Deposition apparatus

Abstract

The application discloses a deposition device. The deposition device comprises a device main body and an air inlet flow uniformizer. The device main body has a process cavity therein, and the device main body also has an air inlet end and an air outlet end. The air inlet flow uniformizer is arranged on one side of the process cavity close to the air inlet end, and the air inlet flow uniformizer is arranged in a cylindrical shape. A plurality of air inlet flow uniform holes are arranged on the air inlet flow uniformizer in a circumferential direction, and the air inlet flow uniform holes are used for connecting an air inlet pipeline. In this way, the application can optimize the flow of process gas and improve the film coating quality.

Description

Technical Field

[0001] This application relates to the field of thin film deposition technology, and in particular to deposition equipment. Background Technology

[0002] Deposition equipment is used to coat substrates. In related technologies, the substrate is placed in a carrier, which is transferred by a propeller. The coating of the substrate requires the introduction of process gases during the process. During the introduction of process gases, changes in the flow velocity within the deposition equipment's process chamber can interfere with the coating process, leading to a decrease in coating quality. Utility Model Content

[0003] Embodiments of this application provide deposition equipment that can optimize the flow of process gases and improve coating quality.

[0004] This application provides a deposition apparatus. The deposition apparatus includes an apparatus body and an air inlet equalizer. The apparatus body has a process chamber, and also has an air inlet end and an air outlet end. The air inlet equalizer is disposed on the side of the process chamber near the air inlet end, and has a plurality of air inlet equalizer holes spaced apart circumferentially. The air inlet equalizer is spaced apart from the inner wall of the apparatus body circumferentially, and the air inlet equalizer holes are used to connect to an air inlet pipe.

[0005] Optionally, the air intake equalization component and the air intake end are arranged to form an air intake space, and multiple air intake equalization holes connect the process cavity and the air intake space, and the air intake space is connected to the air intake pipe.

[0006] Optionally, the deposition equipment also includes a gas flow equalization device, which is disposed on the side of the process cavity near the gas outlet end. The gas flow equalization device is provided with multiple gas flow equalization holes at intervals in the circumferential direction. The gas flow equalization device is spaced apart from the inner wall of the main body of the equipment in the circumferential direction. The multiple gas flow equalization holes are connected to the process cavity and are used to connect with the gas outlet pipe.

[0007] Optionally, the air outlet equalization component has an air outlet cavity inside, which is connected to the air outlet equalization hole and the air outlet cavity is connected to the air outlet pipe.

[0008] Optionally, the side of the air flow equalization component near the air outlet end is spaced apart from the air outlet end and forms a gap space.

[0009] Optionally, the deposition equipment also includes a pipe, one end of which is connected to an outlet pipe, and the other end of which is connected to an outlet flow equalizer. The outlet flow equalizer is supported in the process chamber by the pipe, and the pipe is connected to the outlet chamber.

[0010] Optionally, the gas flow equalization component includes a gas flow equalization section and a gas flow blocking section. The gas flow equalization hole is disposed in the gas flow equalization section, the gas flow cavity is disposed in the gas flow equalization section, the pipe is connected to the side of the gas flow equalization section near the gas flow end, the gas flow equalization section extends in a cylindrical shape from the circumference of the gas flow blocking section along the direction from the gas inlet end toward the gas flow end, and the gas flow blocking section has multiple process windows.

[0011] Optionally, the air flow equalization component includes a cylindrical air flow equalization section, the air outlet cavity is disposed inside the air flow equalization section, the pipe is connected to the side of the air flow equalization section near the air outlet end, the air flow equalization section extends in the direction from the air inlet end to the air outlet end, and the air flow equalization section is through in the direction from the air inlet end to the air outlet end.

[0012] Optionally, the main body of the equipment is provided with a furnace door at the air inlet end. The air inlet flow equalization component includes an air inlet blocking part and an air inlet flow equalization part. The air inlet flow equalization hole is provided in the air inlet flow equalization part. The air inlet flow equalization part extends in a cylindrical shape from the circumference of the air inlet blocking part along the direction from the air outlet end toward the air inlet end. The side of the air inlet flow equalization part near the air inlet end is installed on the furnace door.

