Cooling device for a semiconductor device

Abstract

The application relates to the technical field of process gas cooling, and provides a cooling device of a semiconductor device, which comprises a condensing pipe, a gas inlet assembly and a supporting assembly; the condensing pipe comprises a first pipe body and a second pipe body arranged in an external space around the first pipe body; the gas inlet assembly is used for providing flowing gas between the first pipe body and the second pipe body; the supporting assembly comprises a bottom plate, a first supporting unit and a second supporting unit; one end of the first supporting unit is rotationally connected to the bottom of the second pipe body, and the other end is connected to the bottom plate; one end of the second supporting unit is rotationally connected to the bottom of the second pipe body, and the other end is rotationally connected to the bottom plate; the second supporting unit is configured to be telescopic so as to adjust the included angle between the condensing pipe and the bottom plate. The scheme sets the component capable of adjusting the inclination angle of the condensing pipe, solves the technical problem that the condensing pipe cannot adapt to different process gas flow characteristics due to the fixed position, and realizes the cooling of the process gas by the flowing gas entering the inside of the condensing pipe and absorbing the internal heat.

Description

Technical Field

[0001] This application relates to the field of process gas cooling technology, and more particularly to a cooling device for semiconductor equipment. Background Technology

[0002] Chemical vapor deposition (CVD) is a common method for manufacturing semiconductor thin films. This process can be used to deposit various types of materials, including insulators, semiconductors, and conductors.

[0003] When preparing semiconductor thin films using chemical vapor deposition, the process gas is heated and reacted in the process chamber. After the final preparation is completed, the heated process gas is discharged, and cooling treatment is required for the process gas.

[0004] In existing chemical vapor deposition processes, condensers with an inner and outer double-tube structure are typically used for cooling. Since the position of the condenser is fixed, different types of process gases flow through the inner tube of the condenser in the same direction. The condenser cannot adapt to the flow characteristics of different types of process gases, resulting in the cooling effect of the condenser not meeting expectations.

[0005] Therefore, how to provide a cooling device for semiconductor devices that can be flexibly adjusted is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0006] This application provides a cooling device for semiconductor equipment, which optimizes the flow state of process gas in the tube, improves heat transfer efficiency, and achieves uniform temperature distribution inside the condenser tube, thereby improving the stability of the cooling effect.

[0007] To address the technical problems existing in the prior art, the following technical solution is adopted: A cooling device for a semiconductor device, comprising: A condenser tube, comprising a first tube body and a second tube body, wherein the second tube body is arranged around the external space of the first tube body, and the first tube body has a process gas inlet end and a process gas outlet end; A gas inlet assembly is disposed on the side of the second pipe body near the process gas inlet end, and is used to provide circulating gas to the gap formed between the first pipe body and the second pipe body; The support assembly includes a base plate, a first support unit, and a second support unit. One end of the first support unit is rotatably connected to the bottom of the second tube body, and the other end is connected to the base plate. One end of the second support unit is rotatably connected to the bottom of the second tube body, and the other end is rotatably connected to the base plate. The second support unit is configured to be telescopic to adjust the angle between the condenser tube and the base plate.

[0008] Preferably, the gas inlet assembly includes a guide plate and an adjusting member connected thereto. The guide plate is used to guide the flowing gas into the gap formed between the first pipe and the second pipe, and the adjusting member is used to rotate the guide plate to change the direction of the flowing gas when it enters the gap.

[0009] Preferably, the first support unit includes a first connector and a support column. The first connector has a first fixed end and a first rotating end. The first fixed end is connected to the bottom of the second tube. One end of the support column is rotatably connected to the first rotating end, and the other end is connected to the base plate. And / or, The second support unit includes a second connector, a third connector, and a telescopic column. The second connector has a second fixed end and a second rotating end. The second fixed end is connected to the bottom of the second tube. The third connector has a third fixed end and a third rotating end. The third fixed end is connected to the base plate. The two ends of the telescopic column are rotatably connected to the second rotating end and the third rotating end, respectively, and are configured to be extendable or retractable.

