Target assembly and ion beam sputtering system

Abstract

The application discloses a target assembly and an ion beam sputtering system. The cooling effect of the target body can be improved by optimizing the structure of the target assembly, and technical conditions for improving the production capacity of the ion beam sputtering system are provided. The target assembly comprises a target body and a back plate, the back plate is internally provided with a cooling flow channel, the back plate has opposite first and second face portions, the target body is fixedly attached to the first face portion, the second face portion is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are in communication with the cooling flow channel.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a target assembly and an ion beam sputtering system. Background Technology

[0002] Ion beam sputtering (IBS) is a physical vapor deposition technique that uses an ion beam (such as an argon ion beam) to bombard a target material in a vacuum environment to achieve thin film deposition.

[0003] In ion beam coating, the ion beam bombardment of the target generates a large amount of heat, necessitating target cooling. In related technologies, the target is fixed to a target backplate. The target cooling structure includes a cooling backplate with built-in cooling channels. The cooling backplate also has an inlet and an outlet connected to the cooling channels. The cooling backplate and the target backplate are fixed together with screws. During operation, cooling water from a cooling water source flows into the cooling channels of the cooling backplate through the inlet. As the cooling water flows within the channels, it carries away heat from the target. The heated cooling water then flows out through the outlet, and this cycle continues, achieving target cooling.

[0004] In the above scheme, the heat generated by the target needs to be transferred to the cooling back plate through the target back plate before it can be carried away by the cooling water flowing inside the cooling back plate. The distance between the target and the cooling water is relatively far, the thermal resistance is large, and the cooling effect on the target is not good. Utility Model Content

[0005] The purpose of this application is to provide a target assembly and an ion beam sputtering system. By optimizing the structure of the target assembly, the cooling effect on the target body can be improved, providing technical conditions for increasing the production capacity of the ion beam sputtering system.

[0006] To address the aforementioned technical problems, this application provides a target assembly, including a target body and a backplate. The backplate has a built-in cooling channel and has a first face and a second face opposite to each other. The target body is fixedly attached to the first face, and the second face has a liquid inlet and a liquid outlet, both of which are connected to the cooling channel.

[0007] With the above scheme, a cooling channel is built into the back plate that is fixedly connected to the target body. The target body is in contact with the first surface of the back plate. In this way, the distance between the target body, which is the heat source, and the coolant is shortened. The only gap between them is the thickness of the wall that forms the cooling channel, resulting in low thermal resistance. The surface contact between the target body and the first surface can ensure the heat transfer efficiency between them, thereby improving the cooling effect on the target body and thus helping to improve the deposition efficiency.

[0008] In one feasible solution, the target body is welded and fixed to the first face.

[0009] In one feasible embodiment, the backplate has a first flow channel on the first face, the first flow channel connecting the central region of the first face and the edge region of the first face, and the target body is welded to the first face by solder filling the first flow channel.

[0010] In one feasible solution, the first face has a protruding structure extending toward the side where the target body is located. There are multiple protruding structures, which are arranged around the center of the back plate. A first flow channel is formed between two adjacent protruding structures, and the target body is in contact with the protruding structure.

[0011] In one feasible embodiment, the protrusion structure includes a plurality of protrusions arranged in a direction from the center of the back plate to the edge of the back plate, a second flow channel is formed between two adjacent protrusions, the second flow channel is connected to the first flow channel, and the target body is welded to the first face through solder filled in the second flow channel.

[0012] In one feasible solution, the depth of the first guide channel is 0.1mm to 0.2mm.

[0013] In one feasible solution, the edge of the target body is provided with a first connecting portion protruding away from the center of the target body, and the edge of the back plate is provided with a second connecting portion protruding away from the center of the back plate, and the first connecting portion and the second connecting portion are fixedly connected.

[0014] In one feasible embodiment, the target assembly includes a fixing block, the first connecting portion having a limiting groove, at least a portion of the fixing block being embedded in the limiting groove, the fixing block being fixedly connected to the second connecting portion by fasteners, and the first connecting portion being located between the second connecting portion and the fixing block.

