Vapor deposition apparatus

Abstract

The application discloses an evaporation device, relates to the technical field of vacuum coating, and is used for improving the uniformity of coating and comprises an evaporation chamber, a supporting member, an evaporation source component and a correction member. The supporting member is arranged in the evaporation chamber and is used for supporting a substrate. The evaporation source component is arranged in the evaporation chamber and is located below the supporting member and is used for generating an upward flowing vapor flow. Particles in the vapor flow can be deposited on the substrate to form a film layer, and the film layer comprises a film area. The correction member is arranged in the evaporation chamber. The correction member comprises a blocking part and an adjusting part connected with each other. The blocking part is arranged on a flowing path of the vapor flow. The blocking part has a blocking area facing the evaporation source component. Along the extension direction of the flowing path, the vapor flow partially flows to the blocking area. The adjusting part is used for adjusting the area of the blocking area according to the coating rate in the film area. The evaporation device in the application is used for coating.

Description

Technical Field

[0001] This application relates to the field of vacuum coating technology, and more particularly to a vapor deposition apparatus. Background Technology

[0002] Evaporation equipment, as an important piece of equipment in the coating field, is widely used in the semiconductor coating field. Evaporation equipment mainly heats the evaporation source in a vacuum environment, causing the coating material at the evaporation source to vaporize into particles. These particles then deposit on the substrate surface in a linear motion to form a film layer.

[0003] Therefore, during the coating process, the number of particles in the particle airflow corresponding to different regions of the substrate has a significant impact on the uniformity of the film thickness. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides a vapor deposition apparatus for improving the uniformity of the deposition film.

[0005] This application is achieved through the following technical solution.

[0006] This application provides a vapor deposition apparatus, including a vapor deposition chamber, a support, an evaporation source component, and a correction component. The support is disposed within the vapor deposition chamber and is used to support a substrate. The evaporation source component is disposed within the vapor deposition chamber and located below the support, and is used to generate an upward-flowing vapor stream. Particles in the vapor stream can be deposited on the substrate to form a film layer, the film layer including a film region. The correction component is disposed within the vapor deposition chamber; the correction component includes a connected blocking portion and an adjusting portion. The blocking portion is disposed in the flow path of the vapor stream and has a blocking region facing the evaporation source component. Along the extension direction of the flow path, a portion of the vapor stream flows towards the blocking region. The adjusting portion is used to adjust the area of ​​the blocking region according to the deposition rate within the film region.

[0007] In the technical solution of this application embodiment, the carrier, the evaporation source component, and the correction component are all located in the evaporation chamber, so that the evaporation chamber is in a vacuum state for film deposition. Specifically, the substrate is placed on the carrier, and the vapor flow generated by the evaporation source component flows to the substrate. Finally, the particles in the vapor flow are deposited on the substrate to form a film layer.

[0008] Since the blocking section is located in the flow path of the vapor flow and has a blocking area, some particles in the vapor flow will flow to the blocking area and be blocked. Since the regulating section adjusts the area of ​​the blocking area according to the coating rate in the film region, the amount of vapor flow can be controlled by controlling the blocking area of ​​the blocking area, thereby controlling the amount of particles passing through and adjusting the coating rate in the film region. For example, when the coating rate in the film region is too high, the area of ​​the blocking area is increased to reduce the amount of particles passing through and reduce the coating rate. Or, when the coating rate in the film region is too low, the area of ​​the blocking area is decreased to increase the amount of particles passing through and increase the coating rate, thereby improving the uniformity of the film layer.

[0009] In some embodiments of this application, the blocking part is made of an elastic material and is capable of extending and retracting along its extension surface direction, with the blocking area located within the extension surface of the blocking part; the adjusting part is used to drive the blocking part to extend and retract, thereby adjusting the area of ​​the blocking area. The extension direction of the flow path intersects with the direction of the extension surface.

[0010] With this configuration, the adjusting part can drive the blocking part to extend and retract in the direction of its extension surface, thereby adjusting the area of ​​the blocking region and thus adjusting the coating rate. Since the adjusting part relies on its own elasticity to adjust the area of ​​the blocking region, stepless adjustment can be achieved, resulting in higher adjustment accuracy.

[0011] In some embodiments of this application, the extension surface direction includes intersecting first and second directions; the adjusting part includes two telescopic rods and a power component, both telescopic rods extending along the first direction, the two telescopic rods being spaced apart along the second direction, and both connected to the blocking part; along the first direction, the two telescopic rods can retract in opposite directions relative to each other, so as to cause a portion of the blocking part within the blocking area to contract and reduce the area of ​​the blocking area; or, the two telescopic rods can extend in opposite directions relative to each other, so as to cause a portion of the blocking part within the blocking area to expand and increase the area of ​​the blocking area. The power component is drivenly connected to both telescopic rods to drive the two telescopic rods to move.

[0012] With this configuration, the double telescopic rods, in conjunction with the power unit, enable the blocking part to extend and retract along the first direction, thereby adjusting the area of ​​the blocking region. The structure is reliable and the adjustment is precise.

