Elastic pressing head array structure of multi-layer board pre-pressing and fitting machine

Abstract

The utility model relates to multilayer board prepressing laminating machine technical field, and disclose a kind of elastic pressure head array structure of multilayer board prepressing laminating machine.The elastic pressure head array structure of multilayer board prepressing laminating machine, including pedestal, guide column, oil cylinder, movable base, hot disc and array substrate, the top of the pedestal is fixedly connected with the guide column of four corners distribution, the top of the pedestal is equipped with oil cylinder, the output end of the oil cylinder is equipped with movable base with guide column all sliding connection, the top of the movable base is equipped with hot disc, the device has adjustable pre-tightening force, adapts to different thickness multilayer board, elastic buffer, dynamically adapts uneven surface, pressure distribution is uniform, reduces laminating defect, responds thermal expansion deformation, improves laminating stability and other advantages, solve the problem that local pressure concentration caused by rigid pressure head, laminating defect, and simple spring structure pre-tightening force regulation deficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of multilayer board pre-pressing and bonding machines, specifically to an elastic pressure head array structure for a multilayer board pre-pressing and bonding machine. Background Technology

[0002] Multilayer board pre-pressing laminators are indeed key equipment in the manufacturing of printed circuit boards (PCBs) and multilayer composite materials. They are mainly used to achieve preliminary bonding of interlayer materials during hot pressing, ensuring accurate positioning and uniform pressure distribution of the boards before curing.

[0003] Traditional pre-press laminating machines often use rigid pressure heads or simple spring buffer structures. A hydraulic cylinder drives a movable base to raise a hot plate, so that the pressure head applies pressure to the board.

[0004] However, rigid pressure head arrays are difficult to adapt to the slight unevenness of the board surface, which can easily lead to local pressure concentration and cause defects such as poor bonding, bubbles or delamination. Secondly, the preload adjustment range of the spring buffer structure is limited and lacks uniformity control. When processing multilayer boards of different thicknesses or materials, uneven pressure distribution will reduce product consistency and yield. In addition, the pressure head components of existing equipment mostly adopt a fixed design and lack an elastic compensation mechanism. They cannot dynamically respond to the thermal expansion and deformation of the board during hot pressing, which further aggravates the fluctuation of bonding quality.

[0005] In summary, an elastic pressure head array structure for a multilayer board pre-pressing and bonding machine is proposed to solve the above problems. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this utility model provides an elastic pressure head array structure for a multilayer board pre-pressing and bonding machine. It features adjustable pre-tightening force, adaptability to multilayer boards of different thicknesses, elastic buffering, dynamic adaptation to uneven surfaces, uniform pressure distribution, reduced bonding defects, response to thermal expansion deformation, and improved bonding stability. It solves the problems of local pressure concentration and bonding defects caused by rigid pressure heads, as well as the insufficient pre-tightening force adjustment of simple spring structures.

[0008] (II) Technical Solution

[0009] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: An elastic pressure head array structure for a multilayer board pre-pressing and bonding machine includes a base, guide columns, a hydraulic cylinder, a movable base, a hot plate, and an array substrate. The top of the base is fixedly connected to guide columns distributed at four corners. The top of the base is provided with a hydraulic cylinder. The output end of the hydraulic cylinder is provided with a movable base that is slidably connected to the guide columns. The top of the movable base is provided with a hot plate. The outer side of the guide columns is fixedly connected to the same array substrate located above the movable base. The surface of the array substrate is fixedly connected to guide sleeves that are distributed in a rectangular array and extend downwards. The interior of each guide sleeve is provided with an elastic pressure head assembly that extends downwards and is adapted to the hot plate. The outer side of the guide columns is slidably connected to a mounting plate located above the array substrate. The surface of the mounting plate is provided with pre-tightening components that are distributed in a rectangular array and extend downwards. The lower ends of the pre-tightening components extend into the interior of the guide sleeves and are adapted to the elastic pressure head assemblies. The top of the mounting plate is fixedly connected to a cross. The top of the guide columns is provided with an adjustment component that is rotatably connected to the top of the cross.