[0013] Optionally, the deposition apparatus also includes a carrier and a propeller, the carrier being carried on the propeller for transferring the carrier from the process chamber.

[0014] The beneficial effects of this application are as follows: Unlike existing technologies, this application incorporates an inlet flow equalizer, with inlet flow equalizer holes positioned circumferentially within it. Process gas enters the process chamber from the inlet space through these inlet flow equalizer holes located circumferentially within the inlet flow equalizer. Firstly, the multiple inlet flow equalizer holes effectively equalize the flow of the incoming process gas. Secondly, because the inlet flow equalizer holes are positioned circumferentially within the inlet flow equalizer, the direct impact of the process gas on the carrier and the substrate on the carrier is reduced. This reduces the impact of the process gas on the bonding between the substrate and the carrier, and on the substrate coating, thus solving the problems of high substrate dark area ratio, incomplete coating, and excessively thick local substrate deposition. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an embodiment of the deposition apparatus of this application;

[0016] Figure 2 yes Figure 1 A schematic diagram of some structures in the deposition equipment shown;

[0017] Figure 3 yes Figure 1 A schematic diagram showing the fit between the furnace door and the air inlet equalizer in the deposition equipment shown.

[0018] Figure 4 yes Figure 3 The diagram shows a split structure of the embodiment shown.

[0019] Figure 5 yes Figure 1 A schematic diagram of the structure of an embodiment of the gas flow equalization component in the deposition equipment shown, in conjunction with the main body of the equipment;

[0020] Figure 6 yes Figure 1 A schematic diagram of another embodiment of the gas flow equalization element in the deposition equipment shown, in conjunction with the main body of the equipment. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] During their research, the inventors of this application discovered issues in the substrate coating process, including a high proportion of dark spots, incomplete coating, and excessively thick localized substrate deposition during photoluminescence detection. Through investigation, the inventors found that these problems arise from variations in the flow field and velocity of the process gas within the process chamber, leading to localized pressure changes. These changes cause issues such as dark spots, incomplete coating, and excessively thick localized substrate deposition. Problems with the adhesion between the substrate and the carrier cause localized changes in the substrate's potential, resulting in abnormal film deposition rates and consequently, an abnormally high proportion of dark spots. Further simulation and analysis of the flow field and velocity of the process gas within the process chamber revealed abnormally high turbulence in the furnace opening area, leading to reduced coating uniformity on the substrate. Further research into the deposition equipment structure revealed that in the deposition equipment, gas is drawn away in a straight line, directly impacting the substrate and causing dark spots and uneven coating. Furthermore, the flow equalization device in related technologies requires through holes to be made in the device to install components such as the propeller, observation window, electrode feed rod, and auxiliary heating rod. These through holes can cause the flow equalization effect of the device to fail. To improve the above-mentioned technical problems, this application can provide the following embodiments.

[0023] Combination Figure 1 and Figure 2This application provides a deposition apparatus 1. The deposition apparatus 1 includes an apparatus body 10 and an air inlet equalizer 13. The apparatus body 10 has a process chamber 101. The process chamber 101 can accommodate process equipment such as a propeller 15 and a carrier 16. Under the action of a negative pressure pump, the process chamber 101 maintains a certain vacuum degree to meet the process conditions for coating. The process chamber 101 can also be vented with process gas to provide the corresponding conditions for coating the substrate. The apparatus body 10 has an air inlet end and an air outlet end. The air inlet equalizer 13 is disposed on the side of the process chamber 101 near the air inlet end. The air inlet equalizer 13 has a plurality of air inlet equalizer holes 1321 spaced apart circumferentially. The air inlet equalizer 13 is spaced apart from the inner wall of the process chamber 101 circumferentially. The air inlet equalizer holes 1321 can be directly or indirectly connected to an air inlet pipe. The plurality of air inlet equalizer holes 1321 are connected to the process chamber 101. The axial direction of the air inlet uniform flow hole 1321 is perpendicular to the direction from the air inlet end to the air outlet end. For example, the axial direction of the air inlet uniform flow hole 1321 can be towards the side wall of the process cavity 101. The area corresponding to the projection of the carrier 16 onto the air inlet uniform flow member 13 does not have the air inlet uniform flow hole 1321.