[0015] In one feasible embodiment, a plurality of first connecting portions are provided, and the plurality of first connecting portions are arranged at intervals along the circumference of the target body; a plurality of second connecting portions are provided, and the plurality of second connecting portions are arranged at intervals along the circumference of the back plate.

[0016] In one feasible embodiment, the target assembly includes a water-distributing module and an adapter. The water-distributing module and the adapter are located on the side where the second face is located. The water-distributing module has an inlet channel and an outlet channel. The adapter has an inlet adapter hole and an outlet adapter hole. The water-distributing module is fixedly connected to the adapter. The adapter is fixedly connected to the back plate. The inlet channel communicates with the inlet port through the inlet adapter hole. The outlet channel communicates with the outlet port through the outlet adapter hole.

[0017] In one feasible solution, two first sealing rings are provided between the adapter and the water distribution module. The liquid inlet channel is sealed with one of the first sealing rings, and the liquid outlet channel is sealed with the other of the first sealing rings.

[0018] In one feasible solution, two second sealing rings are provided between the adapter and the back plate, the liquid inlet adapter hole and the liquid inlet are sealed by one second sealing ring, and the liquid outlet adapter hole and the liquid outlet are sealed by another second sealing ring.

[0019] In one feasible embodiment, the second face has a boss protruding toward the side where the adapter is located, the boss pressing against the second sealing ring.

[0020] In one feasible embodiment, the thickness of the boss is 0.4 mm to 0.6 mm.

[0021] In one feasible embodiment, both the inlet and the outlet are located in the central region of the second face.

[0022] This application also provides an ion beam sputtering system, which includes an ion source and a target assembly as described in any of the preceding claims.

[0023] Since the aforementioned target assembly has the aforementioned technical effects, the ion beam sputtering system including the target assembly also has the same technical effects, and will not be discussed again. Attached Figure Description

[0024] Figure 1 This is an exploded view of the target assembly provided in one embodiment of this application;

[0025] Figure 2 for Figure 1 An exploded view of the target body and backplate in the target assembly shown.

[0026] Figure 3 for Figure 2 Structural diagram of the side where the first facet of the backplate is located;

[0027] Figure 4 for Figure 3 Sectional view of AP-AP direction;

[0028] Figure 5 for Figure 4 The diagram shows the structure of the backplate in the P direction;

[0029] Figure 6 for Figure 4 Sectional view along the AQ-AQ axis.

[0030] Explanation of reference numerals in the attached figures:

[0031] Target assembly 1000;

[0032] Target body 200, first connecting part 210, limiting groove 211;

[0033] Back plate 300, first face surface 310, first guide channel 311, protruding structure 312, protrusion 3121, second guide channel 313, second face surface 320, boss 321, liquid inlet 330, liquid outlet 340, cooling channel 350, second connecting part 360, back plate body 370, sealing layer 380, middle region 1S, edge region 2S;

[0034] Fixed block 400;

[0035] Water separation module 500, liquid inlet channel 510, liquid outlet channel 520;

[0036] Adapter 600, liquid inlet adapter hole 610, liquid outlet adapter hole 620, adapter body 630, adapter support plate 640;

[0037] First sealing ring 710, second sealing ring 720;

[0038] First fastener 810, second fastener 820, third fastener 830. Detailed Implementation

[0039] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] The first and second ordinal numbers used in the embodiments of this application are used to distinguish different components with the same name, and do not indicate a specific order or primary and secondary relationship.

[0041] Ion beam sputtering equipment can be used as plasma deposition equipment. Plasma deposition equipment uses argon ions obtained from glow discharge to physically bombard the surface of a target material through a grid, thereby achieving thin film deposition. The deposition rate is an important indicator of plasma deposition equipment. A higher deposition rate helps to increase production capacity. Increasing power is one of the important means to improve deposition efficiency. However, high power conditions will accelerate the argon ion bombardment rate, resulting in a higher surface temperature of the target material after bombardment, and thus requiring higher cooling of the target material.

