A tin cylinder cover with high sealing performance and a tin cylinder

Abstract

The utility model relates to welding technical field especially relates to a high sealing tin jar cover and tin jar thereof, including the cover setting part of cover setting above tin jar body and the sealing part of with tin jar body inner wall fit, the outer peripheral wall of sealing part is recessed and forms has the surge tank for accommodating tin liquid, and the surge tank is close to the upper guide inclined plane of the side groove wall of cover setting part formation is used for guiding tin liquid backflow to the surge tank, the utility model discloses utilize the surge tank on sealing part can accommodate part tin liquid in the process of tin liquid upsurge, and the tin liquid of upsurge back falls is temporarily kept, to provide the buffering action and reduce the possibility of tin liquid overflow, the upper guide inclined plane of setting on tin jar cover can guide tin liquid backflow to the surge tank to further improve the sealing effect of tin jar cover.

Description

Technical Field

[0001] This utility model relates to the field of welding technology, and in particular to a high-sealing tin cylinder cover and its tin cylinder. Background Technology

[0002] Under the action of electromagnetic force, high-temperature molten solder (liquid solder) is transported through the internal molten solder guide tube to the inside of the nozzle, forming a wave of liquid solder to solder the PCB. Then, it flows back into the solder tank along the outer wall of the nozzle, forming a phenomenon of continuous liquid solder spraying out, soldering, and reflowing. Since the soldering targets are distributed in various places in the soldering area, the solder tank is driven by the XY motion mechanism to make high-speed displacement. At this time, due to inertia, the liquid solder can easily overflow directly from the joint between the solder tank cover and the solder tank body. Since the solder tank cover and the solder tank body are frequently disassembled and assembled in high-temperature applications, it is impossible to make additional sealing mechanisms. Therefore, mechanical sealing can only be used to keep the gap between the two infinitely close to zero. However, in the actual processing and assembly of the solder tank cover and the solder tank body, there is an unavoidable gap at the joint surface. The liquid solder overflows from this joint, causing a short circuit in the heating part and causing the equipment to stop. Utility Model Content

[0003] The technical problem to be solved by this utility model is: in order to solve the problem that in the actual processing and assembly of tin cylinder cover and tin cylinder body in the prior art, there is an unavoidable gap at the joint surface, and liquid tin overflows from the joint, causing a short circuit in the heating part and resulting in equipment shutdown, a tin cylinder cover with high sealing performance and its tin cylinder are provided.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a high-sealing tin cylinder cover, including a cover portion covering the tin cylinder body and a sealing portion fitting against the inner peripheral wall of the tin cylinder body. The outer peripheral wall of the sealing portion is recessed to form a surge groove for containing molten tin, and the side wall of the surge groove near the cover portion is formed with an upper guiding slope for guiding the molten tin back to the surge groove.

[0005] Furthermore, the surge tank also includes a lower guide ramp for guiding the molten solder in the surge tank back into the solder cylinder.

[0006] Furthermore, the sealing portion includes a cylindrical section, a tapered section that gradually narrows from the end of the cylindrical section, and a surge ring that extends radially from the end of the tapered section, wherein the surge ring and the tapered section form the aforementioned surge groove.

[0007] Furthermore, the cylindrical segment, the conical segment, and the surge ring are integrally formed, and the diameter of the surge ring is equal to the diameter of the cylindrical segment.

[0008] A soldering pot includes a soldering pot cover, a soldering pot body sealed to the soldering pot cover, a nozzle fixed to the soldering pot cover, and an electromagnetic pump for pumping molten solder from the soldering pot body into the nozzle, wherein a sealed cavity is formed between the soldering pot cover and the soldering pot body.

[0009] Furthermore, the axis of the electromagnetic pump is offset from the axis of the nozzle.

[0010] Furthermore, the output end of the electromagnetic pump is connected to a liquid guide pipe, and a buffer chamber is connected between the liquid guide pipe and the nozzle.

[0011] Furthermore, it also includes a nitrogen supply device, which includes a nitrogen chamber communicating with the sealed cavity, a gas supply pipe for introducing nitrogen into the nitrogen chamber, and a nitrogen outlet mask covering the nozzle and communicating with the nitrogen chamber.

[0012] The beneficial effects of this utility model are as follows: This utility model utilizes a surge groove located on the sealing part to accommodate part of the molten solder during the upward surge and to temporarily retain the molten solder that rises and falls back, so as to provide a buffering effect and reduce the possibility of molten solder overflow. At the same time, the upper guide slope set on the solder cylinder cover can guide the molten solder back to the surge groove, thereby further improving the sealing effect of the solder cylinder cover. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0014] Figure 1 This is a structural schematic diagram of Embodiment 1 of the present invention; Figure 2 yes Figure 1 A magnified view of part A in the middle; Figure 3 This is a schematic diagram of the structure of Embodiment 2 of this utility model; Figure 4 yes Figure 3 A magnified view of part B in the middle section; Figure 5 This is a 3D schematic diagram of the solder bath; Figure 6 This is a cross-sectional view of the tin bath.

