Package substrate carrier

Abstract

The utility model provides a kind of packaging substrate carrying jig, by being provided with bearing area in the edge of the opening of the empty window of base, and multiple limit pegs are set on the base in the periphery of bearing area, the limit peg includes inner core and buffer cap, the bottom of the inner core is fixed on the base, the buffer cap is sleeved on the inner core, and the buffer cap has elasticity, can buffer the impact of glass substrate edge and limit peg in packaging operation carrying process, can reduce the risk of microcrack on glass substrate, avoid the substrate bending deformation in subsequent processing flow with heat process makes microcrack expand to cause substrate delamination etc. Bad, improve packaging product reliability, can also satisfy the compatibility of glass substrate packaging process to existing each machine, can realize the packaging of glass substrate on the basis of not needing additional adjustment machine parts.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a packaging substrate transport fixture. Background Technology

[0002] As artificial intelligence places increasingly higher demands on chip performance, chip density and packaging size continue to increase. Traditional organic substrates are facing increasingly serious warping problems. Packaging substrates with glass cores represent a technological direction for overcoming this challenge.

[0003] However, glass itself has the inherent defect of being fragile. During the packaging process, the traditional transport fixture consists of a metal base and metal limiting pins. During the packaging process, the packaged product moves with the transport fixture within the machine's transport track. When the movement stops, due to inertia, the packaged substrate comes into contact with and impacts the limiting pins. At this time, the edge of the glass core packaged substrate is very prone to micro-cracks, which affects the subsequent reliability of the packaged product.

[0004] Providing a fixture to prevent edge cracks in the packaging substrate during the packaging process is of great significance for improving the reliability of the packaging substrate packaging products. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to provide a packaging substrate transport fixture that can prevent edge microcracks from occurring on the packaging substrate, especially the glass packaging substrate, during the packaging process.

[0006] To address the aforementioned problems, this utility model provides a packaging substrate transport fixture, comprising: a base including a window with an opening, the edge of which is provided with a bearing area for supporting the packaging substrate; and a plurality of limiting pins disposed on the base and located around the bearing area, each limiting pin including an inner core and a buffer cap, the bottom of the inner core being fixed to the base, the buffer cap being sleeved on the inner core, and the buffer cap being elastic.

[0007] In some embodiments, the base includes a plurality of spaced-apart windows.

[0008] In some embodiments, there are strip-shaped through holes between the windows.

[0009] In some embodiments, the maximum width of the window is greater than the width of the packaging substrate, and the maximum length of the window is greater than the length of the packaging substrate.

[0010] In some embodiments, the window has multiple apex corner regions, the edges of the apex corner regions are provided with the bearing area, and the periphery of each bearing area is provided with two limiting pins.

[0011] In some embodiments, the surface of the inner core has annular protrusions.

[0012] In some embodiments, the surface of the inner core has one or more annular protrusions.

[0013] In some embodiments, the difference between the inner and outer diameters of the annular protrusion is 0.1 to 0.5 mm.

[0014] In some embodiments, the annular protrusion is located longitudinally between the surface of the base and half the height of the inner core.

[0015] In some embodiments, the top of the inner core has a chamfer.

[0016] In some embodiments, the chamfer at the top of the inner core is a straight chamfer, a rounded chamfer, or a composite chamfer, wherein the composite chamfer is composed of two or more chamfer shapes.

[0017] In some embodiments, the inner core and the base are integrally formed.

[0018] In some embodiments, the cross-section of the inner core is circular, and the top and bottom cross-sectional sizes of the inner core may be the same or different.

[0019] In some embodiments, a brim receiving groove is formed on the base surface around the bottom of the inner core, and the cushioning cap includes a cap body and a brim, the cap body completely covering the inner core and the brim being located within the brim receiving groove.

[0020] In some embodiments, the cap body is hollow inside, and the inner diameter of the cap body is less than or equal to the outer diameter of the inner core.

[0021] In some embodiments, the height of the cap body is greater than or equal to the height of the inner core.

[0022] In some embodiments, the top of the cap is closed and completely covers the top of the inner core.

[0023] In some embodiments, the cap body is cylindrical.

