Semiconductor tape taping mechanism

Abstract

The utility model aims at providing a kind of semiconductor material tape gumming mechanism, it includes base plate, material carrier seat, adhesive tape wheel, pull belt component, pressure material component, cutting component, material carrier seat is set on base plate, and the guide slot for guiding material tape sliding is horizontally set in material carrier seat, and material carrier seat is provided with sticking material block, and adhesive tape wheel rotation is set in the top of base plate, and pull belt component includes pull belt driving part and pull belt clamp, and pull belt driving part is set on base plate, and pull belt clamp is set on the output shaft of pull belt driving part, and pressure material component includes pressure material driving part and pressure material block, and pressure material driving part is set on base plate, and pressure material block is set on the output shaft of pressure material driving part, and cutting component includes cutting driving part, pressure block, cutting knife, and cutting driving part is set on base plate, and pressure block is set on the output shaft of cutting driving part with cutting knife, and cutting driving part is used to drive pressure block to descend to be adhered in the sticking material block with the adhesive tape of cutting knife, so that cutting knife cuts off adhesive tape.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor chip tape and reel, and in particular to a semiconductor tape adhesive application mechanism. Background Technology

[0002] Semiconductor chip tape-and-reel packaging refers to the process of encapsulating chips onto a tape-like carrier to facilitate automated handling, assembly, transportation, and storage. After semiconductor chip tape-and-reel packaging, the tape needs to be wound into a reel for feeding.

[0003] For example, Chinese patent document CN209097854U discloses a semiconductor tape applicator, which includes an applicator for applying finishing adhesive. The applicator includes a tape cutting structure, a tape reel placement area, and a pressure plate correspondingly installed below the applicator area. The pressure plate is mounted on an inner mounting plate via a swing arm, which is connected to a swing arm motor mounted on the back of the inner mounting plate. The tape reel placement area is located on the inner mounting plate, above the tape cutting structure. The tape cutting structure includes a tape-cutting guide block to prevent tape deviation, a tape-cutting blade to cut the finishing adhesive, a folding piece for folding the tape, a guide wheel for guiding the finishing adhesive, a pressure block, a suction cup for holding the tape, and a Z-shaped... The system includes a Z-axis moving cylinder; a tape-cutting guide block mounted on an inner mounting plate, connected to a first dual-axis cylinder, which is fixed to the front of the inner mounting plate; a tape-cutting blade mounted on the inner mounting plate via a second dual-axis cylinder, opposite the tape-cutting guide block; a tape-folding sheet mounted on the inner mounting plate via a third dual-axis cylinder, directly below the second dual-axis cylinder; a guide wheel mounted on the front of the inner mounting plate; a suction cup mounting seat mounted on a slider, connected to a Z-axis moving cylinder; a tape-pressing block mounted on the slider, directly above the Z-axis moving cylinder, with the slider correspondingly mounted on a slide rail; and the Z-axis moving cylinder and slide rail fixedly mounted on the back of the inner mounting plate, directly below the suction cup. The tape-applying mechanism allows for the automatic cutting and finishing of tape by cutting a small section of tape and applying it to the material strip.

[0004] However, the existing adhesive application mechanism described above has the following shortcomings in actual operation: The tail adhesive refers to the tape adhered to the very end of the tape. After the tape is wound into the reel, the tail adhesive can be bonded to the front of the tape for fixation, thus stabilizing the entire reel. However, the existing adhesive application mechanism requires a suction cup to first adhere and fix the tape, then a tape cutter to cut the tape, and finally the suction cup to lower the tape onto the reel for bonding. Therefore, the accuracy of tape application depends on the movement precision of the suction cup, which acts as a transfer mechanism. If the tape is misaligned during cutting by the tape cutter, the tape cannot be accurately bonded to the reel.

[0005] Therefore, in order to overcome the above-mentioned shortcomings, the semiconductor tape application mechanism of this application is proposed. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a semiconductor tape applicator that effectively improves the accuracy of tape application to the tape.

