An upright flip takeoff

Abstract

The utility model discloses a vertical turnover material taking device, include: turnover mechanism, including first mounting seat, vertical carousel, a plurality of adsorption subassembly and be used for driving the first drive component of vertical carousel rotation, a plurality of adsorption subassembly along the center of vertical carousel is circular ring array distribution, adsorption subassembly includes support seat, slide on support seat on slide rod, the pressure piece and suction nozzle connected respectively in slide rod both ends, be provided with first elastic piece between pressure piece with support seat, the suction nozzle is used to take or release chip, press mechanism, located turnover mechanism's one side, including second mounting seat, press block and second drive component, second drive component is used for driving press block elevating to drive suction nozzle elevating. The utility model can avoid arranging complex structure's multi -joint manipulator around the turret platform to complete the turnover action of chip, saves the equipment cost and occupies the space.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a vertical flipping material handling device. Background Technology

[0002] A turret sorter is a highly efficient testing and sorting device for electronic components. Its core component is a rotating turret with multiple circumferential picking stations. Through the intermittent rotation of the turret, continuous material picking, testing, and sorting can be achieved. In traditional applications, materials are typically fed into the conveyor track in the correct orientation using directional feeding mechanisms such as vibratory feeders. The picking heads on the turret can then directly pick up the materials without needing to flip them.

[0003] With the development of semiconductor technology, wafers serve as the carriers of integrated circuits. During testing, chips are often placed on wafer platforms for loading. On the wafer platform, the chips are placed in an inverted position, that is, the back of the chip faces upward.

[0004] However, there is usually a height difference and spatial distance between the wafer platform and the turret platform. The effective stroke of the pick-up head of a traditional turret sorter is usually only a few millimeters of parallel movement, and its degree of freedom of movement is limited. It is impossible to pick up the chip from the wafer platform, rotate it 180°, and then transfer it to the turret platform. At the same time, the space around the turret is compact, making it difficult to arrange a complex multi-joint robotic arm with a wide range of lifting and rotating functions. Utility Model Content

[0005] To overcome the shortcomings of the existing technology, this utility model provides a vertical flipping material handling device, which can avoid arranging complex multi-joint robotic arms around the turret platform to complete the chip flipping action, saving equipment costs and space.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] A vertical tilting and unloading device includes:

[0008] The flipping mechanism includes a first mounting base, a vertical turntable, multiple adsorption components disposed on the vertical turntable, and a first driving component for driving the vertical turntable to rotate. The first driving component is disposed on the first mounting base. The multiple adsorption components are arranged in a circular array along the center of the vertical turntable. Each adsorption component includes a support base, a slide rod slidably connected to the support base, a pressure receiving member and a suction nozzle respectively connected to both ends of the slide rod. One end of the slide rod connected to the pressure receiving member faces the center of the vertical turntable. A first elastic member is disposed between the pressure receiving member and the support base. The suction nozzle is used to pick up or release chips.

[0009] The pressing mechanism, located on one side of the flipping mechanism, includes a second mounting base, a pressing block, and a second drive assembly. The second drive assembly is mounted on the second mounting base and is used to drive the pressing block to rise and fall.

[0010] When the adsorption component rotates to its lowest point, the second drive component drives the lower pressure block to descend, pressing down on the pressure-receiving component. The pressure-receiving component overcomes the elastic force of the first elastic element and drives the slide rod and the suction nozzle to descend, so that the suction nozzle can pick up the chip.

[0011] As a further improvement to the above technical solution, a sleeve is provided on the support base, and the sliding rod is slidably connected inside the sleeve.

[0012] As a further improvement to the above technical solution, the pressure-bearing component includes a connecting block and a pressure-bearing column. The connecting block is connected to one end of the slide rod facing the center of the vertical turntable, and the pressure-bearing column is disposed on the connecting block.

[0013] As a further improvement to the above technical solution, a U-shaped seat is provided on one side of the support base, and two rollers are rotatably connected to the U-shaped seat. The connecting block is located at the opening of the U-shaped seat, and the two rollers are respectively rotatably connected to the two sides of the connecting block.

