A multi-layer stacking anti-toppling limiting structure for semiconductor device transportation

Abstract

The utility model relates to the field of anti -toppling limiting structure, concretely relates to a kind of multilevel stacking anti-toppling limiting structure of semiconductor equipment transportation, including limiting base, for multilevel stacking of semiconductor equipment transportation.The utility model relates to a kind of multilevel stacking anti-toppling limiting structure of semiconductor equipment transportation, through the setting of placing plate, fixed sleeve, telescopic link, handle, limiting post, second spring, butt block, screw rod, moving seat and insert block, the distance between multiple placing plates can be adjusted according to the size of semiconductor equipment, by pulling handle and driving telescopic link to move in fixed sleeve, so that the limiting post in the inboard of handle is separated from the limiting hole outside fixed sleeve, then rotating handle drives telescopic link, butt block and screw rod to rotate, and the telescopic of moving seat and insert block on both sides into placing plate is driven by screw rod rotation, so that insert block is separated from the slot in the inside of support frame, then the distance between multiple placing plates is adjusted, and semiconductor equipment transportation stacking is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of anti-tipping limiting structures, specifically to a multi-level stacked anti-tipping limiting structure for transporting semiconductor equipment. Background Technology

[0002] The multi-level stacking anti-tipping limiting structure for semiconductor equipment transportation is a device architecture specifically designed for the safe and stable transportation of semiconductor equipment. Through multi-level layout, reasonable stacking method and effective limiting and anti-tipping measures, it ensures that semiconductor equipment is not damaged during transportation.

[0003] Traditional multi-level stacking anti-tipping limiting structures for transporting semiconductor equipment mostly simply place the semiconductor equipment on placement plates inside the frame, without adjusting the height of the placement plates according to the size of the semiconductor equipment. Different sizes of semiconductor equipment have significantly different center of gravity heights. When the height of the placement plates cannot be adjusted, if the center of gravity of the equipment is high and multiple layers are stacked, the center of gravity of the entire stacking structure will also rise. During transportation, when encountering bumps, turns, or sudden braking, it is easy to tip over, resulting in equipment damage. At the same time, for smaller semiconductor equipment, the placement plate height is fixed and the spacing is large, leaving a lot of empty space above and around the equipment, failing to fully utilize the internal space of the transport frame, reducing transportation efficiency and increasing transportation costs.

[0004] Therefore, it is necessary to invent a multi-level stacking anti-tipping and limiting structure for transporting semiconductor devices to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a multi-level stacking anti-tipping limiting structure for transporting semiconductor equipment. By pulling the handle, a telescopic rod moves within the fixed sleeve, causing the limiting post inside the handle to disengage from the limiting hole outside the fixed sleeve. Then, rotating the handle causes the telescopic rod, connecting block, and screw to rotate. The screw's rotation causes the moving seats and insert blocks on both sides to extend and retract into the placement plate, disengaging the insert blocks from their slots inside the support frame. The distance between multiple placement plates can then be adjusted to facilitate the stacking and transport of semiconductor equipment. This addresses the problem of traditional multi-level stacking anti-tipping limiting structures for transporting semiconductor equipment, which mostly simply place the semiconductor equipment on a frame. The semiconductor devices are placed on internal mounting boards, and the height of the mounting boards cannot be adjusted according to the size of the semiconductor devices. Different sizes of semiconductor devices have significantly different center of gravity heights. When the height of the mounting boards cannot be adjusted, if the center of gravity of the devices is high and multiple layers are stacked, the center of gravity of the entire stacked structure will also rise. During transportation, when encountering bumps, turns, or sudden braking, the devices are prone to tipping over, resulting in equipment damage. At the same time, for smaller semiconductor devices, the height of the mounting boards is fixed and the spacing is large, leaving a lot of empty space above and around the devices. This prevents the full utilization of the internal space of the transport frame, reduces transportation efficiency, and increases transportation costs.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multi-level stacked anti-tipping limiting structure for transporting semiconductor equipment, including a limiting base, for transporting multi-level stacked semiconductor equipment; A support frame is fixed around the upper part of the limiting base, and slots are provided on the inner side of the support frame; A placement plate, located inside the support frame, is used to place semiconductor equipment. A baffle is fixedly connected to the top of the placement plate, and a fixing sleeve is fixedly connected to the right side of the placement plate. A telescopic rod moves through the inside of the fixing sleeve. A handle is fixedly connected to the rear end of the telescopic rod, and limit posts are fixedly connected to the inner side of the handle. A second spring is sleeved on the outside of the telescopic rod, and a docking block is fixedly connected to the front end of the telescopic rod. A screw is movably sleeved on the outside of the docking block, and movable seats are threaded to both sides of the screw. Insert blocks are fixedly connected to the outer ends of the movable seats.

