Lamp wafer box for integrated circuit packaging

Abstract

The utility model discloses a kind of LAMP wafer boxes for integrated circuit sealing and testing, including loading assembly, the loading assembly includes box body and box cover, the top inner wall of box cover is fixedly connected with protective block, box body and box cover are equipped with placing assembly, the placing assembly includes placing seat, placing seat is placed in box body, the top of placing seat is equipped with through opening, the bottom inner wall of through opening is equipped with multiple installation grooves, protective pad is fixedly connected in installation groove, the top of protective pad is equipped with placing groove.The utility model is pressed in the top of wafer by protective block, to fix wafer, at the same time, wafer is clamped by the elasticity of protective pad, to prevent wafer from shaking, and protective block and protective pad adopt one of anti-static high-elasticity EVA bubble cotton, shockproof foam anti-static pearl wool, to effectively prevent wafer from static damage and mechanical vibration in processing and transportation process, to avoid wafer from being damaged in transportation process.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging and testing technology, and in particular to a LAMP wafer cassette for integrated circuit packaging and testing. Background Technology

[0002] Currently, LAMP wafer cassettes are mainly used for loading wafers before integrated circuit packaging and testing, to facilitate the transportation and storage of wafers before processing.

[0003] Existing LAMP wafer cassettes are not very effective at protecting the wafers inside, making them susceptible to damage during transportation and storage. Therefore, in order to better protect the wafers inside the wafer cassettes, promote technological progress in the industry, and improve core technological competitiveness, this application proposes a new implementation scheme that differs from the wafer cassette structure in the prior art. Utility Model Content

[0004] The purpose of this invention is to solve the problem that existing LAMP wafer cassettes do not provide adequate protection for the wafers loaded therein, and to propose a LAMP wafer cassette for integrated circuit packaging and testing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A LAMP wafer cassette for integrated circuit packaging and testing includes a loading assembly. The loading assembly includes a cassette body and a cassette cover. A protective block is fixedly connected to the top inner wall of the cassette cover. A placement assembly is provided inside the cassette body and the cassette cover. The placement assembly includes a placement seat, which is placed inside the cassette body. The top of the placement seat has an opening, and the bottom inner wall of the opening has multiple mounting slots. A protective pad is fixedly connected to the mounting slot, and the top of the protective pad has a placement slot.

[0006] Furthermore, the bottom inner wall of the box body is integrally formed with a guide frame, and the bottom of the placement seat is placed inside the guide frame.

[0007] Furthermore, the top of the inner walls on multiple sides of the box body is provided with guide grooves, and the bottom of the box cover is integrally formed with a sliding frame, which is inserted into the guide grooves.

[0008] Furthermore, the bottom of the box body is provided with two positioning holes, and the top outer wall of the box lid is integrally formed with a positioning block, which engages with the positioning holes.

[0009] Furthermore, two support pads are fixedly connected to the bottom of the placement base, and the support pads are in contact with the bottom inner wall of the box body.

[0010] Furthermore, a suction cup is fixedly connected to the bottom of the placement base.

[0011] Furthermore, the outer walls of both sides of the box lid are fixedly connected with male buckles, and the outer walls of both sides of the box body are fixedly connected with female buckles, which are fastened to the male buckles.

[0012] The beneficial effects of this utility model are as follows: 1. The wafer is secured by a protective block pressed on top of it, while the wafer is clamped by the elasticity of the protective pad to prevent it from shaking. The protective block and the protective pad are made of either anti-static high-elastic EVA foam or shockproof anti-static pearl cotton, which effectively prevents electrostatic damage and mechanical vibration of the wafer during processing and transportation, thus avoiding damage to the wafer during transportation.

[0013] 2. By engaging the positioning port of the upper loading component with the positioning block of the lower loading component to facilitate the stacking of disc boxes, space is saved and transportation efficiency is improved.

[0014] 3. The two suction cups can firmly fix the placement seat in the guide frame, preventing it from shifting due to vibration during transportation, or even colliding with the inner wall of the box and causing damage to the wafer. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a LAMP wafer cassette for integrated circuit packaging and testing proposed in this utility model; Figure 2 This is a front cross-sectional view of the LAMP wafer cassette for integrated circuit packaging and testing proposed in this utility model. Figure 3 This is a cross-sectional view of the placement component of a LAMP wafer cassette for integrated circuit packaging and testing proposed in this utility model. Figure 4 This is a cross-sectional exploded view of a LAMP wafer cassette for integrated circuit packaging and testing proposed in this utility model. Figure 5 This is a schematic diagram of the wafer loading state in a LAMP wafer cassette for integrated circuit packaging and testing proposed in this utility model; Figure 6 This is a schematic diagram of the stacked structure of multiple loading components of a LAMP wafer cassette for integrated circuit packaging and testing proposed in this utility model.

[0016] In the diagram: 1. Loading component; 101. Box body; 102. Guide frame; 103. Guide groove; 104. Positioning port; 105. Box cover; 106. Sliding frame; 107. Positioning block; 108. Protective block; 2. Placement component; 201. Placement seat; 202. Through port; 203. Mounting groove; 204. Protective pad; 205. Placement groove; 206. Support pad; 3. Suction cup; 4. Female buckle; 5. Female buckle. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0018] Reference Figures 1-6 A LAMP wafer cassette for integrated circuit packaging and testing includes a loading assembly 1, which includes a cassette body 101 and a cassette cover 105. A protective block 108 is adhered to the inner top wall of the cassette cover 105. The box body 101 and the box lid 105 are provided with a placement component 2, which includes a placement seat 201, and the placement seat 201 is placed inside the box body 101; The top of the placement base 201 is provided with an opening 202, and the bottom inner wall of the opening 202 is provided with multiple mounting grooves 203. A protective pad 204 is bonded inside the mounting groove 203. Both the protective block 108 and the protective pad 204 are made of one of antistatic high-elastic EVA foam or shockproof foam antistatic pearl cotton, thereby effectively preventing electrostatic damage and mechanical vibration of the wafer during processing and transportation. The top of the protective pad 204 is provided with a placement slot 205, into which the wafer is inserted to facilitate the placement of the wafer.

