High temperature masking tape

Abstract

The utility model discloses a high temperature shielding adhesive tape, including support layer and setting a plurality of adhesive tape unit on support layer, the adhesive tape unit includes first adhesive layer, substrate layer, breathable layer, second adhesive layer and the layer of type separation that first adhesive layer, substrate layer, breathable layer, second adhesive layer are connected in turn and stack, first adhesive layer is used for bonding substrate layer on support layer, the center area of second adhesive layer is equipped with through -hole, breathable layer is used for in the welding through the through -hole with PCB board sound hole center area connection, the steam and gas generated from sound hole are discharged, substrate layer is used for in the welding completely closed cover PCB board sound hole, this adhesive tape utilizes substrate layer to realize the complete sealing of sound hole, forms the exhaust passage through breathable layer and through -hole simultaneously, effectively discharges the welding gas, effectively solved the problem that traditional shielding adhesive tape in the closed sound hole welding high temperature leads to the position of the air hole to produce steam, after that, steam will form impurity, influence the sound effect.

Description

Technical Field

[0001] This utility model relates to the field of adhesive tape technology, specifically to a high-temperature masking adhesive tape. Background Technology

[0002] In the electronics manufacturing industry, any sensor or component that needs to physically interact with the external environment will have a corresponding "channel" or "interface" formed on the PCB board, which requires special protection during manufacturing. For example, the PCB board has a series of small holes or a slot on the sound output channels of microphones, speakers, and receivers, forming "sound output holes." During soldering, these sound output holes also need to be protected to prevent them from being blocked by solder or flux, otherwise the sound will become quieter, muffled, and the sound quality will be severely damaged. However, the high-temperature tape currently used completely seals the vent holes. When the circuit board is wave soldering or reflow soldering, the high temperature causes moisture to form at the vent holes. This moisture then forms impurities, affecting the sound output. Utility Model Content

[0003] To solve the above problems, this utility model provides a high-temperature masking tape.

[0004] The technical solution adopted in this utility model is:

[0005] A high-temperature masking tape includes a support layer and a plurality of tape units disposed on the support layer; each tape unit includes a first adhesive layer, a substrate layer, a breathable layer, a second adhesive layer, and a release layer stacked sequentially; the first adhesive layer is used to bond the substrate layer to the support layer; the second adhesive layer has a through hole in its central region; the breathable layer is used to connect with the central region of the PCB board's sound outlet through the through hole during welding, allowing moisture generated during welding to escape from the sound outlet; the substrate layer is used to completely seal and cover the PCB board's sound outlet during welding.

[0006] Furthermore, the diameter of the through hole is 1 / 2 to 1 / 3 of the diameter of the sound outlet hole on the PCB board.

[0007] Furthermore, the breathable layer is made of polytetrafluoroethylene microporous membrane, which is connected to the substrate layer by an adhesive or by hot-pressing.

[0008] Furthermore, the thickness of the polytetrafluoroethylene microporous membrane is 50–120 μm, and / or its micropore diameter is 0.1–

[0009] 1.0μm.

[0010] Furthermore, the substrate layer is made of PI tape, PET tape, or PEEK tape.

[0011] Furthermore, the thickness of the substrate layer is 30–50 μm.

[0012] Furthermore, the first, second, and third adhesive layers are all silicone pressure-sensitive adhesive layers.

[0013] Furthermore, the support layer is made of release paper or release film.

[0014] The beneficial effects of this invention are as follows: During high-temperature soldering processes such as reflow soldering, the trace amounts of moisture remaining in the PCB board's exhaust holes rapidly vaporize upon heating, forming high-pressure water vapor. Simultaneously, some volatile organic compounds also vaporize and enter the venting layer through the adhesive layer's pores. Because the venting layer itself has a microporous structure, when the gas enters from the central pore, it naturally diffuses radially outwards along the path of least resistance, eventually escaping into the atmosphere from the edge area of ​​the venting layer. Throughout the entire process, the substrate layer maintains its structural integrity and airtightness, ensuring that external contaminants cannot enter during the entire exhaust process. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a high-temperature masking tape according to the present invention.

[0016] Figure 2 This is a schematic diagram of the tape unit structure. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with the accompanying drawings and preferred embodiments.

[0018] See Figure 1 and Figure 2 A high-temperature masking tape includes a support layer 10 and a plurality of tape units 20 disposed on the support layer; the tape unit 20 includes a first adhesive layer 21, a substrate layer 22, a third adhesive layer 23, a breathable layer 24, a second adhesive layer 25 and a release layer 26 that are stacked in sequence.

[0019] The support layer 10 is made of ordinary release paper or release film and mainly serves to support and fix the tape unit 20. Several tape units are fixed side by side on the support layer through the first adhesive layer 21, so that the entire tape can be wound up through the support layer, which is convenient for industrial production, transportation and use.