[0024] Furthermore, the air intake equalization component 13 and the air intake end enclose an air intake space, and multiple air intake equalization holes 1321 connect the process cavity 101 and the air intake space. The air intake space is connected to the air intake pipe, which can be connected to a gas source. The process gas first enters the air intake space through the air intake pipe, and after being dispersed in the air intake space, it enters the process cavity 101 through the circumferentially arranged air intake equalization holes 1321. In this way, after the process gas enters the process cavity 101, the majority of its flow velocity is mainly distributed around the periphery of the air intake equalization component 13, and the gas ejected from the air intake equalization holes 1321 flows towards the inner wall of the process cavity 101, thereby reducing the impact of the process gas on the carrier 16 and the substrate on the carrier 16.

[0025] By setting up an air inlet equalizer 13 and positioning the air inlet equalizer holes 1321 circumferentially on the air inlet equalizer 13, the process gas needs to pass through the air inlet equalizer holes 1321 as it enters the process chamber 101 from the air inlet space. On the one hand, the arrangement of multiple air inlet equalizer holes 1321 can achieve a uniform flow effect on the incoming process gas; on the other hand, since the air inlet equalizer holes 1321 are positioned circumferentially, the direct impact of the process gas on the carrier 16 and the substrate on the carrier 16 is reduced, thereby reducing the impact of the process gas on the adhesion between the substrate and the carrier 16, and reducing the problems of high substrate dark film ratio and uneven coating.

[0026] In some embodiments, the deposition apparatus 1 includes a carrier 16 and a propeller 15. The carrier 16 is supported on the propeller 15, which is used to transfer the carrier 16 into or out of the process chamber 101. The propeller 15 is capable of transferring the carrier 16 from inside the process chamber 101 to the outside, or transferring the carrier 16 from the outside into the process chamber 101, and the propeller 15 is capable of supporting the carrier 16 within the process chamber 101. The peripheries of the carrier 16 and the propeller 15 are spaced from the sidewalls of the process chamber 101. The process gas can diffuse throughout the process chamber 101 to meet the deposition process conditions. By providing an inlet flow equalizer 13, problems such as direct impact of the process gas on the substrate and uneven distribution are reduced.

[0027] Combination Figure 3 and Figure 4 In some embodiments, the air inlet end of the equipment body 10 is provided with a furnace door 19. The air inlet flow equalization component 13 includes an air inlet blocking part 131 and an air inlet flow equalization part 132. An air inlet flow equalization hole 1321 is provided in the air inlet flow equalization part 132, which extends in a cylindrical shape from the air inlet blocking part 131 along the direction from the air outlet end toward the air inlet end. The side of the air inlet flow equalization part 132 near the air inlet end is installed on the furnace door 19. The air inlet flow equalization part 132, the air inlet blocking part 131, and the furnace door 19 enclose an air inlet space. An air inlet assembly can be provided on the furnace door 19, through which the process gas enters the air inlet space. The air inlet blocking part 131 can prevent the process gas from being directly blown toward the carrier 16 and the substrate on the carrier 16. The process gas in the intake space can enter the process cavity 101 through the intake flow equalization hole 1321 on the intake flow equalization section 132, enabling the intake to avoid the carrier 16. In this case, the axial direction of the intake flow equalization hole 1321 can be oriented towards the side wall of the process cavity 101. The axial direction of the intake flow equalization hole 1321 can be perpendicular to the direction from the intake end to the outlet end.

[0028] Furthermore, the intake flow equalization holes 1321 are arranged in at least one ring around the circumference of the intake flow equalization section 132, and multiple rings can be arranged along the direction from the intake end to the outlet end. The multiple rings of intake flow equalization holes 1321 can be arranged flush with each other or staggered, without specific limitation.

[0029] Optionally, in other embodiments, the air intake equalization member 13 may be arranged in a disc shape, and the air intake equalization part 132 may be arranged in a ring shape around the outer periphery of the disc-shaped air intake blocking part 131. In this case, the axial direction of the air intake equalization hole 1321 is perpendicular to the direction from the air intake end to the air outlet end (i.e., the axial direction of the device body 10). Alternatively, the axial direction of the air intake equalization hole 1321 may be arranged at an angle to the direction from the air intake end to the air outlet end, and the angle is less than 45°. The air intake equalization hole 1321 may be arranged in a ring along the circumference of the air intake equalization part 132 on a preset diameter. The air intake equalization hole 1321 may be arranged in multiple rings on the air intake equalization part 132 with different preset diameters. The multiple rings of air intake equalization holes 1321 may be arranged flush with each other or staggered with each other, which is not specifically limited here.