[0007] The objective of this utility model is achieved through the following technical solution: A semiconductor tape application mechanism includes: substrate; A material carrier is disposed on the substrate. A guide groove for guiding the material strip to slide is laterally opened in the material carrier. A material sticking block is disposed on the material carrier. A tape pulley is rotatably mounted on the top of the substrate so that one end of the tape is released from the tape pulley and then adhered to the adhesive block. A pull belt assembly, comprising a pull belt drive and a pull belt clamp, wherein the pull belt drive is disposed on the substrate and the pull belt clamp is disposed on the output shaft of the pull belt drive, the pull belt drive is used to drive the pull belt clamp to move closer to or away from the adhesive block along the direction of the guide groove, and the pull belt clamp is used to clamp the adhesive tape adhered to the adhesive block; A pressing assembly includes a pressing drive and a pressing block. The pressing drive is disposed on the substrate, and the pressing block is disposed on the output shaft of the pressing drive and is located above the guide groove. The pressing drive is used to drive the pressing block to move up and down. A cutting assembly includes a cutting drive, a clamping block, and a cutter. The cutting drive is disposed on the substrate. The clamping block and the cutter are disposed at intervals on the output shaft of the cutting drive, and the clamping block is aligned with the adhesive block. The cutter is located on the side of the clamping block closer to the adhesive block. The cutting drive is used to drive the clamping block to descend so as to adhere the tape to the adhesive block, while the cutter cuts the tape.

[0008] Optionally, a plurality of guide wheels are rotatably disposed on the substrate, with each guide wheel spaced apart between the tape pulley and the adhesive block, so that the tape passes through each guide wheel in sequence.

[0009] Optionally, the pressing drive includes a lifting part, which is disposed on the base plate, and the pressing block is disposed on the output shaft of the lifting part.

[0010] Optionally, the pressing drive further includes a transverse section disposed on the substrate, and the lifting section disposed on the output shaft of the transverse section.

[0011] Optionally, the cutting assembly further includes a carrier plate disposed on the output shaft of the cutting drive, and the clamping block and the cutter are spaced apart on the carrier plate.

[0012] Optionally, an elastic element is sleeved on the clamping block, and the elastic element abuts against the clamping block and the carrier plate respectively.

[0013] Optionally, the cutter is provided with a sharp point.

[0014] Optionally, the adhesive block is provided with a cutting groove, which is used to avoid the cutting blade.

[0015] Optionally, the adhesive block is further provided with a clamping groove, which is perpendicular to the cutting groove, and the clamping groove is used to avoid the pull belt clamp.

[0016] Optionally, the semiconductor tape application mechanism further includes a cutting drive and scissors. The cutting drive is disposed on the substrate, and the scissors are disposed on the output shaft of the cutting drive. The cutting drive is used to drive the scissors to extend into or away from the guide groove.

[0017] Compared with the prior art, the present invention has at least the following advantages: This utility model discloses a semiconductor tape application mechanism, comprising a substrate, a carrier, a tape puller, a tape pulling assembly, a pressing assembly, and a cutting assembly. The carrier is disposed on the substrate, and a guide groove is laterally formed within the carrier to guide the tape sliding. An adhesive block is disposed on the carrier. The tape puller is rotatably disposed on the top of the substrate so that one end of the tape is released from the tape puller and adheres to the adhesive block. The tape pulling assembly includes a tape pulling drive and a tape pulling clamp. The tape pulling drive is disposed on the substrate, and the tape pulling clamp is disposed on the output shaft of the tape pulling drive. The tape pulling drive is used to drive the tape pulling clamp to move closer to or away from the adhesive block along the direction of the guide groove, and the tape pulling clamp is used to clamp the adhesive block. The tape is attached to the adhesive block. The pressing assembly includes a pressing drive and a pressing block. The pressing drive is mounted on a base plate, and the pressing block is mounted on the output shaft of the pressing drive and located above the guide groove. The pressing drive drives the pressing block to move up and down. The cutting assembly includes a cutting drive, a clamping block, and a cutter. The cutting drive is mounted on the base plate, and the clamping block and cutter are spaced apart on the output shaft of the cutting drive. The clamping block is aligned with the adhesive block, and the cutter is located on the side of the clamping block closer to the pressing block. The cutting drive drives the clamping block to descend, thus adhering the tape to the adhesive block while simultaneously cutting the tape. In this way, the tape is first adhered to the material belt by the tape pulling assembly, then the tape is pressed and fixed by the pressing assembly, and finally the tape is cut by the cutting assembly, forming a new tape end on the adhesive block. This eliminates the need for intermediate cut tape transfer, resulting in higher accuracy. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a semiconductor tape application mechanism according to one embodiment of the present invention; Figure 2 for Figure 1 A schematic diagram of the semiconductor tape application mechanism from another angle; Figure 3 This is a schematic diagram of the structure of the material carrier, the belt assembly, and the pressing assembly according to one embodiment of the present invention; Figure 4 This is a schematic diagram of the material carrier and cutting assembly according to one embodiment of the present invention; Figure 5 This is a schematic diagram of the material carrier, shearing drive, and scissors according to one embodiment of the present invention.

