A transport mechanism for suppressing substrate warpage

Abstract

The utility model discloses a conveying mechanism for restraining substrate warping, including a plurality of conveying roller, a plurality of conveying roller horizontal arrangement and for conveying substrate into dust -free room, upper air plate and lower air plate, the upper air plate is located the top of conveying roller, lower air plate is located the below of conveying roller, the upper air plate and lower air plate all act on substrate, and the air pressure of upper air plate is greater than the air pressure of lower air plate, air blower, the air inlet of air blower is connected with dust -free room, and the air outlet is connected with upper air plate and lower air plate, the utility model discloses the conveying mechanism for restraining substrate warping, through setting corresponding upper air plate and lower air plate above and below substrate, and the air pressure of upper air plate is greater than the air pressure of lower air plate, forms stable airflow pressure, effectively restrains the warping deformation of substrate, and makes substrate can enter dust -free room flatly and adheres.

Description

Technical Field

[0001] This utility model relates to the field of substrate processing technology, and specifically to a conveying mechanism for suppressing substrate warping. Background Technology

[0002] Currently, packaging substrates are gradually evolving towards thinner and lighter designs with higher density. The total thickness of the packaging substrate is continuously decreasing, and the number of stacked layers and material ratios are also changing accordingly. This results in a significant reduction in the overall rigidity of the substrate. During production and transportation, the substrate is highly susceptible to warping or bending deformation due to thermal and mechanical stress, significantly increasing the risk of substrate deformation.

[0003] When the total thickness of the packaging substrate decreases to a certain range, such as in the processing of ultra-thin copper foil substrates with a thickness of less than 0.3mm, the bending stiffness of the substrate is small, resulting in a large number of warps. Once the warping exceeds 2cm, the substrate will get stuck, deviate, or fail to enter the pressing rollers smoothly at the entrance of the cleanroom during the process of being transported to the cleanroom. In severe cases, it will cause the entire board to be damaged or scrapped, directly affecting the production yield and equipment stability. Utility Model Content

[0004] To overcome the above shortcomings, the purpose of this utility model is to provide a conveying mechanism for suppressing substrate warping. By setting corresponding upper and lower air plates above and below the substrate, and with the air pressure of the upper air plate being greater than that of the lower air plate, a stable airflow pressure is formed, which effectively suppresses the warping deformation of the substrate and allows the substrate to enter the cleanroom flat and in good fit.

[0005] Technical solution: This utility model discloses a conveying mechanism for suppressing substrate warping, comprising:

[0006] Multiple conveyor rollers, which are arranged horizontally and used to convey the substrate into a cleanroom;

[0007] An upper air plate and a lower air plate, wherein the upper air plate is located above the conveyor roller and the lower air plate is located below the conveyor roller, both the upper air plate and the lower air plate act on the substrate, and the air pressure of the upper air plate is greater than that of the lower air plate;

[0008] A blower, the air inlet of which is connected to the cleanroom, and the air outlet of which is connected to the upper air plate and the lower air plate.

[0009] Furthermore, the upper air plate and the lower air plate are parallel to the substrate, and the length direction of the upper air plate and the lower air plate is consistent with the conveying direction of the substrate.

[0010] Furthermore, the upper wind plate has two parts, which are respectively located on both sides of the edge of the substrate; the lower wind plate has two parts, which are respectively located on both sides of the edge of the substrate.

[0011] Furthermore, the end of the upper air plate facing the substrate conveying direction is aligned with the end of the lower air plate facing the substrate conveying direction, and the end of the upper air plate away from the substrate conveying direction is longer than the end of the lower air plate away from the substrate conveying direction.

[0012] Furthermore, the surface of the upper air plate has a first air hole area, and the surface of the lower air plate is provided with a plurality of second air hole areas at intervals, with any one of the second air hole areas located between two adjacent conveying rollers.

[0013] Furthermore, the entrance to the cleanroom also has upper and lower pressing rollers arranged vertically for conveying the substrate.

[0014] Furthermore, the blower is also equipped with a high-efficiency filter and a pressure sensor between it and the upper and lower air plates.

[0015] Furthermore, the air pressure is controlled by regulating valves between the upper air plate and the lower air plate.

[0016] Furthermore, a height sensor for measuring the warpage height of the substrate is also provided on the transport path of the substrate.

[0017] Furthermore, both the upper and lower air intake panels are located at the entrance of the cleanroom.