[0030] Combination Figure 1 and Figure 2 In some embodiments, the deposition apparatus 1 further includes an exhaust gas equalization element 14, which is disposed on the side of the process chamber 101 near the exhaust end. The exhaust gas equalization element 14 is circumferentially spaced from the inner wall of the apparatus body 10. The exhaust gas equalization element 14 has a plurality of exhaust gas equalization holes 1421 spaced circumferentially. The axial direction of the exhaust gas equalization holes 1421 is perpendicular to the direction from the inlet end to the outlet end; for example, the axial direction of the exhaust gas equalization holes 1421 can also be towards the side wall of the process chamber 101. The area corresponding to the projection of the carrier 16 onto the exhaust gas equalization element 14 does not have exhaust gas equalization holes 1421. The exhaust gas equalization holes 1421 can be directly or indirectly connected to an exhaust pipe, which can be connected to equipment such as a negative pressure pump.

[0031] In some embodiments, an air outlet cavity is formed between the air outlet equalizer 14 and the air outlet end of the device body 10. The air outlet equalizer 14 is installed at the air outlet end of the device body.

[0032] In some embodiments, the gas outlet equalization component 14 has an outlet cavity inside, which is connected to the outlet equalization hole 1421 and the outlet pipe. Gas in the process chamber 101 can be drawn into the outlet cavity through the outlet equalization hole 1421. The gas in the outlet cavity can be discharged directly or indirectly from the outlet pipe. By separately setting the outlet cavity for exhaust, the interference of components near the outlet end on the gas outlet process can be reduced, so that a stable and uniform negative pressure can be generated at the outlet equalization hole 1421, thereby uniformly discharging the gas in the process chamber 101. If the outlet equalization hole 1421 of the outlet equalization component 14 is through-hole, the outlet equalization component 14 and the outlet end form an outlet space. The gas outlet process will be affected by the interference of various components at the outlet end, and the flow field around the outlet equalization component 14 is sensitive to the pumping speed fluctuations of the vacuum pump and the pumping pipe, which is not conducive to improving the gas outlet uniformity.

[0033] In some embodiments, the deposition apparatus further includes a pipe 143, one end of which is connected to the gas outlet pipe of the apparatus body 10, and the other end of which is connected to the gas outlet cavity in the gas outlet equalization component 14. The gas outlet equalization component 14 is supported within the process cavity 101 via the pipe 143, and the circumferential direction of the gas outlet equalization component 14 is spaced apart from the inner wall of the apparatus body 10. Process gas can enter the gas outlet equalization hole 1421 through the space between the gas outlet equalization component 14 and the inner wall of the apparatus body 10. The pipe 143 is located in the space 18. By setting the pipe 143, the gas outlet equalization component 14 can be supported in the process cavity 101, and the gas outlet cavity can be connected to the gas outlet pipe. This allows the gas in the process cavity to enter the gas outlet cavity through the gas outlet equalization hole 1421, then through the pipe 143, and finally be discharged through the gas outlet pipe. In this way, the exhaust process can be made relatively independent, reducing interference to the exhaust process.

[0034] Combination Figure 1 In some embodiments, the gas flow equalizer 14 is spaced apart from the gas outlet end, forming a space 18. This spaced-apart arrangement reduces the direct heat loss from the gas outlet end within the process chamber 101. The process gas first enters the gas flow equalizer 14 through the gas flow equalizer hole 1421, and then enters the pipe 143, where it is discharged by a negative pressure pump and other pipes. The pipe 143 connects the gas flow equalizer 14 and the vacuum pump. The gas flow equalizer 14 can be installed on the side wall of the process chamber 101 or at the gas outlet end using other components; no specific limitation is made here.