[0020] Explanation of reference numerals in the attached figures: 10. Semiconductor tape application mechanism; 100. Substrate; 200. Material carrier; 310. Belt puller; 400. Tape pulling assembly; 500. Material pressing assembly; 600. Cutting assembly; 210. Guide groove; 700. Adhesive block; 20. Tape; 410. Tape pulling drive; 420. Tape pulling clamp; 510. Material pressing drive; 520. Material pressing block; 610. Cutting drive; 620. Pressing block; 630. Cutter; 320. Guide wheel; 511. Lifting part; 512. Lateral movement part; 640. Carrier plate; 650. Elastic element; 631. Sharp part; 710. Cutting groove; 720. Material clamping groove; 810. Shearing drive; 820. Scissors; 910. Swing arm; 920. Swing motor. Detailed Implementation

[0021] To facilitate understanding of this utility model, a more comprehensive description will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model.

[0022] like Figures 1 to 4 As shown, a semiconductor tape application mechanism 10 includes a substrate 100, a material carrier 200, a tape roller 310, a tape pulling assembly 400, a pressing assembly 500, and a cutting assembly 600. The material carrier 200 is disposed on the substrate 100, and a guide groove 210 for guiding the tape sliding is laterally formed in the material carrier 200. An adhesive block 700 is disposed on the material carrier 200. The tape roller 310 is rotatably disposed on the top of the substrate 100 to allow the adhesive to be applied. After one end of the tape 20 is released from the pulley 310, it adheres to the adhesive block 700. The tape pull assembly 400 includes a tape pull drive 410 and a tape pull clamp 420. The tape pull drive 410 is disposed on the base plate 100, and the tape pull clamp 420 is disposed on the output shaft of the tape pull drive 410. The tape pull drive 410 is used to drive the tape pull clamp 420 to move closer to or away from the adhesive block 700 along the direction of the guide groove 210. The tape pull clamp 420 is used to clamp and adhere the tape to the adhesive block 700. The adhesive tape on the adhesive block 700 is supported by a pressing assembly 500, which includes a pressing drive 510 and a pressing block 520. The pressing drive 510 is disposed on the substrate 100, and the pressing block 520 is disposed on the output shaft of the pressing drive 510 and is located above the guide groove 210. The pressing drive 510 is used to drive the pressing block 520 to perform lifting and lowering movements. The cutting assembly 600 includes a cutting drive 610, a clamping block 620, and a cutter. 630. The cutting drive 610 is disposed on the substrate 100. The clamping block 620 and the cutter 630 are disposed at intervals on the output shaft of the cutting drive 610. The clamping block 620 is aligned with the adhesive block 700, and the cutter 630 is located on the side of the clamping block 620 closer to the pressure block 520. The cutting drive 610 is used to drive the clamping block 620 down to adhere the tape to the adhesive block 700 while the cutter 630 cuts the tape.