[0024] In some embodiments, the cap brim receiving groove is an annular groove surrounding the inner core.

[0025] In some embodiments, the depth of the brim receiving groove is greater than or equal to the thickness of the brim.

[0026] In some embodiments, when the packaging substrate is placed in the bearing area, there is a gap between the packaging substrate and the limiting pin, the gap being 0.2 to 0.5 mm.

[0027] The above technical solution, by setting a bearing area at the edge of the opening of the window in the base, and setting multiple limiting pins on the base around the bearing area, the limiting pins include an inner core and a buffer cap. The bottom of the inner core is fixed to the base, and the buffer cap is sleeved on the inner core. The buffer cap is elastic and can buffer the impact between the edge of the glass substrate and the limiting pin during the packaging operation. This can reduce the risk of microcracks on the glass substrate and avoid defects such as substrate delamination caused by substrate bending and deformation during subsequent processing with thermal processes. This improves the reliability of the packaged product and can also meet the compatibility of the glass substrate packaging process with existing machines, enabling the packaging of glass substrates without additional adjustment of machine accessories.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the present invention. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is an overall top view of the packaging substrate transport fixture provided in the first embodiment of the present invention, which carries the packaging substrate.

[0031] Figure 2 This is a front view schematic diagram of the inner core of the limiting nail provided in the first embodiment of this utility model;

[0032] Figure 3 This is a front view schematic diagram of the buffer cap of the limiting nail provided in the first embodiment of this utility model;

[0033] Figure 4 This is a top view schematic diagram of the brim receiving groove provided in the first embodiment of the present utility model;

[0034] Figure 5 This is a cross-sectional view of the limiting nail on the base provided in the first embodiment of this utility model;

[0035] Figure 6 This is a front view schematic diagram of the inner core of the limiting nail provided in the second embodiment of this utility model;

[0036] Figure 7This is a cross-sectional view of the limiting nail on the base provided in the second embodiment of this utility model;

[0037] Figure 8 This is a front view schematic diagram of the inner core of the limiting nail provided in the third embodiment of this utility model;

[0038] Figure 9 This is a front view schematic diagram of the buffer cap of the limiting nail provided in the third embodiment of this utility model;

[0039] Figure 10 This is a cross-sectional view of the limiting nail on the base provided in the third embodiment of this utility model. Detailed Implementation

[0040] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0041] For the first embodiment, please refer to... Figures 1-5 ,in, Figure 1 This is an overall top view of the packaging substrate transport fixture provided in the first embodiment of the present invention, which carries the packaging substrate. Figure 2 This is a front view schematic diagram of the inner core of the limiting nail provided in the first embodiment of this utility model; Figure 3 This is a front view schematic diagram of the buffer cap of the limiting nail provided in the first embodiment of this utility model; Figure 4 This is a top view schematic diagram of the brim receiving groove provided in the first embodiment of the present utility model; Figure 5 This is a cross-sectional view of the limiting nail on the base provided in the first embodiment of this utility model.

[0042] like Figure 1 As shown, the packaging substrate transport fixture includes a base 11 and a plurality of limiting pins 13. The base 11 includes a window 12. The window 12 has an opening, and a bearing area 121 is provided at the edge of the opening. The bearing area 121 is used to bear the packaging substrate 10. The limiting pins 13 are disposed on the base 11 and are located around the bearing area 121.

[0043] refer to Figure 2 , Figure 3 and Figure 4 The limiting pin 13 includes an inner core 131 and a buffer cap 132. The bottom of the inner core 131 is fixed to the base 11, and the buffer cap 132 is sleeved on the inner core 131 and is elastic.

[0044] The following is a detailed explanation.

[0045] During the packaging process, the opening 12 is used for vacuum adsorption between the bottom of the packaging substrate 10 and each machine platform. The maximum width of the opening 12 in the lateral direction is greater than the width of the packaging substrate 10, and the maximum length of the opening 12 in the longitudinal direction is greater than the length of the packaging substrate 10. Figure 1 As shown, the window 12 extends beyond the corresponding side of the packaging substrate 10 on both sides in the horizontal direction, and extends beyond the corresponding side of the packaging substrate 10 on both sides in the vertical direction. In this embodiment, the maximum width of the opening of the window 12 in the horizontal direction is 10-15 mm greater than the width of the packaging substrate 10, and the maximum length of the opening of the window 12 in the vertical direction is 10-15 mm greater than the length of the packaging substrate 10.