[0014] As a further improvement to the above technical solution, the flipping mechanism further includes a gas distribution component, which includes:

[0015] The air distribution plate is fixedly installed on the first mounting base. It has a first air passage and a second air passage that are isolated from each other. The air distribution plate is provided with an air extraction connector and an air cut-off connector. The first air passage is connected to the air extraction connector, and the second air passage is connected to the air cut-off connector.

[0016] The air distribution ring is fixedly mounted on the vertical turntable and is rotatably and sealed to the end face of the air distribution plate. It has multiple independent third air passages inside and multiple connectors that communicate with each of the third air passages in its circumference. The connectors are connected to the corresponding nozzles through air pipes.

[0017] An air distribution structure is formed on the contact end face of the air distribution plate and the air distribution ring, and is used to selectively connect the third air passage with the first air passage or the second air passage when the vertical turntable rotates.

[0018] As a further improvement to the above technical solution, the air distribution assembly further includes a connecting shaft, a connecting seat, and a pre-compression component. The connecting shaft is disposed on the first mounting seat and passes through the vertical turntable. The connecting seat is disposed at one end of the connecting shaft. The air distribution plate is connected to the connecting seat through the pre-compression component, which is used to pre-compress the air distribution plate onto the air distribution ring.

[0019] As a further improvement to the above technical solution, the second drive assembly includes a first motor, a cam, a follower wheel, a lifting seat, and a second elastic element. The first motor is mounted on the second mounting seat, the cam is disposed on the output shaft of the first motor, the follower wheel is disposed on the lifting seat and contacts the cam, the lifting seat is movably connected to the second mounting seat, the lowering block is disposed on the lifting seat, and the second elastic element is disposed between the second mounting seat and the lifting seat.

[0020] As a further improvement to the above technical solution, a first baffle is provided at the bottom of the second mounting base, the first baffle is located directly below the lifting base, and the second elastic element is a first spring, which is disposed between the lifting base and the first baffle.

[0021] As a further improvement to the above technical solution, the second mounting base and the lifting base are slidably connected in the vertical direction through the first guide module.

[0022] As a further improvement to the above technical solution, a buffer assembly is provided between the lower pressure block and the lifting seat. The buffer assembly includes a second baffle and a second spring. The second baffle is disposed on the lifting seat and located directly above the lower pressure block, and the second spring is disposed between the second baffle and the lower pressure block.

[0023] As a further improvement to the above technical solution, the lifting seat and the lowering block are slidably connected in the vertical direction through a second guide module.

[0024] The beneficial effects of this utility model are: This utility model provides a vertical flipping material handling device, which integrates a ring-shaped adsorption component on a vertical turntable and combines it with a pressing mechanism to achieve a 180° flip of the chip during the process of transferring the chip from the wafer platform to the turret platform. This avoids the need to arrange a complex multi-joint robotic arm around the turret platform to complete the chip flipping action, saving equipment costs and space. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] Figure 1This is a schematic diagram of the structure of a vertical tilting material handling device provided in an embodiment of this utility model;

[0027] Figure 2 yes Figure 1 Exploded view of the tilting mechanism;

[0028] Figure 3 yes Figure 2 Schematic diagram of the adsorption component;

[0029] Figure 4 yes Figure 3 A sectional view;

[0030] Figure 5 yes Figure 2 Exploded view of the center gas separator assembly;

[0031] Figure 6 yes Figure 1 Schematic diagram of the middle and lower pressure mechanism;

[0032] Figure 7 yes Figure 6 A structural diagram from another perspective.