[0010] The beneficial effects of this utility model are:

[0011] The elastic pressure head array structure of this multilayer board pre-pressing and bonding machine, based on the thickness of the multilayer board, uses a rotating adjustment component to push the cross and mounting plate along the guide column, thereby adjusting the pre-tightening force of the pre-tightening component on the elastic pressure head assembly to adapt to the thickness of the multilayer board. The multilayer board is placed on a hot plate, and the hydraulic cylinder is activated, pushing the movable base upwards along the guide column, bringing the multilayer board into contact with the elastic pressure head assembly. The elastic pressure head assembly simultaneously provides cushioning, dynamically adapting to minor undulations on the board surface. The pre-tightening force ensures uniform pressure distribution, reducing the risk of air bubbles and delamination. The hot plate heats the board, and the elastic pressure head assembly remains stable under pressure and responds to thermal expansion deformation, ensuring bonding quality. It features adjustable pre-tightening force, adaptability to multilayer boards of different thicknesses, elastic cushioning, dynamic adaptation to surface unevenness, uniform pressure distribution, reduced bonding defects, and improved bonding stability in response to thermal expansion deformation.

[0012] Based on the above technical solution, the present invention can be further improved as follows.

[0013] Furthermore, the elastic pressure head assembly includes a guide rod, a pressure plate, a polyurethane elastic block, a partition plate, and a spring. The guide sleeve is provided with a guide rod extending downwards. The lower end of the guide rod is fixedly connected to a pressure plate adapted to the hot plate. The bottom of the pressure plate is attached with a polyurethane elastic block. The outer side of the guide rod is fixedly connected to a partition plate located inside the guide sleeve. The outer side of the guide rod is fitted with a spring located inside the guide sleeve and abutting against the top of the partition plate.

[0014] Furthermore, the pre-tightening assembly includes a sleeve and a pressure ring. The surface of the mounting plate is fixedly connected with sleeves arranged in a rectangular array and extending downwards. The lower ends of the sleeves extend into the interior of the guide sleeve and fit around the outer side of the upper end of the guide rod. The bottom of each sleeve is fixedly connected with a pressure ring located inside the guide sleeve and abutting against the upper end of the spring.

[0015] Furthermore, the adjustment assembly includes an X-shaped bracket, a handwheel screw, and a lock nut. The top of the guide column is fixedly connected to the same X-shaped bracket. The top of the X-shaped bracket is threadedly connected to a handwheel screw that extends below it and is rotatably connected to the top of the cross. The outer side of the handwheel screw is threadedly connected to a lock nut that abuts against the top of the X-shaped bracket.

[0016] The beneficial effect of adopting the above-mentioned further solution is that, according to the thickness of the multilayer board, rotating the handwheel screw pushes the cross and the mounting plate to move down along the guide post, thereby driving the sleeve and the pressure ring to move down inside the guide sleeve, the pressure ring compresses the spring, sets the initial preload, and tightens the anti-loosening nut to lock the handwheel screw in a fixed position.

[0017] Furthermore, each of the polyurethane elastic blocks has a compressible silicone pad attached to its bottom.

[0018] The beneficial effect of adopting the above-mentioned further solution is that the compressible silicone gasket has high elasticity and compressibility, and works in synergy with the polyurethane elastic block to more effectively absorb local pressure fluctuations, adapt to minor unevenness on the surface of the board, avoid indentations or damage, and ensure uniform pressure distribution. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a cross-sectional view of the guide sleeve structure of this utility model.

