Laminated electronic passport information page inlay with acrylate glue film

Abstract

The utility model relates to the field of laminated passport page discloses a laminated electronic passport information page inlay layer with acrylate glue film, including protection layer, compensation layer, buried line layer, PET hinge layer. The device can fill the gap between the chip hole and the chip in the laminating process through the acrylate glue film attached to the upper and lower sides of the chip, support the material of the chip area, prevent the chip area material from being dented and deformed after high-temperature lamination, ensure the beauty of the electronic passport information page, and avoid premature aging and cracking.

Description

Technical Field

[0001] This utility model relates to the technical field of laminated passport pages, and more particularly to an inlay layer for a laminated electronic passport information page with an acrylic film. Background Technology

[0002] Similar to traditional cards, the data page of the electronic passport is also assembled from multiple layers of PC material and PET hinges. After assembly, it is placed in a laminate for lamination. The multiple layers of PC and PET hinges need to be laminated at high temperature to melt and form an effective bond. Finally, a cutting machine is used to ensure the straightness and appearance quality of the product. The difference between the electronic passport and traditional cards is that a chip is embedded in the multiple layers of PC.

[0003] The existing electronic passport information page has a layer with a space slightly larger than the chip size, and the chip is implanted in it. If it is directly laminated, the high temperature during the process will cause the material in the chip area to dent and deform, which will directly affect the quality and appearance of the product, increase the possibility of material cracking in the chip area and accelerate the aging of the product. The reduction in material strength will also weaken the protection of the chip. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] In view of the problems existing in the existing laminated electronic passport information page inlay layer with acrylic film, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a laminated electronic passport information page inlay layer with an acrylic film, the purpose of which is to fill the gap between the chip hole and the chip, and to prevent the chip area material from sinking during high-temperature lamination.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a laminated electronic passport information page inlay layer with an acrylic film, including a protective layer, a compensation layer, an embedded wire layer, and a PET hinge layer.

[0008] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylic film described in this utility model, the compensation layer has a first chip hole.

[0009] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylic film described in this utility model, copper wires are wound on the embedded wire layer, and a second chip hole overlapping the first chip hole is opened within the copper wire.

[0010] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylic film described in this utility model, a chip is disposed between the first chip hole and the second chip hole, and an acrylic film is attached to both the upper and lower sides of the chip.

[0011] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylic film described in this utility model, the protective layer has two layers with a thickness of 0.05mm.

[0012] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylic film described in this utility model, the thickness of the compensation layer is 0.15mm.

[0013] In a preferred embodiment of the laminated electronic passport information page inlay layer with an acrylic film described in this utility model, the thickness of the embedded wire layer is 0.1 mm, and the diameter of the copper wire is 0.1 mm.

[0014] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylate film described in this utility model, the thickness of the chip is 240μm.

[0015] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylic film described in this utility model, the acrylic film has a thickness of 0.04 mm, a length of 15 mm, and a width of 9 mm.

[0016] As a preferred embodiment of the laminated electronic passport information page inlay layer with acrylic film described in this utility model, the PET hinge layer has a thickness of 0.1 mm, a width of 20 mm, and a particle size of 150 mesh.

[0017] The beneficial effects of this invention are as follows: By attaching an acrylic film to the top and bottom sides of the chip, the gap between the chip holes and the chip can be filled during the lamination process to support the material in the chip area, prevent the PC material from sinking and deforming in the chip area after high-temperature lamination, ensure the aesthetics of the electronic passport information page, and avoid premature aging and cracking. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the inlay layer of a laminated electronic passport information page with an acrylic film according to this utility model.

[0019] Figure 2 This is an exploded view of the inlay layer of a laminated electronic passport information page with an acrylic film according to this utility model.

[0020] Figure 3 This is a flowchart illustrating the manufacturing process of the inlay layer of a laminated electronic passport information page with an acrylic film, according to this utility model.

[0021] Figure 4 This is a physical image of an acrylic film with an acrylic film in the inlay layer of a laminated electronic passport information page according to this utility model.

[0022] Figure 5 This is a diagram illustrating an acrylic film with an acrylic film in the inlay layer of a laminated electronic passport information page according to this invention. Detailed Implementation

[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0026] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0027] Example 1 Reference Figures 1-2 The first embodiment of this utility model provides a laminated electronic passport information page inlay layer with an acrylic film. This laminated electronic passport information page inlay layer with an acrylic film includes a protective layer 100, a compensation layer 200, a wire embedding layer 300, and a PET hinge layer 400.

[0028] The embedded wire layer carries the sensing circuit; the compensation layer is placed on top of the embedded wire layer to compensate for the thickness difference caused by the sensing circuit and maintain the flatness of the overall structure; part of the PET hinge layer is placed between the embedded wire layer and the compensation layer to fuse with the main material during lamination to form a firm fixation; another part is exposed at the edge of the information page to serve as a flexible connection for sewing and binding with the passport; finally, two protective layers wrap the entire structure to protect the core layer.

[0029] Example 2 Reference Figure 1 , Figure 2 , Figure 4 and Figure 5 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that a first chip hole 201 is provided on the compensation layer 200.

