carried out to forming die, the purpose of quick cooling to die is achieved, through the combination of semiconductor refrigeration sheet and cooling liquid in storage tank, the purpose of even quick cooling to heat generated in the manufacturing process of forming die is realized.

Description

Technical Field

[0001] This utility model belongs to the field of molding die technology, and specifically relates to a molding die structure with rapid cooling function. Background Technology

[0002] Molding dies are tools used in the molding and processing of materials such as plastics and metals. Through specific mold structure design, they use high temperature and high pressure to mold raw materials into the desired products. They are widely used in manufacturing processes such as injection molding, die casting, and stamping. By optimizing the cooling system, heating system, and venting design of the mold, molding efficiency and product quality can be improved, and production costs can be reduced. In modern manufacturing, the precise design and high efficiency of molding dies are the key to achieving large-scale, high-precision production.

[0003] In traditional molding dies, the cooling system usually uses built-in cooling water pipes for temperature regulation. However, since the arrangement of the cooling water pipes is limited by the shape of the mold structure, the cooling effect is often uneven, resulting in long cooling time and low cooling efficiency on the mold surface. This not only prolongs the production cycle of the product, but also increases energy consumption and reduces production efficiency.

[0004] To address these issues, we provide a molding die structure with rapid cooling capability. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a molding die structure with rapid cooling function.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A molding die structure with rapid cooling function includes an upper die and a lower die below the upper die. A uniform and rapid cooling mechanism is provided on the outer side of the lower die. The uniform and rapid cooling mechanism includes a base. A storage tank and a dual-cavity refrigeration box are fixedly connected to the upper surface of the base. A controller body is fixedly connected to the outer surface of the dual-cavity refrigeration box. A feed pump is provided on the outer side of the base. The input end of the feed pump is fixedly connected to a transport pipe. The bottom end of the transport pipe is fixedly connected to the outer surface of the storage tank. The output end of the feed pump is fixedly connected to the inner wall of the dual-cavity refrigeration box. A discharge pump is fixedly connected to the outer surface of the dual-cavity refrigeration box. An inner cavity is provided inside the dual-cavity refrigeration box. Two sets of semiconductor cooling chips are fixedly connected to the inner wall of the inner cavity. Two sets of temperature sensors are fixedly connected to the inner wall of the inner cavity. The cold end of the semiconductor cooling chip is in contact with the outer surface of the lower die.

[0007] Preferably, a stabilizing plate is fixedly connected to the outer surface of the discharge pump, and the bottom surface of the stabilizing plate is fixedly connected to the upper surface of the base.

[0008] Preferably, a piston is disposed above the storage tank, and the outer surface of the piston is threadedly connected to the inner wall of the storage tank.

[0009] Preferably, a fixing frame is fixedly connected to the outer surface of the controller body, and the outer surface of the fixing frame is fixedly connected to the side of the dual-cavity refrigeration box.

[0010] Preferably, a fixing block is fixedly connected to the outer surface of the feed pump, and the outer surface of the fixing block is fixedly connected to the left side of the dual-chamber refrigeration box.

[0011] Preferably, the inner wall of the base is threaded with two sets of bolts, and each bolt has a washer fitted on its outer surface, with the bottom end of each washer contacting the upper surface of the base.

[0012] Compared with the prior art, the present invention has the following beneficial effects: This invention utilizes a uniform and rapid cooling mechanism to uniformly cool the molding die, achieving rapid cooling. The combination of a semiconductor cooling chip and coolant in a storage tank enables uniform and rapid cooling of the heat generated during the molding die's manufacturing process. The controller operates the semiconductor cooling chip, which rapidly and uniformly lowers the surface temperature of the lower die, avoiding the uneven cooling issues common in traditional devices that use cold pipes for sudden cooling, thus improving the device's effectiveness. A feed pump transports the coolant from the storage tank to the dual-chamber cooling box via a transport pipe, quickly removing the heat generated by the semiconductor cooling chip and improving the device's heat dissipation efficiency. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the entire utility model; Figure 2 This is a three-dimensional structural diagram of the semiconductor cooling chip of this utility model; Figure 3 This is a three-dimensional structural diagram of the stabilizing plate of this utility model; Figure 4 This is a three-dimensional structural diagram of the lower mold of this utility model; Figure 5 This is a three-dimensional structural diagram of the discharge pump of this utility model; Figure 6 This is a three-dimensional structural diagram of the inner cavity of this utility model.

