A vacuum coating device

Abstract

The utility model belongs to vacuum coating technology field discloses a kind of vacuum coating devices. The vacuum coating device includes coating chamber and plasma generating assembly. Among them, coating chamber is used to accommodate workpiece;Plasma generating assembly includes discharge electrode, first vacuum source and installation chamber, discharge electrode is placed in installation chamber, installation chamber is at least partially placed in coating chamber or installation chamber and coating chamber adjacent arrangement;The opening of first vacuum source is opened in the chamber wall of installation chamber, and first vacuum source is used to vacuumize installation chamber, coating chamber and installation chamber are independently vacuumized respectively.In utility model, improve exhaust efficiency, timely discharge process gas from coating chamber into installation chamber, so that installation chamber is maintained at appropriate and stable vacuum degree, ensure the discharge effect in coating chamber, reduce the discharge risk of installation chamber, while improve energy utilization efficiency.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating technology, and in particular to a vacuum coating device. Background Technology

[0002] Physical vapor deposition (PVD) has been widely used in industries such as automotive, consumer electronics, photovoltaic devices, and semiconductor manufacturing due to its high film density, strong adhesion, and high deposition rate. Sputtering is an important PVD deposition technology. In sputtering systems, independent sputtering and reaction zones are often set up. The sputtering zone uses a medium-frequency power supply to generate plasma, sputtering the target material onto the substrate. Subsequently, a conveying mechanism transports the substrate to the reaction zone. The reaction zone typically uses a radio frequency power supply to generate plasma, ionizing the gaseous material to be reacted with the sputtered products on the substrate to form the desired thin film.

[0003] In the prior art, sometimes the discharge electrode is placed in the coil mounting chamber under atmospheric conditions, and a partition is set between the coil mounting chamber and the coating chamber. However, in this configuration, the pressure difference on both sides of the partition is large, which increases the safety risk. Sometimes the discharge electrode is placed in the coil mounting chamber under vacuum conditions. However, in this configuration, the process gas in the coating chamber can easily enter the coil mounting chamber, which may cause discharge in the coil mounting chamber, affecting the discharge effect in the coating chamber and reducing the energy utilization efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a vacuum coating device that improves exhaust efficiency. While ensuring a good vacuum in the installation chamber, it can promptly remove process gases entering the installation chamber from the coating chamber, maintaining a suitable and stable vacuum in the installation chamber, ensuring that the pressure difference is not too large, while also ensuring the discharge effect in the coating chamber, reducing the discharge risk in the installation chamber, and improving energy utilization efficiency.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A vacuum coating apparatus, comprising:

[0007] The coating chamber is used to hold the workpiece.

[0008] A plasma generating assembly includes a discharge electrode, a first vacuum source, and a mounting chamber. The discharge electrode is located inside the mounting chamber, and the mounting chamber is at least partially placed inside the coating chamber or the mounting chamber is arranged adjacent to the coating chamber. The opening of the first vacuum source is formed in the wall of the mounting chamber, and the first vacuum source is used to evacuate the mounting chamber. The coating chamber and the mounting chamber are evacuated independently.

[0009] As an alternative to a vacuum coating apparatus, the mounting chamber is defined by an isolator and a base. The isolator is used to isolate the coating chamber and the mounting chamber. The electromagnetic waves generated by the discharge electrode can penetrate the isolator and act on the process gas in the coating chamber.

[0010] As an alternative to a vacuum coating apparatus, the isolation element is formed by stacking two dielectric plates along the extended plane of the dielectric plates, with the working end of the first vacuum source facing the junction of the two dielectric plates.

[0011] As an alternative to a vacuum coating apparatus, one end of the discharge electrode passes through the base, and the discharge electrode and the base are connected by a sealing assembly.

[0012] As an alternative to a vacuum coating apparatus, the base is provided with mounting holes, and the sealing assembly includes a sealing element and a sleeve sequentially fitted onto the discharge electrode. The sleeve is threadedly engaged with the base to compress the sealing element and cause deformation.

[0013] As an alternative to the vacuum coating apparatus, the base is further connected to a mounting member, which is at least partially inserted through the mounting hole. The discharge electrode passes through the mounting member, and the sealing member is located between the discharge electrode and the mounting member. The sleeve is screwed to the mounting member.

[0014] As an alternative to a vacuum coating apparatus, the plane formed by the rotation of the discharge electrode is opposite to the extended plane of the insulating member, and multiple sets of the discharge electrodes are arranged side by side inside the mounting chamber.

