Protective device for semiconductor transport

Abstract

The application provides a kind of semiconductor transport protection device, it is related to semiconductor transport protection technical field, including bottom plate, the top of the bottom plate is provided with a plurality of layering storage structure, the storage structure includes first protective plate, the top of the first protective plate is provided with a plurality of accommodating grooves, the accommodating groove is installed with protective sleeve, the bottom of the storage structure is fixedly installed with a plurality of first protective sheet.The application is provided with first protective plate, protective sleeve and first protective sheet, when semiconductor chip is placed in the inside of protective sleeve, it can be protected by protective sleeve and first protective sheet more comprehensive physical protection, effectively resist the physical impact in the process of transportation, ensure semiconductor chip structure integrity, reduce its damage rate in the process of transportation, so as to reduce the cost loss caused by damage.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor transportation protection technology, and more specifically, to a protective device for semiconductor transportation. Background Technology

[0002] In the semiconductor industry, semiconductor chips are key components of electronic devices. Their manufacturing process is complex and costly. These chips are highly susceptible to external environmental factors during transportation, such as physical impacts. These factors can lead to performance degradation or even damage to the chips, severely impacting product quality and production efficiency. Therefore, we propose an improvement to this problem: a protective device for semiconductor transportation. Utility Model Content

[0003] This utility model provides a protective device for semiconductor transportation, including a base plate. Several stacked storage structures are arranged on top of the base plate. Each storage structure includes a first protective plate. Several receiving slots are formed on the top of the first protective plate, and protective sleeves are installed within the receiving slots. Several first protective sheets are fixedly installed on the bottom of the storage structures. Through the arrangement of the first protective plate, protective sleeves, and first protective sheets, the semiconductor chip, when placed inside the protective sleeves, receives comprehensive physical protection from the protective sleeves and first protective sheets. This effectively resists physical impacts during transportation, ensuring the integrity of the semiconductor chip structure, reducing its damage rate during transportation, and thus reducing cost losses due to damage.

[0004] As a preferred technical solution of this application, the first protective plate in the upper storage structure is inserted into the receiving groove in the lower storage structure; the top of the bottom plate is provided with a plurality of grooves, and the first protective plate in the lowermost storage structure is inserted into the inner wall of the groove.

[0005] As a preferred technical solution of this application, a first side groove is provided on both sides of the base plate, and a connecting shaft is fixedly installed in each of the two first side grooves. A limiting plate is sleeved on the outer surface of each of the two connecting shafts.

[0006] As a preferred technical solution of this application, the limiting plate is provided with a plurality of limiting holes, and the center distance between two adjacent limiting holes is the same as the thickness of the first protective plate.

[0007] As a preferred technical solution of this application, a second side groove is provided on the side of the first protective plate, and the inner wall of the second side groove is inserted into the limiting plate.

[0008] As a preferred technical solution of this application, a first loading and unloading slot is also provided on the side of the first protective plate.

[0009] As a preferred technical solution of this application, a limiting structure is provided between the two limiting plates, and the limiting structure is located above the storage structure.

[0010] As a preferred technical solution of this application, the limiting structure includes a second protective plate, and a plurality of second protective plates are fixedly installed on the bottom of the second protective plate. The second protective plates are inserted into the protective sleeve in the uppermost storage structure.

[0011] As a preferred technical solution of this application, the second protective plate has a third side groove on both sides, and the inner walls of the two third side grooves are respectively inserted into the outer surfaces of the two limiting plates. The second protective plate also has a second pick-and-place groove on its side.

[0012] As a preferred technical solution of this application, a handle is fixedly installed on the top of the second protective plate, and sleeves are fixedly connected to both ends of the handle. The two sleeves are respectively sleeved on the outer surface of the two limiting plates, and a hand-tightening bolt is threaded on the sleeve. The hand-tightening bolt is inserted into one of the limiting holes.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: In the scheme of this application: This application, through the setting of a first protective plate, a protective sleeve, and a first protective sheet, provides comprehensive physical protection for semiconductor chips when they are placed inside the protective sleeve. This effectively resists physical impacts during transportation, ensuring the integrity of the semiconductor chip structure, reducing its damage rate during transportation, and thus reducing cost losses caused by damage. Attached Figure Description

[0014] Figure 1 A schematic diagram of the structure of the semiconductor transport protective device provided in this application; Figure 2 A schematic diagram of the groove provided in this application; Figure 3 This is a schematic diagram of the structure of the receiving groove provided in this application; Figure 4 A bottom view of the first protective plate provided in this application; Figure 5 A schematic diagram of the structure of the third side groove provided in this application; Figure 6 A schematic diagram of the structure of the second protective sheet provided in this application.