[0042] Based on this, the embodiments of this application provide a target assembly that can be used in ion beam sputtering equipment. Through structural improvements to the target assembly, the cooling effect on the target can be improved, providing technical conditions for increasing the production capacity of ion beam sputtering equipment.

[0043] Please refer to Figure 1 and Figure 2 , Figure 1 This is an exploded view of the target assembly provided in one embodiment of this application. Figure 2 for Figure 1 An exploded view of the target body and backplate in the target assembly shown.

[0044] This application provides a target assembly 1000, which includes a target body 200 and a back plate 300. The target body 200 and the back plate 300 are fixedly connected, and the fixedly connected target body 200 and back plate 300 can be referred to as a target structure. The back plate 300 has a built-in cooling channel 350 (marked as...). Figure 4 and Figure 6 In the middle section, the backplate 300 has a first facet 310 and a second facet 320 facing each other. The target body 200 is fixedly attached to the first facet 310, that is, the target body 200 is fixed to the first facet 310 and the target body 200 is in surface contact with the first facet 310. The backplate 300 has a liquid inlet 330 and a liquid outlet 340 (marked in the middle section) on the second facet 320. Figure 5 and Figure 6 In the middle section, both the liquid inlet 330 and the liquid outlet 340 are connected to the cooling channel 350.

[0045] During operation, the coolant can flow into the cooling channel 350 through the inlet 330. When the coolant flows through the cooling channel 350, it can exchange heat with the target body 200. After the heat exchange, the heated coolant can flow out through the outlet 340, be cooled by the external heat exchange equipment, and then flow back into the cooling channel 350 through the inlet 330. This cycle continues to cool the target body 200.

[0046] With the above solution, a cooling channel 350 is built into the back plate 300 which is fixedly connected to the target body 200. The target body 200 is in contact with the first surface 310 of the back plate 300. In this way, the distance between the target body 200, which is the heat source, and the coolant is shortened. The only gap between them is the thickness of the wall portion forming the cooling channel 35, resulting in low thermal resistance. The surface contact between the target body 200 and the first surface 310 can ensure the heat transfer efficiency between them, thereby improving the cooling effect on the target body 200 and thus helping to improve the deposition efficiency.

[0047] In some implementation schemes, the target body 200 is welded to the first surface 310 of the backplate 300. Welding ensures effective fixation between the target body 200 and the backplate 300, while minimizing the air gap between them. Since the target assembly 1000 is located in a vacuum chamber within the ion beam sputtering equipment, a smaller air gap between the target body 200 and the backplate 300 improves the heat transfer efficiency between them, thus enhancing the heat dissipation or cooling effect on the target body 200.

[0048] Please refer to this as well. Figure 3 , Figure 3 for Figure 2 Structural diagram of the side where the first face of the backplate is located.

[0049] In some implementation schemes, the backplate 300 has a first guide groove 311 on the first face 310. The first guide groove 311 connects the middle region 1S of the first face 310 and the edge region 2S of the first face 310. The target body 200 is welded to the first face 310 by solder filling the first guide groove 311.

[0050] The central region 1S of the first face 310 refers to the region near the center of the first face 310, and the edge region 2S refers to the region near the outer edge of the first face 310. The central region 1S and the edge region 2S are clearly separated by a boundary line. In practical applications, the boundary line can be determined according to the shape and size of the back plate 300 and the connection requirements between the back plate 300 and the target body 200.

[0051] The first guide channel 311 can connect the edge region 2S and the middle region 1S. When the back plate 300 and the target body 200 are welded, the welding material located between the two and close to the edge region 2S can flow to the middle region 1S through the first guide channel 311 after melting, ensuring that the target body 200 can be effectively welded to the middle region 1S of the back plate 300, ensuring the connection strength between the back plate 300 and the target body 200, thereby reducing the risk of the target body 200 falling off due to high temperature.

[0052] Multiple first guide grooves 311 can be provided, and the multiple first guide grooves 311 can be arranged around the center of the back plate 300. In this way, the uniformity of the welding position between the back plate 300 and the target body 200 can be ensured, which is beneficial to improving the welding effect between the back plate 300 and the target body 200.