[0013] In some embodiments of this application, the direction of the extended surface includes a second direction; the carrier is rotatably connected to the vapor deposition chamber, and the correction element is offset relative to the rotation axis of the carrier; there are multiple film regions, multiple blocking regions, and multiple adjustment parts. Along the extension direction of the flow path, multiple film regions and multiple blocking regions are correspondingly arranged, and multiple blocking regions and multiple adjustment parts are correspondingly arranged. The adjustment parts are used to adjust the area of ​​the corresponding blocking region according to the deposition rate in the corresponding film region. The multiple adjustment parts are arranged along the second direction; wherein, the second direction is the radial direction of the carrier.

[0014] With this configuration, the rotating carrier itself can improve the uniformity of the coating. Since the same correction component includes a blocking part and multiple adjustment parts, and the same film layer includes multiple film regions, the coating rate of multiple film regions can be adjusted using the same correction component, which can further improve the uniformity of the film layer and also improve the monitoring and adjustment rate.

[0015] In some embodiments of this application, the extension surface direction also includes a first direction intersecting the second direction; along the radial direction of the support member, the initial size of the plurality of blocking regions first increases and then decreases in the first direction.

[0016] This configuration effectively compensates for the fact that during the coating process, the coating rate in the central area along the radial direction of the carrier is inherently higher than that in the areas at both ends, reducing the coating edge effect and further improving the uniformity of the coating rate and the uniformity of the film layer.

[0017] In some embodiments of this application, the blocking portion covers the outside of the adjusting portion.

[0018] This design, employing a fully enclosed blocking and regulating mechanism, completely isolates the steam flow from the regulating mechanism, preventing steam from corroding the regulating mechanism and extending its service life.

[0019] In some embodiments of this application, the vapor deposition equipment further includes a deposition detection component electrically connected to the adjustment unit, which is used to detect the deposition rate within the film area.

[0020] With this setup, the coating detection component and the adjustment unit form a closed-loop cooperation, which monitors the coating rate in real time and adjusts the area of ​​the blocking region in real time based on the monitoring results. This adjustment has higher efficiency and accuracy, and can further improve the uniformity of the film layer.

[0021] In some embodiments of this application, the coating detection component includes a crystal oscillator, a film thickness gauge, and a controller. The crystal oscillator, film thickness gauge, and adjustment unit are all electrically connected to the controller. The film thickness gauge is used to generate a coating rate based on the detection result of the crystal oscillator, and the controller is used to control the adjustment unit to make adjustments based on the coating rate.

[0022] With this setup, the combination of the crystal oscillator and the film thickness gauge can ensure the feedback speed, further improve the real-time control rate of the blocking section, and meet the requirements of coating accuracy.

[0023] In some embodiments of this application, the carrier is rotatably connected to the vapor deposition chamber; there are multiple correction elements, which are arranged at intervals around the rotation axis of the carrier.

[0024] This configuration allows for the control of 360° omnidirectional vapor flow, eliminating coating shadow defects.

[0025] In some embodiments of this application, the peripheral wall surface of the telescopic rod has a tooth set, and along the first direction, the tooth set includes multiple tooth structures. The tooth sets on the two telescopic rods are arranged opposite to each other. The power component includes a drive unit and a gear connected in transmission. The gear is located between the two tooth sets and meshes with the tooth structures in the two tooth sets respectively. The extension direction of the rotation axis of the gear intersects with the extension surface direction.

[0026] With this configuration, the drive unit rotates the gears, which in turn drive the two telescopic rods to extend and retract in opposite directions, making the gear meshing transmission method more reliable. Attached Figure Description

[0027] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0028] Figure 1 A first structural schematic diagram of a vapor deposition apparatus provided for some embodiments of this application;

[0029] Figure 2 A top view schematic diagram of a vapor deposition apparatus provided for some embodiments of this application;

[0030] Figure 3 A first top view schematic diagram of a modification provided for some embodiments of this application;

[0031] Figure 4 Top view schematic diagram of the adjustment section provided for some embodiments of this application;

[0032] Figure 5 A second top view schematic diagram of the modifications provided for some embodiments of this application;

[0033] Figure 6 A second structural schematic diagram of the vapor deposition apparatus provided for some embodiments of this application;

[0034] Figure 7 A schematic flowchart illustrating the control method for a vapor deposition apparatus provided in some embodiments of this application.

[0035] Explanation of reference numerals in the attached figures

[0036] 100-Evaporation chamber; 200-Supporting component; 300-Evaporation source component; 400-Correction component; 410-Blocking part; 420-Adjusting part; 421-Telescopic rod; 422-Power component; 500-Coating detection component; 510-Crystal oscillator; 520-Film thickness gauge; 530-Controller; 1-Substrate; 2-Film layer; 21-Film area; X-First direction; Y-Second direction. Detailed Implementation

[0037] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this application; the terms “comprising” and “having”, and any variations thereof, in the specification and the foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0039] In the description of the embodiments of this application, technical terms such as "first," "second," and "third" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects are in an "or" relationship.