[0023] It should be noted that the substrate 100 is vertically mounted, and the material carrier 200 is fixedly mounted on one side of the substrate 100 by screws. A guide groove 210 is formed laterally within the material carrier 200, allowing the tape to slide along the guide groove 210 and thus pass directionally through the material carrier 200. An adhesive block 700 is provided on the top surface of one end of the material carrier 200. For example, the adhesive block 700 can be mounted on the material carrier 200 by screws, or it can be integrally formed with the material carrier 200. The tape pulley 310 is rotatably mounted on the top of the substrate 100 via a rotating shaft, so that one end of the tape is gradually released from the tape pulley 310 and adheres to the adhesive block 700. The belt drive 410 is mounted on the substrate 100. For example, the belt drive 410 is a belt module driven by a motor, and a first slider is slidably mounted laterally on the substrate 100. The first slider is fixedly connected to the belt. The belt clamp 420 is a pneumatic clamp and is fixed on the first slider. Thus, the belt is driven to rotate by the motor, causing the first slider to slide laterally along the substrate 100, thereby allowing the belt clamp 420 to slide laterally back and forth. When the belt clamp 420 approaches the adhesive block 700, the belt clamp 420 clamps one end of the tape on the adhesive block 700. Then, the belt drive 410 drives the belt clamp 420 to slide away from the adhesive block 700, so that the tape is pulled out and the tape is located above the guide groove 210, that is, above the material belt. A pressing drive unit 510 is mounted on the substrate 100, and a pressing block 520 is located above the guide groove 210. The pressing drive unit 510 drives the pressing block 520 to descend, pressing the pulled-out tape onto the strip. Then, the pressing drive unit 510 drives the pressing block 520 to rise and return to its original position. Finally, a cutting drive unit 610 drives the clamping block 620 and the cutter 630 to descend simultaneously. The clamping block 620 presses the tape onto the adhesive block 700, while the cutter 630 cuts the tape between the pressing block 520 and the clamping block 620. For example, the cutting drive unit 610 can be a cylinder. In this way, tape can be applied to the end of the strip, and the above actions can be repeated for subsequent operations. In this application, the tape is first adhered to the material belt and then cut, rather than being cut first and then transferred. This effectively ensures the accuracy of the tape adhesion to the material belt.

[0024] like Figure 1 , Figure 2 As shown, in one embodiment, a plurality of guide wheels 320 are rotatably disposed on the substrate 100, and each guide wheel 320 is spaced apart between the tape pulley 310 and the adhesive block 700, so that the tape passes through each guide wheel 320 in sequence.

[0025] It should be noted that, in order to ensure that the tape can be stably drawn from the pulley 310 and guided and adhered to the adhesive block 700, a plurality of guide wheels 320 are rotatably mounted between the pulley 310 and the adhesive block 700. For example, by mounting a pin on the substrate 100, the guide wheels 320 are fixed to the pin by ball bearings, allowing the guide wheels 320 to rotate relative to the substrate 100.

[0026] like Figures 1 to 3 As shown, in one embodiment, the pressing drive 510 includes a lifting part 511, which is disposed on the base plate 100, and the pressing block 520 is disposed on the output shaft of the lifting part 511.

[0027] It should be noted that, for example, the lifting part 511 is a cylinder, which drives the pressing block 520 to move up and down, so that when the pressing block 520 descends, it can stick and fix the tape to the end of the material belt.

[0028] like Figures 1 to 3 As shown, in one embodiment, the pressing drive 510 further includes a transverse section 512, which is disposed on the substrate 100, and a lifting section 511 is disposed on the output shaft of the transverse section 512.

[0029] It should be noted that, for example, the transverse section 512 is also a belt module driven by a motor, wherein a second slide plate is slidably mounted on the base plate 100, so that the second slide plate is connected to the transverse section 512, and the lifting section 511 is mounted on the second slide plate. In this way, the transverse section 512 drives the lifting section 511 to move laterally, and the lifting section 511 drives the pressing block 520 to move up and down, so that the pressing block 520 can press different parts of the tape multiple times, so that the tape can be reliably bonded and fixed on the material belt.