[0053] In some implementation schemes, the first surface 310 of the back plate 300 is provided with a protruding structure 312 extending toward the side where the target body 200 is located. There are multiple protruding structures 312, which are arranged around the center of the back plate 300. That is, the multiple protruding structures 312 are arranged along the circumference of the back plate 300, and a first guide groove 311 is formed between two adjacent protruding structures 312. The target body 200 is in contact with the protruding structure 312, that is, the target body 200 is in surface contact with the protruding structure 312.

[0054] As configured above, the raised structure 312 facilitates the formation of the first guide groove 311. At the same time, the raised structure 312 is in contact with the surface of the target body 200. In this way, the target body 200 is welded to the non-raised structure 312 area of ​​the first surface 310. In the welding area, solder is filled between the target body 200 and the back plate 300. In the non-welding area, the target body 200 is in close contact with the raised structure 312, which can reduce the air gap between the target body 200 and the back plate 300 and effectively improve the heat transfer efficiency between the target body 200 and the back plate 300.

[0055] In addition, the protruding structure 312 makes the contact area between the target body 200 and the back plate 300 dispersed, and the two are not in a large overall contact area. When the back plate 300 is heated and expanded, the protruding structure 312 can effectively disperse the thermal expansion, thereby reducing thermal deformation.

[0056] Figure 2 and Figure 3 In the illustrated embodiment, the protrusion structure 312 includes a plurality of protrusions 3121, which are arranged in a direction from the center of the back plate 300 to the edge of the back plate 300. This can be understood as the plurality of protrusions 3121 being arranged in the radial direction of the back plate 300. A second guide groove 313 is formed between two adjacent protrusions 3121. The second guide groove 313 is connected to the first guide groove 311. The target body 200 is also welded to the first face surface 310 by solder filling the second guide groove 313.

[0057] With this configuration, the distribution of welding points between the target body 200 and the back plate 300 is more uniform, which is more conducive to improving the bonding strength between the target body 200 and the back plate 300, thereby reducing the risk of the target body 200 falling off at high temperatures. At the same time, the number of surface contact positions between the target body 200 and the back plate 300 is large and evenly distributed, which is more conducive to reducing thermal expansion deformation.

[0058] The first guide groove 311, the second guide groove 313 and the protrusion 3121 are mutually matched, and the protrusion thickness of the protrusion 3121 is consistent with the groove depth of the guide groove.

[0059] For example, the depth of the first guide channel 311 can be set in the range of 0.1mm to 0.2mm. This channel depth can take into account both the fixing effect between the target body 200 and the back plate 300, as well as the heat transfer efficiency between the two. Correspondingly, the protrusion thickness of the protrusion structure 312 is also 0.1mm to 0.2mm.

[0060] The depth of the first guide channel 311 or the thickness of the protrusion of the protrusion structure 312 can also be set as needed, and is not limited to the above range.

[0061] Figure 2 and Figure 3 Only one arrangement of the protruding structure 312 is shown. In other embodiments, the arrangement of the protruding structure 312 or the arrangement of the protrusion 3121 can be other forms. The shape of the protrusion 3121 is not limited and can be quadrilateral, elliptical, polygonal, or irregular, etc.

[0062] In some implementation schemes, the edge of the target body 200 is provided with a first connecting part 210 protruding in a direction away from the center of the target body 200, and the edge of the back plate 300 is provided with a second connecting part 360 protruding in a direction away from the center of the back plate 300. The first connecting part 210 and the second connecting part 360 are fixedly connected.

[0063] With this configuration, the target body 200 and the back plate 300 are fixed not only by welding but also by the first connecting part 210 and the second connecting part 360. If the solder between the target body 200 and the back plate 300 fails due to melting at high temperature, the connection between the first connecting part 310 and the second connecting part 360 can also limit the target body 200, preventing it from falling off due to high temperature.

[0064] In specific implementation, such as Figure 1 As shown, the target assembly 1000 also includes a fixing block 400. The first connecting portion 210 of the target body 200 has a limiting groove 211. At least a portion of the fixing block 400 is embedded in the limiting groove 211. The fixing block 400 and the second connecting portion 360 of the back plate 300 are fixedly connected by a first fastener 810. The first connecting portion 210 is located between the fixing block 400 and the second connecting portion 360.