[0010] Preferably, the adjusting component includes a fixed rod, a connecting rod, and a slider. Each guide plate is provided with a fixed rod. The two ends of the connecting rod are respectively rotatably connected to the fixed rods on two adjacent guide plates. The slider is connected to the side of the connecting rod away from the second tube body and is used to push so that the connecting rod and the fixed rod cooperate to move, thereby rotating the guide plate.

[0011] Preferably, the gas inlet assembly further includes a housing, the wall of which has an air duct opening composed of at least two partitions, the guide plate is located inside the housing, the length direction of the partitions is perpendicular to the length direction of the guide plate, and a slide is formed between two adjacent partitions for the slider to slide along the length direction of the partitions.

[0012] Preferably, the gas inlet assembly further includes a filter element, which is disposed on a wall of the housing near the second pipe and opposite to the air duct opening, for filtering the circulating gas.

[0013] Preferably, the filter element includes a filter screen, a mounting frame, a disassembly plate, and a handle. The filter screen is disposed within the mounting frame, the bottom of the disassembly plate is connected to the top of the mounting frame, and the handle is connected to the top of the disassembly plate for disassembling the filter element.

[0014] Preferably, the filter element further includes a locking member, the disassembly plate has a through hole, the housing has a channel, and the locking member passes through the through hole and is tightly fitted into the channel, so that the disassembly plate abuts against the top of the housing.

[0015] Preferably, the cooling device further includes a heat dissipation component, which is disposed on the side of the second tube near the process gas outlet end, for discharging the circulating gas in the gap.

[0016] Preferably, the heat dissipation assembly includes a heat dissipation cylinder, a fan, a fixing plate, and a drive motor. The fan is located at the end of the heat dissipation cylinder away from the second tube body. The fixing plate and the drive motor are both located inside the heat dissipation cylinder. The drive motor is mounted on the fixing plate, and the output end of the drive motor passes through the fixing plate and is connected to the fan.

[0017] Preferably, a number of heat dissipation fins are evenly arranged on the outer side of the first tube wall.

[0018] According to the specific embodiments provided in this application, the following technical effects are disclosed: The technical solution of this application provides a cooling device for a semiconductor device, comprising: a condenser tube, the condenser tube including a first tube body and a second tube body, the second tube body being disposed around the external space of the first tube body, the first tube body having a process gas inlet end and a process gas outlet end; a gas inlet assembly, the gas inlet assembly being disposed on the side of the second tube body near the process gas inlet end, for providing circulating gas to the gap formed between the first tube body and the second tube body; and a support assembly, the support assembly including a base plate, a first support unit and a second support unit, one end of the first support unit being rotatably connected to the bottom of the second tube body and the other end being connected to the base plate, one end of the second support unit being rotatably connected to the bottom of the second tube body and the other end being rotatably connected to the base plate, the second support unit being configured to be retractable to adjust the angle between the condenser tube and the base plate. The solution addresses the technical problem in existing technologies where the fixed position of the condenser tube prevents it from adapting to the flow characteristics of different process gases by incorporating an adjustable condenser tube tilt angle component. Specifically, the tilt angle of the condenser tube can be adjusted according to the physical properties of the process gas to optimize its flow state within the tube and improve heat transfer efficiency. Simultaneously, the flowing gas enters the interior of the condenser tube through the gas inlet component, absorbing internal heat and achieving cooling of the process gas. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is an overall schematic diagram of the cooling device for a semiconductor device provided in an embodiment of this application; Figure 2 This is a cross-sectional schematic diagram of the cooling device for a semiconductor device provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the gas inlet assembly provided in the embodiments of this application; Figure 4 This is a top view schematic diagram of the connection between the guide plate and the adjusting component provided in the embodiment of this application; Figure 5 This is a cross-sectional schematic diagram of the filter element provided in the embodiments of this application.

