Composite copper foil attachment structure

CN224828043UActive Publication Date: 2026-10-09东莞市德普特电子有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202522129394.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-30
Publication Date
2026-10-09
Estimated Expiration
2035-09-30

AI Technical Summary

Technical Problem

[0002]目前业内铜箔贴附方式普遍一次性分离结构,顶、底膜未完全利用(只起附着保护作用),现有的贴附方法为:将铜箔和顶膜从底膜上剥离,铜箔和顶膜贴附在产品上,再将顶膜撕离,其贴附结构如图3所示;上述的铜箔贴附结构存在以下缺陷:

Benefits of technology

[0015]本实用新型结构新颖,通过在顶层保护膜和底层离型膜分别设置有顶膜预断线和底膜预断线,在将复合铜箔贴附于电子产品上时,只需要先撕离顶膜预断线以上的部分顶层保护膜和底模预断线以上的部分底层离型膜,顶层保护膜的下侧部分和底层离型膜的下侧部分保留,可以分别起到保护和支撑复合铜箔本体的作用,并且在贴附或者返工时,只需要撕离局部小区域即可完成返工,返工成功率以及工作效率高;进一步的,在所述顶膜预断线的一端设置有第一三角斜分割线以及在所述底模预断线的一端设置有第二三角斜分割线,可以有效减少顶层保护膜和底层离型膜的面积,且可以利用第一三角斜分割线和第二三角斜分割线作为撕离端,便于在减小顶底膜面积的同时确保自动化设备机台撕膜操作的可行性。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224828043U_ABST
    Figure CN224828043U_ABST
Patent Text Reader

Abstract

The utility model relates to electronic device copper foil attachment technical field especially is a kind of composite copper foil attachment structure, it includes top layer protective film, composite copper foil body and bottom layer release film from top to bottom arrangement in order, bottom layer release film is attached in the bottom of composite copper foil body, top layer protective film is attached in the top of composite copper foil body, the upside of top layer protective film is equipped with top film pre-break line, one end of top film pre-break line is provided with first triangular slanted division line, the upside of bottom layer release film is equipped with bottom film pre-break line, one end of bottom model pre-break line is provided with second triangular slanted division line, first triangular slanted division line and second triangular slanted division line are correspondingly set. The utility model novel structure, the downside of top layer protective film and the downside of bottom layer release film are retained, can respectively play the role of protection and support composite copper foil body, rework success rate and work efficiency are high;The area of top layer protective film and bottom layer release film can be effectively reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of copper foil bonding technology for electronic devices, and in particular to a composite copper foil bonding structure. Background Technology

[0002] Currently, the industry standard for copper foil bonding is a one-time separation structure, where the top and bottom films are not fully utilized (they only serve an adhesion and protective function). The existing bonding method involves peeling the copper foil and top film from the bottom film, attaching the copper foil and top film to the product, and then peeling off the top film. The bonding structure is as follows: Figure 3 As shown, the above-mentioned copper foil bonding structure has the following defects:

[0003] Low utilization rate of top and bottom films: The top and bottom films need to be much larger than the copper foil design (cost impact) in order to meet the requirements of film peeling and application by the equipment;

[0004] There is a risk of copper foil wrinkling: the base film has been peeled off when the copper foil is applied; the copper foil is unsupported, and because the copper foil is relatively soft, the risk of copper foil wrinkling is high during application (especially in complex structures).

[0005] Low rework yield: After the base film is peeled off, it is completely adhered to the product. If it is applied crookedly, it will be necessary to apply it again, resulting in the scrapping of the copper foil. Summary of the Invention

[0006] This invention addresses the problems of existing technologies by providing a novel composite copper foil bonding structure. The lower portion of the top protective film and the lower portion of the bottom release film are retained, respectively serving to protect and support the composite copper foil body. This results in a high rework success rate and high work efficiency. It effectively reduces the area of ​​the top protective film and the bottom release film, and utilizes the first and second triangular oblique dividing lines as tear-off ends, facilitating the reduction of the top and bottom film areas while ensuring the feasibility of automated equipment tear-off operations.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0008] This utility model provides a composite copper foil bonding structure, which includes a top protective film, a composite copper foil body, and a bottom release film arranged sequentially from top to bottom. The bottom release film is bonded to the bottom of the composite copper foil body, and the top protective film is bonded to the top of the composite copper foil body. A top film pre-cut line is provided on the upper side of the top protective film, and a first triangular oblique dividing line is provided at one end of the top film pre-cut line. A bottom film pre-cut line is provided on the upper side of the bottom release film, and a second triangular oblique dividing line is provided at one end of the bottom film pre-cut line. The first triangular oblique dividing line and the second triangular oblique dividing line are correspondingly arranged.

[0009] Preferably, the bottom surface adhesiveness of the top protective film is 4-6g.

[0010] Preferably, the release force of the bottom release film is 1-3g.

[0011] The top film pre-break line and the bottom film pre-break line are disposed on the upper side of the irregularly shaped and easily deformable area of ​​the composite copper foil body.

[0012] The top protective film has a first positioning hole at each end.

[0013] The bottom release film has second positioning holes at both ends.

[0014] The beneficial effects of this utility model are:

[0015] This utility model features a novel structure. By setting a top film pre-cut line and a bottom film pre-cut line on the top protective film and bottom release film respectively, when attaching the composite copper foil to electronic products, only the portion of the top protective film above the top film pre-cut line and the portion of the bottom release film above the bottom film pre-cut line need to be peeled off first. The lower portions of the top protective film and the bottom release film are left intact, which can respectively protect and support the composite copper foil body. Furthermore, during attachment or rework, only a small local area needs to be peeled off to complete the rework, resulting in a high rework success rate and work efficiency. In addition, a first triangular oblique dividing line is set at one end of the top film pre-cut line and a second triangular oblique dividing line is set at one end of the bottom film pre-cut line, which can effectively reduce the area of ​​the top protective film and the bottom release film. Moreover, the first and second triangular oblique dividing lines can be used as peeling ends, which facilitates the reduction of the top and bottom film areas while ensuring the feasibility of film peeling operations on automated equipment. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a composite copper foil bonding structure according to the present invention.

