Chip side edge sputtering effect improvement device

Abstract

The utility model relates to a chip side edge sputtering effect improvement device, wherein the chip side edge sputtering effect improvement device includes a workbench, a cloth is placed on the workbench, the cloth is provided with a compression area, the compression area is used for placing a chip, a compression mechanism, the compression mechanism includes a pressure seat, a pressure head and an elastic piece, the pressure seat is drivingly connected with the pressure head, the elastic piece is arranged between the pressure seat and the pressure head, the end of the pressure head is arranged towards the compression area of the cloth, wherein the elastic piece has a preset strength, so that after the pressure seat drives the pressure head to compress the chip on the compression area, the elastic piece is extruded and deformed, the pressure head deviates towards the direction of the pressure seat, so as to avoid the sidewall of the chip sinking into the cloth. The utility model can pass through specially designed compression mechanism, and the pressure head and the pressure seat have a certain elastic stroke, so as to avoid the chip sinking into the cloth caused by direct hard compression.

Description

Technical Field

[0001] This utility model relates to a chip processing apparatus, and more particularly to a device for improving the chip side sputtering effect. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this utility model and does not constitute prior art.

[0003] Semiconductor chips require a sputtering process to obtain a metal layer on their outer surface to achieve electromagnetic shielding. This is a necessary step in the manufacturing process. Specifically, in the sputtering process, the chip needs to be placed on a flexible fabric in advance, and then the top surface of the chip is pressed from top to bottom with a pressure head to make the chip tightly bonded to the fabric and avoid contaminating the bottom of the chip during sputtering.

[0004] However, in some cases during the pressing process, due to excessive pressing force and the soft material of the bonding pad, the chip becomes embedded in the bonding pad, and the sidewalls of some chips become embedded in the bonding pad, making it impossible to be covered by the metal layer in the subsequent sputtering process, thus affecting the electromagnetic shielding effect.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0006] The purpose of this invention is to provide a device for improving the chip side sputtering effect. It can use a specially designed pressing mechanism with a certain elastic stroke between the pressing head and the pressing base to avoid the chip getting stuck in the bonding pad due to direct hard pressing.

[0007] To achieve the above objectives, this utility model discloses a chip side sputtering effect improvement device, which includes: Workbench; A bonding pad is placed on the worktable, and a pressing area is provided on the bonding pad for placing a chip. A pressing mechanism, comprising a pressing base, a pressing head, and an elastic element, wherein the pressing base is drivingly connected to the pressing head, the elastic element is disposed between the pressing base and the pressing head, and the end of the pressing head is disposed toward the pressing area of ​​the fabric. The elastic element has a preset strength, so that after the pressure seat drives the pressure head to press the chip on the pressing area, the elastic element is squeezed and deformed, and the pressure head is offset towards the pressure seat to prevent the sidewall of the chip from sinking into the adhesive.

[0008] As a further description of the above technical solution, the pressing mechanism also includes a limiting block, which is fixed to the bottom of the pressing base and forms a limiting groove around the bottom of the pressing base. The side wall of the pressing head is provided with a locking block, which is locked in the limiting groove to prevent the pressing head from detaching from the pressing base.

[0009] As a further description of the above technical solution, the limiting block includes two oppositely arranged blocks, and the number and position of the card blocks correspond one-to-one with the limiting blocks.

[0010] As a further description of the above technical solution, the elastic element has a relaxed first state and a contracted second state, wherein, In the first state, the bottom of the locking block is in contact with the bottom of the limiting block, and the pressure head and the pressure base have the greatest distance between them; In the second state, the card block is in contact with the bottom surface of the pressure seat, and the pressure head is at the closest distance to the pressure seat.

[0011] As a further description of the above technical solution, when the elastic element is in the second state, the weight applied to the top of the chip by the pressure head is less than 980g.

[0012] As a further description of the above technical solution, when the pressure head applies a preset pressure to the chip, the chip just happens to adhere to the patch, and the elastic element is in a state between the first state and the second state.

[0013] As a further description of the above technical solution, the elastic element is configured as a metal helical spring.

[0014] As a further description of the above technical solution, the number of elastic elements is set to be a plurality of spaced-apart elements.