[0018] The beneficial effects of this utility model are as follows:

[0019] (1) This utility model sets up corresponding upper and lower air plates above and below the substrate, and the air pressure of the upper air plate is greater than that of the lower air plate to form a stable airflow pressure, which effectively suppresses the warping deformation of the substrate, thereby ensuring that the substrate is pressed by the airflow and is transported to the clean room in a flat and fit manner.

[0020] (2) The upper and lower air plates are independently controlled by regulating valves to achieve precise adjustment of airflow pressure, ensuring that the pressure difference between the upper and lower air plates is constant and adjustable, thereby adapting to the conveying needs of substrates of different thicknesses and materials and improving the versatility of the conveying mechanism.

[0021] (3) In this utility model, the end of the upper air plate that is away from the substrate conveying direction is longer than the lower air plate. So when the substrate enters the airflow action area along the conveying roller, it is first subjected to the airflow of the upper air plate. The airflow of the upper air plate first presses the upper surface of the substrate with a higher air pressure. Then, the airflow generated by the lower air plate lifts the substrate from below with a lower air pressure. Finally, a stable bidirectional airflow is formed to act on the substrate together, thereby avoiding the situation where the substrate is not conveyed due to uneven force caused by applying airflow to the upper and lower sides of the substrate at the same time. Attached Figure Description

[0022] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of this invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely schematic to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, under the guidance of this invention, can select various possible shapes and proportions to implement this invention according to specific circumstances. In the drawings:

[0023] Figure 1 This is a top view of the conveying mechanism for suppressing substrate warping according to the present invention;

[0024] Figure 2 This is a side view of the conveying mechanism for suppressing substrate warping according to the present invention.

[0025] Figure 3 This is a schematic diagram of the upper and lower windshields of this utility model;

[0026] Figure 4 This is a schematic diagram of the windshield of the present invention;

[0027] Figure 5 This is a schematic diagram of the downwind plate described in this utility model.

[0028] In the diagram: 1. Substrate; 2. Cleanroom; 21. Upper pressing roller; 22. Lower pressing roller; 3. Conveyor roller; 41. Upper air plate; 411. First air vent area; 42. Lower air plate; 421. Second air vent area; 5. Blower; 6. High-efficiency filter; 7. Air pressure sensor; 8. Height sensor. Detailed Implementation

[0029] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments.

[0030] In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The implementation methods of this utility model will now be described based on its overall structure.

[0031] like Figures 1 to 5 As shown, this utility model discloses a conveying mechanism for suppressing substrate warping, comprising:

[0032] Multiple conveyor rollers 3 are arranged horizontally and used to convey the substrate 1 into the cleanroom 2.

[0033] An upper air plate 41 and a lower air plate 42 are provided. The upper air plate 41 is located above the conveying roller 3, and the lower air plate 42 is located below the conveying roller 3. Both the upper air plate 41 and the lower air plate 42 act on the base plate 1, and the air pressure of the upper air plate 41 is greater than that of the lower air plate 42.

[0034] Blower 5, the air inlet of which is connected to the cleanroom 2, and the air outlet of which is connected to the upper air plate 41 and the lower air plate 42.

[0035] With the above structure, the substrate 1 is supported by multiple horizontally arranged conveyor rollers 3 and conveyed into the cleanroom 2. An upper air plate 41 and a lower air plate 42 are respectively arranged above and below the substrate 1, forming a pressing channel with airflow clamped from both above and below. The air inlet of the blower 5 is connected to the cleanroom 2, used to draw in clean air from the cleanroom 2, and supplies air to the upper air plate 41 and the lower air plate 42 through the air outlet. The upper air plate 41 blows airflow from top to bottom toward the upper surface of the substrate 1, and the lower air plate 42 blows airflow from bottom to top toward the lower surface of the substrate 1. Furthermore, the air pressure of the upper air plate 41 is greater than that of the lower air plate 42, meaning the airflow pressure acting on the upper surface of the substrate 1 is slightly higher than that on the lower surface. Therefore, during the conveying process, the upper air plate 41 applies a downward pressure to flatten the substrate 1. To prevent the pressure provided by the upper air plate 41 from pressing the substrate 1 into the conveyor rollers 3 and causing jamming, the lower air plate 42 provides an upward supporting force to prevent jamming.

[0036] This invention effectively suppresses the warping and deformation of the substrate 1 by utilizing the air pressure difference between the upper air plate 41 and the lower air plate 42, while also avoiding the phenomenon of plate jamming during the pressing process.