[0065] Thus, part of the fixing block 400 is embedded in the limiting groove 211, and the fixing block 400 is also connected to the second connecting part 360 of the back plate 300, which can limit the relative position of the target body 200 and the back plate 300.

[0066] The opening of the limiting groove 211 of the first connecting part 210 faces away from the back plate 300. After part of the fixing block 400 is embedded in the limiting groove 211, part of it extends out of the first connecting part 210 to facilitate connection with the second connecting part 360. After connection, the first connecting part 210 is equivalent to being clamped between the fixing block 400 and the second connecting part 360, which can ensure the limiting effect on the target body 200.

[0067] In a specific implementation, multiple first connecting portions 210 can be provided, and these multiple first connecting portions 210 are arranged at intervals along the circumference of the target body 200. Multiple second connecting portions 360 are also provided, and these multiple second connecting portions 360 are arranged at intervals along the circumference of the back plate 300. In this way, the target body 200 has multiple circumferential connections with the back plate 300, which can improve the limiting effect between the two and further reduce the risk of the target body 200 detaching under high-temperature conditions.

[0068] Multiple first connecting portions 210 can be evenly distributed along the circumference of the target body 200, and multiple second connecting portions 360 can be evenly distributed along the circumference of the back plate 300, with the positions of the first connecting portions 210 and the second connecting portions 360 corresponding to each other. When using fixing blocks 400 to achieve connection, the number of fixing blocks 400 is consistent with the number of first connecting portions 210 and second connecting portions 360. In this way, the balance of the limiting connection between the target body 200 and the back plate 300 can be ensured.

[0069] Figures 1 to 3 In the example shown, the target body 200 has three first connecting portions 210, and the back plate 300 has three second connecting portions 360. In other embodiments, the number of first connecting portions 210 and second connecting portions 360 can be set as needed, for example, four or five.

[0070] In some implementation schemes, such as Figure 1As shown, the target assembly 1000 also includes a water-distributing module 500 and an adapter 600. The water-distributing module 500 and the adapter 600 are located on the side where the second face 320 of the back plate 300 is located, that is, on the side away from the target body 200. The water-distributing module 500 has a liquid inlet channel 510 and a liquid outlet channel 520, and the adapter 600 has a liquid inlet adapter hole 610 and a liquid outlet adapter hole 620. The water-distributing module 500 is fixedly connected to the adapter 600, and the adapter 600 is fixedly connected to the back plate 300. The liquid inlet channel 510 communicates with the liquid inlet 330 through the liquid inlet adapter hole 610, and the liquid outlet channel 520 communicates with the liquid outlet 340 through the liquid outlet adapter hole 620. The water-distributing module 500 is located on the side of the adapter 600 away from the back plate 300.

[0071] The water distribution module 500 can be connected to an external coolant source to form a coolant circulation loop, allowing the coolant to circulate between the coolant source and the cooling channel 350.

[0072] With the above settings, the connection between the water distribution module 500 and the backplate 300 can be easily achieved through the adapter 600, and the reliability of the connection with the backplate 300 can be ensured.

[0073] In some implementations, two first sealing rings 710 are provided between the adapter 600 and the water distribution module 500. The inlet channel 510 is sealed to the inlet adapter hole 610 by one first sealing ring 710, and the outlet channel 520 is sealed to the outlet adapter hole 620 by another second sealing ring 720. This prevents coolant leakage between the adapter 600 and the water distribution module 500, ensuring that the coolant flow rate into the cooling channel 350 meets requirements and guarantees the cooling effect on the target body 200.

[0074] In practice, an annular mounting groove for installing the first sealing ring 710 can be provided on the end face of the water distribution module 500 facing the adapter 600. The port of the liquid inlet channel 510 or the port of the liquid outlet channel 520 is located at the center of the annular mounting groove. After the adapter 600 is fixedly connected to the water distribution module 500, the end face of the adapter 600 facing the water distribution module 500 can press against the first sealing ring 710 to ensure a sealing effect. The annular mounting groove can limit the position of the first sealing ring 710.