[0033] Reference numerals: 100-Tilting mechanism, 110-First mounting base, 120-Vertical turntable, 130-Adsorption assembly, 131-Support base, 132-Slide rod, 133-Pressure-bearing component, 1331-Connecting block, 1332-Pressure-bearing column, 134-Suction nozzle, 135-First elastic element, 136-Sleeve, 137-U-shaped seat, 138-Roller, 140-First drive assembly, 150-Gas distribution assembly, 151-Gas distribution plate, 152-Air extraction connector, 153-Air shut-off connector, 154-Gas distribution ring, 155-Connector, 156-Connecting shaft, 157-Connecting seat, 158-Pre-compression component;

[0034] 200-Pressing mechanism, 210-Second mounting base, 220-Pressing block, 230-Second drive assembly, 231-First motor, 232-Cam, 233-Follower wheel, 234-Lifting seat, 235-Second elastic element, 236-First baffle, 237-First guide module, 238-Buffer assembly, 2381-Second baffle, 2382-Second spring, 239-Second guide module. Detailed Implementation

[0035] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0036] Reference Figures 1 to 4 The present invention provides a vertical flipping material handling device, which includes a flipping mechanism 100 and a pressing mechanism 200.

[0037] Structurally, the flipping mechanism 100 includes a first mounting base 110, a vertical turntable 120, multiple adsorption components 130 disposed on the vertical turntable 120, and a first driving component 140 for driving the vertical turntable 120 to rotate. The first driving component 140 is disposed on the first mounting base 110. The multiple adsorption components 130 are arranged in a circular array along the center of the vertical turntable 120. Each adsorption component 130 includes a support base 131, a slide rod 132 slidably connected to the support base 131, a pressure receiving component 133 and a suction nozzle 134 respectively connected to both ends of the slide rod 132. One end of the slide rod 132 connected to the pressure receiving component 133 faces the center of the vertical turntable 120. A first elastic element 135 is disposed between the pressure receiving component 133 and the support base 131. The suction nozzle 134 is connected to an external negative pressure device and is used to suck up or release chips.

[0038] Furthermore, the pressing mechanism 200 is located on one side of the flipping mechanism 100 and includes a second mounting base 210, a pressing block 220 and a second drive assembly 230. The second drive assembly 230 is disposed on the second mounting base 210 and is used to drive the pressing block 220 to rise and fall.

[0039] Understandably, the wafer platform carrying the chip is located below the lowest end of the vertical turntable 120. The first drive assembly 140 drives the vertical turntable 120 to rotate intermittently. The vertical turntable 120 drives multiple adsorption assemblies 130 to rotate synchronously around the center of the vertical turntable 120. When the adsorption assembly 130 rotates to the lowest end, the suction nozzle 134 is directly facing the chip. Then, the second drive assembly 230 drives the lower pressure block 220 to descend. The lower pressure block 220 presses down on the pressure receiving component 133. The pressure receiving component 133 overcomes the resistance of the first elastic component 135 and drives the slide rod 132 and the suction nozzle 134 to descend. The suction nozzle 134 contacts the surface of the chip. At this time, the negative pressure device is activated, and the suction nozzle 134 firmly picks up the chip using negative pressure. Then, the second drive assembly 230 drives the lower pressure block 220 to rise. The lower pressure block 220 removes the pressure on the pressure receiving component 133. Under the rebound force of the elastic element 135, the pressure-bearing element 133, the slide bar 132, and the suction nozzle 134 that has picked up the chip are lifted together to the initial height. At this time, the chip is removed from the wafer platform. Then, the first drive component 140 drives the vertical turntable 120 to rotate intermittently. The vertical turntable 120 drives multiple adsorption components 130 to continue rotating around the center of the vertical turntable 120. Another adsorption component 130 rotates to the lowest end, repeating the above actions, and the picked-up chip moves in a circular motion. When the adsorption component 130 that picks up the chip rotates to the highest point, the chip completes a 180° flip, so that the front of the chip faces up. At this time, the negative pressure device cuts off the negative pressure of the suction nozzle 134, the chip is released, and the pick-up head of the turret sorter grabs the chip to the designated position. Finally, the adsorption component 130 continues to rotate with the vertical turntable 120 to start the next working cycle.

[0040] Therefore, by integrating the ring-shaped adsorption components 130 onto the vertical turntable 120 and combining them with the pressing mechanism 200, the chip can be rotated 180° during the process of transferring the chip from the wafer platform to the turret platform. This avoids the need to arrange complex multi-joint robotic arms around the turret platform to complete the chip rotation action, thus saving equipment costs and space.