[0037] Both the upper air plate 41 and the lower air plate 42 are parallel to the substrate 1, and their length directions are aligned with the conveying direction of the substrate 1. This ensures that the upper air plate 41 and the lower air plate 42 can form a uniform and stable airflow distribution along the entire conveying path of the substrate 1. When the blower 5 operates, gas is blown out from the upper air plate 41 and the lower air plate 42 in a direction perpendicular to the substrate 1, thereby creating pressure perpendicular to the substrate 1 on both the upper and lower sides. The airflow can continuously and uniformly act on the entire surface of the substrate 1 during its movement, avoiding bending or vibration caused by uneven local pressure.

[0038] In this embodiment, there are two upper air plates 41, which are located on both sides of the edge of the substrate 1 respectively; there are also two lower air plates 42, which are located on both sides of the edge of the substrate 1 respectively. The upper air plates 41 and the lower air plates 42 are vertically aligned and correspond to each other, so that the upper air plates 41 and the lower air plates 42 can apply uniform and symmetrical airflow pressure to the substrate 1 during the substrate 1 conveying process, thereby further improving the suppression effect on substrate 1 warping.

[0039] When the substrate 1 is supported by multiple conveyor rollers 3 and conveyed towards the cleanroom 2, two upper air panels 41 located on both sides of the substrate 1 blow air downwards from above, while the corresponding two lower air panels 42 blow air upwards from below. The blower 5 supplies air to the four air panels simultaneously through a split pipe. The air pressure of the upper air panel 41 is higher than that of the lower air panel 42, thereby suppressing the warping of the substrate 1.

[0040] Preferably, the end of the upper air plate 41 facing the conveying direction of the substrate 1 is aligned with the end of the lower air plate 42 facing the conveying direction of the substrate 1, while the end of the upper air plate 41 away from the conveying direction of the substrate 1 is longer than the corresponding end of the lower air plate 42. That is, the ends of the upper air plate 41 and the lower air plate 42 closest to the cleanroom 2 are aligned, and the length of the end of the upper air plate 41 away from the cleanroom 2 is greater than the length of the lower air plate 42.

[0041] With the above structure, when the substrate 1 is placed into the conveyor roller 3, since one end of the upper air plate 41 is longer than the lower air plate 42, the substrate 1 is first subjected to the airflow pressure of the upper air plate 41. The upper air plate 41 applies pressure to the substrate 1 first. As the conveyor roller 3 further transports the substrate 1, the substrate 1 is then lifted by the airflow of the lower air plate 42. This avoids the uneven force on the substrate 1 caused by the simultaneous application of airflow to the upper and lower sides of the substrate 1, which would prevent the substrate 1 from being smoothly transported into the cleanroom 2.

[0042] In this embodiment, the upper air plate 41 is a long strip-shaped component. A continuous first air hole area 411 is provided on the side of the upper air plate 41 facing the substrate 1. The first air hole area 411 is evenly distributed along the length direction of the upper air plate 41, thereby continuously supplying air to the surface of the substrate 1 to suppress warping of the substrate 1. Correspondingly, the lower air plate 42 is also a long strip-shaped component. A plurality of second air hole areas 421 are spaced apart on the side of the lower air plate 42 facing the substrate 1. The second air hole areas 421 are also distributed along the length direction of the lower air plate 42. Since the lower air plate 42 is located below the conveyor rollers 3, the conveyor rollers 3 will block the airflow of the lower air plate 42. Therefore, the second air hole areas 421 are arranged at intervals along the length direction of the lower air plate 42, and any one of the second air hole areas 421 is located at a position between two adjacent conveyor rollers 3, that is, any one of the second air hole areas 421 is located directly below the gap formed by two adjacent rollers. In this way, the several spaced second air hole regions 421 avoid the obstruction of the airflow by the transfer roller 3 when releasing airflow to the substrate 1.

[0043] Furthermore, a pair of upper pressing rollers 21 and lower pressing rollers 22, corresponding vertically, are provided at the entrance of cleanroom 2. The lower pressing roller 22 is aligned horizontally with the conveyor roller 3, so that the upper pressing rollers 21 and lower pressing rollers 22 work together to press the substrate 1 as it is about to enter the entrance section of cleanroom 2. The upper pressing rollers 21 and lower pressing rollers 22 provide vertical pressure and frictional driving force when entering the entrance of cleanroom 2, thereby suppressing vibration or displacement of the substrate 1 when entering cleanroom 2, and preventing the substrate 1 from warping or shifting.

[0044] The air outlet of the blower 5 is connected to the upper air plate 41 and the lower air plate 42 via pipes, and a high-efficiency filter 6 and a pressure sensor 7 are also connected between the blower 5 and the air plates. The high-efficiency filter 6 is used to further purify the air drawn from the cleanroom 2 to ensure that the filtered clean gas does not cause secondary pollution, effectively remove dust, oil mist or impurities that may be carried out by the blower 5, and ensure that the airflow used to press the warped substrate 1 meets the cleanliness requirements.

