Pure adhesive film for printed circuit

Abstract

The utility model relates to pure glue film technical field especially a pure glue film for printed circuit, including pure glue film body still include: groove, the upper and lower both sides end surface of pure glue film body all are set with multiple groups of grooves, viscose layer, the viscose layer is adhered to one side of pure glue film body, this pure glue film for printed circuit has solved the shortcoming that the pure glue film in the prior art can have the wrinkle phenomenon when pasting the bending area.

Description

Technical Field

[0001] This utility model relates to the field of pure adhesive film technology, and in particular to a pure adhesive film for printed circuits. Background Technology

[0002] Pure adhesive film for printed circuits mainly serves functions such as insulation, protection, and reinforcement. During use, pure adhesive film may be adhered to bending areas. However, existing pure adhesive films tend to wrinkle significantly when applied to bending areas, resulting in wavy protrusions. These protrusions reduce the adhesion strength between the pure adhesive film and the printed circuit, thus affecting the quality of the finished product. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing pure adhesive films, which wrinkle when pasted in bending areas, and to propose a pure adhesive film for printed circuit boards.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] Design a pure adhesive film for printed circuits, including a pure adhesive film body, and further comprising:

[0006] Grooves: Multiple sets of grooves are formed on both the upper and lower end faces of the pure adhesive film body.

[0007] An adhesive layer is attached to one side of the pure adhesive film body.

[0008] Preferably, a protective film is attached to both the adhesive layer and the outer end of the pure adhesive film body.

[0009] Preferably, both the protective film and the outer end face of the pure adhesive film body are coated with marking lines.

[0010] Preferably, the groove is a long strip structure, and multiple sets of the groove are evenly distributed in the transverse, longitudinal, and 45° oblique directions.

[0011] Preferably, the interior of the trench is filled with glue.

[0012] The beneficial effects of the pure adhesive film for printed circuits proposed in this utility model are as follows:

[0013] By creating grooves on the surface of the pure adhesive film, redundancy is provided for the bending deformation of the pure adhesive film, reducing wrinkles generated during bending, thereby reducing corrugated protrusions and improving the adhesion strength between the pure adhesive film and the printed circuit.

[0014] By injecting additional adhesive into the groove area, the pure adhesive film body is further reinforced by the adhesive after it has bonded to the printed circuit, thereby further improving the peel strength. Attached Figure Description

[0015] Figure 1 A schematic diagram of the three-dimensional structure with the main body as the core;

[0016] Figure 2 A schematic diagram of the explosive dismantling structure, with the main body as the core.

[0017] Figure 3 A cross-sectional structural diagram of the main body;

[0018] Figure 4 for Figure 3 A magnified structural diagram of area A.

[0019] In the diagram: 1. Pure adhesive film body; 2. Groove; 3. Adhesive layer; 4. Protective film; 5. Marking line; X1. Raised part; X2. Recessed part. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Example 1

[0022] Reference Figures 1-4 A pure adhesive film for printed circuit boards includes a pure adhesive film body 1, and further includes:

[0023] Grooves 2: Multiple sets of grooves 2 are opened on both the upper and lower end faces of the pure adhesive film body 1.

[0024] Adhesive layer 3 is adhered to one side of the pure adhesive film body 1.

[0025] Furthermore, the trench 2 has a long strip structure, and multiple sets of trenches 2 are evenly distributed in the transverse, longitudinal, and 45° oblique directions;

[0026] Furthermore, the interior of trench 2 is filled with glue.

[0027] Working principle:

[0028] Reference Figure 4 By opening grooves 2 on the surface of the pure adhesive film body 1, protrusions X1 and recesses X2 are formed on the surface of the pure adhesive film body 1. When the pure adhesive film body 1 is bent under force, the recesses X2 reduce the texture caused by the extrusion on the surface of the pure adhesive film body 1, thereby improving the deformation capability of the pure adhesive film body 1 and avoiding the peeling of the printed circuit due to local extrusion texture caused by bending. The adhesive layer 3 is only provided on the outer end face of the protrusions X1.

[0029] When bonding the pure adhesive film body 1 to the printed circuit, the pure adhesive film body 1 and the printed circuit are bonded together by the adhesive layer 3 to form a combination. To further improve the stability of the bond and the peel strength, glue can be injected into the groove 2 on the side of the pure adhesive film body 1 that is bonded to the printed circuit. The glue and the adhesive layer 3 work together to improve the bonding strength.

[0030] Example 2

[0031] To further protect the outer surfaces of the adhesive layer 3 and the pure adhesive film body 1, refer to Figure 2 Both the adhesive layer 3 and the outer end of the pure adhesive film body 1 are covered with a protective film 4.

[0032] Furthermore, marking lines 5 are applied to the outer end faces of both the protective film 4 and the pure adhesive film body 1.

[0033] Working principle:

[0034] When bonding the pure adhesive film body 1 to the printed circuit, first peel off the protective film 4 on one side of the adhesive layer 3, and then bond the pure adhesive film body 1 to the printed circuit through the adhesive layer 3 to complete the bonding between the pure adhesive film body 1 and the printed circuit.

[0035] After the pure adhesive film body 1 is combined with the printed circuit, observe the markings 5 ​​on the pure adhesive film body 1 and the markings 5 ​​on the protective film 4 on the pure adhesive film body 1. Observe whether the two sets of markings 5 ​​are misaligned or twisted. When the two sets of markings 5 ​​are misaligned or twisted, it indicates that the pure adhesive film body 1 has wrinkles or distortion, and should be marked as a defective product and removed from the production line.

[0036] Meanwhile, the marking line 5 can be set to different colors to mark the pure adhesive film body 1 of different specifications, so as to quickly identify the specifications of the pure adhesive film body 1.

[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A pure adhesive film for printed circuit boards, comprising a pure adhesive film body (1), characterized in that: Also includes: Grooves (2): Multiple sets of grooves (2) are opened on both the upper and lower end faces of the pure adhesive film body (1). An adhesive layer (3) is attached to one side of the pure adhesive film body (1).

2. The pure adhesive film for printed circuit boards according to claim 1, characterized in that: The adhesive layer (3) and the pure adhesive film body (1) are both attached with a protective film (4) on the outer side.

3. The pure adhesive film for printed circuit boards according to claim 2, characterized in that: The protective film (4) and the outer end face of the pure adhesive film body (1) are both coated with marking lines (5).

4. The pure adhesive film for printed circuits according to claim 1, characterized in that: The groove (2) is a long strip structure, and multiple sets of the groove (2) are evenly distributed in the horizontal, vertical and 45° diagonal directions.

5. The pure adhesive film for printed circuits according to claim 4, characterized in that: The inside of the groove (2) is filled with glue.

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