[0042] In the description of the embodiments of this application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0043] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0044] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical term "contact" should be interpreted broadly, and can be direct contact, contact through an intermediate medium layer, contact between two contacting parties with substantially no interaction force, or contact between two contacting parties with interaction force.

[0045] The following is a detailed description of this application.

[0046] Evaporation equipment is an important piece of equipment in the coating field and is widely used in the semiconductor coating field. Single-pot electron beam evaporation equipment is even more widely used. The coating principle of single-pot electron beam evaporation equipment is: by heating the evaporation source in a vacuum environment, the coating material at the evaporation source is vaporized into particles, and then these particles are deposited on the substrate surface in a linear motion to form a film layer.

[0047] During the coating process, the number of particles in the particle airflow corresponding to different regions of the substrate has a significant impact on the uniformity of the film thickness.

[0048] Based on this need, related technologies include a correction plate in the vapor deposition equipment. The correction plate blocks the particle airflow at different positions to change the deposition rate at different positions of the substrate, thereby improving the uniformity of the substrate and ensuring the quality of the substrate.

[0049] However, the correction plate in the relevant technology is generally a plate structure with a fixed shape. Since the evaporation angle will vary for different plating materials, it is necessary to replace the correction plate with a different shape to adapt to different plating materials in order to adapt to this difference, which increases the complexity of the operation.

[0050] In addition, after a period of vapor deposition, the amount of plating material will decrease, and the distance between the plating material and the substrate will increase. As a result, the coating condition will also change, and a fixed-shape correction plate will no longer meet the requirements.

[0051] Based on this, such as Figure 1 , Figure 2 As shown, this application provides a vapor deposition apparatus, which includes a vapor deposition chamber 100, a support member 200, an evaporation source component 300, and a correction component 400. The support member 200 is disposed within the vapor deposition chamber 100 and is used to support a substrate 1. The evaporation source component 300 is disposed within the vapor deposition chamber 100 and located below the support member 200, and is used to generate an upward-flowing vapor stream. Particles in the vapor stream can be deposited on the substrate 1 to form a film layer 2, the film layer 2 including a film region 21. The correction component 400 is disposed within the vapor deposition chamber 100; the correction component 400 includes a connected blocking portion 410 and an adjusting portion 420. The blocking portion 410 is disposed in the flow path of the vapor stream and has a blocking region facing the evaporation source component 300. Along the extension direction of the flow path, a portion of the vapor stream flows towards the blocking region. The adjusting portion 420 is used to adjust the area of ​​the blocking region according to the deposition rate within the film region 21.

[0052] During the coating process in the vapor deposition equipment, the vapor deposition chamber 100 is under vacuum. This prevents contamination of the substrate 1 during the coating process and ensures the quality of the substrate 1 after coating. Typically, vapor deposition equipment is equipped with a vacuum system, which can be used to evacuate the vapor deposition chamber 100 before use.

[0053] In addition, the carrier 200 refers to the component that plays the role of supporting the substrate 1. For example, the carrier 200 is a disc structure and can be rotatably connected to the vapor deposition equipment. The rotation axis of the carrier 200 extends in the vertical direction. In this way, by rotating the carrier 200, the substrate 1 on the carrier 200 can be rotated, thereby avoiding the vapor flow from impacting a fixed part of the substrate 1, thereby improving the uniformity of the coating on the substrate 1.

[0054] For example, in order to ensure that the carrier 200 does not affect the coating of the substrate 1, the carrier 200 should have a space to avoid the vapor flow so that the vapor flow can be deposited on the substrate 1.

[0055] In some examples, the evaporation source component 300 mainly includes a heating device and a plating material disposed in the heating device. The plating material is heated by the heating device to melt it, and then the plating material is converted into a gas (vapor stream), which then moves upward to the location of the substrate 1 and is deposited on the substrate 1 to form a film layer 2.

[0056] The particles in the vapor stream refer to the material of the film layer 2 to be coated. For example, the material of the film layer 2 can be aluminum, copper, nickel, silicon dioxide, silicon nitride, or stainless steel, etc., and the specific selection depends on the film layer 2 to be coated. The film layer 2 includes film regions 21. Within the plane of the film layer 2, the film layer 2 is divided into several regions. The coating rate in multiple film regions 21 should be close to the threshold range. In this way, after the coating is completed, the thickness of the film layer 2 in multiple film regions 21 can be similar, thereby improving the overall thickness uniformity of the film layer 2.

[0057] In addition, it is understandable that the blocking part 410 is provided on the flow path of the vapor flow. The vapor flow part flowing into the blocking area along the extension direction of the flow path means that the blocking part 410 only blocks the ions in the vapor flow. That is to say, along the extension direction of the flow path, the blocking area only occupies a part of the cross-section of the vapor flow and does not completely block the vapor flow.

[0058] In some examples, the shape of the blocking part 410 can be set according to actual needs, and the shape of the blocking area on the corresponding blocking part 410 is also selected and set according to the actual coating requirements. The blocking area refers to the surface area that performs the blocking function.