[0045] Furthermore, a pressure sensor 7 is installed in the pipeline between the high-efficiency filter 6 and the upper air plate 41 and the lower air plate 42. The pressure sensor 7 is used to monitor the air supply pressure in real time and accurately reflect the actual air pressure value before entering the air plate. If an abnormal drop or rise in air pressure is detected, the control system will issue an alarm signal and reduce the fan speed or shut off the air supply according to the air pressure value to ensure the safety of the equipment and the base plate 1.

[0046] The upper air plate 41 and the lower air plate 42 each have their air pressure controlled by regulating valves independently installed on their respective air supply lines. The clean gas output from the blower 5 via the high-efficiency filter 6 passes through their respective regulating valves before entering the upper air plate 41 and the lower air plate 42. By controlling the opening of these regulating valves, the airflow and pressure entering each air plate are precisely adjusted, achieving independent control of the air pressure of the upper air plate 41 and the lower air plate 42. This maintains a stable pressure difference between the upper air plate 41 and the lower air plate 42, with the air pressure on the upper air plate 41 being slightly higher than that on the lower air plate 42. This ensures that the upper air plate 41 suppresses warping of the substrate 1, while the lower air plate 42 provides upward airflow to prevent the substrate 1 from getting stuck in the conveyor roller 3. In this embodiment, by controlling the airflow and pressure of the upper air plate 41 and the lower air plate 42, vibration or displacement of the substrate 1 caused by air pressure fluctuations is avoided, improving the flatness of the substrate 1 and the production yield.

[0047] Preferably, a height sensor for measuring the warpage height of substrate 1 is provided on the transport path of substrate 1. The height sensor is installed before substrate 1 enters the air-plate pressing area to detect warpage of substrate 1 during transport. In a feasible embodiment, the height of the cleanroom 2 entrance is 2cm. When the height sensor detects that the warpage height of substrate 1 is greater than 2cm, a transmission signal is sent to instruct the air-plate to open, thereby suppressing the warped air-plate with airflow. Providing a height sensor on the transport path of substrate 1 enables the transport mechanism to have a self-detection function, improving the stability of substrate 1 transport and reducing scratches, collisions, and yield losses caused by substrate 1 warpage.

[0048] Preferably, both the upper air plate 41 and the lower air plate 42 are located at the entrance of the cleanroom, thereby pressing the substrate 1 and conveying it along the conveying path to the entrance of the cleanroom 2 under the action of the conveying roller 3, until the substrate 1 is completely inside the cleanroom 2.

[0049] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A conveying mechanism for suppressing substrate warping, characterized in that, include: Multiple conveyor rollers, which are arranged horizontally and used to convey the substrate into a cleanroom; An upper air plate and a lower air plate, wherein the upper air plate is located above the conveyor roller and the lower air plate is located below the conveyor roller, both the upper air plate and the lower air plate act on the substrate, and the air pressure of the upper air plate is greater than that of the lower air plate; A blower, the air inlet of which is connected to the cleanroom, and the air outlet of which is connected to the upper air plate and the lower air plate.

2. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, The upper and lower wind plates are parallel to the substrate, and the length direction of the upper and lower wind plates is consistent with the conveying direction of the substrate.

3. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, The upper wind plate has two parts, which are located on both sides of the edge of the substrate; the lower wind plate has two parts, which are located on both sides of the edge of the substrate.

4. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, One end of the upper air plate facing the substrate conveying direction is aligned with one end of the lower air plate facing the substrate conveying direction, and the end of the upper air plate away from the substrate conveying direction is longer than the end of the lower air plate away from the substrate conveying direction.

5. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, The upper wind plate has a first air hole area on its surface, and the lower wind plate has a plurality of second air hole areas spaced apart on its surface, with any one of the second air hole areas located between two adjacent conveying rollers.

6. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, The entrance to the cleanroom also has upper and lower pressing rollers, which are arranged vertically to transfer the substrate.

7. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, The blower is also equipped with a high-efficiency filter and a pressure sensor between it and the upper and lower air plates.

8. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, The wind pressure is controlled by regulating valves between the upper wind plate and the lower wind plate.

9. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, A height sensor for measuring the warpage height of the substrate is also provided on the transport path of the substrate.

10. The conveying mechanism for suppressing substrate warping according to claim 1, characterized in that, Both the upper and lower air intakes are located at the entrance of the cleanroom.

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