[0075] In other implementations, the annular mounting groove for installing the first sealing ring 710 can also be provided on the end face of the adapter 600 facing the water distribution module 500, or the annular mounting groove for installing the first sealing ring 710 can be partially provided on the water distribution module 500 and partially provided on the adapter 600.

[0076] The water distribution module 500 and the adapter 600 can be fixedly connected by a third fastener 830.

[0077] In some implementations, two second sealing rings 720 are provided between the adapter 600 and the back plate 300. One second sealing ring 720 seals the liquid inlet adapter hole 610 and the liquid inlet 330, while another second sealing ring 720 seals the liquid outlet adapter hole 620 and the liquid outlet 340. This prevents coolant leakage between the adapter 600 and the back plate 300, ensuring that the coolant flow rate into the cooling channel 350 meets requirements and guarantees the cooling effect on the target body 200.

[0078] In practice, an annular mounting groove for mounting the second sealing ring 720 can be provided on the end face of the adapter 600 facing the back plate 300. The liquid inlet adapter hole 6610 or the liquid outlet adapter hole 620 is located at the center of the annular mounting groove. After the adapter 600 is fixedly connected to the back plate 300, the end face of the back plate 300 facing the adapter 600 can press against the second sealing ring 720 to ensure a sealing effect. The annular mounting groove can limit the position of the second sealing ring 720.

[0079] In other implementations, the annular mounting groove for mounting the second sealing ring 720 may also be provided on the side of the back plate 300 facing the adapter 600, i.e., the second face 320 of the back plate 300; or, part of the annular mounting groove for mounting the second sealing ring 720 may be provided on the adapter 600 and part may be provided on the back plate 300.

[0080] Please refer to this as well. Figure 4 and Figure 5 , Figure 4 for Figure 3 Middle AP-AP sectional view, Figure 5 for Figure 4 The diagram shows the structure of the backplate in the P direction.

[0081] In some implementations, the second surface 320 of the back plate 300 is provided with a boss 321 protruding towards the side where the adapter 600 is located, and the boss 321 presses against the second sealing ring 720. In this way, after the back plate 300 and the adapter 600 are fixedly connected, the boss 321 of the back plate 300 can be used to press against the second sealing ring 720 to ensure the sealing effect between the liquid inlet 330 and the liquid inlet adapter hole 610, and between the liquid outlet 340 and the liquid outlet adapter hole 620.

[0082] For example, the thickness of the boss 321 can be 0.4mm to 0.6mm.

[0083] In other implementation schemes, the side of the adapter 600 facing the back plate 300 can also be provided with a boss structure protruding towards the side where the back plate 300 is located. The liquid inlet adapter 610 and the liquid outlet adapter 620 of the adapter 600 are located in the area where the boss structure is located. After the adapter 600 and the back plate 300 are fixedly connected, the boss structure can abut against the second face 320 to cooperate with the second sealing ring 720 to achieve a better sealing effect.

[0084] In other implementation schemes, both the face surfaces of the adapter 600 and the back plate 300 can be provided with boss structures. Through the abutment of the boss structures, a better sealing effect can be achieved in conjunction with the second sealing ring 720.

[0085] In some implementations, the inlet 330 and outlet 340 of the backplate 300 are located in the middle region of the second face 320. In this way, the coolant flowing in from the inlet 330 can first exchange heat with the middle region of the target body 200, effectively cooling the middle region of the target body 200 where the temperature is higher.

[0086] See again Figure 1 The adapter 600 and the back plate 300 can be fixedly connected by the second fastener 820.

[0087] The adapter 600 may include an adapter body 630 and an adapter support plate 640. The adapter body 630 is provided with the aforementioned liquid inlet adapter hole 610 and liquid outlet adapter hole 620. The adapter support plate 640 is fixedly connected to the back plate 300.

