Graphite heat dissipation film for baseband

Abstract

The application relates to the technical field of heat dissipation films, in particular to a graphite heat dissipation film for a baseband, which comprises a protective layer, a high-thermal-conductivity graphite layer and a glue layer arranged in sequence. The high-thermal-conductivity graphite layer can quickly disperse local heat of the baseband module. The protective layer prevents the high-thermal-conductivity graphite layer from directly contacting the external environment, reduces the particulate pollution and short-circuit risk caused by friction, and the glue layer not only realizes stable adhesion of the high-thermal-conductivity graphite layer and the baseband module, but also can block the current path through insulation, and at the same time, the elastic buffer of the glue layer can absorb the vibration energy of the communication equipment, reduce the mechanical impact on the baseband module, and through the layered structure, the defects of the traditional single graphite material, such as easy fragmentation, lack of insulation and shock absorption capacity, are solved, and the graphite heat dissipation film is widely applied to high-power scenes such as 5G communication equipment and new energy batteries, and the heat dissipation efficiency and the stability of the communication equipment are significantly improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation film technology, and in particular to a graphite heat dissipation film for baseband. Background Technology

[0002] With the development of 5G communication technology, the baseband module, as a core component in 5G communication equipment and new energy batteries, needs to process high-frequency signals and generate a lot of heat. This has led to a significant increase in the heat generated during the operation of communication equipment, and heat dissipation has become a key factor restricting the performance and lifespan of communication equipment.

[0003] In related technologies, traditional heat dissipation materials, such as metal heat sinks and thermally conductive silicone, have drawbacks such as low thermal conductivity, large weight, or complex manufacturing processes. Graphite, on the other hand, is widely used in the thermal management of communication equipment due to its excellent planar thermal conductivity.

[0004] However, existing graphite heat dissipation films have the following problems: a single high thermal conductivity graphite layer is easily broken, and when in direct contact with the baseband module, it is easy to generate particles due to friction, which affects the stability of the equipment. Traditional heat dissipation films only meet the thermal conductivity requirements and lack comprehensive performance such as insulation and shock absorption. Utility Model Content

[0005] To address the aforementioned issues, this application provides a graphite heat dissipation film for baseband applications.

[0006] The graphite heat dissipation film for baseband provided in this application adopts the following technical solution: A graphite heat dissipation film for baseband, the heat dissipation film body comprising a protective layer, a high thermal conductivity graphite layer and an adhesive layer, wherein the thickness of the high thermal conductivity graphite layer is 0.025 mm.

[0007] By adopting the above technical solution, the protective layer isolates the high thermal conductivity graphite layer from direct contact with the baseband module, reducing the contamination of the circuit by friction particles or affecting the stability of signal transmission. The main function of the adhesive layer is to firmly bond the high thermal conductivity graphite layer to the baseband module and other heat dissipation target surfaces. It not only provides physical adhesion but also plays a role in electrical isolation, reducing the risk of short circuits between different electronic components. In addition, the adhesive layer has a certain degree of elasticity and buffering performance, which can absorb some mechanical stress and reduce the direct impact on the high thermal conductivity graphite layer and the baseband module.

[0008] Preferably, the protective layer is disposed above the high thermal conductivity graphite layer, and the adhesive layer is disposed below the high thermal conductivity graphite layer.

[0009] By adopting the above technical solution, the encapsulation design of the protective layer and adhesive layer significantly improves the mechanical strength of the high thermal conductivity graphite layer, reduces the breakage of the high thermal conductivity graphite layer caused by external force or vibration of the baseband module, isolates the high thermal conductivity graphite layer from the external environment, reduces the risk of the high thermal conductivity graphite layer breaking due to friction or generating particulate contamination of the baseband module, and the adhesive layer firmly attaches the high thermal conductivity graphite baseband to the surface of the baseband module through bonding, while also providing a buffering and shock absorption function.

[0010] Preferably, the protective layer is a black PET film with a thickness of 0.015 mm.

[0011] By adopting the above technical solution, the black PET film has excellent electrical insulation properties, which can effectively block the direct contact between the high thermal conductivity graphite layer and the external environment, reduce the risk of particulate contamination of the baseband module or short circuit caused by friction, and the protective layer with a thickness of 0.015mm can reduce interference with the planar thermal conductivity of the high thermal conductivity graphite layer while ensuring mechanical strength, and ensure that the heat of the high thermal conductivity graphite layer is efficiently conducted to the surface of the baseband module.

