LED packaging high-temperature adhesive tape
Patent Information
- Application Number
- CN202522087311.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-28
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-28
AI Technical Summary
PET基材本身的机械强度较低，且单面涂布的胶层厚度较薄(通常0.05-0.1mm)，导致传统高温胶带的抗撕裂性能不足，在LED封装过程中，若遇到芯片贴装时的挤压、搬运时的碰撞，易出现胶层撕裂、破损，影响封装效
[0012]本实用新型的有益效果：PET薄膜作为胶带的核心基材，承担维持胶带形状、提供机械强度的作用；隔热层位于PET薄膜层与耐高温粘结剂层之间，防止高温从耐高温粘结剂层传导至PET薄膜层，避免PET薄膜因长期接触高温而软化、失去机械强度，从而延长胶带的使用寿命。耐高温粘结剂层与有机硅压敏胶层协同作用，用于增强胶带与LED组件的粘结强度，并提高胶带的耐高温稳定性。有机硅压敏胶的柔韧性使其能贴合LED组件的不规则表面(如芯片边缘、基板凹凸处)。离型层位于胶带最外层，保护有机硅压敏胶层(防止粘连、污染)，便于胶带的存储、模切和贴装。总体而言，本申请通过PET薄膜层、隔热层、耐高温粘结剂层、有机硅压敏胶粘剂层及离型层的五层复合设计，实现了“隔热-粘结-保护”的多重功能，针对性解决了传统LED封装高温胶带在高温环境下PET基材易发生软化、变形甚至熔化，导致胶带固定作用失效的技术问题。
Smart Images
Figure CN224832555U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of tape technology, specifically to a high-temperature tape for LED packaging. Background Technology
[0002] Traditional high-temperature LED packaging tapes are made of flexible polyester film (PET) as the substrate, with a high-performance silicone pressure-sensitive adhesive uniformly coated on one side. The PET substrate itself has low mechanical strength, and the adhesive layer on one side is relatively thin (typically 0.05-0.1mm), resulting in insufficient tear resistance. During LED packaging, if subjected to pressure during chip mounting or impacts during handling, the adhesive layer is prone to tearing and damage, affecting the packaging effect. Furthermore, the upper limit of the high-temperature resistance of the PET substrate is typically around 200℃ (long-term operating temperature is approximately 120℃). Under high-temperature environments, the PET substrate is prone to softening, deformation, or even melting, causing the tape to fail in its fixing function. Utility Model Content
[0003] To solve the above problems, this utility model provides a high-temperature adhesive tape for LED packaging.
[0004] The technical solution adopted in this utility model is:
[0005] A high-temperature LED encapsulation tape includes a PET film layer, a heat insulation layer, a high-temperature resistant adhesive layer, an organosilicon pressure-sensitive adhesive layer, and a release layer. The heat insulation layer is a polyurethane microporous membrane layer, used to isolate the PET film layer and the high-temperature resistant adhesive layer and prevent high temperature from being conducted to the PET film layer. The high-temperature resistant adhesive layer is a phenolic resin adhesive layer, used to improve the overall high-temperature resistance of the tape. The organosilicon pressure-sensitive adhesive layer is used for bonding the tape to the LED component.
[0006] Furthermore, the thickness of the polyurethane microporous membrane is 100-300 μm.
[0007] Furthermore, the micropore diameter of the polyurethane microporous membrane is 10-20 μm.
[0008] Furthermore, the thickness of the phenolic resin adhesive layer is 30-80 μm.
[0009] Furthermore, the thickness of the PET film layer is 35-95 μm.
[0010] Furthermore, the thickness of the silicone pressure-sensitive adhesive layer is 10-50 μm.
[0011] Furthermore, the thickness of the release layer is 25-100 μm.
[0012] The beneficial effects of this invention are as follows: The PET film, as the core substrate of the tape, plays a crucial role in maintaining the tape's shape and providing mechanical strength. The heat insulation layer, located between the PET film layer and the high-temperature resistant adhesive layer, prevents high temperatures from being conducted from the adhesive layer to the PET film layer, thus avoiding softening and loss of mechanical strength due to prolonged exposure to high temperatures, thereby extending the tape's service life. The high-temperature resistant adhesive layer and the silicone pressure-sensitive adhesive layer work synergistically to enhance the bonding strength between the tape and the LED components and improve the tape's high-temperature stability. The flexibility of the silicone pressure-sensitive adhesive allows it to conform to irregular surfaces of the LED components (such as chip edges and substrate unevenness). The release layer, located on the outermost layer of the tape, protects the silicone pressure-sensitive adhesive layer (preventing adhesion and contamination) and facilitates the tape's storage, die-cutting, and mounting. Overall, this application achieves multiple functions of "heat insulation, bonding, and protection" through a five-layer composite design consisting of a PET film layer, a heat insulation layer, a high-temperature resistant adhesive layer, an organosilicon pressure-sensitive adhesive layer, and a release layer. It specifically solves the technical problem that traditional LED packaging high-temperature tapes are prone to softening, deformation, or even melting of the PET substrate under high-temperature conditions, leading to the failure of the tape's fixing effect. Attached Figure Description
[0013] Figure 1 This is a structural schematic diagram of a high-temperature LED packaging tape according to this application. Detailed Implementation
[0014] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with the accompanying drawings and preferred embodiments.