[0021] Figure label: 1. Condenser; 2. Gas inlet assembly; 3. Support assembly; 4. Heat dissipation assembly; 10. First pipe body; 10a. Process gas inlet end; 10b. Process gas outlet end; 11. Second pipe body; 20. Guide plate; 21. Adjusting component; 22. Housing; 23. Filter element; 30. Base plate; 31. First support unit; 32. Second support unit; 40. Heat dissipation cylinder; 41. Fan; 42. Fixing plate; 43. Drive motor; 100, heat dissipation fins; 210, fixing rod; 211, connecting rod; 212, slider; 220, partition; 230, filter screen; 231, mounting frame; 232, disassembly plate; 233, handle; 234, locking component; 310, first connecting component; 311, support column; 320, second connecting component; 321, third connecting component; 322, telescopic column; 2340, knob; 2341, lead screw. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] As described in the background section, existing chemical vapor deposition processes typically employ condensers with an inner and outer double-tube structure for cooling. Since the condenser is fixed in position, different types of process gases flow through the inner tube of the condenser in the same direction. The condenser cannot adapt to the flow characteristics of different types of process gases, resulting in the cooling effect of the condenser not meeting expectations.

[0024] Based on this, this application aims to provide a cooling device for semiconductor equipment to solve the technical problem in the prior art that the condenser tube cannot be adapted to different process gas flow characteristics due to its fixed position.

[0025] The embodiments of this application will be analyzed in detail below with reference to the accompanying drawings.

[0026] refer to Figure 1 and Figure 2 The cooling device includes a condenser tube 1, which includes a first tube body 10 and a second tube body 11. The length of the first tube body 10 is greater than the length of the second tube body 11. The second tube body 11 is arranged around the external space of the first tube body. The first tube body 10 has a process gas inlet end 10a and a process gas outlet end 10b. A gas inlet assembly 2 is provided on the side of the second tube body 11 near the process gas inlet end 10a. The gas inlet assembly 2 is used to provide circulating gas to the gap formed between the first tube body 10 and the second tube body 11.

[0027] The heated process gas enters from the process gas inlet 10a of the first tube 10, flows along the inner wall of the first tube 10, and finally exits from the process gas outlet 10b. The first tube 10 is relatively long, which can extend the residence time of the process gas and enhance the heat exchange efficiency. During the flow of the process gas in the first tube 10, its heat is transferred to the inner wall of the first tube 10, and then from the inner wall to the outer wall of the first tube 10. The circulating gas enters the gap formed between the first tube 10 and the second tube 11 through the gas inlet assembly 2, absorbing the heat from the outer wall of the first tube 10 to achieve cooling of the process gas.

[0028] As a specific implementation method, the circulating gas can be air or nitrogen.

[0029] refer to Figure 1 and Figure 2The cooling device also includes: a support assembly 3, which includes a base plate 30, a first support unit 31, and a second support unit 32. One end of the first support unit 31 is rotatably connected to the bottom of the second tube 11, and the other end is connected to the base plate 30. One end of the second support unit 32 is rotatably connected to the bottom of the second tube 11, and the other end is rotatably connected to the base plate 30. The second support unit 32 is configured to be telescopic to adjust the angle between the condenser tube 1 and the base plate 30. The gas inlet assembly 2 includes a guide plate 20 and an adjusting member 21 connected thereto. The guide plate 20 is used to guide the flowing gas into the gap formed between the first tube 10 and the second tube 11. The adjusting member 21 is used to rotate the guide plate 20 to change the direction of the flowing gas when it enters the gap.