[0015] As an alternative to a vacuum coating apparatus, the discharge electrode is formed by multiple turns of winding, with each turn of the discharge electrode having a rectangular shape and the top corners of the rectangle being connected by a rounded transition.

[0016] As an alternative to a vacuum coating apparatus, the base is positionable within the coating chamber so that the discharge electrode can be adjusted relative to the workpiece.

[0017] As an alternative to a vacuum coating apparatus, the base is provided with a gas guiding channel along the circumferential ring of the isolation member, the gas guiding channel being used to deliver process gas into the coating chamber.

[0018] Beneficial effects:

[0019] In this invention, the coating chamber provides a space for coating the workpiece. When current is passed through the discharge electrode in the plasma generator assembly, an alternating electromagnetic field is generated, simultaneously ionizing the surrounding process gas and forming plasma. The discharge electrode is located inside the mounting chamber. The opening of the first vacuum source is located in the wall of the mounting chamber, and the first vacuum source is used to evacuate the mounting chamber. The coating chamber and the mounting chamber are evacuated independently. That is, by directly connecting the mounting chamber to the first vacuum source, the intermediate exhaust stroke can be shortened, effectively improving exhaust efficiency. While ensuring a good vacuum level in the mounting chamber, it can also promptly remove process gas entering the mounting chamber from the coating chamber, maintaining a suitable and stable vacuum level in the mounting chamber, avoiding excessive pressure difference between the two sides, and ensuring the discharge effect in the coating chamber. Furthermore, the independent evacuation processes of the coating chamber and the mounting chamber further improve the evacuation efficiency of the two chambers and shorten the device preparation time. Attached Figure Description

[0020] Figure 1 This is a simplified structural diagram of the vacuum coating apparatus provided in this embodiment of the present invention;

[0021] Figure 2 This is a front view of the plasma generating assembly provided in this embodiment of the present invention;

[0022] Figure 3 This is a side view of the plasma generating assembly provided in an embodiment of the present invention;

[0023] Figure 4 This is a cross-sectional view of the plasma generating assembly provided in an embodiment of the present invention;

[0024] Figure 5 This is a partial cross-sectional view of the sealing assembly provided in an embodiment of this utility model.

[0025] In the picture:

[0026] 100. Workpiece; 200. Power supply; 300. Air intake system; 400. Vacuum system; 500. Stage; 600. Plasma;

[0027] 1. Coating chamber;

[0028] 2. Plasma generating assembly; 21. Discharge electrode; 22. First vacuum source; 23. Mounting chamber; 231. Isolator; 232. Base; 2311. Dielectric plate; 233. Gas guide channel;

[0029] 3. Sealing assembly; 31. Seal; 32. Sleeve; 33. Pressure ring;

[0030] 4. Installation components;

[0031] 5. Bracket;

[0032] 6. Matcher;

[0033] 7. Adjustable capacitor;

[0034] 8. Cooling water assembly. Detailed Implementation

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0036] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0039] To facilitate a better understanding of this application by those skilled in the art, the concepts and features that may be involved in this application will be briefly described below.

[0040] The most common low-temperature plasma sources are capacitively coupled plasma (CCP) ion sources and inductively coupled plasma (ICP) ion sources. Compared to CCP ion sources, ICP plasma sources have advantages such as high plasma density, low gas pressure discharge, and weak standing wave effect. They can also reduce contamination caused by high-energy ion bombardment of the substrate. Therefore, ICP ion sources are widely used in PVD equipment.

[0041] Please see the appendix Figure 1 This embodiment relates to a vacuum coating apparatus (hereinafter referred to as "coating apparatus"), which includes a coating chamber 1 and a plasma generating assembly 2. The coating chamber 1 is used to accommodate a workpiece 100. The plasma generating assembly 2 includes a discharge electrode 21, a first vacuum source 22, and a mounting chamber 23. The discharge electrode 21 is placed inside the mounting chamber 23, which is at least partially located inside the coating chamber 1 or is adjacent to it. The opening of the first vacuum source 22 is formed in the wall of the mounting chamber 23, and the first vacuum source 22 is used to evacuate the mounting chamber 23. The coating chamber 1 and the mounting chamber 23 are evacuated independently. The opening of the first vacuum source 22 in the wall of the mounting chamber 23 can be achieved in the following way: When the first vacuum source 22 is a molecular pump, the inlet flange of the molecular pump is connected face-to-face with the exhaust port flange of the mounting chamber 23 through fasteners (such as bolts) and the sealing structure is pressed tightly, thereby forming a vacuum passage with extremely high conductivity between the two without any intermediate pipelines. Understandably, other connection structures can also be used to connect the opening of the first vacuum source 22 and the wall of the mounting chamber 23, as long as the conductivity restriction caused by the connecting pipeline can be effectively avoided.