[0012] Preferably, the adhesive layer is a backing adhesive, and the thickness of the adhesive layer is 0.015 mm.

[0013] By adopting the above technical solution, the thickness of the adhesive layer is 0.015mm, which ensures sufficient adhesion while reducing the interface gap caused by excessive adhesive layer thickness. This allows the high thermal conductivity graphite layer to be tightly bonded to the surface of the baseband module, reducing thermal resistance in the heat transfer path and improving thermal conductivity. The adhesive also has insulating properties, blocking the current path to reduce the risk of short circuits. At the same time, the elasticity of the adhesive itself absorbs the vibration energy during equipment operation, reducing the mechanical impact on the baseband module.

[0014] Preferably, the density of the high thermal conductivity graphite layer is 2.080 g / cm³.

[0015] By adopting the above technical solution, since the density of the high thermal conductivity graphite layer is 2.080 g / cm³, the high density indicates that the internal porosity of the high thermal conductivity graphite layer is low and the grains are more compact, which reduces scattering and thermal resistance in the heat conduction path, thereby further enhancing the thermal conductivity in the planar direction. While ensuring high density, the thickness of the high thermal conductivity graphite layer is only 0.025 mm, which takes into account the requirements of lightweighting and adaptability to the internal space of complex equipment. It is especially suitable for scenarios with extremely high space utilization requirements, such as 5G communication equipment and new energy batteries.

[0016] Preferably, the thermal conductivity of the high thermal conductivity graphite layer is between 2014 W / Mk and 2090 W / Mk.

[0017] By adopting the above technical solution, since the thermal conductivity of the high thermal conductivity graphite layer is between 2014-2090W / MK, the high thermal conductivity allows the high thermal conductivity graphite layer to quickly disperse the local high temperature in the baseband module to the entire heat dissipation path in a very short time, significantly reducing the temperature of the baseband module and effectively reducing the performance degradation of the baseband module caused by overheating.

[0018] Preferably, the thermal diffusivity of the high thermal conductivity graphite layer is 1140-1160 mm^2 / s.

[0019] By adopting the above technical solution, since the thermal diffusivity of the high thermal conductivity graphite layer is 1140-1160 mm^2 / s, the high thermal diffusivity indicates that the high thermal conductivity graphite layer reduces scattering and interface thermal resistance in the heat conduction path, making heat transfer more direct and uniform, thereby improving the overall heat dissipation efficiency, reducing the accumulation of heat in the baseband module, and reducing the degradation of the baseband module or hardware damage caused by local overheating.

[0020] Preferably, the heat dissipation film body is provided with clearance space.

[0021] By adopting the above technical solution, and by designing clearance space on the heat dissipation film body, clearance is made for the baseband module, capacitors and power management unit in the baseband module, reducing direct contact between the high thermal conductivity graphite layer and components in non-heat dissipation areas, and reducing installation difficulties or abnormal operation of communication equipment caused by physical interference.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting up a multi-layer composite structure consisting of a 0.025mm high thermal conductivity graphite layer as the core, a protective layer and an adhesive layer, efficient heat dissipation of the baseband module is achieved. The protective layer isolates friction particles, and the adhesive layer provides bonding insulation and buffering and shock absorption, which significantly improves the stability and long-term operational reliability of communication equipment. 2. By setting the protective layer as a 0.015mm thick black PET film, the excellent electrical insulation of the black PET film can be used to block the high thermal conductivity graphite layer from direct contact with the external environment, reducing the risk of friction-generated particulate matter contaminating the baseband module or causing a short circuit. At the same time, it can minimize the interference with the planar thermal conductivity of the high thermal conductivity graphite layer, thereby achieving efficient heat conduction while ensuring mechanical strength. 3. By using a 0.015mm thick adhesive backing layer, interfacial gaps are eliminated to enhance the adhesion between the high thermal conductivity graphite layer and the baseband module and improve thermal conductivity. The insulating properties of the adhesive backing also block short-circuit risks and provide elastic buffering to absorb vibration energy. Attached Figure Description

[0023] Figure 1 This is a structural schematic diagram of an embodiment of this application.

[0024] Figure 2 This is a cross-sectional view of an embodiment of this application.