[0088] In the design where both the inlet 330 and outlet 340 are located in the central region of the second face 320, the adapter body 630 is located in the central region of the adapter 600, and the adapter support plate 640 can extend from the adapter body 630 in a direction away from the adapter body 630. The adapter support plate 640 can be fixedly connected to the second connecting portion 360 of the back plate 300. This eliminates the need for additional structures on the back plate 300 for connection with the adapter 600. That is, the second connecting portion 360 of the back plate 300 is used both for connection with the first connecting portion 310 of the target body 200 and for connection with the adapter support plate 640 of the adapter 600.

[0089] Figure 1 In the example shown, the adapter 600 is provided with three adapter support plates 640, which respectively cooperate with the three second connecting parts 360 of the back plate 300.

[0090] To ensure reliable connection, the adapter plate 640 can be fixedly connected to the second connecting part 360 via two second fasteners 820. In other implementation examples, the number of adapter plates 640 and the number of second fasteners 820 can be changed as needed.

[0091] In other implementation schemes, a connection structure specifically for connecting with the adapter 600 can also be provided on the back plate 300, that is, the structure on the back plate 300 that connects with the adapter 600 does not have to be the second connection part 360.

[0092] For example, the aforementioned first fastener 810, second fastener 820 and third fastener 830 can all be screws or bolts.

[0093] In some implementations, the cooling channel 350 built into the backplate 300 can be a U-shaped structure, such as... Figure 6 As shown, Figure 6 The dashed arrows in the middle indicate the flow path of the coolant in the cooling channel 350 after it flows into the back plate 300 from the inlet 330.

[0094] In other implementation schemes, the cooling channel 350 can also be a serpentine structure or a spiral structure, etc.

[0095] In some implementation schemes, such as Figure 4 As shown, the backplate 300 may include a backplate body 370 and a sealing layer 380. After a flow channel groove is machined on the side of the backplate body 370 facing the target body 200, the sealing layer 380 is fixedly connected to the backplate body 370, so that the sealing layer 380 seals the opening of the flow channel groove to form a cooling flow channel 350 built into the backplate 300. This facilitates the machining of the cooling flow channel 350.

[0096] The sealing layer 380 and the back plate body 370 can be fixed by welding, which has a good fixing effect and makes it easy to ensure the sealing of the cooling channel 350.

[0097] Combination Figure 1 and Figure 4 In the target assembly 1000 provided in this embodiment, the target body 200 and the coolant are separated only by a sealing layer 380, which can effectively shorten the distance between the coolant and the target body 200, reduce thermal resistance, and improve the cooling effect on the target body 200.

[0098] The target assembly 1000 provided in this embodiment allows the first fastener 810 to be removed after the target body 200 has been worn out during service, thus severing the connection between the first connecting part 210 and the second connecting part 360. This melts the solder between the target body 200 and the back plate 300, allowing the target body 200 to detach from the back plate 300. The back plate 300 can then be fixedly connected to a new target body 200, enabling the back plate 300, adapter 600, etc., to be reused, reducing material loss and lowering material costs.

[0099] In addition to the aforementioned target assembly 1000, this application also provides an ion beam sputtering system, which includes an ion source and a target assembly, wherein the target assembly is the target assembly 1000 described in the foregoing embodiments. The ion source is used to generate an ion beam that bombards the target body 200. Since this ion beam sputtering system includes the aforementioned target assembly 1000, it has the same technical effects as the aforementioned target assembly 1000, which will not be elaborated here.

[0100] Other structural components of the ion beam sputtering system can be implemented based on existing technologies, and will not be repeated here.

[0101] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A target assembly, characterized in that, The device includes a target body (200) and a back plate (300). The back plate (300) has a built-in cooling channel (350). The back plate (300) has a first face (310) and a second face (320) facing each other. The target body (200) is fixedly attached to the first face (310). The second face (320) is provided with a liquid inlet (330) and a liquid outlet (340). Both the liquid inlet (330) and the liquid outlet (340) are connected to the cooling channel (350).

2. The target assembly according to claim 1, characterized in that, The target body (200) is welded and fixed to the first face (310).