[0059] In some examples, substrate 1 refers to the material or object used to support film layer 2 during particle deposition. For example, the material of substrate 1 can be metal, glass, ceramic, or quartz.

[0060] With the above configuration, the carrier 200, the evaporation source component 300, and the correction component 400 are all located within the evaporation chamber 100, which puts the evaporation chamber 100 into a vacuum state for film deposition. Specifically, the substrate 1 is placed on the carrier 200, and the vapor flow generated by the evaporation source component 300 flows towards the substrate 1. Ultimately, the particles in the vapor flow are deposited on the substrate 1 to form the film layer 2.

[0061] Since the blocking part 410 is located in the flow path of the vapor flow and has a blocking area, some particles in the vapor flow will flow to the blocking area and be blocked. Since the regulating part 420 adjusts the area of ​​the blocking area according to the coating rate in the film region 21, the amount of vapor flow can be controlled by controlling the blocking area of ​​the blocking area, thereby controlling the amount of particles passing through and adjusting the coating rate in the film region 21. For example, when the coating rate in the film region 21 is too high, the area of ​​the blocking area is increased to reduce the amount of particles passing through and reduce the coating rate. Or, when the coating rate in the film region 21 is too low, the area of ​​the blocking area is decreased to increase the amount of particles passing through and increase the coating rate, thereby improving the uniformity of the film layer 2, mainly improving the thickness uniformity of the film layer 2.

[0062] The structure of the blocking part 410 can be selected and configured as needed, as long as the area of ​​the blocking region on the blocking part 410 can be changed under the adjustment of the adjusting part 420. For example, the blocking part 410 can be composed of multiple plate-like structures, which are spliced ​​together to form a large plate. One large surface of the large plate faces the evaporation source component 300, and the blocking region is located within this large surface. Then, the overlapping area of ​​the multiple plate-like structures within the extended surface of the large plate is adjusted by the adjusting part 420, thereby adjusting the area of ​​the large surface of the large plate, and thus adjusting the area of ​​the blocking region, thereby changing the degree to which the blocking region blocks the steam flow. This satisfies the requirement that the shape of the blocking part 410 is variable and the degree of blocking the steam flow is adjustable. Alternatively, the blocking part 410 can also be a component that can extend and retract, changing its shape through its own extension and retraction, thereby changing the area of ​​the blocking region and realizing the change in the degree of blocking the steam flow. A detailed description follows.

[0063] In some embodiments, such as Figure 3 As shown, the blocking part 410 is made of an elastic material and is capable of extending and retracting along its extension surface direction. The blocking area is located within the extension surface of the blocking part 410. The adjusting part 420 is used to drive the blocking part 410 to extend and retract, thereby adjusting the area of ​​the blocking area. The extension direction of the flow path intersects with the direction of the extension surface.

[0064] The elastic material that makes up the blocking part 410 also has high temperature resistance, so it can adapt to the high temperature environment inside the vapor deposition chamber 100 to meet the actual coating requirements.

[0065] For example, the elastic material constituting the blocking part 410 may be fluororubber (FKM), silicone rubber, hydrogenated nitrile rubber (HNBR), phenylene silicone rubber, borosilicate rubber, silicone nitrile rubber, TPU (thermoplastic polyurethane) or TPV (thermoplastic vulcanizate), etc.

[0066] In addition, the support member 200 can rotate around the vertical direction, and the plane where the extension surface is located is perpendicular to the rotation direction of the support member 200, that is, the plane where the extension surface is located is perpendicular to the vertical direction.

[0067] In some examples, the blocking part 410 is a flat plate structure, and the extension surface of the flat plate structure is the plane on which the flat plate structure is located. Since the blocking area is located on the plane on which the flat plate structure is located, the blocking area is easy to set and is more convenient to adjust using the adjustment part 420.

[0068] Alternatively, the adjusting part 420 can be a component that combines a motor and a rod-shaped structure. The motor drives the rod-shaped structure to move, which in turn causes the portion of the blocking part 410 corresponding to the blocking area to extend or retract, thereby adjusting the shape of the blocking part 410 and thus adjusting the area of ​​the blocking region. Alternatively, the adjusting part 420 can also be an elastic component, using the elasticity of the elastic component to adjust the shape of the blocking part 410.

[0069] Furthermore, the adjustment unit 420 can drive the blocking unit 410 to extend and retract within its extension surface in the following ways: the adjustment unit 420 can drive the blocking unit 410 to extend and retract in all directions of its extension surface, or it can drive the blocking unit 410 to extend and retract in only any direction of its extension surface. The specific setting depends on the adjustment requirements.

[0070] With the above settings, the adjusting part 420 can drive the blocking part 410 to extend and retract in its extension direction, thereby adjusting the area of ​​the blocking region and thus adjusting the coating rate. Since the adjusting part 420 adjusts the area of ​​the blocking region by its own elasticity, it can achieve stepless adjustment with higher adjustment accuracy, which can further improve the uniformity of the coating.