[0015] The image shows: 1. Base plate; 101. Groove; 102. First side groove; 103. Connecting shaft; 104. Limiting plate; 105. Limiting hole; 2. Storage structure; 201. First protective plate; 202. Receiving groove; 203. Protective sleeve; 204. Second side groove; 205. First pick-up and drop groove; 206. First protective plate; 3. Limiting structure; 301. Handle; 302. Sleeve; 303. Hand-tightening bolt; 304. Second protective plate; 305. Second protective plate; 306. Second pick-up and drop groove; 307. Third side groove. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0018] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0019] For an example, please refer to... Figures 1-6 A protective device for transporting semiconductors includes a base plate 1. Above the base plate 1 are several stacked storage structures 2. Each storage structure 2 includes a first protective plate 201. The top of the first protective plate 201 has several receiving slots 202, and protective sleeves 203 are installed within the receiving slots 202. Several first protective sheets 206 are fixedly installed at the bottom of the storage structure 2. When a semiconductor chip is placed inside the protective sleeve 203, it receives comprehensive physical protection from the protective sleeve 203 and the first protective sheets 206, effectively resisting physical impacts during transport, ensuring the integrity of the semiconductor chip structure, reducing its damage rate during transport, and thus reducing cost losses due to damage.

[0020] Furthermore, the first protective sheet 206 located in the upper storage structure 2 is inserted into the receiving groove 202 located in the lower storage structure 2; the top of the bottom plate 1 is provided with several grooves 101, and the first protective sheet 206 located in the lowermost storage structure 2 is inserted into the inner wall of the groove 101. The bottom plate 1 is used for support and isolation protection of the lowermost storage structure 2.

[0021] Furthermore, a first side groove 102 is provided on both sides of the base plate 1, and a connecting shaft 103 is fixedly installed in each of the two first side grooves 102. A limiting plate 104 is sleeved on the outer surface of each of the two connecting shafts 103. The limiting plate 104 can rotate around the connecting shaft 103. The side of the limiting plate 104 contacts the side wall of the first side groove 102. It can maintain its position when the limiting plate 104 is vertical by means of friction and will not rotate automatically.

[0022] Furthermore, the limiting plate 104 is provided with a number of limiting holes 105, and the center distance between two adjacent limiting holes 105 is the same as the thickness of the first protective plate 201, so as to accommodate different numbers of storage structures 2.

[0023] Furthermore, a second side groove 204 is provided on the side of the first protective plate 201. The inner wall of the second side groove 204 is inserted into the limiting plate 104, so that the limiting plate 104 can limit the first protective plate 201 to improve the stability of the first protective plate 201 during transportation.

[0024] Furthermore, a first pick-and-place slot 205 is provided on the side of the first protective plate 201. The first pick-and-place slot 205 is provided to provide hand operating space for picking up and placing the first protective plate 201, so as to facilitate picking up and placing the first protective plate 201.

[0025] Furthermore, a limiting structure 3 is provided between the two limiting plates 104, and the limiting structure 3 is located above the storage structure 2. The limiting structure 3 is used for protection and limiting of the uppermost storage structure 2.

[0026] Furthermore, the limiting structure 3 includes a second protective plate 304, and several second protective plates 305 are fixedly installed at the bottom of the second protective plate 304. The second protective plates 305 are inserted into the protective sleeve 203 in the uppermost storage structure 2. The second protective plates 305, the protective sleeve 203 and the first protective plate 206 can all be made of foam, and foam has a good cushioning and protective effect.

[0027] Furthermore, the second protective plate 304 has a third side groove 307 on both sides, and the inner walls of the two third side grooves 307 are respectively inserted into the outer surfaces of the two limiting plates 104, so that the limiting plates 104 can limit the second protective plate 304. The second protective plate 304 is also provided with a second pick-up and put-out slot 306 on its side. The second pick-up and put-out slot 306 is provided to provide hand operating space for picking up and putting out the second protective plate 304, so as to facilitate picking up and putting out the second protective plate 304.