[0030] The first support unit 31 and the second support unit 32 separate the condenser tube 1 from the base plate 30. In the initial state, the first support unit 31 and the second support unit 32 are parallel and of the same length, keeping the condenser tube 1 parallel to the base plate 30. In the adjustment state, the first support unit 31 remains stationary, while the second support unit 32 is adjusted to extend. As the length of the second support unit 32 increases, the condenser tube 1 is pushed upward, increasing the angle between the condenser tube 1 and the base plate 30, and increasing the inclination of the condenser tube 1. In the recovery state, the first support unit 31 remains stationary, while the second support unit 32 is adjusted to contract. As the length of the second support unit 32 decreases, the condenser tube 1 returns to its original position and descends, decreasing the angle between the condenser tube 1 and the base plate 30, and reducing the inclination of the condenser tube 1.

[0031] The gas inlet assembly 2 can be connected to an external gas supply device for the cooling unit. This gas supply device can directly supply low-temperature gas or use external air. In the unadjusted state, the guide plate 20 guides the gas into the gap along a direction perpendicular to the process gas flow. In this state, because the gas directly blows onto part of the first tube 10 wall after entering the gap, there is significant resistance, and the gas disperses due to impact on the tube wall, affecting the flow effect within the gap. In the adjusted state, the guide plate 20 rotates under the action of the adjusting element 21, reducing the angle between the gas flow direction and the process gas flow direction from a right angle to an acute angle. The gas flow direction gradually approaches the process gas flow direction, greatly reducing resistance and resulting in good gas flow within the gap.

[0032] In one specific embodiment, the first support unit 31 and the second support unit 32 are respectively disposed at the bottom ends of the second tube body 11 to increase the distance between the two support points and improve the support stability of the condenser tube 1.

[0033] As an example, the process gas is gas A with an extremely high incident velocity. If the condenser tube 1 and the base plate 30 are parallel, i.e., the angle between them is 0°, gas A will flow rapidly through the first tube 10 and exit from the process gas outlet 10b. Due to the excessively high flow velocity, the heat transfer time is insufficient, and the heat from gas A cannot be effectively transferred to the first tube 10. Gas A still carries a large amount of heat when it exits, and the cooling device does not achieve a good cooling effect. Therefore, the second support unit 32 is adjusted to push the condenser tube 1 upward, increasing the angle between the condenser tube 1 and the base plate 30 to... ( (Within a range of 60° to 75°), the inclination of the condenser tube 1 is increased. When gas A flows into the first tube 10 at an extremely high incident velocity, the large inclination of the condenser tube 1 forces gas A to overcome gravity and flow upwards along the inclined tube, performing an "uphill" motion. This significantly reduces the initial velocity and acceleration of gas A, increasing its flow time within the first tube 10. Heat is then more fully transferred to the outer wall of the first tube 10, and the flowing gas carries away the heat transferred from the outer wall, achieving cooling of gas A. Simultaneously, the guide plate 20, pre-adjusted by the adjusting component 21, rotates to an appropriate position, making the flow direction of the flowing gas closer to the flow direction of gas A. This creates a coordinated flow, improving heat exchange efficiency. Furthermore, the resistance of the flowing gas when flowing into the gap is lower, and its distribution within the gap is more uniform, avoiding the problem of uneven tube wall temperature distribution caused by the flowing gas directly blowing into a localized area of ​​the first tube 10.

