Arc ion plating plasma magnetic filtering device
Patent Information
- Application Number
- CN202522050469.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-24
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-24
AI Technical Summary
然而,传统的弯管磁过滤装置需要设置多个电磁线圈以控制过滤管道内磁场的分布,使等离子体能够顺利通过弯管,这种设计导致结构复杂且镀膜效率不高
[0016]本实用新型的电弧离子镀等离子体磁过滤装置包括弧源组件、过滤组件、设于弧源组件的第一磁结构、套设于过滤组件的第二磁结构以及初筛组件,弧源组件与过滤组件中部中空且连通以形成等离子体通道,初筛组件设于等离子体通道内且其两端分别连接弧源组件与过滤组件,初筛组件设有连通等离子体通道的筛选通道。筛选通道的通道径小于等离子体通道的通道径,大颗粒在朝向待镀膜产品的运动过程中依靠惯性沉积在初筛组件上,减少进入过滤组件的大颗粒数量,过滤组件通过单个电磁线圈对大颗粒进行二次过滤,既大大减少到达待镀膜产品的大颗粒数量,还避免了传统多线圈结构的复杂性,同时还能保持离子流密度、不会损失等离子体的传输效率,提升镀膜品质,保障膜层性能。
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Figure CN224832814U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of coating preparation technology, specifically relating to an arc ion plating plasma magnetic filter device. Background Technology
[0002] Vacuum cathode arc ion plating technology has gained significant attention due to its high ionization rate and strong adhesion, and has been widely used on the surfaces of fasteners, cutting tools, and various equipment. This technology generates plasma by producing arc discharge on the surface of a cathode arc target, which evaporates and ionizes the target material. It has advantages such as high deposition rate, dense film, high hardness, and good adhesion.
[0003] However, in the process of preparing thin films by arc ion plating, the arc spot current density is as high as 2.5 to 5 × 10⁻⁶. 10 A / m 2 This causes molten liquid metal to appear at the arc spot location on the target surface. Under the action of local plasma pressure, it is ejected in the form of droplets, adhering to the film surface or embedding in the film, forming "large particle" defects. Compared to films with a thickness of micrometers or submicrometers, large particles with a size of 0.1-10 micrometers have a serious hazard to the quality and performance of the film, as exemplified by PM2.5 pollution of air quality.
[0004] With the increasingly widespread application of thin film materials and technologies, the solution to the problem of large particle defects has become a bottleneck for the further development of arc ion plating methods, severely restricting their application in the preparation of next-generation thin film materials. Currently, to address the problem of large particle defects in arc ion plating, techniques such as magnetic filtration and pulsed bias are mainly employed. However, traditional bent-tube magnetic filtration devices require multiple electromagnetic coils to control the distribution of the magnetic field within the filtration pipe, allowing plasma to pass smoothly through the bend. This design results in a complex structure and low coating efficiency. Furthermore, while existing magnetic filtration methods can filter large particles, they sacrifice plasma transport efficiency, affecting ion current density and consequently impacting film performance. Utility Model Content
[0005] To address the aforementioned problems, the purpose of this invention is to provide an arc ion plating plasma magnetic filter device, which aims to effectively solve the problem of large particle defects affecting the coating efficiency in arc ion plating.
[0006] To achieve the above objectives, this utility model proposes an arc ion plating plasma magnetic filtration device, comprising an arc source assembly, a filter assembly, a first magnetic structure disposed on the arc source assembly, a second magnetic structure sleeved on the filter assembly, and a primary screening assembly. The arc source assembly and the filter assembly are hollow in the middle and connected to form a plasma channel. The primary screening assembly is disposed within the plasma channel and its two ends are respectively connected to the arc source assembly and the filter assembly. The primary screening assembly has a screening channel connected to the plasma channel, and the channel diameter of the screening channel is smaller than the channel diameter of the plasma channel.
[0007] Optionally, the primary screening component includes a shield and a heat-conducting component spaced apart. The shield is disposed on the arc source component to shield the magnetic field interference of the second magnetic structure on the first magnetic structure. The heat-conducting component is disposed at one end of the filtering component adjacent to the arc source component. The shield has a first sieve hole, and the heat-conducting component has a second sieve hole. The first sieve hole communicates with the second sieve hole to form the screening channel.
[0008] Optionally, the aperture of the first sieve hole is smaller than the aperture of the second sieve hole.
[0009] Optionally, the shield is made of magnetic material, and the two ends of the shield are detachably connected to the arc source assembly. The shield has a recessed relief groove in the middle, and the first screen hole is opened through the bottom wall of the relief groove.