[0030] like Figure 2 and Figure 4 As shown, in one embodiment, the cutting assembly 600 further includes a carrier plate 640, which is disposed on the output shaft of the cutting drive member 610, and the clamping block 620 and the cutter 630 are disposed at intervals on the carrier plate 640.

[0031] It should be noted that the cutting drive 610 is mounted on the back side of the substrate 100, and one end of the carrier plate 640 is mounted on the output shaft of the cutting drive 610, with the carrier plate 640 extending through the substrate 100 to the front side of the substrate 100. The clamping block 620 and the cutter 630 are both mounted on the carrier plate 640. This facilitates the fixed mounting of the clamping block 620 and the cutter 630 on the output shaft of the cutting drive 610.

[0032] like Figure 1 , Figure 2 and Figure 4As shown, in one embodiment, an elastic element 650 is sleeved on the clamping block 620, and the elastic element 650 abuts against the clamping block 620 and the carrier plate 640 respectively.

[0033] It should be noted that the elastic element 650 is a helical spring, which is sleeved on the clamping block 620, so that both ends of the elastic element 650 abut against the clamping block 620 and the carrier plate 640 respectively. Thus, when the clamping block 620 presses the tape onto the adhesive block 700, the elastic element 650 is compressed, and the elastic force of the elastic element 650 is used to tighten the tape.

[0034] like Figure 4 As shown, in one embodiment, the cutter 630 is provided with a sharp portion 631. Thus, the sharp portion 631 can reliably cut the tape.

[0035] like Figure 3 and Figure 4 As shown, in one embodiment, the adhesive block 700 has a cutting groove 710, which is used to prevent the cutter 630 from cutting. In this way, when the cutter 630 cuts into the cutting groove 710, it can reliably cut the tape.

[0036] Furthermore, such as Figure 3 and Figure 4 As shown, in one embodiment, the adhesive block 700 is further provided with a clamping groove 720, which is perpendicular to the cutting groove 710. The clamping groove 720 is used to avoid the air pulling of the clamp 420.

[0037] It should be noted that the extension direction of the clamping groove 720 is perpendicular to the extension direction of the cutting groove 710. Since the cutter 630 is located on the side of the clamping block 620 that is close to the pressing block 520, when the clamping block 620 presses the tape onto the adhesive block 700, the cutter 630 cuts the tape. At this time, the tape is separated by the cutting groove 710, and the newly formed end of the tape will cover the clamping groove 720. In one working cycle, the tape clamp 420 can clamp the new end of the tape on the clamping groove 720.

[0038] like Figure 1 and Figure 5 As shown, in one embodiment, the semiconductor tape application mechanism 10 further includes a cutting drive 810 and scissors 820. The cutting drive 810 is disposed on the substrate 100, and the scissors 820 is disposed on the output shaft of the cutting drive 810. The cutting drive 810 is used to drive the scissors 820 to extend into or away from the guide groove 210.

[0039] It should be noted that before applying adhesive to the end of the feed channel, the continuous strip needs to be cut. Therefore, a shearing drive 810 is slidably installed in the middle of the guide groove 210. In one embodiment, the shearing drive 810 is a cylinder. The shearing drive 810 is installed on the back side of the substrate 100. The shearing drive 810 drives the scissors 820 to pass through the substrate 100 and approach the guide groove 210. Furthermore, in one embodiment, the scissors 820 are pneumatic scissors. In this way, the shearing drive 810 first drives the scissors 820 to approach the guide groove 210, and then the scissors 820 cuts the material strip. Then, the pull drive 410 drives the pull clamp 420 to pull the end of the tape on the adhesive block 700 to above the end of the cut material strip (the end of the material strip refers to the tail end of the material strip wound on the spool). Then, the pressing drive 510 drives the pressing block 520 to press and bond the tape to the end of the cut material strip. Finally, the cutting drive 610 drives the pressing block 620 and the cutter 630 to descend, so that the pressing block 620 bonds the tape to the adhesive block 700 while the cutter 630 cuts the tape. In this way, the material strip continues to be wound onto the spool, so that the tape follows the end of the material strip and is wound onto the spool for bonding and fixing.