[0071] In some embodiments, such as Figure 4 As shown, the extension surface direction includes an intersecting first direction X and a second direction Y. The adjustment unit 420 includes two telescopic rods 421 and a power component 422. Both telescopic rods 421 extend along the first direction X and are spaced apart along the second direction Y, and are both connected to the blocking part 410. Along the first direction X, the two telescopic rods 421 can retract in opposite directions relative to each other, causing a portion of the blocking part 410 within the blocking area to contract and reduce the area of ​​the blocking area; alternatively, the two telescopic rods 421 can extend in opposite directions relative to each other, causing a portion of the blocking part 410 within the blocking area to expand and increase the area of ​​the blocking area. The power component 422 is drively connected to both telescopic rods 421 to drive the movement of the two telescopic rods 421.

[0072] The angle between the first direction X and the second direction Y can be 75°, 80°, 85° or 90°, etc. For ease of understanding, this application describes the first direction X and the second direction Y as being perpendicular. For example, the carrier 200 rotates around the vertical direction, the extension surface is perpendicular to the vertical direction, the first direction X and the second direction Y are perpendicular, and the second direction Y is the radial direction of the carrier 200.

[0073] In some examples, both telescopic rods 421 and the power unit 422 are located inside the blocking part 410, that is, the blocking part 410 covers the outside of the two telescopic rods 421 and the power unit 422. With this arrangement, the blocking part 410 can prevent the telescopic rods 421 and the power unit 422 from directly contacting the steam flow, and can prevent the steam flow from damaging the telescopic rods 421 and the power unit 422, thereby extending the service life of the telescopic rods 421 and the power unit 422.

[0074] Of course, in other examples, the two telescopic rods 421 and the power unit 422 can also be located outside the blocking part 410, which is a flat plate structure. The telescopic rods 421 are supported on one side of the large surface of the flat plate structure, similar to the mask and frame structure in a kite. The telescopic rods 421 are similar to the frame structure in a kite, and the flat plate structure is similar to the mask in a kite.

[0075] With the above configuration, when it is necessary to reduce the area of ​​the obstructed region, the two telescopic rods 421 can retract in opposite directions relative to each other, thereby increasing the overlap area of ​​the two telescopic rods 421 when projected in the second direction Y, thus reducing the total length of the two telescopic rods 421 in the first direction X, thereby causing a portion of the obstructing part 410 within the obstructed region to contract and reduce the area of ​​the obstructed region. When it is necessary to increase the area of ​​the obstructed region, the two telescopic rods 421 can extend and retract in opposite directions relative to each other, thereby reducing the overlap area of ​​the two telescopic rods 421 when projected in the second direction Y, thereby increasing the total length of the two telescopic rods 421 in the first direction X, thereby causing a portion of the obstructing part 410 within the obstructed region to expand and increase the area of ​​the obstructed region. By using the double telescopic rods 421 in conjunction with the power component 422 to realize the extension and retraction of the obstructing part 410 along the first direction X, the area of ​​the obstructed region can be adjusted, resulting in a reliable structure and precise adjustment.

[0076] In some embodiments, such as Figure 4 As shown, the telescopic rod 421 has a toothed assembly on its peripheral wall surface. Along the first direction X, the toothed assembly includes multiple tooth structures, and the toothed assemblies on the two telescopic rods 421 are arranged opposite to each other. The power component 422 includes a drive unit and a gear connected in transmission. The gear is located between the two toothed assemblies and meshes with the tooth structures in the two toothed assemblies respectively. The extension direction of the rotation axis of the gear intersects the extension surface direction.

[0077] In other words, the multiple tooth structures within the gear set constitute a rack, which can mesh with the gear, thereby enabling the two telescopic rods 421 to extend and retract in opposite directions.

[0078] In some examples, the first direction X, the second direction Y, and the extension direction of the rotation axis of the gear are perpendicular to each other. This ensures the stability of the meshing of the gear and tooth structure and the reliability of the extension and retraction of the drive telescopic rod 421.

[0079] The drive unit can be a motor, whose output shaft is connected to the rotation center of the gear to drive the gear to rotate.

[0080] With the above configuration, the drive unit drives the gear to rotate, and the gear meshes with the tooth structure on the two telescopic rods 421, thereby causing the two telescopic rods 421 to extend or retract in opposite directions. The gear meshing transmission method is more reliable.

[0081] In other embodiments, the power component 422 includes a drive unit and a linkage structure. The linkage structure is disposed between the two telescopic rods 421, with one end of the linkage structure movably connected to one telescopic rod 421 and the other end of the linkage structure movably connected to the other telescopic rod 421. The drive unit drives the linkage structure to rotate within the extension surface, thereby causing the two telescopic rods 421 to extend and retract in opposite directions. In this case, it is necessary to guide the telescopic rods 421 so that they can move along the first direction X.