[0034] As another example, the process gas is gas B with a certain viscosity and a large flow rate. If the condenser tube 1 and the base plate 30 are parallel, i.e., the angle between them is 0°, the large flow rate of gas B adheres to the inner wall of the first tube 10, leading to increased thermal resistance, decreased heat transfer efficiency, and difficulty in efficiently absorbing heat. Simultaneously, the viscous resistance causes flow stagnation, affecting the flow efficiency of gas B. Therefore, adjusting the second support unit 32 pushes the condenser tube 1 upward, increasing the angle between the condenser tube 1 and the base plate 30 to... ( (Within a range of 15° to 20°), the inclination of the condenser tube 1 is increased. When gas B flows into the first tube 10 with a certain viscosity, the moderate inclination of the condenser tube 1 allows gas B to flow along the inner wall of the first tube 10 using its own moderate gravitational force. This reduces flow stagnation and obstruction caused by viscous resistance, resulting in a more uniform flow distribution of gas B within the first tube 10, lowering thermal resistance and improving heat transfer efficiency. Simultaneously, the guide plate 20 rotates to an appropriate position under the advance adjustment of the adjusting component 21, causing the flow direction of the circulating gas to approach the flow direction of gas B. This creates a coordinated flow, improving heat exchange efficiency. Furthermore, the resistance of the circulating gas flowing into the gap is lower, and its distribution within the gap is more uniform, avoiding the problem of uneven tube wall temperature distribution caused by the circulating gas directly blowing into a localized area of ​​the first tube 10.

[0035] In summary, by incorporating components that allow for adjustable tilt angles of the condenser tube 1 and components that allow for changing the inlet direction of the circulating gas, the technical problems of the condenser tube 1 being unable to adapt to different process gas flow characteristics and uneven cooling due to its fixed position in the prior art are solved. Specifically, the tilt angle of the condenser tube 1 can be adjusted according to the physical properties of the process gas to optimize the flow state of the process gas inside the tube and improve heat transfer efficiency. At the same time, the inlet direction of the circulating gas can be adjusted by rotating the guide plate 20, so that the flow direction of the circulating gas is matched with the flow direction of the process gas, achieving uniform temperature distribution inside the condenser tube 1, avoiding local over-cooling or under-cooling, and improving the stability of the cooling effect.

[0036] As a preferred embodiment, refer to Figure 1 and Figure 2 The first support unit 31 includes a first connector 310 and a support column 311. The first connector 310 has a first fixed end and a first rotating end. The first fixed end is connected to the bottom of the second tube 11. One end of the support column 311 is rotatably connected to the first rotating end and the other end is connected to the base plate 30.

[0037] The support column 311 maintains a fixed length. When the condenser tube 1 is pushed, the condenser tube 1 will rotate relative to the support column 311 through the first connector 310.

[0038] As a preferred embodiment, refer to Figure 1 and Figure 2The second support unit 32 includes a second connector 320, a third connector 321, and a telescopic column 322. The second connector 320 has a second fixed end and a second rotating end. The second fixed end is connected to the bottom of the second tube 11. The third connector 321 has a third fixed end and a third rotating end. The third fixed end is connected to the base plate 30. The two ends of the telescopic column 322 are rotatably connected to the second rotating end and the third rotating end, respectively, and are configured to be extendable or retractable.

[0039] The telescopic column 322 is connected to the rotating end of the second connector 320 and the rotating end of the third connector 321, allowing the tilt angle of the condenser tube 1 to be adjusted arbitrarily. It should be noted that the tilt angle here is always an acute angle. The telescopic length of the telescopic column 322 directly corresponds to the tilt angle of the condenser tube 1. By controlling the stroke of the telescopic column 322, the tilt range of the condenser tube 1 can be precisely set, such as 15° to 20° or 60° to 75°.

[0040] In one specific implementation, the telescopic column 322 is formed by two nested tubes, one of which can extend or retract relative to the other tube.

[0041] In one specific implementation, the telescopic column 322 is connected to the controller and the power supply via a wire. After power is applied, the controller can control the telescopic column 322 to extend or retract.

[0042] As a preferred embodiment, refer to Figure 3 and Figure 4 There are two guide plates 20. The adjusting component 21 includes two fixed rods 210, a connecting rod 211 and a slider 212. Each guide plate 20 is provided with a fixed rod 210. The two ends of the connecting rod 211 are rotatably connected to the fixed rods 210 on the two adjacent guide plates 20. The slider 212 is connected to the side of the connecting rod 211 away from the second tube 11 and is used to push so that the connecting rod 211 and the fixed rod 210 cooperate to move, so that the guide plate 20 rotates.