[0046] The bearing area 121 is used to contact the edge region of the top corner of the packaging substrate 10. The width of the bearing area 121 is 2 to 5 mm.

[0047] refer to Figure 1 The window 12 has multiple corner regions, and the edges of the corner regions are provided with the bearing area 121. Specifically, each window 12 has four corner regions, and the edge of each corner region is provided with the bearing area 121. Two limiting pins 13 are provided around the periphery of each bearing area 121, and correspondingly, each window 12 corresponds to eight limiting pins 13. In some embodiments, four limiting pins 13 are provided around the periphery of each bearing area 121.

[0048] The base 11 includes a plurality of spaced-apart windows 12. In this embodiment, there are strip-shaped through holes 14 between the windows 12. The strip-shaped through holes 14 are used to relieve the internal stress of the base 11, thereby reducing the warpage of the packaging substrate carrier fixture and thus reducing the impact of warpage on the packaging substrate 10.

[0049] The windows 12 are arranged in a matrix on the base 11. Figure 1 The four windows 12 shown are simply a row of windows 12 arranged in a matrix on the base 11. Each window 12, as well as the corresponding bearing area 121 and the limiting pin 13, have the same structure.

[0050] Continue to refer to Figure 2The top of the inner core 131 has a chamfer, which facilitates the fitting of the buffer cap 132 onto the surface of the inner core 131. In this embodiment, the chamfer is a rounded chamfer, which can be formed by a rounding process, for example, by machining a sharp right angle into a rounded surface.

[0051] The surface of the inner core 131 has annular protrusions 1311. Figure 2 In the inner core 131, the surface of the inner core 131 has a ring of annular protrusions 1311 along the circumferential direction.

[0052] The cross-section of the inner core 131 is circular. Specifically, the cross-section of the annular protrusion 1311 of the inner core 131 and the cross-section of the portion of the inner core 131 excluding the annular protrusion 1311 are both circular.

[0053] The top and bottom cross-sectional sizes of the inner core 131 may be the same or different. In this embodiment, the portion of the inner core 131 excluding the annular protrusion 1311 is cylindrical. The top and bottom cross-sectional sizes of the inner core 131 are the same. Specifically, the outer diameter of the portion of the inner core 131 excluding the annular protrusion 1311 is 1–3 mm, and the height of the inner core 131 is 2–5 mm.

[0054] The difference between the inner and outer diameters of the annular protrusion 1311 is 0.1 to 0.5 mm, meaning that the width of the annular protrusion 1311 is 0.05 to 0.25 mm. The surface of the annular protrusion 1311 facing the outer surface of the inner core 131 is an arc surface.

[0055] The annular protrusion 1311 is located longitudinally between the surface of the base 11 and half the height of the inner core 131, which facilitates the fitting of the buffer cap 132 onto the surface of the inner core 131 and also facilitates the fastening of the buffer cap 132 and the inner core 131.

[0056] like Figure 3 As shown, the buffer cap 132 includes a cap body 1321 and a cap brim 1322. The cap body 1321 has a circular cross-section. The cap body 1321 is hollow, and its inner diameter is less than or equal to the outer diameter of the inner core 131. When the inner core 131 has the annular protrusion 1311 on its surface, the inner diameter of the cap body 1321 is less than or equal to the outer diameter of the portion of the inner core 131 excluding the annular protrusion 1311. Figure 3The dotted line represents the hollow inner space 1323 of the cap, which is cylindrical and has the same structure as the inner core 131. Correspondingly, the diameter of the inner space 1323 is smaller than the outer diameter of the portion of the inner core 131 excluding the annular protrusion 1311.

[0057] The inner core 131 is made of metal. The inner core 131 is fixed to the base 11.