[0015] See Figure 1 A high-temperature LED encapsulation tape includes a PET film layer 10, a heat insulation layer 20, a high-temperature resistant adhesive layer 30, a silicone pressure-sensitive adhesive layer 40, and a release layer 50 connected in sequence. The heat insulation layer isolates the PET film layer and the high-temperature resistant adhesive layer, preventing high temperature conduction to the PET film layer; the high-temperature resistant adhesive layer improves the high-temperature resistance of the tape; and the silicone pressure-sensitive adhesive layer is used for bonding the tape to the LED assembly.
[0016] The PET film layer 10 is made of PET film, and its thickness is selected in the range of 35-95μm.
[0017] In this embodiment, the heat insulation layer 20 is composed of a polyurethane microporous membrane with a thickness selected in the range of 100-300 μm to ensure heat insulation effect and maintain the overall structural compactness of the tape. The micropore diameter of the polyurethane microporous membrane layer is 10-20 μm to ensure its good heat insulation performance and maintain the flexibility of the membrane. The thermal conductivity of the polyurethane microporous membrane is typically 0.018-0.024 W / (m·K), which can effectively block high-temperature conduction between the PET film layer and the high-temperature resistant adhesive layer, protecting the PET film from softening.
[0018] In this embodiment, the high-temperature resistant adhesive layer 30 is a phenolic resin adhesive layer, with a thickness selected in the range of 40-60 μm to balance high-temperature resistance with the overall compactness of the tape structure. Ordinary phenolic resin can withstand long-term temperatures of 150-200℃ and short-term (e.g., tens of hours) temperatures exceeding 300℃, far higher than PET film (softening point approximately 250℃). This effectively isolates the high temperatures in LED encapsulation, preventing the PET film from softening or delaminating.
[0019] The silicone pressure-sensitive adhesive layer 40 is the surface functional layer of the tape, which comes into direct contact with LED components (such as chips, substrates, and reflectors). Its thickness is selected within the conventional range of 10-50 μm.
[0020] Release layer 50 is located on the outermost layer of the tape and is used to protect the silicone pressure-sensitive adhesive layer from contamination, moisture or mechanical damage. It can be release paper or release film, and its thickness can be selected in the range of 25-50μm.
[0021] The preparation method of this application is as follows:
[0022] 1. PET film and polyurethane microporous membrane are stacked and then hot-pressed together at 120-180℃ to obtain a composite film;
[0023] 2. Apply a high-temperature resistant adhesive layer 30 and an organosilicon pressure-sensitive adhesive layer 40 sequentially to the outer surface of the heat insulation layer 20 of the composite film, lay the release paper, and perform a second hot pressing within the range of 150-180℃, curing for 1-2 hours to obtain the final product.
[0024] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications are also within the protection scope of the present utility model.
Claims
1. A high-temperature adhesive tape for LED encapsulation, characterized in that, It includes a PET film layer, a heat insulation layer, a high-temperature resistant adhesive layer, an organosilicon pressure-sensitive adhesive layer, and a release layer; the heat insulation layer is a polyurethane microporous membrane layer, used to isolate the PET film layer and the high-temperature resistant adhesive layer and prevent high temperature from being conducted to the PET film layer; the high-temperature resistant adhesive layer is a phenolic resin adhesive layer, used to improve the overall high-temperature resistance of the tape; and the organosilicon pressure-sensitive adhesive layer is used for bonding the tape to the LED components.
2. The high-temperature LED encapsulation tape according to claim 1, characterized in that, The thickness of the polyurethane microporous membrane is 100-300μm.
3. The high-temperature LED encapsulation tape according to claim 2, characterized in that, The micropore diameter of the polyurethane microporous membrane is 10-20 μm.
4. The high-temperature LED encapsulation tape according to claim 1, characterized in that, The thickness of the phenolic resin adhesive layer is 40-60 μm.
5. The high-temperature LED encapsulation tape according to claim 1, characterized in that, The thickness of the PET film layer is 35-95μm.
6. The high-temperature LED encapsulation tape according to claim 1, characterized in that, The thickness of the silicone pressure-sensitive adhesive layer is 10-50 μm.
7. The high-temperature LED encapsulation tape according to claim 1, characterized in that, The thickness of the release layer is 25-50 μm.