[0042] In some embodiments, the discharge electrode 21 can be linear or coil-shaped. This embodiment will focus on the coil-shaped discharge electrode 21.

[0043] Please see the appendix Figure 1 -Appendix Figure 4 Specifically, the workpiece 100 can be a substrate to be coated, wherein the coating chamber 1 is the space for coating the workpiece 100, and the workpiece 100 is placed on the stage 500. After a radio frequency (RF) current is passed through the discharge electrode 21 in the plasma generating assembly 2, an alternating electromagnetic field is generated, which simultaneously ionizes the surrounding process gas and forms plasma 600.

[0044] There are several ways to configure the mounting chamber 23. Specifically, the mounting chamber 23 can be partially located within the coating chamber 1; or it can be entirely located within the coating chamber 1; or the mounting chamber 23 can be adjacent to the coating chamber 1, i.e., an opening is formed in the coating chamber 1, and the chamber is connected by a partition that allows electromagnetic fields to pass through. Simultaneously, the discharge electrode 21 is placed inside the mounting chamber 23. The first vacuum source 22 can be a molecular pump, and the mounting chamber 23 can be directly evacuated using the first vacuum source 22. Furthermore, the evacuation processes of the coating chamber 1 and the mounting chamber 23 can be performed independently.

[0045] The process gas is delivered to the coating chamber 1 through the air intake system 300, and the coating chamber 1 is evacuated by the vacuum system 400, which can be a vacuum pump.

[0046] Because the vacuum level of the mounting chamber 23 is relatively low, especially during the coating process, process gas needs to be introduced into the coating chamber 1. The process gas in the coating chamber 1 is easily forced into the mounting chamber 23, which in turn makes it easy for discharge to occur in the mounting chamber 23, thereby further affecting the discharge effect in the coating chamber 1.

[0047] In this embodiment, the opening of the first vacuum source 22 is located in the wall of the mounting chamber 23, and the first vacuum source 22 is used to evacuate the mounting chamber 23. The coating chamber 1 and the mounting chamber 23 are evacuated independently. By directly connecting the mounting chamber 23 to the first vacuum source 22, the intermediate exhaust stroke is shortened, which can effectively improve the exhaust efficiency. While ensuring a good vacuum level in the mounting chamber 23, it can also promptly remove the process gas entering the mounting chamber 23 from the coating chamber 1, maintaining a suitable and stable vacuum level in the mounting chamber 23. At the same time, it ensures the discharge effect in the coating chamber 1 and improves the evacuation rate of the mounting chamber 23. In addition, the independent evacuation process of the coating chamber 1 and the mounting chamber 23 further improves the evacuation efficiency of the two chambers and shortens the preparation time of the device.

[0048] Optionally, the mounting chamber 23 is jointly enclosed and defined by the isolation element 231 and the base 232. The isolation element 231 is used to isolate the coating chamber 1 and the mounting chamber 23. The electromagnetic waves generated by the discharge electrode 21 can penetrate the isolation element 231 and act on the process gas in the coating chamber 1.

[0049] Specifically, the base 232 is made of metal, providing structural support and fixation. The isolator 231, as a key interface, must maintain the relative vacuum seal of the mounting chamber 23 while allowing the electromagnetic waves generated by the discharge electrode 21 to effectively penetrate. Therefore, the isolator 231 spatially isolates the coating chamber 1 from the mounting chamber 23. However, the isolator 231 must still ensure that the electromagnetic waves generated by the discharge electrode 21 can smoothly pass through and reach the coating chamber 1, thereby exciting the process gas to generate plasma 600. The isolator 231 needs to be made of a material that can efficiently transmit electromagnetic waves (such as dielectrics like quartz) to ensure that the excitation energy of the plasma 600 is transferred to the coating chamber 1 with minimal loss.

[0050] In this embodiment, the base 232 and the isolator 231 need to be sealed to prevent process gases from entering the mounting chamber 23 through gaps using the pressure difference on both sides of the isolator 231. However, employing highly efficient sealing measures (eliminating gaps and achieving absolute isolation) can easily increase costs. In this embodiment, by setting a first vacuum source 22, process gases entering the mounting chamber 23 can be discharged in a timely and efficient manner. Therefore, the sealing requirements of this coating apparatus are not high, and general sealing measures (which may have slight gaps and not achieve absolute isolation) can also ensure an efficient coating environment, thereby reducing the cost of this coating apparatus.