[0058] The cap body 1321 is elastic. The cap body 1321 is made of a high-temperature resistant, acid and alkali corrosion resistant, and possesses a certain degree of elasticity and ductility polymer material. This allows the cap body 1321 to be fitted over and completely cover the inner core 131, even when the inner diameter of the cap body 1321 is less than or equal to the outer diameter of the portion of the inner core 131 excluding the annular protrusion 1311. In this embodiment, the material of the cap body 1321 is one of silicone, polytetrafluoroethylene, or polyetheretherketone.

[0059] The height of the cap body 1321 is greater than or equal to the height of the inner core 131. Figure 3 In this case, the top of the cap body 1321 is closed and completely covers the top of the inner core 131, therefore, the height of the cap body 1321 is greater than the height of the inner core 131.

[0060] In some embodiments, the top of the cap 1321 has an opening, which allows the cap 1321 to be fitted until its top surface is flush with the top of the inner core 131, and the height of the cap 1321 is equal to the height of the inner core 131.

[0061] The thickness of the brim 1322 is 0.1 to 0.5 mm.

[0062] A brim receiving groove 112 is formed on the surface of the base 11 around the bottom of the inner core 131, the cap body 1321 completely covers the inner core 131 and the brim 1322 is located in the brim receiving groove 112.

[0063] Since the bottom of the inner core 131 is fixed to the base 11, and the surface of the base 11 around the bottom of the inner core 131 is recessed to form the cap brim receiving groove 112, the bottom surface of the inner core 131 is lower than the surface of the base 11.

[0064] like Figure 4 As shown, the brim receiving groove 112 is an annular groove on the base 11 surrounding the inner core 131, so as to conform to the shape of the brim 1322.

[0065] like Figure 5As shown, the depth of the brim receiving groove 112 is greater than or equal to the thickness of the brim 1322, so that the brim 1322 can be completely placed in the brim receiving groove 112. The longitudinal cross-section of the brim receiving groove 112 is rectangular, which is consistent with the longitudinal cross-sectional shape of the brim 1322.

[0066] Figure 5 Both the base 11 and the inner core 131 are made of metal. In the actual installation process, after the base 11 and the inner core 131 are formed, the bottom of the inner core 131 is fixed to the base 11.

[0067] When the encapsulation substrate 10 is placed in the bearing area 121, there is a gap between the encapsulation substrate 10 and the limiting pin 13, the gap being 0.2 to 0.5 mm. In this embodiment, the portion of the cap 1321 corresponding to the annular protrusion 1311 protrudes outward, that is, the distance between the portion of the cap 1321 corresponding to the annular protrusion 1311 and the encapsulation substrate is 0.2 to 0.5 mm.

[0068] In this embodiment, the packaging substrate 10 is a glass substrate. By adding the buffer cap 132 to the periphery of the inner core 131 of the limiting pin 13, the impact between the edge of the glass substrate and the limiting pin 13 can be buffered, thereby reducing the risk of microcracks on the glass substrate. This avoids defects such as glass substrate delamination caused by the expansion of microcracks due to bending deformation of the glass substrate during subsequent processing with thermal processes, thus improving the reliability of the packaged product.

[0069] In addition, the transport fixture with the buffer cap 132 can meet the compatibility requirements of the glass substrate packaging process with existing machines, thereby enabling the packaging of glass substrates without additional adjustments to machine accessories.

[0070] For the second embodiment, please refer to... Figures 6-7 ,in, Figure 6 This is a front view schematic diagram of the inner core of the limiting nail provided in the second embodiment of this utility model; Figure 7 This is a cross-sectional view of the limiting nail on the base provided in the second embodiment of this utility model.

[0071] In the second embodiment, the structure of the substrate and the window is the same as in the first embodiment, and can be referred to accordingly. Figure 1 The structure of the cap of the limiting pin is the same as that in the first embodiment, and can be referred to accordingly. Figure 3 The structure of the cap brim receiving groove is the same as in the first embodiment, and can be referred to accordingly. Figure 4 The difference between the second embodiment and the first embodiment lies in the structure of the inner core of the limiting pin.

[0072] like Figure 6 As shown, the inner core 231, excluding the annular protrusion 2311, is cylindrical. The chamfer at the top of the inner core 231 is a straight chamfer, forming a bevel at a specific angle using a right-angle chamfer.