[0043] At least two guide vanes 20 can divide the space into at least three channels for the flow of gas. Two adjacent guide vanes 20 form a linkage structure with a fixed rod 210 and a connecting rod 211. The movement of the connecting rod 211 and the fixed rod 210 is driven by a slider 212, which can simultaneously adjust the angle of the two guide vanes 20 to ensure coordinated changes in the airflow direction in each channel.

[0044] As an example, see reference Figure 3The guide vane 20 is positioned at a preset angle by default. A fixing rod 210 is fixed to the guide vane 20, and a connecting rod 211 connects two adjacent fixing rods 210. A slider 212 is located in the middle of the side of the connecting rod 211 furthest from the guide vane 20. By manually pushing the slider 212, its displacement is transmitted to the two adjacent fixing rods 210 via the connecting rod 211, forcing the guide vane 20 to rotate. Since multiple guide vanes 20 are connected in series via the connecting rod 211, the rotation angles of all guide vanes 20 change synchronously.

[0045] As a preferred embodiment, refer to Figure 3 The gas inlet assembly 2 also includes a housing 22. The wall of the housing 22 is provided with an air duct opening composed of at least two partitions 220. The guide plate 20 is located inside the housing 22. The length direction of the partition 220 is perpendicular to the length direction of the guide plate 20. A slide is formed between two adjacent partitions 220 for the slider 212 to slide along the length direction of the partition 220.

[0046] Among them, the air duct openings serve as physical separation and a certain airflow guidance function, as referenced. Figure 3 The guide plate 20 forms multiple vertically parallel channels for the flow of gas. The length direction of the baffle 220 is perpendicular to the length direction of the guide plate 20, thus forming multiple horizontally parallel channels for the flow of gas. The baffle 220 is located on the outside of the guide plate 20 to avoid local airflow concentration caused by direct impact when the gas enters the housing 22, ensuring that the gas can enter the housing 22 evenly and smoothly.

[0047] As a preferred embodiment, refer to Figure 1 and Figure 5 The gas inlet assembly 2 also includes a filter element 23, which is disposed on a wall of the housing 22 near the second pipe 11 and opposite to the air duct opening, for filtering the circulating gas.

[0048] The circulating gas enters the interior of the housing 22 through the air duct, is filtered by the filter element 23, and then flows into the gap between the first tube 10 and the second tube 11.

[0049] As a preferred embodiment, refer to Figure 5 The filter element 23 includes a filter screen 230, a mounting frame 231, a disassembly plate 232, and a handle 233. The filter screen 230 is disposed inside the mounting frame 231. The bottom of the disassembly plate 232 is connected to the top of the mounting frame 231, and the handle 233 is connected to the top of the disassembly plate 232 for disassembling the filter element 23.

[0050] The filter screen 230 can be made of polyester fiber material. When the filter screen 230 needs to be replaced, the operator can remove the filter element 23 from the housing 22 using the handle 233, separate the disassembly plate 232 from the mounting frame 231, remove the used filter screen 230 from the mounting frame 231, connect the new filter screen 230 to the four corners of the mounting frame 231 to make the filter screen 230 tensioned, then install the disassembly plate 232 on the mounting frame 231, and lift the filter element 23 onto the housing 22 using the handle 233.

[0051] As a preferred embodiment, refer to Figure 5 The filter element 23 also includes a locking element 234. The disassembly plate 232 has a through hole, and the housing 22 has a channel. The locking element 234 passes through the through hole and is tightly fitted into the channel, so that the disassembly plate 232 abuts against the top of the housing 22.