[0015] In the picture: 1. Cover section; 2. Sealing section; 201. Cylindrical section; 202. Conical section; 203. Surge ring; 3. Surge groove; 301. Upper guide slope; 302. Lower guide slope; 4. Tin cylinder; 5. Nozzle; 6. Liquid guide pipe; 7. Buffer chamber; 701. Lower connection section; 702. Upper connection section; 703. Buffer cavity; 8. Nitrogen chamber; 9. Gas delivery pipe; 10. Nitrogen outlet mask; 1001. Reference platform; 1002. Lower guide cone; 1003. Upper guide cone. Detailed Implementation

[0016] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention. Therefore, they only show the components, orientations, and references (e.g., up, down, left, right, etc.) relevant to the present invention and are intended only to aid in the description of the features in the drawings. Therefore, the following specific embodiments are not intended to be restrictive, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0017] like Figure 1 and Figure 2 As shown, a high-sealing tin cylinder cover is sealed to a tin cylinder body 4, forming a sealed cavity for containing molten tin. The tin cylinder cover includes a cover portion 1 covering the tin cylinder body 4 and a sealing portion 2 that fits against the inner peripheral wall of the tin cylinder body 4. The cover portion 1 protrudes radially from the sealing portion 2, and the sealing portion 2 is inserted into the tin cylinder body 4. The cover portion 1 covers the tin cylinder body 4, and the two work together to seal the tin cylinder body 4. Furthermore, the diameter of the cover portion 1 is larger than the outer diameter of the tin cylinder body 4, which can further improve the sealing effect. The outer peripheral wall of the sealing part 2 is recessed to form a surge groove 3 for containing molten solder. The surge groove 3 is an annular groove, and the side wall of the surge groove 3 near the cover part 1 is formed with an upper guide slope 301 for guiding the molten solder back to the surge groove 3. The upper guide slope 301 is inclined from top to bottom toward the axis of the solder cylinder cover. During the soldering process, the solder cylinder moves at high speed to each part to be soldered to provide molten solder to the nozzle 5. Under the action of inertia, the molten solder will surge in the sealed cavity, causing the molten solder to overflow from the joint between the solder cylinder cover and the solder cylinder body 4. The surge groove 3 located on the sealing part 2 can accommodate part of the molten solder during the upward surge and provide temporary retention for the upward and falling molten solder to provide a buffer effect and reduce the possibility of molten solder overflow. At the same time, the upper guide slope 301 set on the solder cylinder cover can guide the molten solder back to the surge groove 3, thereby further improving the sealing effect of the solder cylinder cover.

[0018] In some examples, the surge tank 3 also includes a lower guide slope 302 for guiding the molten solder in the surge tank 3 back to the solder cylinder 4. The lower guide slope 302 is inclined from top to bottom in a direction away from the axis of the solder cylinder cover. The upper guide slope 301 and the lower guide slope 302 are symmetrically arranged to form a V-shaped structure or a trapezoidal structure.

[0019] In some examples, the sealing part 2 includes a cylindrical section 201, a tapered section 202 that gradually tapers from the end of the cylindrical section 201, and a surge ring 203 that extends radially from the end of the tapered section 202. The surge ring 203 and the tapered section 202 form the surge groove 3 described above. The outer peripheral wall of the tapered section 202 is the upper guide slope 301 described above, and the plane corresponding to the upper guide plane is a plane.

[0020] In some examples, the cylindrical segment 201, the conical segment 202, and the surge ring 203 are integrally formed, and the diameter of the surge ring 203 is equal to the diameter of the cylindrical segment 201, that is, the outer peripheral wall of the surge ring 203 fits against the inner peripheral wall of the tin cylinder 4 for initial sealing.

[0021] In some examples, a solder bath includes the aforementioned high-sealing solder bath cover, a solder bath body 4 sealed to the solder bath cover, a nozzle 5 fixed to the solder bath cover, and an electromagnetic pump for pumping molten solder from the solder bath body 4 into the nozzle 5, the electromagnetic pump being located below the solder bath body 4.

[0022] In some examples, the axis of the electromagnetic pump is offset from the axis of the nozzle 5, that is, the nozzle 5 is misaligned with the electromagnetic pump, so that the path of the molten solder is not straight but bent, thereby avoiding sudden spraying or sudden drop of the molten solder and improving the stability of the molten solder.