[0010] Optionally, the heat-conducting component is located between the filter assembly and the arc source assembly, and one end of the filter assembly connected to the arc source assembly is provided with an extension flange along its radial direction, and both ends of the heat-conducting component are detachably connected to the extension flange.
[0011] Optionally, the filter assembly includes a filter tube and a vacuum chamber. The filter tube has a mounting groove on its outer periphery. The second magnetic structure is sleeved on the outer periphery of the filter tube and located in the mounting groove. The mounting groove also has a cooling pipe, which is located adjacent to the arc source assembly.
[0012] Optionally, the second magnetic structure includes an electromagnetic coil and a positioning component. The positioning component is disposed in the mounting groove and has a positioning groove for positioning the electromagnetic coil. The width of the positioning groove is adjustable.
[0013] Optionally, the positioning component includes a positioning element and a movable element. The positioning element is detachably disposed in the mounting groove, and the filter tube has a movable part. The movable element is movably disposed in the movable part to adjust the position of the electromagnetic coil.
[0014] Optionally, the arc source assembly has a cooling channel inside its housing and an inlet valve and an outlet valve on its exterior. The cooling channel is used to cool the arc source assembly.
[0015] Optionally, the first magnetic structure is a permanent magnet.
[0016] This utility model discloses an arc ion plating plasma magnetic filtration device comprising an arc source assembly, a filter assembly, a first magnetic structure disposed on the arc source assembly, a second magnetic structure sleeved on the filter assembly, and a primary screening assembly. The arc source assembly and the filter assembly are hollow in the middle and connected to form a plasma channel. The primary screening assembly is disposed within the plasma channel, with its two ends connected to the arc source assembly and the filter assembly, respectively. The primary screening assembly has a screening channel connected to the plasma channel. The channel diameter of the screening channel is smaller than that of the plasma channel. Large particles, during their movement towards the product to be coated, are deposited on the primary screening assembly due to inertia, reducing the number of large particles entering the filter assembly. The filter assembly performs secondary filtration of large particles through a single electromagnetic coil, which not only greatly reduces the number of large particles reaching the product to be coated but also avoids the complexity of traditional multi-coil structures. At the same time, it maintains ion current density, does not lose plasma transmission efficiency, improves coating quality, and ensures film performance. Attached Figure Description
[0017] Figure 1 This is a side cross-sectional view of an embodiment of the arc ion plating plasma magnetic filter device of this utility model.
[0018] Figure 2 This is a front-view structural schematic diagram of an embodiment of the arc ion plating plasma magnetic filter device of this utility model.
[0019] Figure 3 This is a schematic diagram of the structure at the position of the filter tube in an embodiment of the electric arc ion plating plasma magnetic filter device of this utility model.
[0020] Figure 4 This is a schematic diagram of the cooperation structure between the arc source component and the shielding cover in an embodiment of the arc ion plating plasma magnetic filter device of this utility model.
[0021] In the diagram: 100, magnetic filter device; 10, arc source assembly; 11, cooling channel; 13, liquid inlet valve; 15, liquid outlet valve; 30, filter assembly; 31, filter tube; 311, extension flange; 31A, mounting groove; 32, vacuum chamber; 50, first magnetic structure; 60, second magnetic structure; 61, electromagnetic coil; 62, positioning assembly; 621, positioning element; 622, moving element; 70, primary screening assembly; 71, shielding cover; 72, heat-conducting element; 71A, first sieve hole; 72A, second sieve hole; 80, cooling pipe; 90, target material. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of this utility model clearer and more understandable, the technical solutions of this utility model will be clearly and completely described below in conjunction with the accompanying drawings.
[0023] Reference Figures 1 to 4 As shown, this utility model provides an arc ion plating plasma magnetic filter device 100 (hereinafter referred to as a magnetic filter device).
[0024] like Figures 1 to 4 As shown, the magnetic filtration device 100 includes an arc source assembly 10, a filter assembly 30, a first magnetic structure 50 disposed on the arc source assembly 10, a second magnetic structure 60 sleeved on the filter assembly 30, and a primary screening assembly 70. The arc source assembly 10 and the filter assembly 30 are hollow in the middle and connected to form a plasma channel. The primary screening assembly 70 is disposed in the plasma channel and its two ends are respectively connected to the arc source assembly 10 and the filter assembly 30. The primary screening assembly 70 is provided with a screening channel connected to the plasma channel. The channel diameter of the screening channel is smaller than the channel diameter of the plasma channel.