[0025] Explanation of reference numerals in the attached drawings: 1. Heat dissipation film body; 11. Clearance space; 12. Protective layer; 13. High thermal conductivity graphite layer; 14. Adhesive layer. Detailed Implementation

[0026] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0027] This application discloses a graphite heat dissipation film for baseband applications. (See also...) Figure 1 and Figure 2 A graphite heat dissipation film for baseband includes a heat dissipation film body 1, which is composed of a protective layer 12, a high thermal conductivity graphite layer 13, and an adhesive layer 14. The protective layer 12 is disposed above the high thermal conductivity graphite layer 13, and the adhesive layer 14 is disposed below the high thermal conductivity graphite layer 13. This layered structure allows each layer to play its own advantages and work together to achieve good heat dissipation and protection.

[0028] Furthermore, the high thermal conductivity graphite layer 13 can quickly conduct heat, while the protective layer 12 can reduce the breakage of the high thermal conductivity graphite layer 13. The adhesive layer 14 facilitates the adhesion of the heat dissipation film body 1 to the part that needs heat dissipation. It not only provides physical adhesion but also plays a role in electrical isolation, reducing the risk of short circuits between different electronic components. In addition, the adhesive layer 14 has a certain degree of elasticity and buffering performance, which can absorb some mechanical stress and reduce the direct impact on the high thermal conductivity graphite layer 13 and the baseband module.

[0029] Specifically, the protective layer 12 is a black PET film with a thickness of 0.015 mm. The black PET film is a flat thin film with good chemical corrosion resistance and electrical insulation. These properties enable the black PET to effectively protect the high thermal conductivity graphite layer 13 and effectively block the direct contact between the high thermal conductivity graphite layer 13 and the external environment, reducing the risk of particulate contamination of the baseband module or short circuit caused by friction. At the same time, the thickness of the protective layer 12 of 0.015 mm ensures mechanical strength while reducing interference with the planar thermal conductivity of the high thermal conductivity graphite layer 13, ensuring that the heat of the high thermal conductivity graphite layer 13 is efficiently conducted to the surface of the baseband module.

[0030] Furthermore, the high thermal conductivity graphite layer 13 includes graphite material, which has a unique layered crystal structure. This structure endows the high thermal conductivity graphite layer 13 with planar thermal conductivity. The carbon atoms of the high thermal conductivity graphite layer 13 are arranged in hexagons to form a two-dimensional planar network structure. Within this plane, the carbon atoms are tightly connected by covalent bonds, which enables heat to be conducted quickly within the plane.

[0031] Meanwhile, the density of the high thermal conductivity graphite layer 13 is between 2.080 g / cm³. This density indicates that the high thermal conductivity graphite layer 13 has low internal porosity and more compact grain arrangement, which reduces scattering and thermal resistance in the heat conduction path, thereby further enhancing the thermal conductivity in the planar direction. While ensuring high density, the thickness of the high thermal conductivity graphite layer 13 is only 0.025 mm, which takes into account the requirements of lightweighting and adaptability to the internal space of complex equipment. It is especially suitable for scenarios with extremely high space utilization requirements, such as 5G communication equipment and new energy batteries.

[0032] Furthermore, the high thermal conductivity graphite layer 13 has a thermal conductivity between 2014 W / Mk and 2090 W / Mk and a thermal diffusivity between 1140 and 1160 mm^2 / s. This allows the high thermal conductivity graphite layer 13 to quickly disperse the local high temperature in the baseband module to the entire heat dissipation path in a very short time, significantly reducing the temperature of the baseband module and effectively reducing the performance degradation of the baseband module caused by overheating.

[0033] Meanwhile, the thermal diffusivity between 1140-1160 mm^2 / s indicates that the high thermal conductivity graphite layer 13 reduces scattering and interfacial thermal resistance in the heat conduction path, making heat transfer more direct and uniform, thereby improving the overall heat dissipation efficiency, reducing heat accumulation in the baseband module, and reducing baseband module degradation or hardware damage caused by local overheating.

[0034] Furthermore, the adhesive layer 14 includes a backing adhesive, which is a sticky colloidal material. The backing adhesive typically has good adhesion and stability, and can firmly adhere the heat dissipation film body 1 to the baseband module. At the same time, the backing adhesive also has insulating properties, blocking the current path to reduce the risk of short circuit. In addition, the elasticity of the backing adhesive itself can absorb the vibration energy during equipment operation, and can also reduce the mechanical impact on the baseband module.