[0082] In some embodiments, such as Figure 5 , Figure 6 As shown, the direction of the extended surface includes the second direction Y. The carrier 200 is rotatably connected to the vapor deposition chamber 100, and the corrector 400 is offset relative to the rotation axis of the carrier 200. There are multiple film regions 21, multiple blocking regions, and multiple adjustment parts 420. Along the extension direction of the flow path, multiple film regions 21 and multiple blocking regions are correspondingly arranged, and multiple blocking regions and multiple adjustment parts 420 are correspondingly arranged. The adjustment parts 420 are used to adjust the area of ​​the corresponding blocking region according to the deposition rate in the corresponding film region 21. The multiple adjustment parts 420 are arranged along the second direction Y; wherein, the second direction Y is the radial direction of the carrier 200.

[0083] The offset of the correction element 400 relative to the rotation axis of the carrier 200 means that the center of the correction element 400 and the rotation axis of the carrier 200 do not overlap. For example, the rotation axis of the carrier 200 and the correction element 400 do not overlap.

[0084] In addition, the radial direction of the support member 200 is perpendicular to the vertical direction.

[0085] In some examples, the corrector 400 includes an adjustment part 420 and a plurality of blocking parts 410. The adjustment part 420 includes two telescopic rods 421 and a power component 422. The blocking area and the adjustment part 420 are correspondingly arranged. The two telescopic rods 421 of the adjustment part 420 are arranged at the positions of the corresponding blocking areas so that by adjusting the size of the portion of the corresponding blocking part 410 in the first direction X, the size of the corresponding blocking area in the first direction X is adjusted, and the area of ​​the corresponding blocking area in the first direction X is adjusted.

[0086] With the above configuration, the rotating carrier 200 can prevent the vapor flow from bombarding a fixed area of ​​the substrate 1, thereby improving the uniformity of the coating. Since the same correction element 400 includes a blocking part 410 and multiple adjusting parts 420, and the same film layer 2 includes multiple film regions 21, the multiple film layers 2 are refined into more regions. Therefore, the same correction element 400 can be used to adjust the coating rate of multiple film regions 21, further improving the uniformity of the film layer 2 and also increasing the monitoring and adjustment rate.

[0087] During vapor deposition, especially point source vapor deposition, the film thickness in the central area of ​​substrate 1 is usually thicker and thinner at the edges. Therefore, in addition to offsetting the baffle plate, the initial size of the baffle plate's blocking area must be specially designed to reduce the influence of edge effects, thereby ensuring the uniformity of the coating and the uniformity of the film layer 2 thickness.

[0088] In some embodiments, such as Figure 5 As shown, the extension surface direction also includes a first direction X that intersects with the second direction Y. Along the radial direction of the support member 200, the initial dimensions of the multiple blocking regions in the first direction X first increase and then decrease.

[0089] That is, along the second direction Y, the initial size of the multiple blocking regions in the first direction X first increases and then decreases. The initial size of the blocking region in the first direction X refers to the size of the blocking region in the first direction X when the adjustment unit 420 has not yet adjusted the blocking unit 410 and the blocking unit 410 is in its initial shape.

[0090] In some examples, the length of the telescopic rod 421 needs to be set as needed to adapt to the initial size of the blocking area. For example, along the radial direction of the carrier 200, the length of the telescopic rod 421 corresponding to the multiple adjustment parts 420 first increases and then decreases. In this way, the size of the telescopic rod 421 can correspond to the initial size of the blocking area, which can facilitate the setting of the telescopic rod 421.

[0091] With the above configuration, the initial size of multiple blocking regions along the radial direction of the carrier 200 first increases and then decreases in the first direction X. That is, along the radial direction of the carrier 200, the initial size of the blocking region located in the middle region is the largest, and then the size of the blocking region gradually decreases as it approaches both ends. Thus, in the initial state, that is, without changing the area of ​​the blocking region, the blocking region located in the middle can block more particles than the blocking region located at the edge. This can effectively compensate for the problem that the coating rate of the film region 21 located in the middle is higher than that of the film region 21 located at both ends along the radial direction of the carrier 200 during the coating process, reduce the coating edge effect, further improve the uniformity of the coating rate, and improve the uniformity of the film layer 2.

[0092] In some embodiments, the blocking portion 410 covers the outside of the adjusting portion 420.

[0093] That is, the blocking part 410 has a cavity structure inside, the adjusting part 420 is disposed inside the cavity structure, and the adjusting part 420 and the inner wall of the cavity structure are matched and fitted, thereby realizing the covering of the adjusting part 420 by the blocking part 410.

[0094] In some examples, the adjustment part 420 includes a power component 422 and two telescopic rods 421. In this case, the blocking part 410 covers the outside of the adjustment part 420. The covering of the blocking part 410 should not affect the movement of the telescopic rods 421 and the adjustment of the power component 422.

[0095] Through the above-described configuration, the fully enclosed blocking part 410 and adjusting part 420 are used in combination, completely isolating the steam flow from the adjusting part 420, preventing steam from corroding the adjusting part 420, and extending the service life of the adjusting part 420. Furthermore, since the blocking part 410 is enclosed outside the adjusting part 420, the adjusting part 420 and the blocking part 410 can fit more closely, allowing the adjusting part 420 to adjust the blocking part 410 more precisely, especially when the adjusting part 420 includes two telescopic rods 421 and a power component 422.