[0040] like Figure 1 and Figure 2 As shown, in one embodiment, the semiconductor tape application mechanism 10 further includes a swing arm 910 and a swing motor 920. One end of the swing arm 910 is rotatably mounted on the substrate 100 and is connected to the guide groove 210. The swing motor 920 is mounted on the substrate 100, and its output shaft is connected to the swing arm 910. Thus, the swing motor 920 drives the swing arm 910 to rotate, making the other end of the swing arm 910 a free end that can extend into the tray. After the tape enters the swing arm 910 through the guide groove 210, it is then guided by the swing arm 910 and wound and fixed in the tray.

[0041] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the utility model patent. Unless otherwise specifically defined, the installation / fixing / setting mentioned in this utility model can be understood as including, but not limited to, locking and fixing with screws / bolts, welding, or bonding with adhesives, wherein the adhesives used can be commercially available finished products. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A semiconductor tape application mechanism, characterized in that, include: substrate; A material carrier is disposed on the substrate. A guide groove for guiding the material strip to slide is laterally opened in the material carrier. A material sticking block is disposed on the material carrier. A tape pulley is rotatably mounted on the top of the substrate so that one end of the tape is released from the tape pulley and then adhered to the adhesive block. A pull belt assembly, comprising a pull belt drive and a pull belt clamp, wherein the pull belt drive is disposed on the substrate and the pull belt clamp is disposed on the output shaft of the pull belt drive, the pull belt drive is used to drive the pull belt clamp to move closer to or away from the adhesive block along the direction of the guide groove, and the pull belt clamp is used to clamp the adhesive tape adhered to the adhesive block; A pressing assembly includes a pressing drive and a pressing block. The pressing drive is disposed on the substrate, and the pressing block is disposed on the output shaft of the pressing drive and is located above the guide groove. The pressing drive is used to drive the pressing block to move up and down. A cutting assembly includes a cutting drive, a clamping block, and a cutter. The cutting drive is disposed on the substrate. The clamping block and the cutter are disposed at intervals on the output shaft of the cutting drive, and the clamping block is aligned with the adhesive block. The cutter is located on the side of the clamping block closer to the adhesive block. The cutting drive is used to drive the clamping block to descend so as to adhere the tape to the adhesive block, while the cutter cuts the tape.

2. The semiconductor tape application mechanism according to claim 1, characterized in that, The substrate is also rotatably provided with a plurality of guide wheels, each of which is spaced apart between the tape pulley and the adhesive block, so that the tape passes through each of the guide wheels in sequence.

3. The semiconductor tape application mechanism according to claim 1, characterized in that, The pressing drive includes a lifting part, which is disposed on the base plate, and the pressing block is disposed on the output shaft of the lifting part.

4. The semiconductor tape application mechanism according to claim 3, characterized in that, The pressing drive also includes a transverse section, which is disposed on the substrate, and the lifting section is disposed on the output shaft of the transverse section.

5. The semiconductor tape application mechanism according to claim 1, characterized in that, The cutting assembly also includes a carrier plate, which is disposed on the output shaft of the cutting drive, and the clamping block and the cutter are spaced apart on the carrier plate.

6. The semiconductor tape application mechanism according to claim 5, characterized in that, An elastic element is fitted onto the clamping block, and the elastic element abuts against both the clamping block and the carrier plate.

7. The semiconductor tape application mechanism according to claim 5, characterized in that, The cutter is provided with a sharp point.

8. The semiconductor tape application mechanism according to claim 1, characterized in that, The adhesive block has a cutting groove, which is used to avoid the cutting blade.

9. The semiconductor tape application mechanism according to claim 8, characterized in that, The adhesive block is also provided with a clamping groove, which is perpendicular to the cutting groove. The clamping groove is used to avoid the pull belt clamp.

10. The semiconductor tape application mechanism according to claim 1, characterized in that, The semiconductor tape application mechanism further includes a cutting drive and scissors. The cutting drive is disposed on the substrate, and the scissors are disposed on the output shaft of the cutting drive. The cutting drive is used to drive the scissors to extend into or away from the guide groove.

Images