[0025] The magnetic filtration device 100 of this invention has an arc source component 10 for generating electric arc plasma; a first magnetic structure 50 disposed on the arc source component 10 for generating a magnetic field when ionizing the target material 90; a filter component 30 for filtering large particles by relying on a second magnetic structure 60; the arc source component 10 and the filter component 30 are hollow in the middle and connected to form a plasma channel; a primary screening component 70 is disposed in the plasma channel and its two ends are respectively connected to the arc source component 10 and the filter component 30, so that the ions after ionization can first pass through the primary screening component 70 for pre-screening. The primary screening component 70 is provided with a screening channel connected to the plasma channel, and the large particles are initially screened by the size of the screening channel, thereby performing a first filtration. For example, the channel diameter of the screening channel is smaller than that of the plasma channel. Large particles are deposited on the primary screening component 70 by inertia during their movement toward the product to be coated, reducing the number of large particles entering the filter component 30. The filter component 30 performs secondary filtration of large particles through a single electromagnetic coil 61, which not only greatly reduces the number of large particles reaching the product to be coated, but also avoids the complexity of traditional multi-coil structures. At the same time, it can maintain the ion current density, not lose the plasma transmission efficiency, improve the coating quality, and ensure the performance of the film layer.
[0026] Traditional curved tube magnetic filter devices 100 require multiple electromagnetic coils 61 to control the magnetic field distribution within the filter tube 31, enabling plasma to pass smoothly through the curved tube. This results in a complex structure and low coating efficiency. The present invention features a reasonable structural design and a modular design that facilitates maintenance and replacement. By controlling the magnetic field distribution within the filter tube 31 with a single electromagnetic coil 61, the complexity of traditional multi-coil structures is avoided. This achieves efficient plasma transmission, significantly improves coating efficiency, reduces equipment maintenance costs, and extends the equipment's lifespan.
[0027] Optionally, the first magnetic structure 50 is a ring-shaped permanent magnet made of ferrite, with its outer surface coated with an anti-corrosion coating to generate a stable magnetic field environment.
[0028] Optionally, the primary screening component 70 includes a shield 71 and a heat-conducting component 72 spaced apart. The shield 71 is disposed on the arc source component 10 to shield the magnetic field interference of the second magnetic structure 60 on the first magnetic structure 50. The heat-conducting component 72 is disposed on one end of the filter component 30 adjacent to the arc source component 10. The shield 71 is provided with a first screen hole 71A, and the heat-conducting component 72 is provided with a second screen hole 72A. The first screen hole 71A communicates with the second screen hole 72A to form a screening channel.
[0029] In this embodiment, the target material 90 for coating is located on the side of the arc source assembly 10 near the filter assembly 30, and the shield 71 is provided with a first sieve hole 71A to allow plasma to pass through. The shield 71 is made of magnetically conductive material and is coaxially arranged with the filter assembly 30. It is used to reduce external interference (such as magnetic field interference from the second magnetic structure 60) on the surface magnetic field of the target material 90 and to prevent magnetic field leakage. At the same time, the shield 71 acts as a baffle to mechanically block and shield large particles.
[0030] The heat-conducting element 72 is provided with a second sieve hole 72A to allow plasma to pass through. The heat-conducting element 72 is made of copper material with high thermal conductivity and is set at the inlet of the plasma entering the filter assembly 30 to enhance the heat dissipation effect. At the same time, it acts as a baffle to further mechanically block and filter large particles, and can also reduce the performance fluctuation of the overall magnetic filter device 100 caused by high temperature.
[0031] While existing magnetic filtration methods can filter large particles, they sacrifice plasma transmission efficiency, significantly reducing ion current density and impacting coating quality. The shielding cover 71 and the heat-conducting component 72 are respectively equipped with a first sieve 71A and a second sieve 72A for plasma passage. After being ionized, the plasma first passes through the first sieve 71A of the shielding cover 71, and then through the second sieve 72A of the heat-conducting component 72. The initial motion of the plasma is at a certain angle to the target material 90. The plasma movement path involves initial concentrated motion followed by diffusion. Throughout this process, large particles undergo two physical screenings at the shielding cover 71 and the heat-conducting component 72, followed by a secondary filtration within the magnetic field of the filter assembly 30. This significantly reduces the number of large particles, improving coating efficiency and coating quality.
[0032] Optionally, the aperture of the first sieve aperture 71A is smaller than that of the second sieve aperture 72A, so that large particles can be physically shielded by the shield 71 in the early stage of movement, while smaller plasma particles can pass through the first sieve aperture 71A. The shield 71 with small aperture can retain the shielding function as much as possible.