[0096] When the adjusting unit 420 adjusts the blocking unit 410 according to the coating rate of the film region 21, the height of the coating rate of the film region 21 can be judged based on experience, and then the adjusting unit 420 can be controlled to adjust the area of ​​the blocking region on the blocking unit 410. Alternatively, a precision instrument can be used to monitor the coating status of the film region 21 in real time, and then the feedback can be sent to the adjusting unit 420 in real time, and the adjusting unit 420 can then adjust the blocking unit 410 in real time. A detailed description follows.

[0097] In some embodiments, such as Figure 6As shown, the vapor deposition equipment also includes a coating detection component 500, which is electrically connected to the adjustment unit 420. The coating detection component 500 is used to detect the coating rate in the film area 21.

[0098] In some examples, the number of film regions 21 in a single film layer 2 is multiple. The coating detection unit 500 can detect the coating rate of multiple film regions 21, and then control the adjustment unit 420 corresponding to the film region 21 to adjust the area of ​​the corresponding blocking region, thereby adjusting the coating rate of the corresponding film region 21. For example, when the coating rate of the film region 21 is too high, the adjustment unit 420 is used to increase the area of ​​the corresponding blocking region, thereby increasing the number of particles that the blocking region can block, and thus reducing the coating rate of the film region 21. As another example, when the coating rate of the film region 21 is too low, the adjustment unit 420 is used to decrease the area of ​​the corresponding blocking region, thereby decreasing the number of particles that the blocking region can block, and thus increasing the coating rate of the film region 21.

[0099] With the above settings, the coating detection component 500 and the adjustment unit 420 form a closed-loop cooperation, which monitors the coating rate in real time and adjusts the area of ​​the blocking region in real time according to the monitoring results. This adjustment has higher efficiency and accuracy, and can further improve the uniformity of the film layer 2.

[0100] In some embodiments, such as Figure 6 As shown, the coating detection component 500 includes a crystal oscillator 510, a film thickness gauge 520, and a controller 530. The crystal oscillator 510, the film thickness gauge 520, and the adjustment unit 420 are all electrically connected to the controller 530. The film thickness gauge 520 is used to generate the coating rate based on the detection result of the crystal oscillator 510, and the controller 530 is used to control the adjustment unit 420 to make adjustments based on the coating rate.

[0101] It is understandable that the crystal oscillator 510 is based on the piezoelectric effect for detection. It mainly emits different vibration frequencies according to the change in the thickness of the film layer 2, and transmits the signal of the vibration frequency to the controller 530. Then the controller 530 controls the adjustment unit 420 according to the signal.

[0102] With the above settings, the crystal oscillator 510 can generate different vibration frequencies to the film thickness gauge 520 according to the thickness of the film layer 2 within the film region 21. The film thickness gauge 520 then converts the vibration frequency signal into a film thickness signal, which is then transmitted to the controller 530. The controller 530 then controls the adjustment unit 420 to make adjustments based on the film thickness signal. The cooperation between the crystal oscillator 510 and the film thickness gauge 520 can ensure the feedback speed, further improve the rate of real-time control of the blocking unit 410, meet the requirements of coating accuracy, and ensure the uniformity of the film layer 2.

[0103] In some embodiments, such as Figure 6As shown, the carrier 200 is rotatably connected to the vapor deposition chamber 100. There are multiple correction elements 400, which are arranged at intervals around the rotation axis of the carrier 200.

[0104] The number of correction components 400 can be two, three, four, five, or six, and can be selected and set according to needs. For example, the number of correction components 400 is two, and the two correction components 400 are symmetrically arranged on opposite sides of the rotation axis of the carrier 200. This component can improve the uniformity of the coating, and the number of correction components 400 can also be controlled, thereby controlling the cost of components in the vapor deposition equipment.

[0105] With the above settings, multiple correction elements 400 can be used to monitor and adjust the coating efficiency of the film area 21 of the film layer 2 in different orientations, and the 360° omnidirectional vapor flow can be controlled, eliminating coating shadow defects and further improving the uniformity of coating.

[0106] Based on the above-mentioned vapor deposition equipment, such as Figure 7 As shown, this application also provides a control method for a vapor deposition apparatus, which is applied in any of the above embodiments of the vapor deposition apparatus, and will be described below.

[0107] The control method includes S100-S200:

[0108] S100: In response to the first instruction, when the coating rate in the film region 21 is greater than the threshold range, the control adjustment unit 420 increases the area of ​​the blocking region.

[0109] The threshold range is a suitable range for the coating rate, and the specific range can be selected and set according to actual needs.

[0110] In some examples, the adjustment unit 420 includes a telescopic rod 421 and a power component 422, and the blocking part 410 is made of an elastic material. Controlling the adjustment unit 420 to reduce the area of ​​the blocking region includes controlling the movement of the power component 422 to cause the telescopic rod 421 to extend in opposite directions relative to each other, thereby causing a portion of the blocking part 410 within the blocking region to expand and increase the area of ​​the blocking region.