[0021] In the diagram: 1. Base; 2. Guide column; 3. Hydraulic cylinder; 4. Movable base; 5. Hot plate; 6. Array substrate; 7. Guide sleeve; 8. Elastic pressure head assembly; 801. Guide rod; 802. Pressure plate; 803. Polyurethane elastic block; 804. Partition plate; 805. Spring; 9. Mounting plate; 10. Pre-tightening assembly; 101. Sleeve; 102. Pressure ring; 11. Cross; 12. Adjustment assembly; 121. X-frame; 122. Handwheel screw; 123. Anti-loosening nut; 13. Compressible silicone gasket. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In the embodiments, by Figure 1-2 This invention discloses an elastic pressure head array structure for a multilayer board pre-pressing and bonding machine. The structure includes a base 1, guide columns 2, hydraulic cylinders 3, a movable base 4, a heating plate 5, and an array substrate 6. The top of the base 1 is fixedly connected to the guide columns 2, which are distributed at four corners. The top of the base 1 is equipped with the hydraulic cylinders 3, and the output end of the hydraulic cylinders 3 is connected to the movable base 4, which is slidably connected to the guide columns 2. The top of the movable base 4 is equipped with the heating plate 5. The outer side of each guide column 2 is fixedly connected to the same array substrate 6, which is located above the movable base 4. The surface of the array substrate 6 is fixedly connected with a rectangular array of... The guide sleeve 7 extends to its lower part. The interior of the guide sleeve 7 is provided with an elastic pressure head assembly 8 that extends to its lower part and is adapted to the hot plate 5. The outer side of the guide post 2 is slidably connected to the same mounting plate 9 located above the array substrate 6. The surface of the mounting plate 9 is provided with pre-tightening components 10 arranged in a rectangular array and extending to its lower part. The lower ends of the pre-tightening components 10 extend into the interior of the guide sleeve 7 and are adapted to the elastic pressure head assembly 8. The top of the mounting plate 9 is fixedly connected to a cross 11. The top of the guide post 2 is provided with the same adjustment component 12 that is rotatably connected to the top of the cross 11.

[0024] The elastic pressure head assembly 8 includes a guide rod 801, a pressure plate 802, a polyurethane elastic block 803, a partition plate 804, and a spring 805. The guide sleeve 7 is provided with a guide rod 801 extending to its lower part. The lower end of the guide rod 801 is fixedly connected to a pressure plate 802 that is compatible with the hot plate 5. The bottom of the pressure plate 802 is attached with a polyurethane elastic block 803. The outer side of the guide rod 801 is fixedly connected to a partition plate 804 located inside the guide sleeve 7. The outer side of the guide rod 801 is fitted with a spring 805 located inside the guide sleeve 7 and abutting against the top of the partition plate 804.

[0025] The pre-tightening assembly 10 includes a sleeve 101 and a pressure ring 102. The surface of the mounting plate 9 is fixedly connected with sleeves 101 arranged in a rectangular array and extending downward therefrom. The lower ends of the sleeves 101 extend into the interior of the guide sleeve 7 and are fitted onto the outer side of the upper end of the guide rod 801. The bottom of each sleeve 101 is fixedly connected with a pressure ring 102 located inside the guide sleeve 7 and abutting against the upper end of the spring 805.

[0026] The adjustment assembly 12 includes an X-shaped frame 121, a handwheel screw 122, and a lock nut 123. The top of the guide column 2 is fixedly connected to the same X-shaped frame 121. The top of the X-shaped frame 121 is threadedly connected to the handwheel screw 122, which extends to its lower part and is rotatably connected to the top of the cross 11. The outer side of the handwheel screw 122 is threadedly connected to the lock nut 123, which abuts against the top of the X-shaped frame 121.

[0027] The bottom of each polyurethane elastic block 803 is fitted with a compressible silicone pad 13.

[0028] Working principle:

[0029] Step 1: Based on the thickness of the multilayer board, rotate the handwheel screw 122 to push the cross 11 and the mounting plate 9 down along the guide post 2, which in turn drives the sleeve 101 and the pressure ring 102 to move down inside the guide sleeve 7. The pressure ring 102 compresses the spring 805, sets the initial preload, and tightens the anti-loosening nut 123 to lock the handwheel screw 122 in a fixed position.