[0035] The exhaust gas equalization component 14 is connected to external negative pressure pump equipment, etc. During the evacuation process, the process gas can enter the exhaust chamber of the exhaust gas equalization component 14 through the exhaust gas equalization hole 1421, and then enter the pipeline 143 and be discharged by the negative pressure pump and pipeline, etc. The exhaust gas equalization hole 1421 is located on the side wall of the exhaust gas equalization component 14, so that the process gas can be deflected to the area near the side wall inside the process chamber 101 during the discharge process, thereby reducing the interference of the process gas with the adhesion between the substrate and the carrier during the discharge process.

[0036] In conjunction with the aforementioned embodiments, by providing an inlet flow equalizer 13 and an outlet flow equalizer 14, with inlet flow equalizer holes 1321 and 1421 located on the sidewalls of the inlet flow equalizer 13 and outlet flow equalizer 14 respectively, the flow direction of the process gas within the process chamber 101 is guided by the inlet flow equalizer 13, reducing direct impact of the process gas on the carrier 16 and the substrate on the carrier 16. The outlet flow equalizer 14 reduces changes in the flow field and velocity of the process gas near it due to fluctuations in the pumping speed of the vacuum pump. The process gas can enter the carrier 16 through diffusion. Through the above methods, the flow field distribution of the process gas within the process chamber 101 can be improved, reducing the impact of the process gas flow on the substrate, thereby reducing problems such as a high proportion of dark films, incomplete plating, and uneven coating.

[0037] Combination Figure 5 In some embodiments, the outlet flow equalization component 14 includes an outlet flow equalization section 142 and an outlet blocking section 141, with an outlet flow equalization hole 1421 disposed in the outlet flow equalization section 142. An outlet cavity is disposed within the outlet flow equalization section 142, and a pipe 143 is connected to the side of the outlet flow equalization section 142 near the outlet end. The outlet flow equalization section 142 extends cylindrically from the outlet blocking section 141 circumferentially along the direction from the inlet end towards the outlet end. The process gas in the process chamber 101 can enter the outlet cavity in the outlet flow equalization section 142 through the outlet flow equalization hole 1421 on the outlet flow equalization section 142, and then be discharged through the pipe 143, reducing local pressure difference fluctuations at the outlet end. In this case, the axial direction of the outlet flow equalization hole 1421 can be oriented towards the sidewall of the process chamber 101. The axial direction of the outlet flow equalization hole 1421 can be perpendicular to the direction from the inlet end towards the outlet end. Furthermore, the outlet flow equalization holes 1421 on the outlet flow equalization section 142 can be arranged in a ring at intervals along the circumference of the outlet flow equalization section 142, or in multiple rings along the direction from the inlet end to the outlet end. The multiple rings of outlet flow equalization holes 1421 can be arranged flush with each other or staggered, without specific limitations.

[0038] Optionally, the airflow equalization component 14 is arranged in a disc shape, and the airflow equalization section 142 is arranged in a ring shape and sleeved on the outer periphery of the disc-shaped airflow blocking section 141. In this case, the axial direction of the airflow equalization hole 1421 can be along the direction from the air inlet end to the air outlet end (that is, the axial direction of the device body 10). Alternatively, the axial direction of the airflow equalization hole 1421 can be arranged at an angle to the direction from the air inlet end to the air outlet end, and the angle is less than 45°. The airflow equalization hole 1421 can be arranged in a ring along the circumference of the airflow equalization section 132 on a preset diameter. The airflow equalization hole 1421 can be arranged in multiple rings on the airflow equalization section 142 with different preset diameters. The multiple rings of airflow equalization holes 1421 can be arranged flush with each other or staggered with each other, which is not specifically limited here.

[0039] In some embodiments, the exhaust blocking portion 141 has multiple process windows 1411. The process windows 1411 of the exhaust blocking portion 141 can be used for the passage of the propeller rod 15, electrode feed rod, and auxiliary heating rod, etc. The process windows 1411 can also be used as observation windows. The process windows 1411 can be sealed by the components through which they pass or by providing a seal. Process gases do not pass through the exhaust blocking portion 141.