[0020] The first adhesive layer 21 is used to bond the substrate layer 22 to the support layer, and its thickness is controlled between 10 μm and 35 μm. Preferably, the first adhesive layer is a silicone pressure-sensitive adhesive layer, which facilitates the peeling of the tape unit from the support layer without leaving any adhesive residue.

[0021] The substrate layer 22 is made of PI tape, PET tape or PEEK tape, and its thickness is controlled between 30 and 50 μm. The outer dimensions of the substrate layer are adapted to the sound outlet holes of the PCB board, and its edge must be 3 to 5 mm larger than the sound outlet holes of the PCB board to achieve complete coverage.

[0022] In this embodiment, the breathable layer 24 is made of a polytetrafluoroethylene microporous membrane with a thickness of 50–120 μm and a micropore size of 0.1–1.0 μm. It is connected to the substrate layer through a third adhesive layer 23. The strong adhesion provided by the adhesive ensures that the breathable layer does not separate from the substrate layer under high temperature and airflow impact. The third adhesive layer 23 is preferably a silicone pressure-sensitive adhesive layer with a thickness of 5–10 μm, and the coating thickness is controlled by advanced processes such as "transfer coating" to ensure that the breathable micropores of the breathable layer are not blocked while the bond is strong.

[0023] In other embodiments, the breathable layer 24 can be directly laminated onto the substrate layer 22 by thermal bonding, which can avoid the problem of poor local breathability caused by uneven coating, but the bonding strength is not as good as that of using an adhesive.

[0024] The second adhesive layer 25 is mainly used to bond the tape units peeled from the support layer to the sound outlet holes on the PCB board. To ensure its adhesion and peelability, the second adhesive layer is preferably formed of silicone pressure-sensitive adhesive with a thickness of 30-50 μm applied to the breathable layer 24. A through hole 251 with a diameter of 1 / 2 to 1 / 3 of the diameter of the sound outlet hole on the PCB board is reserved in the central area of ​​the second adhesive layer 25, serving as a channel connecting the breathable layer 24 and the sound outlet hole.

[0025] Release layer 26 is made of ordinary release paper or release film and mainly serves to protect the second adhesive layer 25.

[0026] This application can be obtained by the following methods:

[0027] 1. Composite layer of substrate and breathable layer: A layer of silicone pressure-sensitive adhesive for forming the third adhesive layer is uniformly coated on one side of the substrate and sent into an oven for drying and semi-curing; the PTFE microporous membrane and the substrate layer coated with the semi-cured adhesive are pressed together by a composite roller.

[0028] 2. Release film pretreatment: A layer of silicone pressure-sensitive adhesive for forming the second adhesive layer is uniformly coated onto the release film using a transfer coating method and allowed to semi-cur. Through holes 251 are precisely die-cut into the semi-cured adhesive layer using a die-cutting machine. Then, the waste material on the adhesive layer is peeled off and recycled to form an adhesive layer with a precise through hole pattern. The release film with the above-mentioned through hole adhesive layer is aligned and pressed with the "substrate-breathable layer" composite roll prepared in step 1 using a composite roller.

[0029] 3. Composite support layer and winding: The first adhesive is applied to the other side of the substrate layer and semi-cured, then composited with the support layer, and wound into a roll after curing.

[0030] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications are also within the protection scope of the present utility model.

Claims

1. A high-temperature masking tape, characterized in that, Includes a support layer and several tape units disposed on the support layer; The tape unit comprises a first adhesive layer, a substrate layer, a breathable layer, a second adhesive layer, and a release layer that are sequentially stacked and connected. The first adhesive layer is used to bond the substrate layer to the support layer; The second adhesive layer has through holes in its central region; The breathable layer is used to connect with the central area of ​​the sound outlet hole on the PCB board through the through hole during welding, so that the water vapor generated during welding can be discharged from the sound outlet hole. The substrate layer is used to completely seal and cover the sound outlet holes of the PCB board during soldering.

2. The high-temperature masking tape according to claim 1, characterized in that, The diameter of the through hole is 1 / 2 to 1 / 3 of the diameter of the sound outlet hole on the PCB board.

3. The high-temperature masking tape according to claim 1, characterized in that, The breathable layer is made of polytetrafluoroethylene microporous membrane, which is connected to the substrate layer by a third adhesive or by hot-pressing.

4. The high-temperature masking tape according to claim 3, characterized in that, The polytetrafluoroethylene microporous membrane has a thickness of 50–120 μm and / or a micropore diameter of 0.1–1.0 μm.

5. The high-temperature masking tape according to claim 1, characterized in that, The substrate layer is made of PI tape, PET tape or PEEK tape.

6. The high-temperature masking tape according to claim 1, characterized in that, The thickness of the substrate layer is 30–50 μm.

7. The high-temperature masking tape according to claim 3, characterized in that, The first, second, and third adhesive layers are all silicone pressure-sensitive adhesive layers.

8. The high-temperature masking tape according to claim 1, characterized in that, The support layer is made of release paper or release film.

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