[0030] A copper wire 301 is wound on the buried wire layer 300, and a second chip hole 302 that coincides with the first chip hole 201 is opened within the copper wire 301.

[0031] A chip 303 is disposed between the first chip hole 201 and the second chip hole 302, and an acrylic film 304 is attached to both the upper and lower sides of the chip 303.

[0032] The first chip hole and the second chip hole are interconnected to form a space for accommodating the chip. Copper wires in the embedded layer surround the chip hole to form a sealed space. Induction current is generated in the changing magnetic field to power the chip. The chip is attached to the chip hole and fixed to the copper wires by welding. Acrylic films attached to the top and bottom sides of the chip fill the tiny gaps between the chip and the chip hole wall under the high temperature and high pressure of lamination, avoiding surface depression and deformation caused by the existence of gaps.

[0033] The remaining structure is the same as that in Example 1.

[0034] Example 3 Reference Figures 1-2 This is the third embodiment of the present invention. The difference between this embodiment and the second embodiment is that the protective layer 100 has two layers with a thickness of 0.05mm.

[0035] The thickness of the compensation layer 200 is 0.15 mm.

[0036] The thickness of the embedded wire layer 300 is 0.1mm. The diameter of the copper wire 301 is 0.1mm.

[0037] The thickness of chip 303 is 240μm.

[0038] The 304 acrylic film has a thickness of 0.04 mm, a length of 15 mm, and a width of 9 mm.

[0039] The PET hinge layer 400 has a thickness of 0.1mm, a width of 20mm, and a particle size of 150 mesh.

[0040] The specific information is shown in the table below: The remaining structure is the same as that in Example 2.

[0041] Example 4 Reference Figure 3 This is the fourth embodiment of the present invention, which differs from the third embodiment in that it provides a preparation process for a laminated electronic passport information page inlay layer with an acrylic film.

[0042] The process includes the following steps: importing the drawing into the drilling machine to drill holes in the compensation layer and the embedded wire layer, ensuring that the compensation layer and the embedded wire layer are closely aligned to ensure accurate positioning; setting the drilling depth of the drilling machine according to the material thickness, and then starting the equipment to drill holes; after drilling, cleaning up the waste material and checking whether the drilling is qualified.

[0043] To perform wire embedding on the embedded layer, first install the copper wire on the embedding machine and pass it through the ultrasonic embedding head; place the embedded layer with the chip holes pre-drilled on the embedding platform, set the embedding program, and start the embedding equipment to begin embedding; after embedding is completed, check for broken wires, loose wires, or other defects.

[0044] An acrylic film is attached to both the top and bottom of the chip. The film is slightly larger than the chip and can completely cover the chip area. The chip is then attached between the first and second chip holes and soldered in place using a spot soldering machine. After soldering, the solder joints are inspected for any signs of cold solder joints.

[0045] Bind the PET hinge layer with the compensation layer, the embedded wire layer, and the protective layer. The PET hinge layer should be placed between the compensation layer and the embedded wire layer. The exposed width of the PET hinge layer is 12mm, and the width of the bonding with the compensation layer and the embedded wire layer is 8mm. There is a protective layer on each of the outer sides of the compensation layer and the embedded wire layer. Use a welding head to fix them.

[0046] Place the bound electronic passport information page on the laminator, turn on the laminator, and set the laminator parameters to 180 degrees and 180 N / cm. 2 Laminate for 20 minutes. After lamination, use a cutting machine to trim the edges of the product.

[0047] The remaining structure is the same as that in Example 3.

[0048] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A laminated electronic passport information page inlay layer having an acrylic film, characterized in that: It includes a protective layer (100), a compensation layer (200), a wire embedding layer (300), and a PET hinge layer (400); the compensation layer (200) has a first chip hole (201); the wire embedding layer (300) is wound with a copper wire (301), and a second chip hole (302) that overlaps with the first chip hole (201) is opened within the copper wire (301); a chip (303) is disposed between the first chip hole (201) and the second chip hole (302), and an acrylic film (304) is attached to both the upper and lower sides of the chip (303).

2. The laminated electronic passport information page inlay layer with an acrylic film according to claim 1, characterized in that: The protective layer (100) has two layers and a thickness of 0.05 mm.

3. The laminated electronic passport information page inlay layer with an acrylic film according to claim 1, characterized in that: The thickness of the compensation layer (200) is 0.15 mm.

4. The laminated electronic passport information page inlay layer with an acrylic film according to claim 1, characterized in that: The thickness of the embedded wire layer (300) is 0.1 mm; the diameter of the copper wire (301) is 0.1 mm.

5. The laminated electronic passport information page inlay layer with an acrylic film according to claim 1, characterized in that: The thickness of the chip (303) is 240 μm.

6. The laminated electronic passport information page inlay layer with an acrylic film according to claim 1, characterized in that: The acrylic film (304) has a thickness of 0.04 mm, a length of 15 mm, and a width of 9 mm.

7. The laminated electronic passport information page inlay layer with an acrylic film according to claim 1, characterized in that: The PET hinge layer (400) has a thickness of 0.1 mm, a width of 20 mm, and a particle size of 150 mesh.

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