Deflection head mechanism for ultrafine filaments

CN224831641UActive Publication Date: 2026-10-09SUZHOU GEJING NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202522041203.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-23
Publication Date
2026-10-09
Estimated Expiration
2035-09-23

AI Technical Summary

Benefits of technology

[0013]与现有技术相比,本实用新型结构简单、安装便捷、使用成本低、可靠性高、寿命长;使用过程中旋转调节轴板会在弹簧力的作用下自动跟随第一千分尺微测头的位置自动调节,操作方便。

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Abstract

The utility model discloses a production equipment mounting seat, the vertical board of production equipment mounting seat has height adjustable equipment butt joint loading structure, forms high low adjustable equipment butt joint part, and the horizontal board on production equipment mounting seat is equipped with the loading plate front and rear adjustable load groove, and the horizontal board of loading plate is connected in the loading plate front and rear adjustable load groove through the fixed part, and the horizontal board of loading plate is rotatable to set up the head adjustment part rotation axle board, sets up the head adjustment part guide wheel module on the head adjustment part rotation axle board, and corresponds the head adjustment part rotation axle board, and still sets up the micrometer fine adjustment module on the loading plate, and the micrometer fine adjustment module includes first micrometer fine measurement head, second micrometer fine measurement head, and the elastic support part that sets up with the spring of cylindrical pin is formed to the first micrometer fine measurement head, second micrometer fine measurement head.
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Description

Technical Field

[0001] This utility model relates to photovoltaic silicon wafer production technology and equipment, and particularly to ultrafine filaments for photovoltaic production and their preparation technology and equipment. Specifically, it relates to an adjustment mechanism for ultrafine filaments. Background Technology

[0002] The preparation of ultrafine filaments and tungsten metal wires for photovoltaic silicon wafer cutting is a metal plastic processing process in which the wire is pulled out from the die hole of the wire exiting die under the action of drawing force to produce wires with smaller diameters. In order to ensure the stability of wire quality and uniform internal stress, manual adjustment is required to ensure that the wire is placed on a plane and forms a stable loop without any curling ends.

[0003] Therefore, it is necessary to provide a tilting mechanism for ultrafine filaments to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a tilting mechanism for ultrafine filaments.

[0005] The technical solution is as follows: A tilting head adjustment mechanism for ultrafine filaments includes a production equipment mounting base. The vertical plate of the production equipment mounting base has a height-adjustable equipment docking and loading structure, forming a height-adjustable equipment docking part. The horizontal plate on the production equipment mounting base has a front-to-back adjustable loading groove for the loading plate. The horizontal plate of the loading plate is connected to the front-to-back adjustable loading groove for the loading plate by a fastener. A tilting head adjustment part rotating shaft plate is rotatably provided on the loading plate. A tilting head adjustment guide wheel module is provided on the tilting head adjustment part rotating shaft plate, and a micrometer fine adjustment module is also provided on the loading plate. The micrometer fine adjustment module includes a first micrometer probe and a second micrometer probe, and each of the first and second micrometer probes is provided with an elastic support part consisting of a cylindrical pin and a spring.

[0006] Furthermore, the tilting head guide wheel module includes a guide wheel support shaft, one end of which is connected to the rotating shaft plate of the tilting head adjustment part, and the other end is rotatably equipped with the tilting head guide wheel.

[0007] Furthermore, a deep groove ball bearing is installed between the tilting head guide wheel and the guide wheel support shaft.

[0008] Furthermore, a bearing cap is also provided for the deep groove ball bearing, which is fixed by an internal hexagonal flathead screw.

[0009] Furthermore, the height-adjustable equipment docking and loading structure consists of a set of symmetrically arranged waist-shaped holes.

[0010] Furthermore, the fastener is formed by a combination of hex socket screws, elastic washers, and flat washers.

[0011] Furthermore, the loading plate is also equipped with a rotating shaft plate auxiliary support plate for the tilting adjustment section.

[0012] Furthermore, a smooth rotation component consisting of a deep groove ball bearing is provided between the auxiliary support plate of the tilting head adjustment section's rotating shaft plate, the loading plate, and the tilting head adjustment section's rotating shaft plate.

[0013] Compared with the prior art, this utility model has a simple structure, is easy to install, has low operating cost, high reliability, and long service life; during use, the rotating adjustment shaft plate will automatically adjust to the position of the first micrometer measuring head under the action of spring force, making operation convenient. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the present invention.

[0015] Figure 2 yes Figure 1 A sectional view of cc.