[0015] Based on the above technical solution, the beneficial effects of this utility model are as follows: This invention provides a device for improving the chip side sputtering effect. Through a specially designed pressing mechanism, the pressure head and base have a certain elastic stroke, preventing the chip from sinking into the bonding pad due to direct hard pressing. Specifically, based on the structure of this invention, an elastic stroke is provided during the pressing mechanism's downward pressure. After the pressure head initially contacts the chip, it gradually applies greater pressure under the action of the elastic element until a preset pressure is reached that allows the chip to adhere precisely to the bonding pad. Compared to existing hard pressing methods, this invention avoids the chip sinking into the bonding pad, thus improving the pressing quality.

[0016] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a cross-sectional schematic diagram of a chip side sputtering effect improvement device provided in the embodiments of this specification; Figure 2 This is a plan view of a chip side sputtering effect improvement device provided in the embodiments of this specification; Figure 3 This is a schematic diagram comparing existing technologies; Figure 4 This is a comparison diagram of soft lamination and hard lamination; In the picture: 1. Workbench; 2. Fabric application; 21. Pressing area; 3. Pressing mechanism; 31. Pressing base; 32. Pressing head; 33. Elastic element; 34. Limiting block; 35. Limiting groove; 36. Locking block; 4. Chip. Detailed Implementation

[0019] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0020] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0021] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0022] Please see Figure 1-2 This embodiment provides a chip 4-side sputtering effect improvement device, which includes: Workbench 1; The adhesive tape 2 is placed on the workbench 1. The adhesive tape 2 has a pressing area 21, which is used to place the chip 4. The pressing mechanism 3 includes a pressing base 31, a pressing head 32, and an elastic element 33. The pressing base 31 is connected to the pressing head 32 in a driving manner. The elastic element 33 is disposed between the pressing base 31 and the pressing head 32. The end of the pressing head 32 is disposed toward the pressing area 21 of the patch 2. The elastic element 33 has a preset strength, so that after the pressure seat 31 drives the pressure head 32 to press the chip 4 on the pressing area 21, the elastic element 33 is squeezed and deformed, and the pressure head 32 is offset toward the pressure seat 31 to prevent the sidewall of the chip 4 from sinking into the patch 2.

[0023] Specifically, based on the structure of this utility model, in use, the operator first places the chip 4 to be coated on the bonding area 21 of the adhesive patch 2. Generally, the bonding area 21 is as follows: Figure 2 The bonding pad 2 is set to a square shape with a perimeter similar to that of the chip 4. In some cases, the bonding pad 2 has a cutout in the middle of the pressing area 21 to accommodate the bottom pins of the chip 4. Then, the operator starts the pressing mechanism 3, causing the pressing base 31 of the pressing mechanism 3 to move downward, and driving the pressing head 32 and the elastic element 33 to move downward synchronously. After the pressing head 32 contacts the chip 4, the pressing head 32... Figure 4 The pressure applied to chip 4 varies. Due to the elastic element 33, the deformation of the elastic element 33 allows the pressure head 32 to provide relatively stable pressure to the top surface of chip 4. In contrast, in existing hard pressing technology without the elastic element 33, only linear pressure can be applied to chip 4. After chip 4 is pressed onto the adhesive pad 2, the pressing base 31 of the pressing mechanism 3 returns, causing the pressure head 32 to disengage. Subsequently, the operator sprays and forms an electromagnetic shielding metal layer on the surface of chip 4. Since chip 4 is not pressed into the adhesive pad 2, the sidewalls of chip 4 are also completely covered by the metal layer.

[0024] In this invention, a specially designed pressing mechanism 3, with a certain elastic stroke between the pressing head 32 and the pressing base 31, avoids the chip 4 from getting stuck in the adhesive tape 2 due to direct hard pressing. Specifically, based on the structure of this invention, an elastic stroke is provided during the pressing of the pressing mechanism 3. After the pressing head 32 initially contacts the chip 4, the pressing head 32 can gradually provide greater pressure under the action of the elastic element 33 until a preset pressure is reached that allows the chip 4 to just adhere to the adhesive tape 2. Compared with existing hard pressing, the device of this invention can avoid the chip 4 getting stuck in the adhesive tape 2, thus improving the pressing quality.

[0025] Furthermore, the pressing mechanism 3 also includes a limiting block 34, which is fixed to the bottom of the pressing base 31 and forms a limiting groove 35 around the bottom of the pressing base 31. A locking block 36 is provided on the side wall of the pressing head 32, and the locking block 36 is engaged in the limiting groove 35 to prevent the pressing head 32 from detaching from the pressing base 31. The limiting block 34 includes two oppositely arranged blocks, and the number and position of the locking blocks 36 correspond one-to-one with the limiting blocks 34. By using the limiting blocks 34 to form the limiting groove 35 in this embodiment, and by allowing the locking blocks 36 to slide within the limiting groove 35, the movement of the pressing head 32 can be made more stable, and the two symmetrical connections on both sides also help maintain the stability of the pressing head 32.