[0014] The figure shows: 1. Upper mold; 2. Lower mold; 3. Uniform and rapid cooling mechanism; 301. Base; 302. Dual-cavity refrigeration box; 303. Controller body; 304. Transport pipe; 305. Storage tank; 306. Feed pump; 307. Discharge pump; 308. Semiconductor refrigeration chip; 309. Temperature sensor; 310. Inner cavity; 4. Bolt; 5. Gasket; 6. Fixing block; 7. Piston; 8. Fixing frame; 9. Stabilizing plate. Detailed Implementation

[0015] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0016] Please see Figures 1 to 6 As shown, this utility model embodiment provides a molding die structure with rapid cooling function, including an upper die 1, a lower die 2 below the upper die 1, and a uniform rapid cooling mechanism 3 on the outer side of the lower die 2. The uniform rapid cooling mechanism 3 includes a base 301, and two sets of bolts 4 are threadedly connected to the inner wall of the base 301. Each bolt 4 has a washer 5 on its outer surface, and the bottom end of each washer 5 is in contact with the upper surface of the base 301. The base 301 can be fixed by the bolts 4 and the washer 5 to avoid the problem of shaking of the base 301 during use.

[0017] Please see Figures 1 to 6As shown, a storage tank 305 and a dual-chamber refrigeration box 302 are fixedly connected to the upper surface of the base 301. A controller body 303 is fixedly connected to the outer surface of the dual-chamber refrigeration box 302. A fixing frame 8 is fixedly connected to the outer surface of the controller body 303. The outer surface of the fixing frame 8 is fixedly connected to the side of the dual-chamber refrigeration box 302. The fixing frame 8 can be used to reinforce the controller body 303 and prevent it from falling off during use. The controller consists of two parts: hardware and software. The hardware mainly includes a central processing unit (CPU) for calculation, input / output (I / O) interfaces for connecting sensors and actuators, a memory for storing programs and data, as well as a power supply and communication module. The software includes the control algorithm program. Real-time operating systems (RTOS) and human-machine interfaces work together to ensure precise and efficient system control, which is widely used in industrial automation, smart homes, automotive electronics, and other fields. A controller is a core device that regulates system operation by processing input signals in real time and generating control commands. Its working principle can be summarized as follows: First, it collects signals from sensors or external inputs, such as temperature and speed, and compares them with preset target values ​​to calculate the deviation; then, it uses built-in algorithms such as PID control and logical judgment to analyze the deviation and generate adjustment commands; finally, it drives actuators such as motors and valves through the output interface to adjust the system state, while continuously monitoring the effect through closed-loop feedback to achieve dynamic stability. The controller can control the electrical components of this technical solution.

[0018] Please see Figures 1 to 6As shown, a feed pump 306 is provided on the outer side of the base 301. A fixing block 6 is fixedly connected to the outer surface of the feed pump 306. The outer surface of the fixing block 6 is fixedly connected to the left side of the dual-cavity refrigeration box 302. The fixing block 6 can fix the feed pump 306 to prevent fluctuations during use. The input end of the feed pump 306 is fixedly connected to a transport pipe 304. The bottom end of the transport pipe 304 is fixedly connected to the outer surface of the storage tank 305. The output end of the feed pump 306 is fixedly connected to the inner wall of the dual-cavity refrigeration box 302. A discharge pump 307 is fixedly connected to the outer surface of the dual-cavity refrigeration box 302. An inner cavity 310 is provided inside the dual-cavity refrigeration box 302. Two sets of semiconductor cooling chips 308 are fixedly connected to the inner wall of the inner cavity 310. Two sets of temperature sensors 309 are fixedly connected to the inner wall of the inner cavity 310. The cold end of the semiconductor cooling chip 308 is in contact with the outer surface of the lower mold 2. A device is provided above the storage tank 305. A piston 7 is included, with its outer surface threaded to the inner wall of the storage tank 305. The piston 7 seals the storage tank 305, preventing impurities from entering and affecting the quality of the stored refrigerant. The thermoelectric cooling chip 308 consists of alternating N-type and P-type thermoelectric material particles, conductive metal electrodes, and an insulating ceramic substrate. Its working principle is based on the Peltier effect: when a direct current passes through a semiconductor thermocouple, electrons and holes undergo energy level transitions at the conductor junction, absorbing heat to form a cold junction, while simultaneously releasing heat to form a hot junction, achieving temperature difference cooling. The cold junction temperature can be lowered below ambient temperature, while the hot junction dissipates heat through a radiator. The entire system has no moving parts, is compact, and is commonly used in applications such as precise temperature control of electronic devices, miniature refrigerators, and laser heat dissipation.