[0033] Optionally, the shield 71 is made of magnetic material, and the two ends of the shield 71 are detachably connected to the arc source assembly 10. The shield 71 has a recessed relief groove in the middle, and the first screen hole 71A is opened through the bottom wall of the relief groove.
[0034] In this embodiment, the shielding cover 71 further reduces the influence of external magnetic fields on the magnetic field distribution on the surface of the target material 90, optimizes the magnetic field distribution on the surface of the target material 90, and also provides mechanical shielding, filtering out some large particles. The clearance groove of the shielding cover 71 is used to accommodate the arc source assembly 10.
[0035] Optionally, the heat-conducting component 72 is located between the filter assembly 30 and the arc source assembly 10. One end of the filter assembly 30 connected to the arc source assembly 10 is provided with an extension flange 311 along its radial direction, and both ends of the heat-conducting component 72 are detachably connected to the extension flange 311.
[0036] The existing device lacks an effective heat dissipation design at the inlet of the 31 filter tubes, failing to remove the heat generated during the filtration process in a timely manner. This can easily lead to excessively high internal temperatures, affecting the filtration effect. In this embodiment, by setting a heat-conducting element 72 at the inlet of the filter assembly 30, the heat generated during the filtration process can be removed in a timely manner, improving the heat dissipation effect, effectively preventing excessively high internal temperatures, ensuring the stability of the filtration effect, and also acting as a baffle to further filter large particles.
[0037] It should be noted that the entire device also includes a cooling system to ensure the temperature stability of each component during operation.
[0038] Optionally, the arc source assembly 10 includes an electric arc ion plating arc source and a magnetic field structure, wherein the electric arc ion plating arc source is cooled by water cooling. For example, the arc source assembly 10 has a cooling channel 11 inside its housing and an inlet valve 13 and an outlet valve 15 outside, the cooling channel 11 being used to cool the electric arc ion plating arc source of the arc source assembly 10.
[0039] The magnetic field structure adopts a cylindrical ring structure coaxial with the filter component 30, namely the ring-shaped first magnetic structure 50. The first magnetic structure 50 is detachably assembled with the arc ion plating arc source so that the first magnetic structure 50 can be replaced, thereby adjusting different magnetic field strengths to adapt to arc sources of different specifications and shapes.
[0040] Furthermore, a liquid cooling channel 16 is also provided at the core of the arc source component 10. The liquid cooling channel 16 is connected to the liquid inlet 17 and the liquid outlet 18. The liquid cooling channel 16 is filled with circulating coolant to cool the target material 90 and reduce the generation of large ionized particles. The ring space of the permanent magnet of the first magnetic structure 50 avoids the liquid inlet 17 and the liquid outlet 18, so that the liquid cooling flow path is reasonably arranged. At the same time, it makes the internal space layout of the arc source component 10 compact and improves the space utilization rate. The proximity of the liquid cooling flow path to the target material 90 can make the cooling effect more obvious.
[0041] Optionally, the filter assembly 30 includes a filter tube 31 and a vacuum chamber 32. The filter tube 31 is provided with a mounting groove 31A on its outer periphery. The second magnetic structure 60 is sleeved on the outer periphery of the filter tube 31 and located in the mounting groove 31A. The mounting groove 31A is also provided with a cooling pipe 80, which is located adjacent to the arc source assembly 10.
[0042] In this embodiment, the filter tube 31 is made of high-temperature and corrosion-resistant stainless steel and is used to guide the arc plasma to travel axially. The inner diameter of the filter tube 31 is determined according to the magnetic field strength and plasma flow rate. The vacuum chamber 32 is provided with a vacuum cavity, in which the sample to be coated is fixed. The mounting flange of the vacuum cavity is made of non-magnetic material and is used to connect the arc source assembly 10 and the filter tube 31 to the vacuum system.
[0043] Optionally, the second magnetic structure 60 includes an electromagnetic coil 61 and a positioning component 62. The positioning component 62 is disposed in the mounting groove 31A and has a positioning groove for positioning the electromagnetic coil 61. The width of the positioning groove is adjustable.
[0044] In this embodiment, the electromagnetic coil 61 is powered by either DC or AC, and its output current is adjustable to generate the required magnetic field. A positioning component 62 is provided at the mounting location of the electromagnetic coil 61. By adjusting the positioning component 62, the mounting position of the electromagnetic coil 61 can be adjusted, thereby achieving precise control of the magnetic field distribution within the filter tube 31. This effectively optimizes the filtration effect for large particles and solves the problem of large particle defects in traditional technologies.