[0051] Please see the appendix Figure 2 Optionally, the isolation element 231 is formed by stacking two dielectric plates 2311 along the extended plane of the dielectric plates 2311, and the working end of the first vacuum source 22 is opposite to the junction of the two dielectric plates 2311. The working end of the first vacuum source 22 can be the opening of the molecular pump on the mounting chamber 23, that is, the exhaust port.

[0052] In this embodiment, the dielectric plate 2311 is made of anti-fouling glass with a thickness of 4mm. Two dielectric plates 2311 are coplanarly arranged and stacked to form a complete isolation element 231, thereby isolating the coating chamber 1 and the mounting chamber 23. Because the two dielectric plates 2311 are stacked, process gas molecules can easily enter the interface between them. By positioning the exhaust port of the first vacuum source 22 directly opposite the interface, the process gas entering the mounting chamber 23 from the interface can be directly extracted, improving the efficiency of process gas removal from the mounting chamber 23.

[0053] Please see the appendix Figure 5 Optionally, one end of the discharge electrode 21 passes through the base 232, and the discharge electrode 21 and the base 232 are connected by a sealing assembly 3.

[0054] Specifically, the discharge electrode 21 is formed through a metal conduit, preferably a copper conduit. One end of the discharge electrode 21 can pass through the base 232 from inside the mounting chamber 23 and exit from the back side of the base 232 (i.e., outside the mounting chamber 23), thus facilitating electrical connection between the end of the discharge electrode 21 and the power supply 200. The signal output from the power supply 200 passes through the matching converter 6 and the adjustable capacitor 7, changing the capacitance value of the adjustable capacitor 7 to quickly match and output current to the discharge electrode 21, causing the discharge electrode 21 to generate electromagnetic waves. The sealing assembly 3 ensures the seal between the discharge electrode 21 and the base 232, thereby ensuring the effectiveness of the vacuum pumping function of the first vacuum source 22.

[0055] Furthermore, the base 232 is provided with mounting holes, and the sealing assembly 3 includes a sealing member 31 and a sleeve 32 that are sequentially sleeved on the discharge electrode 21. The sleeve 32 is threadedly engaged with the base 232 to compress the sealing member 31 and cause it to deform.

[0056] In this embodiment, the mounting hole is used to lead out the end of the discharge electrode 21. Therefore, the shape of the mounting hole should be based on the shape of the discharge electrode 21 to ensure good sealing. In this embodiment, the mounting hole is a circular hole with the same shape as the discharge electrode 21. The base 232 is also connected to a mounting member 4, which at least partially passes through the mounting hole. The discharge electrode 21 passes through the mounting member 4, and the sealing member 31 is located between the discharge electrode 21 and the mounting member 4. The sleeve 32 is screwed to the mounting member 4. The mounting member 4 is a flange. The mounting member 4 is partially inserted into the mounting hole and has an interference fit with the mounting hole. At the same time, a portion of the end face of the mounting member 4 is screwed to the base 232 by screws to fix the mounting member 4. After screwing, the sealing between the mounting member 4 and the base 232 is maintained. The mounting member 4 is made of Teflon material. The part of the mounting member 4 that mates with the mounting hole has a conical surface design. The inner wall of the mounting hole can also be a conical surface or a cylindrical surface to ensure good alignment and stable sealing between the mounting member 4 and the base 232 after screwing. A sealing element 31 is fitted around the discharge electrode 21. Multiple sealing elements 31 can be arranged side-by-side. The sealing elements 31 can be sealing rings. A pressure ring 33 is provided between adjacent sealing elements 31. The discharge electrode 21 with the sealing element 31 fitted is inserted into the mounting component 4, and a portion of the sleeve 32 is also inserted into the mounting component 4, connecting the sleeve 32 to the mounting component 4. Specifically, the outer wall of a portion of the sleeve 32 has external threads, and the inner wall of the mounting hole has internal threads. The sleeve 32 is threadedly connected to the base 232. During the continuous threading process, the sealing element 31 is compressed and deformed, thereby sealing the gap.

[0057] By setting the sealing component 3 described above, not only is the discharge electrode 21 sealed, but the end of the discharge electrode 21 is also fixed, which can effectively improve the convenience of assembly.