[0026] Specifically, the elastic element 33 has a relaxed first state and a contracted second state. In the first state, the locking block 36 is in contact with the bottom of the limiting block 34, and the pressure head 32 is at its furthest distance from the pressure base 31. In the second state, the locking block 36 is in contact with the bottom surface of the pressure base 31, and the pressure head 32 is at its closest distance from the pressure base 31. When the elastic element 33 is in the second state, the pressure head 32 applies a weight of less than 980g to the top of the chip 4. Please refer to [link / reference]. Figure 4 The blue break line represents the rigid pressing without an elastic element in the prior art, where the pressing height and pressure have a linear relationship. Therefore, even with slight changes in height, it can still provide drastically changing pressure, causing the chip 4 to be easily pressed into the patch 2. The orange line represents the soft pressing achieved in this application using the pressing mechanism 3. Due to the intervention of the elastic element 33, even after the pressure exceeds 900g, the pressure provided by the pressing head 32 of the pressing mechanism 3 remains a small increase between 900-1000g with a very gentle slope, forming a constant pressure range. Therefore, it is relatively less likely that the chip 4 will receive excessive pressure and become trapped in the patch 2 due to improper pressing height control. Specifically, when the pressing head 32 provides the preset pressure to the chip 4, the chip 4 is just bonded to the patch 2, and the elastic element 33 is between the first and second states. In this embodiment, the preset pressure can be set to the range of 900-1000g, which is exactly... Figure 4 The pressure is constant within a range where the slope of the change in the elastic element 33 is relatively gentle.

[0027] Specifically, the elastic element 33 is configured as a metal helical spring, and the number of elastic elements 33 is configured as multiple elements arranged at intervals. Metal helical springs are highly standardized, inexpensive, and easy to manufacture. The arrangement of multiple springs can provide a stable and uniform supporting force to the pressure head 32.

[0028] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of the patent application of the present utility model. Therefore, all equivalent technical changes made using the contents of the present utility model specification and drawings are included in the scope of the patent application of the present utility model.

[0029] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0030] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A device for improving the sputtering effect on the side of a chip, characterized in that, The chip side sputtering effect improvement device includes: Workbench; A bonding pad is placed on the worktable, and a pressing area is provided on the bonding pad for placing a chip. A pressing mechanism, comprising a pressing base, a pressing head, and an elastic element, wherein the pressing base is drivingly connected to the pressing head, the elastic element is disposed between the pressing base and the pressing head, and the end of the pressing head is disposed toward the pressing area of ​​the fabric. The elastic element has a preset strength, so that after the pressure seat drives the pressure head to press the chip on the pressing area, the elastic element is squeezed and deformed, and the pressure head is offset towards the pressure seat to prevent the sidewall of the chip from sinking into the adhesive.

2. The chip side sputtering effect improvement device according to claim 1, characterized in that: The pressing mechanism also includes a limiting block, which is fixed to the bottom of the pressing base and forms a limiting groove around the bottom of the pressing base. The side wall of the pressing head is provided with a locking block, which is locked in the limiting groove to prevent the pressing head from detaching from the pressing base.

3. The chip side sputtering effect improvement device according to claim 2, characterized in that: The limiting block includes two that are arranged opposite each other, and the number and position of the card blocks correspond one-to-one with the limiting block.

4. The chip side sputtering effect improvement device according to claim 2, characterized in that: The elastic element has a relaxed first state and a contracted second state, wherein... In the first state, the bottom of the locking block is in contact with the bottom of the limiting block, and the pressure head and the pressure base have the greatest distance between them; In the second state, the card block is in contact with the bottom surface of the pressure seat, and the pressure head is at the closest distance to the pressure seat.

5. The chip side sputtering effect improvement device according to claim 4, characterized in that: When the elastic element is in the second state, the pressure head applies a weight of less than 980g to the top of the chip.

6. The chip side sputtering effect improvement device according to claim 1, characterized in that: When the pressure head applies a preset pressure to the chip, the chip just adheres to the adhesive tape, and the elastic element is in a state between the first state and the second state.

7. The chip side sputtering effect improvement device according to claim 1, characterized in that: The elastic element is a metal helical spring.

8. The chip side sputtering effect improvement device according to claim 1, characterized in that: The number of elastic elements is set to be multiple, arranged at intervals.

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