Glass single-sided thinning and bonding assembly

Abstract

The utility model discloses a kind of glass single-face thinning pair of paste assemblies, it is related to glass thinning technical field, including mutually adhered glass panel, metal circuit surface is equipped on the glass panel, the metal circuit surface of the glass panel is oppositely arranged.Two glass panels are mutually adhered, so that the metal circuit surface on two glass panels is adhered in one, when entire assembly is carried out thinning work, chemical liquid cannot erode metal circuit surface, so as to carry out protection work to the metal circuit surface of glass panel, and then make the thinning quality of glass panel better, and practicality is higher.

Description

Technical Field

[0001] This utility model relates to the field of glass thinning technology, and in particular to a glass single-sided thinning bonding assembly. Background Technology

[0002] Single-sided thinning display technology is one of the core processes driving the display industry towards thinner and more flexible designs. Its development relies on collaborative innovation in materials science, precision machining, and optical design. In the future, with the widespread adoption of new form factors such as AR glasses and rollable TVs, this technology will further advance towards ultra-thinness, high reliability, and low cost. Optimizing the single-sided thinning process is of great significance to my country's future display industry and will also promote the thinning and lightening of electronic products.

[0003] For example, CN116177899A, published on May 30, 2023, discloses a glass thinning device, including: a placement frame for placing or detachably mounting the glass to be processed; and a spraying mechanism including a drive component, a spraying pipe, and multiple nozzles disposed on the spraying pipe. The spraying pipe is rotatably connected to the placement frame around its central axis. The drive component is driven to rotate the spraying pipe, and the multiple nozzles rotate synchronously with the spraying pipe around its central axis to spray etching liquid onto the surface of the glass to be processed. When the aforementioned glass thinning device is in operation, the metal lines on the glass panel are easily corroded, resulting in poor quality of the thinned glass product. Summary of the Invention

[0004] The purpose of this invention is to provide a glass single-sided thinning bonding assembly with higher finished product quality. This invention protects the metal circuitry surfaces of the two glass panels during the thinning process by bonding them together, thus resulting in a higher finished product quality for the thinned glass panels.

[0005] To achieve the above objectives, the technical solution adopted by this utility model to solve its technical problem is: a single-sided thinning and bonding assembly for glass, comprising glass panels bonded together, wherein the glass panels are provided with metal circuit surfaces, and the metal circuit surfaces of the glass panels are arranged opposite to each other.

[0006] The glass panels are bonded together with UV adhesive.

[0007] The metal circuit surface of the glass panel is coated with an oil film coating.

[0008] A buffer pad is provided between the glass panels that are arranged opposite each other, and the UV adhesive and oil film coating are both placed inside the buffer pad.

[0009] Both the glass panel and the metal circuit surface have rectangular cross-sections.

[0010] The oil film coating is a mixture of epoxy resin and polyurethane.

[0011] The buffer pad is a silicone pad.

[0012] The beneficial effects of this utility model are:

[0013] By bonding the two glass panels together, the metal circuit surfaces on the two glass panels are bonded together. When the entire assembly is thinned, the chemical liquid will not corrode the metal circuit surfaces, thus protecting the metal circuit surfaces of the glass panels. This results in better thinning quality and higher practicality of the glass panels.

[0014] The metal circuit surfaces of the glass panels are coated with an oil film coating to further protect the metal circuit surfaces and prevent UV adhesive from damaging them. A buffer pad is also provided between the oppositely placed glass panels. Both the UV adhesive and the oil film coating are placed inside the buffer pad. The buffer pad protects the metal circuit surfaces between the two glass panels and prevents excessive force during bonding from causing the metal circuit surfaces on the two glass panels to be squeezed and damaged. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of the glass single-sided thinning and bonding assembly of this utility model.

[0016] Figure 2 for Figure 1 Top view.

[0017] In the attached diagram: 1-glass panel, 101-metal circuit surface, 2-oil film coating, 3-UV adhesive, 4-buffer pad, 5-cut line. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0019] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0020] like Figure 1 As shown, the single-sided thinning and bonding assembly includes glass panels 1 bonded together. The glass panels 1 are provided with metal circuit surfaces 101. The metal circuit surfaces 101 of the glass panels 1 are arranged opposite to each other, and the two metal circuit surfaces 101 are protected by bonding.

[0021] In use, the two glass panels 1 are bonded together, thereby bonding the metal circuit surfaces 101 on the two glass panels 1 together. When the entire assembly is thinned, the chemical liquid will not corrode the metal circuit surfaces 101, thus protecting the metal circuit surfaces 101 of the glass panels 1, resulting in better thinning quality and higher practicality of the glass panels 1.

[0022] Opposite glass panels 1 are bonded together with UV adhesive 3 to ensure a stable connection between the two glass panels 1. When bonding the glass panels 1, a rectangular adhesive frame is placed on the glass panel 1. At this time, the metal circuit surface 101 of the glass panel 1 is in the adhesive frame. UV adhesive 3 is applied to the adhesive frame. After the application is completed, the adhesive frame is removed, and then the metal circuit surfaces 101 of the two glass panels 1 are bonded together to achieve the bonding work.

[0023] An oil film coating 2 is applied to the metal circuit surface 101 of the glass panel 1. The oil film coating 2 further protects the metal circuit surface 101 and prevents the UV adhesive 3 from damaging the metal circuit surface 101.

[0024] A buffer pad 4 is provided between the glass panels 1 that are set opposite each other. The UV adhesive 3 and the oil film coating 2 are both placed in the buffer pad 4. The buffer pad 4 protects the metal circuit surface 101 between the two glass panels 1, preventing excessive force from being applied during bonding, which would cause the metal circuit surface 101 on the two glass panels 1 to be squeezed against each other and damaged.

[0025] Specifically, both the glass panel 1 and the metal circuit board 101 have rectangular cross-sections, which facilitates the subsequent cutting of the glass panel 1 along the cutting line 5. Specifically, the area of ​​the cutting line 5 matches that of the metal circuit board 101, thereby ensuring that the glass panel 1 can be accurately separated when cutting along the cutting line.

[0026] The oil film coating 2 is a mixture of epoxy resin and polyurethane, which provides stable protection for the metal circuit layer on the glass panel 1.

[0027] The buffer pad 4 is a silicone pad. The silicone pad is elastic, which ensures that the buffer pad 4 controls the distance between the two glass panels 1, thereby protecting the metal circuit surface 101.

[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A single-sided thinning and bonding assembly for glass, characterized in that, The system includes glass panels (1) bonded together, with metal circuit surfaces (101) on the glass panels (1) and the metal circuit surfaces (101) of the glass panels (1) being arranged opposite each other; the opposite glass panels (1) are bonded together by UV adhesive (3); the metal circuit surfaces (101) of the glass panels (1) are coated with an oil film coating (2); a buffer isolation pad (4) is also provided between the opposite glass panels (1), and the UV adhesive (3) and the oil film coating (2) are both disposed in the buffer isolation pad (4).

2. The glass single-sided thinning and bonding assembly according to claim 1, characterized in that, Both the glass panel (1) and the metal circuit surface (101) have rectangular cross sections.

3. The glass single-sided thinning and bonding assembly according to claim 1, characterized in that, The oil film coating (2) is a mixture of epoxy resin and polyurethane.

4. The glass single-sided thinning and bonding assembly according to any one of claims 1-3, characterized in that, The buffer pad (4) is a silicone pad.

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