[0045] Optionally, the positioning component 62 includes a positioning element 621 and a movable element 622. The positioning element 621 is detachably disposed in the mounting groove 31A. The filter tube 31 is provided with a movable part. The movable element 622 is movably disposed in the movable part to adjust the position of the electromagnetic coil 61.
[0046] In this embodiment, the electromagnetic coil 61 is made of copper wire, and its diameter, thickness, and length are determined according to the size of the filter tube 31 and the magnetic field requirements. The electromagnetic coil 61 is positioned by the positioning component 621 and the movable component 622 to guide and filter the plasma. Both the positioning component 621 and the movable component 622 are made of stainless steel or high-strength alloy steel and are fixed to the filter tube 31 by screws. They are used to adjust the installation position of the electromagnetic coil 61 and achieve precise control of the magnetic field distribution. The positioning component 621 and the movable component 622 can be configured such that one is fixed and the other is movable, or both can be movable, allowing the installation position of the electromagnetic coil 61 to be flexibly changed. At the same time, the width of the positioning groove formed by the two components can be adjusted to accommodate electromagnetic coils 61 of different widths.
[0047] In this utility model, the terms "inner", "outer", "upper", "lower", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0048] In this utility model, unless otherwise explicitly specified and limited, the terms "set," "install," "fix," and "connect" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0049] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present utility model.
Claims
1. An arc ion plating plasma magnetic filtration device, characterized in that, The device includes an arc source assembly, a filter assembly, a first magnetic structure disposed on the arc source assembly, a second magnetic structure sleeved on the filter assembly, and a primary screening assembly. The arc source assembly and the filter assembly are hollow in the middle and connected to each other to form a plasma channel. The primary screening assembly is disposed in the plasma channel and its two ends are respectively connected to the arc source assembly and the filter assembly. The primary screening assembly has a screening channel that communicates with the plasma channel, and the channel diameter of the screening channel is smaller than the channel diameter of the plasma channel.
2. The arc ion plating plasma magnetic filter device according to claim 1, characterized in that, The primary screening component includes a shield and a heat-conducting component spaced apart. The shield is disposed on the arc source component to shield the magnetic field interference of the second magnetic structure on the first magnetic structure. The heat-conducting component is disposed at one end of the filtering component adjacent to the arc source component. The shield has a first sieve hole, and the heat-conducting component has a second sieve hole. The first sieve hole communicates with the second sieve hole to form the screening channel.
3. The arc ion plating plasma magnetic filter device according to claim 2, characterized in that, The aperture of the first sieve hole is smaller than the aperture of the second sieve hole.
4. The arc ion plating plasma magnetic filter device according to claim 2, characterized in that, The shield is made of magnetic material. The two ends of the shield are detachably connected to the arc source assembly. The shield has a recessed relief groove in the middle, and the first screen hole is opened through the bottom wall of the relief groove.
5. The arc ion plating plasma magnetic filter device according to claim 2, characterized in that, The heat-conducting component is located between the filter assembly and the arc source assembly. One end of the filter assembly connected to the arc source assembly is provided with an extension flange along its radial direction. Both ends of the heat-conducting component are detachably connected to the extension flange.
6. The arc ion plating plasma magnetic filter device according to claim 1, characterized in that, The filter assembly includes a filter tube and a vacuum chamber. The filter tube has a mounting groove on its outer periphery. The second magnetic structure is sleeved on the outer periphery of the filter tube and located in the mounting groove. A cooling pipe is also provided in the mounting groove, and the cooling pipe is located adjacent to the arc source assembly.
7. The arc ion plating plasma magnetic filter device according to claim 6, characterized in that, The second magnetic structure includes an electromagnetic coil and a positioning component. The positioning component is disposed in the mounting groove and has a positioning groove for positioning the electromagnetic coil. The width of the positioning groove is adjustable.
8. The arc ion plating plasma magnetic filter device according to claim 7, characterized in that, The positioning component includes a positioning element and a movable element. The positioning element is detachably disposed in the mounting groove. The filter tube has a movable part, and the movable element is movably disposed in the movable part to adjust the position of the electromagnetic coil.
9. The arc ion plating plasma magnetic filter device according to any one of claims 1 to 8, characterized in that, The arc source component has a cooling channel inside its housing and an inlet valve and an outlet valve on its exterior. The cooling channel is used to cool the arc source component.
10. The arc ion plating plasma magnetic filter device according to any one of claims 1 to 8, characterized in that, The first magnetic structure is a permanent magnet.