[0041] Reference Figure 4 In some preferred embodiments, a sleeve 136 is provided on the support base 131, and a slide rod 132 is slidably connected inside the sleeve 136. The sleeve 136 can restrict the sliding direction of the slide rod 132, thereby preventing the slide rod 132 from shaking or deviating when moving, and ensuring that the suction nozzle 134 provided at one end of the slide rod 132 accurately picks up the chip on the wafer platform.

[0042] In some preferred embodiments, the pressure-bearing member 133 includes a connecting block 1331 and a pressure-bearing column 1332. The connecting block 1331 is connected to one end of the slide bar 132 facing the center of the vertical turntable 120, and the pressure-bearing column 1332 is disposed on the connecting block 1331.

[0043] Furthermore, the bottom of the pressure block 220 has a central plane and an arc surface connecting the two sides of the central plane.

[0044] Understandably, when the vertical turntable 120 drives the adsorption assembly 130 to rotate, the circumference of the pressure column 1332 on the adsorption assembly 130 abuts against the arc surface of the lower pressure block 220 until the adsorption assembly 130 rotates to its lowest point, and the top of the pressure column 1332 abuts against the center plane of the lower pressure block 220. Then, the second drive assembly 230 drives the lower pressure block 220 to descend. On the one hand, this can accurately guide the pressure column 1332 so that the lower pressure block 220 is precisely aligned with the pressure column 1332. On the other hand, it can prevent the adsorption assembly 130 from interfering with the lower pressure block 220 when rotating.

[0045] Reference Figure 3 Furthermore, a U-shaped seat 137 is provided on one side of the support base 131, and two rollers 138 are rotatably connected to the U-shaped seat 137. The connecting block 1331 is located at the opening of the U-shaped seat 137, and the two rollers 138 are respectively rotatably connected to the two sides of the connecting block 1331.

[0046] Understandably, the two rollers 138 on the U-shaped base 137 guide and limit the two sides of the connecting block 1331, eliminating the deflection of the connecting block 1331 and further ensuring that the slide rod 132 and the suction nozzle 134 move in a straight line, allowing the suction nozzle 134 to accurately pick up the chip. At the same time, the rollers 138 and the connecting block 1331 experience rolling friction, which reduces frictional resistance, reduces the force required for downward pressing, makes the movement smoother and more stable, and extends the service life of the parts.

[0047] Reference Figure 2 and Figure 5 In some preferred embodiments, the flipping mechanism 100 further includes an air distribution assembly 150, which includes: an air distribution plate 151, fixedly mounted on the first mounting base 110, having a first air passage and a second air passage isolated from each other inside; an air extraction connector 152 and an air shut-off connector 153 on the air distribution plate 151; the first air passage communicating with the air extraction connector 152 and the second air passage communicating with the air shut-off connector 153; an air distribution ring 154, fixedly mounted on the vertical turntable 120 and rotatably connected to the end face of the air distribution plate 151; having multiple independent third air passages inside; and having multiple connectors 155 circumferentially connected to each of the third air passages; the connectors 155 being connected to corresponding suction nozzles 134 via air pipes; and an air distribution structure formed on the contact end face of the air distribution plate 151 and the air distribution ring 154, used to selectively connect the third air passages to the first or second air passages when the vertical turntable 120 rotates.

[0048] It is understandable that the suction connector 152 connects to an external negative pressure device, which can continuously provide negative pressure, and the air cut-off connector 153 directly connects to the external atmosphere, which can break the vacuum. When the vertical turntable 120 drives multiple adsorption components 130 to rotate, the gas distribution structure determines that when the adsorption component 130 rotates to different angles, the third gas path corresponding to the adsorption component 130 is connected to the first or second gas path, so as to absorb or release the chip. Moreover, it can even be sealed with the end face of the gas distribution plate 151 to achieve pressure transition or continuously maintain atmospheric pressure and continuously absorb the chip.