[0023] In some examples, the output end of the electromagnetic pump is connected to a liquid guide pipe 6, which is vertical. A buffer chamber 7 is connected between the liquid guide pipe 6 and the nozzle 5. The buffer chamber 7 extends laterally and has a lower connecting part 701 protruding downward at one end. The liquid guide pipe 6 extends into the lower connecting part 701 and is threadedly connected to it. The lower connecting part 701 has several radial through holes, and bolts are installed in the radial through holes. The bolt heads abut against the outer peripheral wall of the liquid guide pipe 6 to improve the connection strength between the liquid guide pipe 6 and the buffer chamber 7. The other end of the buffer chamber 7 protrudes upward to form an upper connecting part 702, which extends into the lower end of the nozzle 5 and is threadedly connected to it. In this embodiment, the buffer chamber 7 includes an upper half chamber and a lower half chamber, which are assembled to form a buffer cavity 703 for containing molten solder for buffering.

[0024] In some examples, a nitrogen supply device is also included, which includes a nitrogen chamber 8 communicating with the sealed cavity, a gas supply pipe 9 for introducing nitrogen into the nitrogen chamber 8, and a nitrogen outlet cover 10 covering the nozzle 5 and communicating with the nitrogen chamber 8. The nitrogen chamber 8 is fixed on the tin cylinder cover, the nitrogen outlet cover 10 is fixed on the nitrogen chamber 8, and the nitrogen chamber 8 is located between the sealed cavity and the nitrogen outlet cover 10. Nitrogen gas enters nitrogen chamber 8 from gas supply pipe 9. Part of the nitrogen gas flows downward into the sealed cavity to isolate the molten tin from the air and prevent the molten tin in the sealed cavity from oxidizing. The other part of the nitrogen gas flows upward into nitrogen outlet mask 10 to protect nozzle 5 and prevent the molten tin at nozzle 5 from oxidizing. The nitrogen outlet mask 10 includes a reference platform 1001 that overlaps above the nitrogen chamber 8, a lower guide cone 1002 that extends downward from the reference platform 1001 and gradually narrows, and an upper guide cone 1003 that extends upward from the reference platform 1001 and gradually narrows. A lower guide cavity is formed between the lower guide cone 1002 and the inner peripheral wall of the nitrogen chamber 8. After the nitrogen enters the lower guide cavity from the gas supply pipe 9, it forms two branches, one of which enters the sealing cavity downward and the other of which enters the nitrogen outlet mask 10 upward.

[0025] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A high-sealing tin cylinder cap, which is in a sealing fit with the tin cylinder body (4), characterized in that: It includes a cover (1) covering the top of the tin cylinder (4) and a sealing part (2) that fits against the inner peripheral wall of the tin cylinder (4). The outer peripheral wall of the sealing part (2) is recessed to form a surge groove (3) for containing molten tin. The side wall of the surge groove (3) near the cover (1) has an upper guide slope (301) for guiding the molten tin back to the surge groove (3).

2. The high-sealing tin cylinder head according to claim 1, characterized in that: The surge tank (3) also includes a lower guide slope (302) for guiding the molten tin in the surge tank (3) back to the tin cylinder (4).

3. The high-sealing tin cylinder cover according to claim 1, characterized in that: The sealing part (2) includes a cylindrical section (201), a tapered section (202) that gradually narrows from the end of the cylindrical section (201), and a surge ring (203) that extends radially from the end of the tapered section (202). The surge ring (203) and the tapered section (202) are provided with the surge groove (3).

4. A high-sealing tin cylinder head according to claim 3, characterized in that: The cylindrical segment (201), the conical segment (202), and the surge ring (203) are integrally formed, and the diameter of the surge ring (203) is equal to the diameter of the cylindrical segment (201).

5. A tin bath, characterized in that: The device includes a tin cylinder cover as described in any one of claims 1-4, a tin cylinder body (4) sealed to the tin cylinder cover, a nozzle (5) fixed to the tin cylinder cover, and an electromagnetic pump for pumping molten tin in the tin cylinder body (4) into the nozzle (5), wherein a sealed cavity is formed between the tin cylinder cover and the tin cylinder body (4).

6. A solder bath according to claim 5, characterized in that: The axis of the electromagnetic pump is offset from the axis of the nozzle (5).

7. A solder bath according to claim 6, characterized in that: The output end of the electromagnetic pump is connected to a liquid guide pipe (6), and a buffer chamber (7) is connected between the liquid guide pipe (6) and the nozzle (5).

8. A solder bath according to claim 5, characterized in that: It also includes a nitrogen supply device, which includes a nitrogen chamber (8) communicating with the sealed cavity, a gas supply pipe (9) for supplying nitrogen into the nitrogen chamber (8), and a nitrogen outlet mask (10) covering the outside of the nozzle (5) and communicating with the nitrogen chamber (8).

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