[0111] S200: In response to the second instruction, when the coating rate in the film region 21 is less than the threshold range, the control adjustment unit 420 reduces the area of ​​the blocking region.

[0112] In some examples, the adjustment unit 420 includes a telescopic rod 421 and a power component 422, and the blocking part 410 is made of an elastic material. Controlling the adjustment unit 420 to reduce the area of ​​the blocking region includes controlling the movement of the power component 422 to cause the telescopic rod 421 to retract in opposite directions relative to each other, thereby causing a portion of the blocking part 410 within the blocking region to contract and reduce the area of ​​the blocking region.

[0113] With the above settings, if the deposition rate in film region 21 is greater than the threshold range, it indicates that the deposition rate in film region 21 is too high. In this case, the area of ​​the blocking region is increased to reduce the number of particles passing through and lower the deposition rate. If the deposition rate in film region 21 is less than the threshold range, it indicates that the deposition rate in film region 21 is too low. In this case, the area of ​​the blocking region is decreased to increase the number of particles passing through and increase the deposition rate, thereby improving the uniformity of film layer 2.

[0114] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A vapor deposition apparatus, characterized in that, include: Evaporation chamber; A carrier is disposed within the vapor deposition chamber and is used to support the substrate; An evaporation source component is disposed in the evaporation chamber and located below the support member, and is used to generate an upward-flowing vapor stream, wherein particles in the vapor stream can be deposited on the substrate to form a film layer, the film layer including a film region; A correction element is disposed within the vapor deposition chamber; the correction element includes a connected blocking portion and an adjusting portion, the blocking portion being disposed on the flow path of the vapor flow, the blocking portion having a blocking area facing the evaporation source component, and the vapor flow partially flowing towards the blocking area along the extension direction of the flow path; The adjustment unit is used to adjust the area of ​​the blocking region according to the coating rate within the film region.

2. The vapor deposition equipment according to claim 1, characterized in that, The blocking part is made of an elastic material and is capable of extending and retracting along its extension surface. The blocking area is located within the extension surface of the blocking part. The adjusting part is used to drive the blocking part to extend and retract, so as to adjust the area of ​​the blocking area. The direction of the flow path intersects the direction of the extension surface.

3. The vapor deposition equipment according to claim 2, characterized in that, The direction of the extension surface includes an intersecting first direction and a second direction; The adjusting part includes two telescopic rods and a power component. Both telescopic rods extend along the first direction and are spaced apart along the second direction, and are both connected to the blocking part. Along the first direction, the two telescopic rods can retract in opposite directions relative to each other, causing a portion of the blocking part within the blocking area to contract and reduce the area of ​​the blocking area; alternatively, the two telescopic rods can extend in opposite directions relative to each other, causing a portion of the blocking part within the blocking area to expand and increase the area of ​​the blocking area. The power component is drively connected to both telescopic rods to drive their movement.

4. The vapor deposition equipment according to claim 2, characterized in that, The direction of the extended surface includes a second direction; the carrier is rotatably connected to the vapor deposition chamber, and the correction element is offset relative to the rotation axis of the carrier; there are multiple film regions, multiple blocking regions, and multiple adjustment parts, which are correspondingly arranged along the extension direction of the flow path, and multiple blocking regions and multiple adjustment parts are correspondingly arranged. The adjustment parts are used to adjust the area of ​​the corresponding blocking region according to the deposition rate in the corresponding film region, and the multiple adjustment parts are arranged along the second direction; wherein, the second direction is the radial direction of the carrier.

5. The vapor deposition equipment according to claim 4, characterized in that, The extension surface direction also includes a first direction intersecting the second direction; along the radial direction of the support member, the initial size of the plurality of blocking regions in the first direction first increases and then decreases.

6. The vapor deposition equipment according to claim 1, characterized in that, The blocking part covers the outside of the adjusting part.

7. The vapor deposition equipment according to claim 1, characterized in that, The vapor deposition equipment also includes a coating detection component, which is electrically connected to the adjustment unit. The coating detection component is used to detect the coating rate in the coating area.

8. The vapor deposition equipment according to claim 7, characterized in that, The coating detection component includes a crystal oscillator, a film thickness gauge, and a controller. The crystal oscillator, the film thickness gauge, and the adjustment unit are all electrically connected to the controller. The film thickness gauge is used to generate the coating rate based on the detection result of the crystal oscillator, and the controller is used to control the adjustment unit to make adjustments based on the coating rate.

9. The vapor deposition equipment according to claim 1, characterized in that, The carrier is rotatably connected to the vapor deposition chamber; there are multiple correction components, which are arranged at intervals around the rotation axis of the carrier.

10. The vapor deposition equipment according to claim 3, characterized in that, The telescopic rod has a toothed assembly on its peripheral wall surface. Along the first direction, the toothed assembly includes multiple tooth structures. The toothed assemblies on the two telescopic rods are arranged opposite to each other. The power component includes a drive unit and a gear connected in transmission. The gear is located between the two toothed assemblies and meshes with the tooth structures in the two toothed assemblies respectively. The extension direction of the rotation axis of the gear intersects with the direction of the extension surface.

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