[0058] Optionally, the plane formed by the rotation of the discharge electrode 21 is opposite to the extended plane of the isolation member 231, and multiple sets of discharge electrodes 21 are arranged in parallel inside the mounting chamber 23.

[0059] Specifically, by aligning the plane formed by the rotation of the discharge electrode 21 with the extended plane of the isolator 231, the alternating electromagnetic field generated by the discharge electrode 21 can penetrate the isolator 231 at a perpendicular or near-perpendicular angle, greatly reducing the reflection and energy loss of electromagnetic waves when penetrating the medium. This ensures that the electromagnetic waves can be distributed more uniformly and deeply into the coating chamber 1, laying the foundation for generating a large-area uniform plasma 600. The parallel arrangement of multiple sets of discharge electrodes 21 realizes the modularization of the plasma source. By independently controlling the power, phase, and other parameters of each set of discharge electrodes 21, electromagnetic fields can be flexibly "spliced" and "superimposed" within the coating chamber 1, thereby precisely controlling the distribution of plasma 600 in three-dimensional space and overcoming the problem of intensity attenuation of the discharge electrode 21 in the edge region.

[0060] Please see the appendix Figure 2 Optionally, the discharge electrode 21 is formed by multiple turns of winding, and the single turn of the discharge electrode 21 is rectangular, with the top corner of the rectangle connected by a rounded transition.

[0061] Specifically, the discharge electrode 21 has a multi-turn spiral structure, with each turn being rectangular, and each of the four apex corners of the rectangle featuring a 1 / 4 rounded transition. The turn pitch of the discharge electrode 21 is 40mm, and the centers of the inner and outer rounded arcs coincide to ensure equal turn pitch. Each discharge electrode 21 can cover an effective film area of ​​750mm × 350mm. Arranging multiple discharge electrodes 21 side by side can increase the covered area. In this embodiment, arranging two discharge electrodes 21 vertically can achieve an effective film area of ​​1540mm × 350mm.

[0062] The discharge electrode 21 is fixed inside the mounting chamber 23 by a bracket 5. The bracket 5 has multiple through holes for the discharge electrode 21 to pass through, and the bracket 5 is used to support the mounting chamber 23. The bracket 5 is insulating and heat-resistant.

[0063] In this embodiment, the rectangular magnetic field effectively eliminates edge and corner effects, controls film thickness non-uniformity, and significantly improves product yield. The rounded transition eliminates tip discharge, avoids localized overheating and ablation of the discharge electrode 21 and abnormal arcing, extends the service life of the discharge electrode 21, and reduces maintenance frequency and cost. Multi-turn winding enhances electromagnetic coupling efficiency, resulting in high plasma density and a fast deposition rate. Simultaneously, the uniform plasma environment is conducive to the formation of dense, highly adhesive, high-quality thin films.

[0064] Optionally, the position of the base 232 within the coating chamber 1 is adjustable so that the relative distance between the discharge electrode 21 and the workpiece 100 can be adjusted.

[0065] Specifically, the base 232 and the coating chamber 1 can be connected by a slide rail. That is, one of the base 232 and the coating chamber 1 is equipped with a slide rail, and the other with a slide groove. The slide rail slides within the slide groove, allowing the base 232 to slide relative to the coating chamber 1. After the position is adjusted, the base 232 is fixed relative to the coating chamber 1. The fixing method can use bolts or other conventional locking structures, thereby adjusting the relative distance between the discharge electrode 21 and the workpiece 100.

[0066] In this embodiment, the relative distance between the discharge electrode 21 and the workpiece 100 is adjustable, which allows for convenient changes in the interaction distance between the electromagnetic field generated by the discharge electrode 21 and the surface of the workpiece 100. Since the electromagnetic field strength is inversely proportional to the square of the distance, even small changes in distance significantly affect the electromagnetic field strength and plasma density at the location of the workpiece 100. Therefore, the relative distance between the discharge electrode 21 and the workpiece 100 can be adjusted according to the shape and size of the workpiece 100 to obtain the most suitable plasma density.

[0067] Optionally, a gas guide channel 233 is provided on the base 232 along the circumference of the isolation member 231, and the gas guide channel 233 is used to deliver process gas into the coating chamber 1.

[0068] Specifically, the base 232 has multiple air guide holes along the circumference of the isolation member 231. The air guide holes are connected to the air guide channel 233. The air intake system 300 delivers the process gas to the air guide channel 233 and discharges it into the coating chamber 1 through the air guide holes. The air guide channel 233 can be provided by a dedicated air guide pipe or it can be directly formed on the base 232.