[0028] Furthermore, a handle 301 is fixedly installed on the top of the second protective plate 304. Both ends of the handle 301 are fixedly connected to sleeves 302. The two sleeves 302 are respectively fitted onto the outer surfaces of the two limiting plates 104. A hand-tightening bolt 303 is threaded onto the sleeve 302. The hand-tightening bolt 303 is inserted into one of the limiting holes 105. The position of the sleeve 302 can be fixed by the insertion of the hand-tightening bolt 303 and the limiting hole 105, thereby fixing the position of the second protective plate 304.

[0029] The semiconductor transport protective device provided by this utility model is used as follows: Reference Figure 1 When taking out or placing semiconductor chips, first turn the hand-tightening bolt 303 to separate it from the limiting hole 105. Then, pull the handle 301 upward to remove the second protective plate 304. Rotate the limiting plate 104 to both sides to separate it from the second side groove 204, which will release the restriction on the first protective plate 201. Then, the semiconductor chips inside the protective sleeve 203 can be taken out or placed. After taking out or placing, rotate the limiting plate 104 to stand it up and then insert the sleeve 302 into the limiting plate 104. Finally, tighten the hand-tightening bolt 303 so that it is inserted into the limiting hole 105.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A protective device for semiconductor transportation, characterized in that, Includes a base plate (1), above which are arranged a plurality of stacked storage structures (2), the storage structure (2) includes a first protective plate (201), the top of the first protective plate (201) is provided with a plurality of receiving slots (202), a protective sleeve (203) is installed in the receiving slots (202), and a plurality of first protective plates (206) are fixedly installed at the bottom of the storage structure (2).

2. The protective device for semiconductor transportation according to claim 1, characterized in that, The first protective plate (206) in the upper storage structure (2) is inserted into the receiving groove (202) in the lower storage structure (2); the top of the base plate (1) is provided with several grooves (101), and the first protective plate (206) in the lowermost storage structure (2) is inserted into the inner wall of the groove (101).

3. The protective device for semiconductor transportation according to claim 1, characterized in that, The base plate (1) has a first side groove (102) on both sides, and a connecting shaft (103) is fixedly installed in each of the two first side grooves (102). A limiting plate (104) is sleeved on the outer surface of each of the two connecting shafts (103).

4. The protective device for semiconductor transportation according to claim 3, characterized in that, The limiting plate (104) has a plurality of limiting holes (105), and the center distance between two adjacent limiting holes (105) is the same as the thickness of the first protective plate (201).

5. The protective device for semiconductor transportation according to claim 3, characterized in that, The first protective plate (201) has a second side groove (204) on its side, and the inner wall of the second side groove (204) is inserted into the limiting plate (104).

6. The protective device for semiconductor transportation according to claim 1, characterized in that, The first protective plate (201) also has a first pick-and-place slot (205) on its side.

7. The protective device for semiconductor transportation according to claim 3, characterized in that, A limiting structure (3) is provided between the two limiting plates (104), and the limiting structure (3) is located above the storage structure (2).

8. The protective device for semiconductor transportation according to claim 7, characterized in that, The limiting structure (3) includes a second protective plate (304), and a number of second protective plates (305) are fixedly installed at the bottom of the second protective plate (304). The second protective plates (305) are inserted into the protective sleeve (203) in the uppermost storage structure (2).

9. The protective device for semiconductor transportation according to claim 8, characterized in that, The second protective plate (304) has a third side groove (307) on both sides, and the inner walls of the two third side grooves (307) are respectively inserted into the outer surfaces of the two limiting plates (104). The second protective plate (304) also has a second take-out groove (306) on its side.

10. The protective device for semiconductor transportation according to claim 9, characterized in that, A handle (301) is fixedly installed on the top of the second protective plate (304). Both ends of the handle (301) are fixedly connected to sleeves (302). The two sleeves (302) are respectively sleeved on the outer surfaces of the two limiting plates (104). A hand-tightening bolt (303) is threaded on the sleeve (302). The hand-tightening bolt (303) is inserted into one of the limiting holes (105).

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