[0007] Preferably, a pull rod extends through both sides of the baffle, a clamp is fixedly connected to the front end of the pull rod, a slide rod extends through both sides of the baffle, a first spring is sleeved on the outside of the slide rod, and the first spring is located between the clamp and the baffle.

[0008] Preferably, the outer side of the fixing sleeve is provided with a limiting hole that matches the limiting post, and the handle is movably engaged with the fixing sleeve through the limiting post.

[0009] Preferably, one end of the screw is provided with a mating groove that matches the mating block, and the mating block and the mating groove are square in shape.

[0010] Preferably, the external threads of the screw are tapped in the opposite direction, and the movable seat is slidably connected to the insert block and the placement plate.

[0011] Preferably, the outer side of the support frame is hinged to an anti-tipping bracket, and the front internal thread of the anti-tipping bracket of the saxaul tree has a threaded rod, the lower end of which is fixedly connected to a support base.

[0012] The technical effects and advantages provided by this utility model in the above technical solution are as follows: This invention, through the arrangement of placement plates, fixing sleeves, telescopic rods, handles, limiting posts, second springs, docking blocks, screws, movable seats, and insert blocks, allows for adjustment of the distance between multiple placement plates according to the size of the semiconductor equipment. By pulling the handle, the telescopic rod moves within the fixing sleeve, causing the limiting post on the inside of the handle to disengage from the limiting hole on the outside of the fixing sleeve. Then, rotating the handle causes the telescopic rod, docking block, and screw to rotate. The rotation of the screw causes the movable seats and insert blocks on both sides to extend and retract into the placement plates, allowing the insert blocks to disengage from the slots inside the support frame. Afterward, the distance between multiple sets of placement plates can be adjusted to facilitate the transportation and stacking of semiconductor equipment. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the clamping plate structure of this utility model; Figure 3 This is a schematic diagram of the movable base and insert block structure of this utility model; Figure 4 This is a schematic diagram of the anti-tipping support structure of this utility model; Figure 5 For the present utility model Figure 3 Enlarged view of the structure at point A in the middle.

[0015] Explanation of reference numerals in the attached figures: 1. Limiting base; 2. Support frame; 3. Slot; 4. Placement plate; 5. Baffle; 6. Pull rod; 7. Clamping plate; 8. Slide rod; 9. First spring; 10. Fixing sleeve; 11. Telescopic rod; 12. Handle; 13. Limiting post; 14. Second spring; 15. Connecting block; 16. Screw; 17. Moving seat; 18. Insert block; 19. Anti-tipping bracket; 20. Threaded rod; 21. Support seat. Detailed Implementation

[0016] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0017] This utility model provides, for example Figure 1-5 The diagram shows a multi-level stacked anti-tipping limiting structure for transporting semiconductor equipment, including a limiting base 1, for transporting multi-level stacked semiconductor equipment. Support frame 2 is fixed around the upper perimeter of the limiting base 1, and slots 3 are provided on the inner side of each support frame 2; A placement plate 4, located inside the support frame 2, is used to place semiconductor equipment. A baffle 5 is fixedly connected to the top of the placement plate 4. A fixing sleeve 10 is fixedly connected to the right side of the placement plate 4. A telescopic rod 11 extends through the inside of the fixing sleeve 10. A handle 12 is fixedly connected to the rear end of the telescopic rod 11. Limiting posts 13 are fixedly connected to the inner side of the handle 12. A second spring 14 is sleeved on the outside of the telescopic rod 11. A docking block 15 is fixedly connected to the front end of the telescopic rod 11. A screw 16 is movably sleeved on the outside of the docking block 15. Threaded connections are made to both sides of the screw 16. The movable seat 17 has two fixedly connected insertion blocks 18 at its outer ends. By pulling the handle 12, the telescopic rod 11 moves within the fixed sleeve 10, causing the limiting post 13 on the inner side of the handle 12 to disengage from the limiting hole on the outer side of the fixed sleeve 10. Then, rotating the handle 12 causes the telescopic rod 11, the docking block 15, and the screw 16 to rotate. The rotation of the screw 16 causes the movable seats 17 and insertion blocks 18 on both sides to extend and retract into the placement plate 4, allowing the insertion blocks 18 to disengage from the slots 3 inside the support frame 2. After that, the distance between multiple sets of placement plates 4 can be adjusted to facilitate the transportation and stacking of semiconductor equipment.