[0019] The bottom inner wall of the box body 101 is integrally formed with a guide frame 102. The bottom of the placement seat 201 is placed inside the guide frame 102, thereby restricting the placement seat 201 within the guide frame 102 and preventing it from shifting left, right or front and back.

[0020] The top of the inner walls of the box body 101 is provided with guide grooves 103, and the bottom of the box cover 105 is integrally formed with a sliding frame 106. The sliding frame 106 is inserted into the guide grooves 103, which facilitates the closing of the box cover 105 and the box body 101, and at the same time improves the sealing between the box cover 105 and the box body 101.

[0021] The bottom of the box body 101 is provided with two positioning holes 104, and the top outer wall of the box cover 105 is integrally formed with a positioning block 107. The positioning block 107 is engaged with the positioning holes 104 to engage the positioning holes 104 of the upper loading component 1 with the positioning block 107 of the lower loading component 1 so that the round disc boxes can be stacked.

[0022] Two support pads 206 are glued to the bottom of the placement base 201. The support pads 206 contact the bottom inner wall of the box body 101. The support pads 206 are made of high elastic rubber material with a thickness of 2-3mm. The contact between the support pads 206 and the bottom inner wall of the box body 101 forms a flexible support, avoiding wear caused by hard contact between the placement base 201 and the box body 101.

[0023] A suction cup 3 is attached to the bottom of the placement base 201. The suction cup 3 attracts the bottom of the placement base 201, thereby fixing the placement base 201 in the guide frame 102 to prevent the placement base 201 from shifting due to vibration during transportation, or even colliding with the inner wall of the box body 101 and causing damage to the wafer.

[0024] Both sides of the outer wall of the box lid 105 are fixed with male buckles 4 by bolts, and both sides of the outer wall of the box body 101 are fixed with female buckles 5 by bolts. The female buckles 5 and the male buckles 4 are fastened together to lock the box lid 105 and the box body 101.

[0025] The working principle of this embodiment is as follows: In use, firstly, the buckle between the female buckle 4 and the female buckle 5 is released. Then, the cover 105 is opened, and the wafer is inserted into the placement slot 205. Next, the cover 105 is placed on top of the body 101 until the sliding frame 106 is inserted into the guide slot 103, which improves the sealing between the cover 105 and the body 101 and makes the protective block 108 press on the top of the wafer, thereby fixing the wafer. At the same time, the wafer is clamped by the elasticity of the protective pad 204 to prevent the wafer from shaking. The protective block 108 and the protective pad 204 are made of either antistatic high-elastic EVA foam or shockproof antistatic pearl cotton, which effectively prevents electrostatic damage and mechanical vibration of the wafer during processing and transportation. Then, the female buckle 5 and the female buckle 4 are fastened together to lock the cover 105 for the transportation of the wafer. During transportation, the positioning port 104 of the upper loading component 1 is engaged with the positioning block 107 of the lower loading component 1 to facilitate the stacking of the disc boxes and save space.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A LAMP wafer cassette for integrated circuit packaging and testing, comprising a loading assembly (1), characterized in that, The loading component (1) includes a box body (101) and a box cover (105). A protective block (108) is fixedly connected to the top inner wall of the box cover (105). A placement component (2) is provided inside the box body (101) and the box cover (105). The placement component (2) includes a placement seat (201). The placement seat (201) is placed inside the box body (101). The top of the placement seat (201) is provided with an opening (202). The bottom inner wall of the opening (202) is provided with multiple mounting grooves (203). A protective pad (204) is fixedly connected inside the mounting groove (203). The top of the protective pad (204) is provided with a placement groove (205).

2. The LAMP wafer cassette for integrated circuit packaging and testing according to claim 1, characterized in that, The bottom inner wall of the box body (101) is integrally formed with a guide frame (102), and the bottom of the placement seat (201) is placed inside the guide frame (102).

3. The LAMP wafer cassette for integrated circuit packaging and testing according to claim 1, characterized in that, The top of the inner walls of the box body (101) on multiple sides is provided with guide grooves (103), and the bottom of the box cover (105) is integrally formed with a sliding frame (106), which is inserted into the guide grooves (103).

4. The LAMP wafer cassette for integrated circuit packaging and testing according to claim 1, characterized in that, The bottom of the box body (101) is provided with two positioning holes (104), and the top outer wall of the box cover (105) is integrally formed with a positioning block (107), which is engaged with the positioning holes (104).

5. A LAMP wafer cassette for integrated circuit packaging and testing according to claim 1, characterized in that, The bottom of the placement base (201) is fixedly connected to two support pads (206), and the support pads (206) are in contact with the bottom inner wall of the box body (101).

6. The LAMP wafer cassette for integrated circuit packaging and testing according to claim 1, characterized in that, The bottom of the placement seat (201) is fixedly connected to a suction cup (3).

7. A LAMP wafer cassette for integrated circuit packaging and testing according to claim 1, characterized in that, Both sides of the outer wall of the box cover (105) are fixedly connected with male buckles (4), and both sides of the outer wall of the box body (101) are fixedly connected with female buckles (5). The female buckles (5) and the male buckles (4) are fastened together.

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