[0049] Specifically, when the adsorption component 130 rotates to its lowest point, the third air path corresponding to the adsorption component 130 connects to the first air path. At this time, the suction nozzle 134 on the adsorption component 130 relies on negative pressure to firmly pick up the chip. When the adsorption component 130 rotates from its lowest point to its highest point, the third air path corresponding to the adsorption component 130 connects to the first air path or seals with the end face of the gas distribution plate 151, so that the suction nozzle 134 on the adsorption component 130 continuously maintains negative pressure to continuously pick up the chip. When the adsorption component 130 rotates to its highest point, the third air path corresponding to the adsorption component 130 connects to the second air path. At this time, the suction nozzle 134 on the adsorption component 130 connects to the external atmosphere to release the chip. When the adsorption component 130 rotates from its highest point to its lowest point, the third air path corresponding to the adsorption component 130 connects to the second air path or seals with the end face of the gas distribution plate 151, so that the suction nozzle 134 on the adsorption component 130 continuously maintains atmospheric pressure to prepare for the next chip pick-up.

[0050] Therefore, by setting an air distribution structure between the air distribution plate 151 and the air distribution ring 154, the air path switching is realized without the need for solenoid valves and other electronic control components, avoiding the risk of wire entanglement, improving the anti-interference performance of the air distribution assembly 150, extending its service life, and at the same time saving space and making the overall structure compact.

[0051] Furthermore, the air distribution assembly 150 also includes a connecting shaft 156, a connecting seat 157, and a pre-compression component 158. The connecting shaft 156 is disposed on the first mounting base 110 and passes through the vertical turntable 120. The connecting seat 157 is disposed at one end of the connecting shaft 156. The air distribution plate 151 is connected to the connecting seat 157 through the pre-compression component 158. The pre-compression component 158 ​​is used to pre-compress the air distribution plate 151 onto the air distribution ring 154.

[0052] Understandably, by adjusting the pre-compression component 158, an initial pre-pressure is applied to the air distribution plate 151 during equipment assembly. The pre-pressure is the axial force from the air distribution plate 151 to the air distribution ring 154, thereby ensuring that the end faces of the air distribution plate 151 and the air distribution ring 154 remain tightly fitted in a static state, thus ensuring the sealing between them.

[0053] When the vertical turntable 120 drives the air distribution ring 154 to rotate, the pre-compression component 158 ​​can compensate for the slight dimensional changes caused by manufacturing tolerances and thermal expansion, ensuring that the end faces of the air distribution plate 151 and the air distribution ring 154 remain sealed to prevent gas leakage.

[0054] Reference Figure 6 and Figure 7 In some preferred embodiments, the second drive assembly 230 includes a first motor 231, a cam 232, a follower wheel 233, a lifting seat 234, and a second elastic element 235. The first motor 231 is mounted on the second mounting base 210. The cam 232 is disposed on the output shaft of the first motor 231. The follower wheel 233 is disposed on the lifting seat 234 and contacts the cam 232. The lifting seat 234 is movably connected to the second mounting base 210. The lower pressure block 220 is disposed on the lifting seat 234. The second elastic element 235 is disposed between the second mounting base 210 and the lifting seat 234.

[0055] In the initial state, the lifting seat 234 is held at the upper limit position under the elastic support of the second elastic element 235. At this time, the outer periphery of the follower wheel 233 contacts the base circle of the cam 232, the lower pressure block 220 moves away from the adsorption component 130, and the vertical turntable 120 can drive the adsorption component 130 to rotate freely.

[0056] When the adsorption assembly 130 rotates to its lowest point, the first motor 231 drives the cam 232 to rotate. The outer circumference of the follower wheel 233 contacts the protrusion of the cam 232 until the protrusion of the cam 232 rotates to its lowest point. The follower wheel 233 is forced down, which in turn pushes the lifting seat 234 to overcome the resistance of the second elastic element 235 and descend. The lifting seat 234 drives the lowering block 220 to contact and press down the pressure column 1332 on the adsorption assembly 130, so that the suction nozzle 134 descends and picks up the chip.

[0057] Next, the first motor 231 continues to drive the cam 232 to rotate. The contact part between the outer periphery of the follower wheel 233 and the cam 232 gradually transitions from the convex part to the base circle. At this time, the second elastic element 235 releases its elastic force to push the lifting seat 234 to rise and reset.