[0018] like Figure 2 As shown, pull rods 6 pass through both sides of the baffle 5, and clamping plates 7 are fixedly connected to the front ends of the pull rods 6. Slide rods 8 pass through both sides of the baffle 5. A first spring 9 is sleeved on the outside of the slide rod 8, and the first spring 9 is located between the clamping plate 7 and the baffle 5. By pulling the pull rods 6, the clamping plate 7 and the first spring 9 outside the slide rod 8 are driven. Then, the semiconductor device is placed on the placement plate 4. Then, the pull rods 6 are released, and the first springs 9 on both sides push the clamping plate 7 to limit the two sides of the semiconductor device, thereby enhancing the stability and limiting of the semiconductor device.

[0019] like Figure 2 and Figure 5 As shown, the outer side of the fixed sleeve 10 is provided with a limiting hole that matches the limiting post 13. The handle 12 is movably engaged with the fixed sleeve 10 through the limiting post 13. When the handle 12 is not pulled, the limiting post 13 on the inner side of the handle 12 is inserted into the fixed sleeve 10 for limiting, thereby preventing others from accidentally touching it and causing the placement plate 4 to loosen. When it is necessary to adjust the height of the placement plate 4 in the support frame 2, simply pull the handle 12 to disengage the inner limiting post 13 from the limiting hole on the outer side of the fixed sleeve 10. Then, the handle 12 can be rotated to drive the telescopic rod 11 and the screw 16 to rotate, so that the moving seat 17 and the insert 18 move relative to each other in the placement plate 4, allowing the insert 18 to disengage from the slot 3 on the inner side of the support frame 2.

[0020] like Figure 5 As shown, one end of the screw 16 has a mating groove that matches the mating block 15. The mating block 15 and the mating groove are square. When the handle 12 is pulled, the telescopic rod 11 and the front mating block 15 move in the mating groove inside the screw 16. Although they move, the mating block 15 will not disengage from the mating groove and will remain connected. Thus, turning the handle 12 can still drive the telescopic rod 11 and the screw 16 to rotate.

[0021] like Figure 3 As shown, the external threads of the screw 16 are tapped in opposite directions. The movable seat 17 is slidably connected to the insert block 18 and the placement plate 4. During the rotation of the screw 16, the external threads on both sides are tapped in opposite directions, thereby driving the two sets of movable seats 17 and insert blocks 18 to move closer or further apart within the placement plate 4.

[0022] like Figure 1 and Figure 4 As shown, an anti-tipping bracket 19 is hinged to the outside of the support frame 2. A threaded rod 20 is threaded through the front internal thread of the anti-tipping bracket 19. A support seat 21 is fixedly connected to the lower end of the threaded rod 20. By rotating the anti-tipping bracket 19 on the outside of the support frame 2, and then rotating the threaded rod 20 on the front of the anti-tipping bracket 19, the support seat 21 is driven to contact the ground, thereby strengthening the overall anti-tipping effect.