[0073] In some embodiments, the chamfer at the top of the inner core 231 is a composite chamfer, which is composed of two or more chamfer shapes. For example, the composite chamfer is formed by splicing a straight chamfer and a rounded chamfer, or the composite chamfer is formed by splicing two rounded chamfers with different curvatures, or the composite chamfer is formed by splicing two straight chamfers with different inclination angles.

[0074] Similar to the first embodiment, such as Figure 7 As shown, the buffer cap 232 includes the cap body 2321 and the cap brim 2322. The cap body 2321 is hollow inside, and the inner diameter of the cap body 2321 is less than or equal to the outer diameter of the inner core 231.

[0075] The surface of the inner core 231 has multiple rings of annular protrusions 2311. In a second embodiment, the outer periphery of the surface of the inner core 231 has two rings of annular protrusions 2311. The difference between the inner and outer diameters of each ring of annular protrusions 2311 is 0.1 to 0.5 mm, and the outer diameters of the two rings of annular protrusions 2311 are the same. The position of each ring of annular protrusions 231 is located longitudinally between the surface of the base 21 and half the height of the inner core, thereby better securing the buffer cap 232 to the surface of the inner core 231.

[0076] In some embodiments, the annular protrusions 2311 on the surface of the inner core 231 are three or more rings, and the outer diameters of the annular protrusions 2311 of different rings are different. The buffer cap 232 is fastened to the surface of the inner core 231 by increasing the undulation of the surface of the inner core 231.

[0077] like Figure 7 As shown, the inner core 231 and the base 21 are integrally formed to better secure them together. In the second embodiment, the inner core 231 and the base 21 are made of the same metal material. Simultaneously with forming the inner core 231, a cap-edge receiving groove (not shown) is formed around the bottom of the inner core 231.

[0078] Third embodiment, please refer to Figures 8-10 ,in, Figure 8 This is a front view schematic diagram of the inner core of the limiting nail provided in the third embodiment of this utility model; Figure 9 This is a front view schematic diagram of the buffer cap of the limiting nail provided in the third embodiment of this utility model; Figure 10This is a cross-sectional view of the limiting nail on the base provided in the third embodiment of this utility model.

[0079] In the third embodiment, the structure of the substrate and the window is the same as in the first embodiment, and can be referred to accordingly. Figure 1 The structure of the cap brim receiving groove is the same as in the first embodiment, and can be referred to accordingly. Figure 4 The difference between the third embodiment and the first embodiment lies in the different structures of the cap and inner core of the limiting pin.

[0080] like Figure 8 As shown, the cross-section of the inner core 331 is circular, and the cross-sectional sizes of the top and bottom of the inner core 331 are different. Specifically, the cross-sectional size of the top of the inner core 331 is smaller than the cross-sectional size of the bottom of the inner core 331.

[0081] This utility model does not limit the cross-sections of different parts of the inner core 331 to be the same. In some embodiments, the top and bottom cross-sections of the inner core 331 are the same size, but the top cross-section of the inner core 331 is different from the cross-section of the middle section of the inner core 331.

[0082] The annular protrusion 3311 is positioned longitudinally between the surface of the base 11 and half the height of the inner core 331, to facilitate the fastening of the buffer cap 332 and the inner core 331. The difference between the inner and outer diameters of the annular protrusion 3311 is 0.1 to 0.5 mm.

[0083] The top of the inner core 331 has a rounded chamfer to facilitate the pressing of the buffer cap 332.

[0084] like Figure 9 As shown, the cushioning cap 332 includes the cap body 3321 and the cap brim 3322. The cap body 3321 has a circular cross-section and is cylindrical in shape. The cap body 3321 is hollow inside. Figure 9 The dotted line portion represents the hollow inner space 3323 of the cap, which is cylindrical.

[0085] The material of the cap 3321 is one of silicone, polytetrafluoroethylene, and polyetheretherketone.

[0086] like Figure 10 As shown, compared with the first and second embodiments, the cap body 3321 in the third embodiment is thicker, and when the cap body 3321 is fitted onto the inner core 331, the outer shape of the cap body 3321 remains cylindrical.