[0058] Therefore, by rotating the cam 232 driven by the first motor 231, and under the preload of the second elastic element 235, the outer contour of the cam 232 remains in contact with the outer periphery of the follower wheel 233, eliminating transmission backlash. This allows for precise control of the lifting stroke, speed, and acceleration of the lower pressure block 220, ensuring the smoothness and accuracy of the material handling process. Simultaneously, the entire second drive assembly 230 has a compact structure, reducing space requirements.

[0059] Furthermore, a first baffle 236 is provided at the bottom of the second mounting base 210. The first baffle 236 is located directly below the lifting base 234. The second elastic element 235 is a first spring, which is disposed between the lifting base 234 and the first baffle 236.

[0060] Specifically, the top of the first baffle 236 is provided with a first receiving groove, and the bottom of the lifting seat 234 is provided with a second receiving groove. The first receiving groove and the second receiving groove are respectively used to limit the bottom and top of the first spring, thereby preventing the first spring from detaching.

[0061] Furthermore, the second mounting base 210 and the lifting base 234 are slidably connected in the vertical direction through the first guide module 237. The first guide module 237 can guide the lifting base 234 to prevent the lifting base 234 from deviating or shaking during the lifting process, and ensure the accuracy of the lifting stroke of the lifting base 234 and the lower pressure block 220.

[0062] Specifically, the first guide module 237 includes a first guide rail and a first slider slidably connected to the first guide rail. The first guide rail is vertically disposed on one side of the second mounting base 210, and the first slider is disposed on one side of the lifting base 234. The lifting base 234 drives the first slider to move, and the first slider moves along the length direction of the first guide rail, thereby reducing the coefficient of friction and reducing the wear of parts.

[0063] In some preferred embodiments, a buffer assembly 238 is provided between the lower pressure block 220 and the lifting seat 234. The buffer assembly 238 includes a second baffle 2381 and a second spring 2382. The second baffle 2381 is disposed on the lifting seat 234 and located directly above the lower pressure block 220. The second spring 2382 is disposed between the second baffle 2381 and the lower pressure block 220.

[0064] Understandably, when the lifting seat 234 drives the lower pressure block 220 to descend, the lower pressure block 220 first contacts the pressure column 1332, the second spring 2382 is compressed, the lower pressure block 220 moves relative to the lifting seat 234, and then the lifting seat 234 drives the lower pressure block 220 to continue to descend, the lower pressure block 220 presses down on the pressure column 1332, thereby buffering and absorbing the impact force or mechanical vibration between the lower pressure block 220 and the pressure column 1332, improving the stability of equipment operation, and at the same time, preventing the suction nozzle 134 from hardly damaging the chip.

[0065] Specifically, a third receiving groove is provided at the bottom of the first baffle 236, and a fourth receiving groove is provided at the top of the lower pressing block 220. The third receiving groove and the fourth receiving groove are respectively used to limit the top and bottom of the second spring 2382, thereby preventing the second spring 2382 from disengaging.

[0066] Furthermore, the lifting seat 234 and the lower pressure block 220 are slidably connected in the vertical direction through the second guide module 239. The second guide module 239 can guide the lower pressure block 220 to prevent the lower pressure block 220 from shifting or shaking during the buffering process, and ensure that the lower pressure block 220 is aligned with the pressure column 1332.

[0067] Specifically, the second guide module 239 includes a second guide rail and a second slider slidably connected to the second guide rail. The second guide rail is vertically disposed on one side of the lifting seat 234, and the second slider is disposed on one side of the lower pressure block 220. When the lower pressure block 220 moves relative to the lifting seat 234, the lower pressure block 220 drives the second slider to slide along the length direction of the second guide rail, thereby reducing the coefficient of friction and reducing the wear of parts.