[0069] In this embodiment, a gas guiding channel 233 is formed on the base 232 and is arranged around the isolation member 231, ensuring that the process gas enters the coating chamber 1 in a uniform manner and improving the uniformity of the process gas in the coating chamber 1. At the same time, the gas guiding hole is very close to the isolation member 231, so that the process gas can immediately collide with high-energy electrons as soon as it is ejected, improving the ionization efficiency and reactivity of the gas.

[0070] In this embodiment, the coating apparatus further includes a cooling water assembly 8, wherein the cooling water assembly 8 includes a water supply component and a cooling water flow channel formed inside the discharge electrode 21. The water supply component introduces cooling water from the back side of the base 232 to one end of the discharge electrode 21, flows through the discharge electrode 21 to the other end and returns, thereby carrying away the heat generated by the current on the discharge electrode 21. Of course, the flow channel inside the discharge electrode 21 can be made of insulating material and extends along the axial direction of the discharge electrode 21.

[0071] Verification showed that the vacuum level in the mounting chamber 23, measured by a vacuum gauge, differed from that in the coating chamber 1 by one order of magnitude, and no discharge was generated in the mounting chamber 23. Therefore, the energy input from the power supply 200 is not consumed inside the mounting chamber 23, but rather most of the energy is transferred to the coating chamber 1, thereby improving energy utilization.

[0072] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A vacuum coating apparatus, characterized in that, include: Coating chamber (1) is used to accommodate workpiece (100). The plasma generating assembly (2) includes a discharge electrode (21), a first vacuum source (22), and an installation chamber (23). The discharge electrode (21) is located inside the installation chamber (23), and the installation chamber (23) is at least partially placed inside the coating chamber (1) or the installation chamber (23) is adjacent to the coating chamber (1). The opening of the first vacuum source (22) is opened in the wall of the installation chamber (23), and the first vacuum source (22) is used to evacuate the installation chamber (23). The coating chamber (1) and the installation chamber (23) are evacuated independently.

2. The vacuum coating apparatus according to claim 1, characterized in that, The mounting chamber (23) is enclosed by an isolator (231) and a base (232). The isolator (231) is used to isolate the coating chamber (1) and the mounting chamber (23). The electromagnetic waves generated by the discharge electrode (21) can penetrate the isolator (231) and act on the process gas in the coating chamber (1).

3. The vacuum coating apparatus according to claim 2, characterized in that, The isolation element (231) is formed by stacking two dielectric plates (2311) along the extended plane of the dielectric plates (2311), and the working end of the first vacuum source (22) is opposite to the junction of the two dielectric plates (2311).

4. The vacuum coating apparatus according to claim 2, characterized in that, One end of the discharge electrode (21) passes through the base (232), and the discharge electrode (21) and the base (232) are connected by a sealing assembly (3).

5. The vacuum coating apparatus according to claim 4, characterized in that, The base (232) is provided with mounting holes. The sealing assembly (3) includes a sealing element (31) and a sleeve (32) that are sequentially sleeved on the discharge electrode (21). The sleeve (32) is threadedly engaged with the base (232) to compress the sealing element (31) and cause deformation.

6. The vacuum coating apparatus according to claim 5, characterized in that, The base (232) is also connected to a mounting member (4), which is at least partially inserted through the mounting hole. The discharge electrode (21) passes through the mounting member (4), and the sealing member (31) is located between the discharge electrode (21) and the mounting member (4). The sleeve (32) is screwed to the mounting member (4).

7. The vacuum coating apparatus according to claim 2, characterized in that, The plane formed by the rotation of the discharge electrode (21) is opposite to the extended plane of the isolation member (231), and multiple sets of the discharge electrodes (21) are arranged in parallel inside the mounting chamber (23).

8. The vacuum coating apparatus according to any one of claims 1-7, characterized in that, The discharge electrode (21) is formed by multiple turns of winding. The single turn of the discharge electrode (21) is rectangular, and the top corner of the rectangle is connected by a rounded transition.

9. The vacuum coating apparatus according to any one of claims 2-7, characterized in that, The base (232) is adjustable in position within the coating chamber (1) so that the discharge electrode (21) can be adjusted to be at a relative distance from the workpiece (100).

10. The vacuum coating apparatus according to any one of claims 2-7, characterized in that, The base (232) is provided with a gas guide channel (233) along the circumferential ring of the isolation member (231), and the gas guide channel (233) is used to deliver process gas into the coating chamber (1).

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