[0035] Meanwhile, the thickness of the adhesive layer 14 is 0.015mm. The thickness of the adhesive layer 14 is 0.015mm. While ensuring sufficient adhesion, the thickness of the adhesive layer 14 reduces the interface gap caused by excessive thickness, so that the high thermal conductivity graphite layer 13 is tightly attached to the surface of the baseband module, reducing the thermal resistance in the heat transfer path and improving the thermal conductivity efficiency.

[0036] In addition, the heat dissipation film body 1 is provided with a clearance space 11. The clearance space 11 makes way for the baseband module, capacitor and power management unit in the baseband module, reducing direct contact between the high thermal conductivity graphite layer 13 and components in non-heat dissipation areas, and reducing the occurrence of installation difficulties or abnormal operation of communication equipment due to physical interference. When designing the clearance space 11, it is necessary to accurately measure the size and position of each component to ensure the accuracy of the clearance space 11.

[0037] It should be noted that in this embodiment, the black PET film serves as the outermost layer covering the high thermal conductivity graphite layer 13. The adhesive is attached to the bottom of the high thermal conductivity graphite layer 13 through a coating process. The black PET film, the high thermal conductivity graphite layer 13, and the adhesive are tightly bonded together by a hot press, so that the black PET film and the high thermal conductivity graphite layer 13 form a mechanical bond. The adhesive is bonded to the high thermal conductivity graphite layer 13 through intermolecular forces.

[0038] The implementation principle of a graphite heat dissipation film for baseband in this application embodiment is as follows: The graphite heat dissipation film for baseband in this embodiment achieves optimal thermal conductivity through a reasonable layered structure where the materials in each layer work together.

[0039] The high thermal conductivity graphite layer utilizes its excellent thermal conductivity to quickly conduct the heat generated by the baseband module away, effectively reducing the temperature of the baseband module. The presence of the protective layer reduces direct contact between the high thermal conductivity graphite layer and the external environment, reducing the risk of particulate contamination of the baseband module or short circuit caused by friction.

[0040] The main function of the adhesive layer is to firmly bond the high thermal conductivity graphite layer to the baseband module and other heat dissipation target surfaces. It not only provides physical adhesion but also plays a role in electrical isolation, reducing the risk of short circuits between different electronic components. In addition, the adhesive layer has a certain degree of elasticity and buffering performance, which can absorb some mechanical stress and reduce the direct impact on the high thermal conductivity graphite layer and the baseband module.

[0041] The space-saving design allows for more space for the baseband module, capacitors, and power management unit within the baseband module, reducing direct contact between the high thermal conductivity graphite layer and components in non-heat-dissipating areas. This reduces installation difficulties or abnormal operation of communication equipment caused by physical interference.

[0042] Compared with traditional heat dissipation materials, this embodiment has significant advantages in thermal conductivity, mechanical strength, insulation and shock absorption. It effectively solves the problems of traditional communication equipment using a single high thermal conductivity graphite layer being easily broken and generating particles due to friction when in direct contact with the baseband module, thus improving the operational stability of the communication equipment.

[0043] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A graphite heat dissipation film for baseband, characterized in that, The heat dissipation film body (1) includes a protective layer (12), a high thermal conductivity graphite layer (13), and an adhesive layer (14), wherein the thickness of the high thermal conductivity graphite layer (13) is 0.025 mm; The protective layer (12) is disposed above the high thermal conductivity graphite layer (13), and the adhesive layer (14) is disposed below the high thermal conductivity graphite layer (13); The protective layer (12) is a black PET film with a thickness of 0.015 mm. The adhesive layer (14) is configured as a backing adhesive, and the thickness of the adhesive layer (14) is 0.015 mm.

2. The graphite heat dissipation film for baseband according to claim 1, characterized in that, The density of the high thermal conductivity graphite layer (13) is 2.080 g / cm³.

3. The graphite heat dissipation film for baseband according to claim 1, characterized in that, The thermal conductivity of the high thermal conductivity graphite layer (13) is between 2014 W / Mk and 2090 W / Mk.

4. The graphite heat dissipation film for baseband according to claim 1, characterized in that, The thermal diffusivity of the high thermal conductivity graphite layer (13) is 1140-1160 mm^2 / s.

5. A graphite heat dissipation film for baseband according to claim 1, characterized in that, The heat dissipation film body (1) is provided with a clearance space (11).

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