[0030] Step 2: Place the multilayer board on the hot plate 5, start the hydraulic cylinder 3, and push the movable base 4 to rise along the guide column 2, so that the multilayer board comes into contact with the compressible silicone pad 13 at the bottom of the polyurethane elastic block 803. The polyurethane elastic block 803 and the spring 805 provide cushioning at the same time. The compressible silicone pad 13 has high elasticity and compressibility. Working together with the polyurethane elastic block 803, it can more effectively absorb local pressure fluctuations, adapt to the slight unevenness of the board surface, avoid indentations or damage, ensure uniform pressure distribution, and reduce the risk of bubbles and delamination.

[0031] Step 3: The hot plate 5 heats the board, and the polyurethane elastic block 803 and the compressible silicone pad 13 remain stable under pressure and respond to thermal expansion deformation to ensure bonding quality.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An elastic pressure head array structure for a multilayer board pre-pressing and bonding machine, comprising a base (1), guide columns (2), hydraulic cylinders (3), movable bases (4), hot plates (5), and an array substrate (6), wherein the top of the base (1) is fixedly connected to guide columns (2) distributed at four corners, the top of the base (1) is provided with hydraulic cylinders (3), the output end of the hydraulic cylinders (3) is provided with movable bases (4) which are slidably connected to the guide columns (2), the top of the movable bases (4) is provided with hot plates (5), and the outer side of the guide columns (2) is fixedly connected to the same array substrate (6) located above the movable bases (4), characterized in that: The surface of the array substrate (6) is fixedly connected with guide sleeves (7) arranged in a rectangular array and extending below them. The interior of each guide sleeve (7) is provided with an elastic pressure head assembly (8) extending below it and adapted to the hot plate (5). The outer side of the guide post (2) is slidably connected with the same mounting plate (9) located above the array substrate (6). The surface of the mounting plate (9) is provided with pre-tightening components (10) arranged in a rectangular array and extending below it. The lower end of the pre-tightening components (10) extends into the interior of the guide sleeve (7) and is adapted to the elastic pressure head assembly (8). The top of the mounting plate (9) is fixedly connected with a cross (11). The top of the guide post (2) is provided with the same adjustment component (12) rotatably connected to the top of the cross (11).

2. The elastic pressure head array structure of a multilayer board pre-pressing and bonding machine according to claim 1, characterized in that: The elastic pressure head assembly (8) includes a guide rod (801), a pressure plate (802), a polyurethane elastic block (803), a partition plate (804), and a spring (805). The guide sleeve (7) is provided with a guide rod (801) extending to its lower part. The lower end of the guide rod (801) is fixedly connected to a pressure plate (802) adapted to the hot plate (5). The bottom of the pressure plate (802) is attached with a polyurethane elastic block (803). The outer side of the guide rod (801) is fixedly connected to a partition plate (804) located inside the guide sleeve (7). The outer side of the guide rod (801) is fitted with a spring (805) located inside the guide sleeve (7) and abutting against the top of the partition plate (804).

3. The elastic pressure head array structure of a multilayer board pre-pressing and bonding machine according to claim 2, characterized in that: The pre-tightening assembly (10) includes a sleeve (101) and a pressure ring (102). The surface of the mounting plate (9) is fixedly connected with sleeves (101) arranged in a rectangular array and extending to its lower part. The lower ends of the sleeves (101) extend into the interior of the guide sleeve (7) and are fitted onto the outer side of the upper end of the guide rod (801). The bottom of each sleeve (101) is fixedly connected with a pressure ring (102) located inside the guide sleeve (7) and abutting against the upper end of the spring (805).

4. The elastic pressure head array structure of a multilayer board pre-pressing and bonding machine according to claim 1, characterized in that: The adjustment assembly (12) includes an X-frame (121), a handwheel screw (122), and a lock nut (123). The top of the guide post (2) is fixedly connected to the same X-frame (121). The top of the X-frame (121) is threadedly connected to a handwheel screw (122) that extends below it and is rotatably connected to the top of the cross (11). The outer side of the handwheel screw (122) is threadedly connected to a lock nut (123) that abuts against the top of the X-frame (121).

5. The elastic pressure head array structure of a multilayer board pre-pressing and bonding machine according to claim 2, characterized in that: Each of the polyurethane elastic blocks (803) has a compressible silicone pad (13) attached to its bottom.

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