[0068] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A vertical tilting and material handling device, characterized in that, include: The flipping mechanism includes a first mounting base, a vertical turntable, multiple adsorption components disposed on the vertical turntable, and a first driving component for driving the vertical turntable to rotate. The first driving component is disposed on the first mounting base. The multiple adsorption components are arranged in a circular array along the center of the vertical turntable. Each adsorption component includes a support base, a slide rod slidably connected to the support base, a pressure receiving member and a suction nozzle respectively connected to both ends of the slide rod. One end of the slide rod connected to the pressure receiving member faces the center of the vertical turntable. A first elastic member is disposed between the pressure receiving member and the support base. The suction nozzle is used to pick up or release chips. The pressing mechanism, located on one side of the flipping mechanism, includes a second mounting base, a pressing block, and a second drive assembly. The second drive assembly is mounted on the second mounting base and is used to drive the pressing block to rise and fall. When the adsorption component rotates to its lowest point, the second drive component drives the lower pressure block to descend, pressing down on the pressure-receiving component. The pressure-receiving component overcomes the elastic force of the first elastic element and drives the slide rod and the suction nozzle to descend, so that the suction nozzle can pick up the chip.

2. The vertical tilting material handling device according to claim 1, characterized in that, The support base is provided with a sleeve, and the slide rod is slidably connected inside the sleeve.

3. The vertical tilting material handling device according to claim 1, characterized in that, The pressure-bearing component includes a connecting block and a pressure-bearing column. The connecting block is connected to one end of the slide rod facing the center of the vertical turntable, and the pressure-bearing column is disposed on the connecting block.

4. A vertical tilting material handling device according to claim 3, characterized in that, A U-shaped seat is provided on one side of the support base, and two rollers are rotatably connected to the U-shaped seat. The connecting block is located at the opening of the U-shaped seat, and the two rollers are respectively rotatably connected to the two sides of the connecting block.

5. A vertical tilting material handling device according to claim 1, characterized in that, The flipping mechanism further includes a gas distribution component, which includes: The air distribution plate is fixedly installed on the first mounting base. It has a first air passage and a second air passage that are isolated from each other. The air distribution plate is provided with an air extraction connector and an air cut-off connector. The first air passage is connected to the air extraction connector, and the second air passage is connected to the air cut-off connector. The air distribution ring is fixedly mounted on the vertical turntable and is rotatably and sealed to the end face of the air distribution plate. It has multiple independent third air passages inside and multiple connectors that communicate with each of the third air passages in its circumference. The connectors are connected to the corresponding nozzles through air pipes. An air distribution structure is formed on the contact end face of the air distribution plate and the air distribution ring, and is used to selectively connect the third air passage with the first air passage or the second air passage when the vertical turntable rotates.

6. A vertical tilting material handling device according to claim 5, characterized in that, The gas distribution assembly further includes a connecting shaft, a connecting seat, and a pre-compression component. The connecting shaft is disposed on the first mounting seat and passes through the vertical turntable. The connecting seat is disposed at one end of the connecting shaft. The gas distribution plate is connected to the connecting seat through the pre-compression component, which is used to pre-compress the gas distribution plate onto the gas distribution ring.

7. A vertical tilting material handling device according to claim 1, characterized in that, The second drive assembly includes a first motor, a cam, a follower wheel, a lifting seat, and a second elastic element. The first motor is mounted on the second mounting seat. The cam is disposed on the output shaft of the first motor. The follower wheel is disposed on the lifting seat and contacts the cam. The lifting seat is movably connected to the second mounting seat. The lowering block is disposed on the lifting seat. The second elastic element is disposed between the second mounting seat and the lifting seat.

8. A vertical tilting material handling device according to claim 7, characterized in that, The bottom of the second mounting base is provided with a first baffle, which is located directly below the lifting base. The second elastic element is a first spring, which is disposed between the lifting base and the first baffle. The second mounting base and the lifting base are slidably connected in the vertical direction through a first guide module.

9. A vertical tilting material handling device according to claim 7, characterized in that, A buffer assembly is provided between the lower pressure block and the lifting seat. The buffer assembly includes a second baffle and a second spring. The second baffle is disposed on the lifting seat and located directly above the lower pressure block. The second spring is disposed between the second baffle and the lower pressure block. The lifting seat and the lower pressure block are slidably connected in the vertical direction through a second guide module.

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