[0023] The working principle of this utility model is as follows: First, adjust the height of multiple placement plates 4 inside the support frame 2 according to the required size of the semiconductor equipment. Pulling the handle 12 moves the telescopic rod 11 within the fixed sleeve 10, causing the limiting post 13 inside the handle 12 to disengage from the limiting hole outside the fixed sleeve 10. Then, rotating the handle 12 causes the telescopic rod 11, docking block 15, and screw 16 to rotate. The rotation of the screw 16 causes the moving seats 17 on both sides and the insertion blocks 18 to extend and retract into the placement plates 4, allowing the insertion blocks 18 to disengage from the slots 3 inside the support frame 2. After that, adjust the distance between the multiple sets of placement plates 4 to facilitate the transport and stacking of the semiconductor equipment. Once the distance between them is adjusted, release the handle 12. The second spring 14 outside the telescopic rod 11 rebounds, causing the limiting post 13 inside the handle 12 to retract. The handle 12 is fixed in the limiting hole on the outside of the fixed sleeve 10 to prevent other personnel from touching it. Next, the pull rods 6 on both sides of the baffle 5 are pulled to drive the clamping plate 7 and the first spring 9 outside the squeezing slide rod 8. Then the semiconductor equipment is placed on the placement plate 4. Then the pull rods 6 are released and the first springs 9 on both sides push the clamping plate 7 to limit the semiconductor equipment on both sides, thereby strengthening the stability and limiting of the semiconductor equipment. After that, the entire structure is transported to the transport truck. Finally, the anti-tipping bracket 19 on the outside of the support frame 2 is rotated. Then the threaded rod 20 on the front side of the anti-tipping bracket 19 is rotated to drive the support seat 21 to touch the ground, thereby strengthening the overall anti-tipping effect. In this way, the use process of the multi-level stacked anti-tipping limiting structure for transporting semiconductor equipment is completed.

[0024] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A multi-level stacked anti-tipping limiting structure for transporting semiconductor equipment, characterized in that: Includes a limiting base (1) for transporting multi-level stacked semiconductor equipment; The support frame (2) is fixed around the upper part of the limiting base (1), and slots (3) are provided on the inner side of the support frame (2). A placement plate (4) is set inside the support frame (2) for placing semiconductor equipment. A baffle (5) is fixedly connected above the placement plate (4). A fixing sleeve (10) is fixedly connected to the right side of the placement plate (4). A telescopic rod (11) is movably passed through the inside of the fixing sleeve (10). A handle (12) is fixedly connected to the rear end of the telescopic rod (11). Limiting posts (13) are fixedly connected to the inner side of the handle (12). A second spring (14) is sleeved on the outside of the telescopic rod (11). A docking block (15) is fixedly connected to the front end of the telescopic rod (11). A screw (16) is movably sleeved on the outside of the docking block (15). Moving seats (17) are threaded on both sides of the screw (16). Insert blocks (18) are fixedly connected to the outer ends of the moving seats (17).

2. The multi-level stacking anti-tipping limiting structure for transporting semiconductor equipment according to claim 1, characterized in that: Pull rods (6) are passed through both sides of the baffle (5), and a clamping plate (7) is fixedly connected to the front end of the pull rods (6). Slide rods (8) are passed through both sides of the baffle (5), and a first spring (9) is sleeved on the outside of the slide rods (8), and the first spring (9) is located between the clamping plate (7) and the baffle (5).

3. The multi-level stacking anti-tipping limiting structure for transporting semiconductor equipment according to claim 1, characterized in that: The outer side of the fixed sleeve (10) is provided with a limiting hole that matches the limiting post (13), and the handle (12) is movably engaged with the fixed sleeve (10) through the limiting post (13).

4. The multi-level stacking anti-tipping limiting structure for transporting semiconductor equipment according to claim 1, characterized in that: One end of the screw (16) is provided with a docking groove that matches the docking block (15), and the docking block (15) and the docking groove are square.

5. The multi-level stacking anti-tipping limiting structure for transporting semiconductor equipment according to claim 1, characterized in that: The external threads of the screw (16) are tapped in opposite directions, and the movable seat (17) is slidably connected to the insert (18) and the placement plate (4).

6. The multi-level stacking anti-tipping limiting structure for transporting semiconductor equipment according to claim 1, characterized in that: The support frame (2) is hinged to the outside of an anti-tipping bracket (19). The front internal thread of the anti-tipping bracket (19) is threaded through a threaded rod (20), and the lower end of the threaded rod (20) is fixedly connected to a support seat (21).

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