[0052] As a specific implementation method, such as Figure 5 As shown, both ends of the disassembly plate 232 are provided with through holes, and both ends of the top of the housing 22 are provided with channels; the locking member 234 includes a knob 2340 and a lead screw 2341 connected thereto. By rotating the knob 2340 in the locking direction, the lead screw 2341 passing through the through hole is threaded and tightly fitted into the channel, so that the disassembly plate 232 abuts against the top of the housing 22. By rotating the knob 2340 in the loosening direction, the lead screw 2341 is disengaged from the channel, so that the disassembly plate 232 is separated from the top of the housing 22.

[0053] As a preferred embodiment, refer to Figure 1 and Figure 2 The cooling device also includes a heat dissipation component 4, which is located on the side of the second tube 11 near the process gas outlet end 10b, and is used to discharge heat and circulating gas in the gap.

[0054] Among them, heat dissipation component 4 can be an air-cooled heat dissipation component.

[0055] As a preferred air-cooled heat dissipation implementation method, refer to Figure 1 and Figure 2 The heat dissipation assembly 4 includes a heat dissipation cylinder 40, a fan 41, a fixing plate 42 and a drive motor 43. The fan 41 is located at the end of the heat dissipation cylinder 40 away from the second tube 11. The fixing plate 42 and the drive motor 43 are both located inside the heat dissipation cylinder 40. The drive motor 43 is mounted on the fixing plate 42 and the output end of the drive motor 43 passes through the fixing plate 42 and is connected to the fan 41.

[0056] When the drive motor 43 is powered on, its output shaft begins to rotate, driving the fan 41 to rotate. When the fan 41 rotates, a negative pressure is formed inside the heat sink 40 to absorb heat and circulating gas inside the condenser 1 and discharge it through the heat sink 40. The fixing plate 42 serves as a support structure for the drive motor 43, ensuring that the drive motor 43 remains stable during operation and reducing the impact of vibration on the heat sink 40.

[0057] As a preferred embodiment, refer to Figure 2 The outer wall of the first tube 10 has several heat dissipation fins 100 evenly arranged.

[0058] The heat dissipation fins 100 can be evenly arranged along the axial direction of the first tube 10 to ensure that the heat of the process gas is evenly dissipated along the first tube 10.

[0059] refer to Figures 1 to 5 The overall operation process of the cooling device is as follows: First, determine the characteristics of the process gas. Connect the process gas inlet 10a of the first tube 10 to the upstream process gas discharge device, and the process gas outlet 10b to the downstream process gas recovery device. Next, adjust the second support unit 32 to push the condenser tube 1, so that the condenser tube 1 and the base plate 30 maintain a suitable angle. Then, push the slider 212 to rotate the guide plate 20 to a suitable angle, ensuring that the flow direction of the circulating gas is close to the flow direction of the process gas. Then, start the upstream and downstream equipment, start the circulating gas supply device, start the heat dissipation component 4, and use the fan 41 to discharge the heat and circulating gas in the condenser tube 1. Finally, after long-term use of the cooling device, take out the filter element 23 through the handle 233 and replace the filter screen 230. The entire process is now complete.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0061] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0062] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A cooling device for a semiconductor device, characterized in that, The cooling device includes: The condenser (1) includes a first tube body (10) and a second tube body (11), the second tube body (11) being arranged around the external space of the first tube body (10), and the first tube body (10) having a process gas inlet end (10a) and a process gas outlet end (10b). Gas inlet assembly (2), the gas inlet assembly (2) is disposed on the side of the second pipe body (11) near the process gas inlet end (10a), and is used to provide circulating gas to the gap formed between the first pipe body (10) and the second pipe body (11); The support assembly (3) includes a base plate (30), a first support unit (31) and a second support unit (32). One end of the first support unit (31) is rotatably connected to the bottom of the second tube (11) and the other end is connected to the base plate (30). One end of the second support unit (32) is rotatably connected to the bottom of the second tube (11) and the other end is rotatably connected to the base plate (30). The second support unit (32) is configured to be telescopic to adjust the angle between the condenser tube (1) and the base plate (30).