[0019] Please see Figures 1 to 6 As shown, a stabilizing plate 9 is fixedly connected to the outer surface of the discharge pump 307. The bottom surface of the stabilizing plate 9 is fixedly connected to the upper surface of the base 301. The stabilizing plate 9 can be used to fix the discharge pump 307 and prevent fluctuation problems during use.

[0020] The specific working principle of this utility model is as follows: First, the controller body 303, the semiconductor cooling chip 308, the discharge pump 307, the feed pump 306, and the temperature sensor 309 are connected to the power supply. Then, the material is injected into the interior of the lower mold 2 through the injection port of the upper mold 1. The controller body 303 controls the temperature sensor 309 and the semiconductor cooling chip 308 to work. The cold end of the semiconductor cooling chip 308 contacts the outer surface of the lower mold 2, and the cold end works to cool, achieving the purpose of uniform cooling around the mold. The hot end of the semiconductor cooling chip 308 contacts the inner wall of the dual-cavity cooling box 302, and the generated heat is dissipated through the coolant in the inner cavity of the dual-cavity cooling box 302. During the cooling process, the controller controls the process. The main body 303 controls the temperature sensor 309, which can detect the temperature of the surface of the inner cavity 310 in real time. The semiconductor cooling chip 308 can accurately and efficiently achieve uniform cooling around the mold. The heat generated is then transferred to the coolant in the inner cavity of the dual-cavity cooling box 302 through the hot end. At this time, the controller main body 303 controls the feed pump 306 to continuously transport the coolant in the storage tank 305 to the inside of the dual-cavity cooling box 302 through the transport pipe 304. Then, the coolant absorbs the heat from the surface of the semiconductor cooling chip 308 in the inner cavity of the dual-cavity cooling box 302 and is discharged through the discharge pump 307. This continuous circulation achieves the purpose of rapid and uniform cooling of the mold, thereby improving the working efficiency of the device.

[0021] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A molding die structure with rapid cooling function, comprising an upper die (1), characterized in that: A lower mold (2) is provided below the upper mold (1). A uniform and rapid cooling mechanism (3) is provided on the outer side of the lower mold (2). The uniform and rapid cooling mechanism (3) includes a base (301). A storage tank (305) and a dual-cavity refrigeration box (302) are fixedly connected to the upper surface of the base (301). A controller body (303) is fixedly connected to the outer surface of the dual-cavity refrigeration box (302). A feed pump (306) is provided on the outer side of the base (301). The input end of the feed pump (306) is fixedly connected to a transport pipe (304). The bottom end is fixedly connected to the outer surface of the storage tank (305), the output end of the feed pump (306) is fixedly connected to the inner wall of the dual-cavity refrigeration box (302), the outer surface of the dual-cavity refrigeration box (302) is fixedly connected to the discharge pump (307), the interior of the dual-cavity refrigeration box (302) is provided with an inner cavity (310), the inner wall of the inner cavity (310) is fixedly connected to two sets of semiconductor refrigeration chips (308), the inner wall of the inner cavity (310) is fixedly connected to two sets of temperature sensors (309), and the cold end of the semiconductor refrigeration chip (308) is in contact with the outer surface of the lower mold (2).

2. The molding die structure with rapid cooling function according to claim 1, characterized in that: A stabilizing plate (9) is fixedly connected to the outer surface of the discharge pump (307), and the bottom surface of the stabilizing plate (9) is fixedly connected to the upper surface of the base (301).

3. The molding die structure with rapid cooling function according to claim 1, characterized in that: A piston (7) is provided above the storage tank (305), and the outer surface of the piston (7) is threadedly connected to the inner wall of the storage tank (305).

4. The molding die structure with rapid cooling function according to claim 1, characterized in that: The outer surface of the controller body (303) is fixedly connected to a fixing frame (8), and the outer surface of the fixing frame (8) is fixedly connected to the side of the dual-cavity refrigeration box (302).

5. A molding die structure with rapid cooling function according to claim 1, characterized in that: The outer surface of the feed pump (306) is fixedly connected to a fixing block (6), and the outer surface of the fixing block (6) is fixedly connected to the dual-chamber refrigeration box (302).

6. The molding die structure with rapid cooling function according to claim 1, characterized in that: The inner wall of the base (301) is threaded with two sets of bolts (4), and each bolt (4) has a washer (5) fitted on its outer surface. The bottom end of each washer (5) is in contact with the upper surface of the base (301).

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