[0087] The above technical solution, by setting a bearing area at the edge of the opening of the window in the base, and setting multiple limiting pins on the base around the bearing area, the limiting pins include an inner core and a buffer cap. The bottom of the inner core is fixed to the base, and the buffer cap is sleeved on the inner core. The buffer cap is elastic and can buffer the impact between the edge of the glass substrate and the limiting pin during the packaging operation. This can reduce the risk of microcracks on the glass substrate and avoid defects such as substrate delamination caused by substrate bending and deformation during subsequent processing with thermal processes. This improves the reliability of the packaged product and also enables the glass substrate packaging process to be adapted to existing machines, allowing glass substrate packaging to be performed without additional adjustments to machine accessories.

[0088] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion. The various embodiments in this specification are described in a related manner, and similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments.

[0089] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A packaging substrate transport fixture, characterized in that, include: The base includes a window with an opening, and a bearing area is provided at the edge of the opening for supporting the encapsulation substrate. Multiple limiting pins are provided on the base and located on the periphery of the bearing area. Each limiting pin includes an inner core and a buffer cap. The bottom of the inner core is fixed to the base, and the buffer cap is sleeved on the inner core and is elastic.

2. The packaging substrate transport fixture according to claim 1, characterized in that, The base includes a plurality of spaced-apart windows.

3. The packaging substrate transport fixture according to claim 2, characterized in that, The windows are connected by strip-shaped through holes.

4. The packaging substrate transport fixture according to claim 1, characterized in that, The maximum width of the window is greater than the width of the packaging substrate, and the maximum length of the window is greater than the length of the packaging substrate.

5. The packaging substrate transport fixture according to claim 1, characterized in that, The empty window has multiple top corner areas, and the edges of the top corner areas are provided with the bearing areas. Each bearing area is surrounded by two limiting pins.

6. The packaging substrate transport fixture according to claim 1, characterized in that, The surface of the inner core has annular protrusions.

7. The packaging substrate transport fixture according to claim 6, characterized in that, The annular protrusion is located longitudinally between the surface of the base and half the height of the inner core.

8. The packaging substrate transport fixture according to claim 6, characterized in that, The surface of the inner core has one or more ring-shaped protrusions.

9. The packaging substrate transport fixture according to claim 6, characterized in that, The difference between the inner and outer diameters of the annular protrusion is 0.1 to 0.5 mm.

10. The packaging substrate transport fixture according to claim 1, characterized in that, The top of the inner core has a chamfer.

11. The packaging substrate transport fixture according to claim 10, characterized in that, The chamfer at the top of the inner core is a straight chamfer, a rounded chamfer, or a composite chamfer, wherein the composite chamfer is composed of two or more chamfer shapes.

12. The packaging substrate transport fixture according to claim 1, characterized in that, The inner core and the base are integrally formed.

13. The packaging substrate transport fixture according to claim 1, characterized in that, The inner core has a circular cross-section, and the top and bottom cross-sections of the inner core may be the same or different.

14. The packaging substrate transport fixture according to claim 1, characterized in that, A brim receiving groove is formed on the base surface around the bottom of the inner core. The buffer cap includes a cap body and a brim, the cap body completely covers the inner core and the brim is located in the brim receiving groove.

15. The packaging substrate transport fixture according to claim 14, characterized in that, The cap body is hollow inside, and the inner diameter of the cap body is less than or equal to the outer diameter of the inner core.

16. The packaging substrate transport fixture according to claim 14, characterized in that, The height of the cap body is greater than or equal to the height of the inner core.

17. The packaging substrate transport fixture according to claim 14, characterized in that, The top of the cap is closed and completely covers the top of the inner core.

18. The packaging substrate transport fixture according to claim 14, characterized in that, The cap is cylindrical.

19. The packaging substrate transport fixture according to claim 14, characterized in that, The cap brim receiving groove is an annular groove surrounding the inner core.

20. The packaging substrate transport fixture according to claim 14, characterized in that, The depth of the brim receiving groove is greater than or equal to the thickness of the brim.

21. The packaging substrate transport fixture according to claim 1, characterized in that, When the packaging substrate is placed in the bearing area, there is a gap between the packaging substrate and the limiting pin, and the gap is 0.2 to 0.5 mm.

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