2. The cooling device for a semiconductor device according to claim 1, characterized in that, The gas inlet assembly (2) includes a guide plate (20) and an adjusting member (21) connected thereto. The guide plate (20) is used to guide the flowing gas into the gap formed between the first pipe body (10) and the second pipe body (11). The adjusting member (21) is used to rotate the guide plate (20) to change the direction of the flowing gas when it enters the gap.

3. The cooling device for a semiconductor device according to claim 1, characterized in that, The first support unit (31) includes a first connector (310) and a support column (311). The first connector (310) has a first fixed end and a first rotating end. The first fixed end is connected to the bottom of the second tube (11). One end of the support column (311) is rotatably connected to the first rotating end and the other end is connected to the base plate (30). And / or, The second support unit (32) includes a second connector (320), a third connector (321) and a telescopic column (322). The second connector (320) has a second fixed end and a second rotating end. The second fixed end is connected to the bottom of the second tube (11). The third connector (321) has a third fixed end and a third rotating end. The third fixed end is connected to the base plate (30). The two ends of the telescopic column (322) are rotatable and are connected to the second rotating end and the third rotating end respectively, and are configured to be extendable or retractable.

4. The cooling device for a semiconductor device according to claim 2, characterized in that, The adjusting component (21) includes a fixed rod (210), a connecting rod (211), and a slider (212). Each guide plate (20) is provided with a fixed rod (210). The two ends of the connecting rod (211) are respectively rotatably connected to the fixed rods (210) on two adjacent guide plates (20). The slider (212) is connected to the side of the connecting rod (211) away from the second tube body (11) and is used to push so that the connecting rod (211) and the fixed rod (210) cooperate to move, so that the guide plate (20) rotates.

5. The cooling device for a semiconductor device according to claim 4, characterized in that, The gas inlet assembly (2) also includes a housing (22), the wall of which is provided with an air duct opening composed of at least two partitions (220), the guide plate (20) is located inside the housing (22), the length direction of the partition (220) is perpendicular to the length direction of the guide plate (20), and a slide is formed between two adjacent partitions (220) for the slider (212) to slide along the length direction of the partition (220).

6. The cooling device for a semiconductor device according to claim 5, characterized in that, The gas inlet assembly (2) also includes a filter element (23), which is disposed on a wall of the housing (22) near the second tube (11) and opposite to the air duct opening, for filtering the circulating gas.

7. The cooling device for a semiconductor device according to claim 6, characterized in that, The filter element (23) includes a filter screen (230), a mounting frame (231), a disassembly plate (232), and a handle (233). The filter screen (230) is disposed inside the mounting frame (231). The bottom of the disassembly plate (232) is connected to the top of the mounting frame (231), and the handle (233) is connected to the top of the disassembly plate (232) for disassembling the filter element (23).

8. The cooling device for a semiconductor device according to claim 7, characterized in that, The filter element (23) also includes a locking element (234). The disassembly plate (232) has a through hole, and the housing (22) has a channel. The locking element (234) passes through the through hole and is tightly fitted to the channel, so that the disassembly plate (232) abuts against the top of the housing (22).

9. The cooling device for a semiconductor device according to claim 1, characterized in that, The cooling device further includes a heat dissipation component (4), which is located on the side of the second tube (11) near the process gas outlet end (10b) and is used to discharge the circulating gas in the gap.

10. The cooling apparatus for a semiconductor device according to claim 9, characterized in that, The heat dissipation assembly (4) includes a heat dissipation cylinder (40), a fan (41), a fixing plate (42), and a drive motor (43). The fan (41) is located at the end of the heat dissipation cylinder (40) away from the second tube body (11). The fixing plate (42) and the drive motor (43) are both located inside the heat dissipation cylinder (40). The drive motor (43) is mounted on the fixing plate (42), and the output end of the drive motor (43) passes through the fixing plate (42) and is connected to the fan (41).

Images