[0040] Combination Figure 6 In some embodiments, the gas flow equalization component 14 includes a cylindrical gas flow equalization section 142. A gas outlet cavity is disposed within the gas flow equalization section 142, and a pipe 143 is connected to the side of the gas flow equalization section 142 near the gas outlet end. The gas flow equalization section 142 extends from the gas inlet end towards the gas outlet end and is continuous in the direction from the gas inlet end towards the gas outlet end. In other words, the gas flow equalization component 14 only has the gas flow equalization section 142 and does not have the aforementioned gas outlet blocking section 141. The continuous gas flow equalization component 14 provides more space for process assembly. If it is necessary to add auxiliary components inserted from the furnace tail during the process, no further structural changes to the gas flow equalization component 14 are required.

[0041] In some embodiments, the air inlet flow equalizer 13 and the air outlet flow equalizer 14 can be in the shape of a hollow cylinder, a hollow frustum, or a hollow ring structure, etc.

[0042] The above are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A deposition apparatus, characterized in that, include: The equipment body has a process cavity inside, and the equipment body also has an air inlet and an air outlet; An air inlet equalizer is provided, which is disposed on the side of the process cavity near the air inlet end. The air inlet equalizer is provided with a plurality of air inlet equalizer holes spaced apart in the circumferential direction. The circumferential direction of the air inlet equalizer is spaced apart from the inner wall of the main body of the equipment. The plurality of air inlet equalizer holes are connected to the process cavity and are used to connect to the air inlet pipe.

2. The deposition apparatus according to claim 1, characterized in that: The air intake equalization component and the air intake end are arranged to form an air intake space. The plurality of air intake equalization holes connect the process cavity and the air intake space. The air intake space is connected to the air intake pipe.

3. The deposition apparatus according to claim 1, characterized in that: The deposition equipment further includes a gas flow equalization component, which is disposed on the side of the process cavity near the gas outlet end. The gas flow equalization component has a plurality of gas flow equalization holes spaced apart circumferentially. The gas flow equalization component is spaced apart from the inner wall of the main body of the equipment in the circumferential direction. The plurality of gas flow equalization holes are connected to the process cavity and are used to connect with the gas outlet pipe.

4. The deposition apparatus according to claim 3, characterized in that: The air outlet equalization component has an air outlet cavity inside, which is connected to the air outlet equalization hole and the air outlet cavity is connected to the air outlet pipe.

5. The deposition apparatus according to claim 4, characterized in that: The side of the air outlet equalizing component near the air outlet end is spaced apart from the air outlet end and forms a gap space.

6. The deposition apparatus according to claim 5, characterized in that: The deposition equipment also includes a pipe, one end of which is connected to an outlet pipe, and the other end of which is connected to and connected to the outlet flow equalizer. The outlet flow equalizer is supported in the process chamber through the pipe, and the pipe is connected to the outlet chamber.

7. The deposition apparatus according to claim 6, characterized in that: The gas flow equalization component includes a gas flow equalization section and a gas flow blocking section. The gas flow equalization hole is disposed in the gas flow equalization section, and the gas flow cavity is disposed inside the gas flow equalization section. The pipe is connected to the side of the gas flow equalization section near the gas flow end. The gas flow equalization section extends in a cylindrical shape from the circumference of the gas flow blocking section along the direction from the gas inlet end toward the gas flow end. The gas flow blocking section has multiple process windows.

8. The deposition apparatus according to claim 6, characterized in that: The air flow equalization component includes a cylindrical air flow equalization section, an air outlet cavity is disposed within the air flow equalization section, a pipe is connected to the side of the air flow equalization section near the air outlet end, the air flow equalization section extends from the air inlet end toward the air outlet end, and the air flow equalization section is through-connected from the air inlet end toward the air outlet end.

9. The deposition apparatus according to claim 2, characterized in that: The main body of the equipment is provided with a furnace door at the air inlet end. The air inlet flow equalization component includes an air inlet blocking part and an air inlet flow equalization part. The air inlet flow equalization hole is provided in the air inlet flow equalization part. The air inlet flow equalization part extends in a cylindrical shape from the air inlet blocking part along the direction from the air outlet end toward the air inlet end. The side of the air inlet flow equalization part near the air inlet end is installed on the furnace door.

10. The deposition apparatus according to any one of claims 1-9, characterized in that: The deposition apparatus also includes a carrier and a propeller, the carrier being supported on the propeller, the propeller being used to transfer the carrier from the process chamber.

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