3. The target assembly according to claim 2, characterized in that, The back plate (300) has a first guide groove (311) on the first face (310), the first guide groove (311) connects the middle region (1S) of the first face (310) and the edge region (2S) of the first face (310), and the target body (200) is welded to the first face (310) by solder filling the first guide groove (311).

4. The target assembly according to claim 3, characterized in that, The first face (310) is provided with a protruding structure (312) protruding towards the side where the target body (200) is located. There are multiple protruding structures (312), and the multiple protruding structures (312) are arranged around the center of the back plate (300). The first guide groove (311) is formed between two adjacent protruding structures (312), and the target body (200) is in contact with the protruding structure (312).

5. The target assembly according to claim 4, characterized in that, The protrusion structure (312) includes a plurality of protrusions (3121), which are arranged in a direction from the center of the back plate (300) to the edge of the back plate (300). A second guide groove (313) is formed between two adjacent protrusions (3121), and the second guide groove (313) communicates with the first guide groove (311). The target body (200) is welded to the first face (310) by solder filled in the second guide groove (313).

6. The target assembly according to any one of claims 3-5, characterized in that, The depth of the first guide groove (311) is 0.1mm~0.2mm.

7. The target assembly according to any one of claims 1-5, characterized in that, The edge of the target body (200) is provided with a first connecting part (210) protruding away from the center of the target body (200), and the edge of the back plate (300) is provided with a second connecting part (360) protruding away from the center of the back plate (300). The first connecting part (210) and the second connecting part (360) are fixedly connected.

8. The target assembly according to claim 7, characterized in that, The target assembly (1000) includes a fixing block (400), the first connecting part (210) has a limiting groove (211), at least a portion of the fixing block (400) is embedded in the limiting groove (211), the fixing block (400) and the second connecting part (360) are fixedly connected by fasteners, and the first connecting part (210) is located between the second connecting part (360) and the fixing block (400).

9. The target assembly according to claim 7, characterized in that, The first connecting part (210) is provided in multiple ways, and the multiple first connecting parts (210) are arranged at intervals along the circumference of the target body (200); the second connecting part (360) is provided in multiple ways, and the multiple second connecting parts (360) are arranged at intervals along the circumference of the back plate (300).

10. The target assembly according to any one of claims 1-5, characterized in that, The target assembly (1000) includes a water distribution module (500) and an adapter (600). The water distribution module (500) and the adapter (600) are located on the side where the second face (320) is located. The water distribution module (500) has an inlet channel (510) and an outlet channel (520). The adapter (600) has an inlet adapter hole (610) and an outlet adapter hole (620). The water distribution module (500) is fixedly connected to the adapter (600). The adapter (600) is fixedly connected to the back plate (300). The inlet channel (510) is connected to the inlet port (330) through the inlet adapter hole (610). The outlet channel (520) is connected to the outlet port (340) through the outlet adapter hole (620).

11. The target assembly according to claim 10, characterized in that, Two first sealing rings (710) are provided between the adapter (600) and the water distribution module (500). The liquid inlet channel (510) and the liquid inlet adapter hole (610) are sealed by one of the first sealing rings (710), and the liquid outlet channel (520) and the liquid outlet adapter hole (620) are sealed by the other first sealing ring (710).

12. The target assembly according to claim 10, characterized in that, Two second sealing rings (720) are provided between the adapter (600) and the back plate (300). The liquid inlet adapter hole (610) and the liquid inlet (330) are sealed by one second sealing ring (720), and the liquid outlet adapter hole (620) and the liquid outlet (340) are sealed by another second sealing ring (720).

13. The target assembly according to claim 12, characterized in that, The second face (320) is provided with a boss (321) protruding toward the side where the adapter (600) is located, and the boss (321) presses against the second sealing ring (720).

14. The target assembly according to claim 13, characterized in that, The thickness of the boss (321) is 0.4mm~0.6mm.

15. The target assembly according to any one of claims 1-5, characterized in that, Both the inlet (330) and the outlet (340) are located in the middle region of the second face.

16. An ion beam sputtering system, characterized in that, The ion beam sputtering system includes an ion source and a target assembly (1000) as described in any one of claims 1-15.

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