[0016] Figure 3 This is an isometric side view of the present invention. Detailed Implementation

[0017] Please see Figure 1-3 This embodiment demonstrates a tilting mechanism for ultrafine filaments, including a production equipment mounting base 1. The vertical plate of the production equipment mounting base 1 has a height-adjustable equipment docking loading structure 11, forming a height-adjustable equipment docking part. The horizontal plate on the production equipment mounting base 1 has a front-to-back adjustable loading groove 12. The horizontal plate 21 of the loading plate 2 is connected to the front-to-back adjustable loading groove 12 of the loading plate through a fixing member 3. A tilting adjustment part rotating shaft plate 4 is rotatably provided on the loading plate 2. A tilting guide wheel module 5 is provided on the tilting adjustment part rotating shaft plate 4. Corresponding to the tilting adjustment part rotating shaft plate 4, a micrometer fine adjustment module 6 is also provided on the loading plate 2. The micrometer fine adjustment module 6 includes a first micrometer micrometer head 61 and a second micrometer micrometer head 62, and an elastic support part consisting of a cylindrical pin 64 and a spring 63 is provided for the first micrometer micrometer head 61 and the second micrometer micrometer head 62.

[0018] The tilting head guide wheel module 5 includes a guide wheel support shaft 51, one end of which is connected to the tilting head adjustment part rotating shaft plate 4, and the other end is rotatably equipped with a tilting head guide wheel 52.

[0019] A deep groove ball bearing 53 is provided between the tilting head guide wheel 52 and the guide wheel support shaft 51.

[0020] The deep groove ball bearing 53 is also provided with a bearing cover 54, which is fixed by an internal hexagonal flat head screw 55.

[0021] The height-adjustable equipment docking and loading structure 11 consists of a set of symmetrically arranged waist-shaped holes.

[0022] The fastener 3 is formed by combining an internal hex screw 31, an elastic washer 32, and a flat washer 33.

[0023] The loading plate 2 is also equipped with a rotating shaft plate auxiliary support plate 7 for the tilting adjustment part.

[0024] A smooth rotation component consisting of a deep groove ball bearing is provided between the auxiliary support plate 7 of the tilting head adjustment section, the loading plate 2, and the tilting head adjustment section rotation shaft plate 4.

[0025] During actual adjustment, first loosen the second micrometer measuring head 62, and then tighten or loosen the first micrometer measuring head 61 as needed. The rotating shaft plate 4 of the tilting head adjustment part will automatically follow the position of the first micrometer measuring head 61 under the action of spring force. After the adjustment is completed, tighten the second micrometer measuring head 62 to completely fix the mechanism and ensure the stability of the mechanism during subsequent start-up.

[0026] Compared with the prior art, this utility model has a simple structure, is easy to install, has low operating cost, high reliability, and long service life; during use, the rotating adjustment shaft plate will automatically adjust to the position of the first micrometer measuring head under the action of spring force, making operation convenient.

[0027] For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A tilting head mechanism for ultrafine filaments, characterized in that: The equipment includes a production equipment mounting base. The vertical plate of the production equipment mounting base has a height-adjustable equipment docking and loading structure, forming a height-adjustable equipment docking part. The horizontal plate on the production equipment mounting base has a front-to-back adjustable loading groove for the loading plate. The horizontal plate of the loading plate is connected to the front-to-back adjustable loading groove for the loading plate by fasteners. The loading plate is rotatably equipped with a tilting head adjustment part rotating shaft plate. The tilting head adjustment part rotating shaft plate is equipped with a tilting head guide wheel module. Corresponding to the tilting head adjustment part rotating shaft plate, the loading plate is also equipped with a micrometer fine adjustment module. The micrometer fine adjustment module includes a first micrometer probe and a second micrometer probe, and each of the first and second micrometer probes is provided with an elastic support part consisting of a cylindrical pin and a spring.

2. The tilting mechanism for an ultrafine filament according to claim 1, characterized in that: The tilting head guide wheel module includes a guide wheel support shaft, one end of which is connected to the rotating shaft plate of the tilting head adjustment part, and the other end is rotatably equipped with the tilting head guide wheel.

3. The tilting mechanism for an ultrafine filament according to claim 2, characterized in that: A deep groove ball bearing is installed between the tilting head guide wheel and the guide wheel support shaft.

4. The tilting mechanism for an ultrafine filament according to claim 3, characterized in that: The deep groove ball bearing is also equipped with a bearing cap, which is fixed by an internal hexagonal flathead screw.

5. The tilting mechanism for an ultrafine filament according to any one of claims 1-4, characterized in that: The height-adjustable equipment docking and loading structure consists of a set of symmetrically arranged waist-shaped holes.

6. The tilting mechanism for an ultrafine filament according to claim 5, characterized in that: The fastener is composed of an internal hexagonal screw, a spring washer, and a flat washer.

7. The tilting mechanism for an ultrafine filament according to claim 6, characterized in that: The loading plate is also equipped with a rotating shaft plate auxiliary support plate for the tilting adjustment section.

8. The tilting mechanism for ultrafine filaments according to claim 7, characterized in that: The auxiliary support plate and loading plate of the tilting head adjustment section are connected by a rotation smoothing component consisting of a deep groove ball bearing.