[0017] Figure 2 This is an exploded view of the composite copper foil bonding structure of this utility model.

[0018] Figure 3 A schematic diagram of the existing copper foil bonding structure.

[0019] exist Figures 1 to 2 The reference numerals in the figures include:

[0020] 1. Top protective film; 2. Composite copper foil body; 3. Bottom release film; 4. Top film pre-cut line; 5. First triangular oblique dividing line; 6. Bottom film pre-cut line; 7. Second triangular oblique dividing line; 8. First positioning hole; 9. Second positioning hole. Detailed Implementation

[0021] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0022] A composite copper foil bonding structure, such as Figures 1 to 2 As shown, it includes, from top to bottom, a top protective film 1, a composite copper foil body 2, and a bottom release film 3. The bottom release film 3 is attached to the bottom of the composite copper foil body 2, and the top protective film 1 is attached to the top of the composite copper foil body 2. A top film pre-cut line 4 is provided on the upper side of the top protective film 1, and a first triangular oblique dividing line 5 is provided at one end of the top film pre-cut line 4. A bottom film pre-cut line 6 is provided on the upper side of the bottom release film 3, and a second triangular oblique dividing line 7 is provided at one end of the bottom film pre-cut line. The first triangular oblique dividing line 5 and the second triangular oblique dividing line 7 are correspondingly provided. The top film pre-cut line 4 and the bottom film pre-cut line 6 are located on the upper side of the irregularly shaped and easily deformable area of ​​the composite copper foil body 2.

[0023] Specifically, this utility model has a novel structure. By setting a top film pre-cut line 4 and a bottom film pre-cut line 6 on the top protective film 1 and the bottom release film 3 respectively, when attaching the composite copper foil to electronic products, it is only necessary to peel off the portion of the top protective film 1 above the top film pre-cut line 4 and the portion of the bottom release film 3 above the bottom film pre-cut line 3. The lower part of the top protective film 1 and the lower part of the bottom release film 3 are retained, which can respectively play the role of protecting and supporting the composite copper foil body 2. Moreover, during attachment or rework, only a small local area needs to be peeled off to complete the rework, resulting in a high rework success rate and work efficiency. Furthermore, a first triangular oblique dividing line 5 is set at one end of the top film pre-cut line 4 and a second triangular oblique dividing line 7 is set at one end of the bottom film pre-cut line, which can effectively reduce the area of ​​the top protective film 1 and the bottom release film 3. The first triangular oblique dividing line 5 and the second triangular oblique dividing line 7 can be used as the peeling end, which facilitates the reduction of the top and bottom film area while ensuring the feasibility of the film peeling operation of the automated equipment.

[0024] In this embodiment, the positions of the top film pre-cut line 4 and the bottom film pre-cut line 6 can be adjusted according to the actual structure of the composite copper foil body 2. The top film pre-cut line 4 and the bottom film pre-cut line 6 are set above the irregular (easily deformable) area of ​​the composite copper foil body 2. When the bottom release film 3 above the bottom film pre-cut line 6 is peeled off, the bottom release film 3 on the lower side is still supported by the bottom release film 3 in the easily deformable area of ​​the composite copper foil body 2, which will not cause deformation and wrinkles during bonding or rework, and the work reliability is strong. This embodiment significantly improves the utilization rate of the top and bottom films, reduces material costs, effectively reduces the risk of wrinkles in the copper foil during bonding, especially for complex structures, improves rework efficiency and yield, and only requires peeling off a small local area to complete the rework.

[0025] In this embodiment, the bottom surface adhesiveness of the top protective film 1 is 4-6g. The release force of the bottom release film 3 is 1-3g.

[0026] In this embodiment, the top protective film 1 has first positioning holes 8 at both ends. The bottom release film 3 has second positioning holes 9 at both ends. Specifically, the first positioning holes 8 and the second positioning holes 9 are correspondingly arranged to facilitate alignment of the top protective film 1 and the bottom release film 3 with the composite copper foil body 2 during attachment, ensuring the accuracy and reliability of the attachment.

[0027] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A composite copper foil bonding structure, characterized in that: The device comprises, from top to bottom, a top protective film, a composite copper foil body, and a bottom release film. The bottom release film is attached to the bottom of the composite copper foil body, and the top protective film is attached to the top of the composite copper foil body. A top film pre-cut line is provided on the upper side of the top protective film, and a first triangular oblique dividing line is provided at one end of the top film pre-cut line. A bottom film pre-cut line is provided on the upper side of the bottom release film, and a second triangular oblique dividing line is provided at one end of the bottom film pre-cut line. The first triangular oblique dividing line and the second triangular oblique dividing line are correspondingly provided.

2. The composite copper foil bonding structure according to claim 1, characterized in that: The bottom surface adhesiveness of the top protective film is 4-6g.

3. The composite copper foil bonding structure according to claim 1, characterized in that: The release force of the bottom release film is 1-3g.

4. The composite copper foil bonding structure according to claim 1, characterized in that: The top film pre-break line and the bottom film pre-break line are set on the upper side of the irregularly shaped and easily deformable area of ​​the composite copper foil body.

5. The composite copper foil bonding structure according to claim 1, characterized in that: The top protective film has a first positioning hole at each end.

6. The composite copper foil bonding structure according to claim 1, characterized in that: The bottom release film has second positioning holes at both ends.