A plating power supply system based on a split unit rectifier

Abstract

The utility model discloses a kind of electroplating power supply systems based on split unit rectifier, including electroplating tank and at least two unit rectifiers, unit rectifier is at least provided with a group of output copper bar, output copper bar is evenly distributed in the two sides of electroplating tank, two pieces of anode plate are arranged in electroplating tank and are spaced apart from top to bottom, the side of anode plate away from each other is provided with connecting copper bar group, two connecting copper bar groups are respectively protruding from the upper and lower ends of electroplating tank and are connected with busbar, and the busbar of upper and lower ends is connected with the positive electrode of output copper bar on the same side. The unit rectifier of the utility model can be distributedly arranged around electroplating tank, and current output point is closer to power point, so as to greatly shorten the use length of copper bar;Meanwhile, the utility model distributes total current to multiple unit rectifiers, and the current carrying capacity required by each busbar decreases, so that thinner and smaller specification busbar can be used, and the use amount and specification of busbar are greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, specifically to an electroplating power supply system based on a split-type unit rectifier. Background Technology

[0002] In the electroplating industry, the electroplating tank is the core equipment for realizing the electroplating process. Currently, the traditional power supply mode commonly used in electroplating plants involves configuring a rectifier of appropriate power based on the size of the electroplating tank and the total current required by the process. This rectifier is usually installed at one end or to the side of the electroplating tank. For example... Figure 1 As shown, in practical applications, this centralized single-rectifier power supply system has revealed many inherent defects, which seriously restrict the efficiency, quality and safety of electroplating production.

[0003] First, in high-power applications, the size and weight of a single rectifier are exceptionally large to meet the high current requirements. This not only occupies a significant amount of production space but also poses great difficulties for equipment handling, installation, and daily maintenance, increasing operating costs.

[0004] Secondly, regarding electrical connections, since the rectifiers are centrally located in a single position, long copper busbars need to be laid to guide the current from the rectifier output to both ends of the electroplating tank and even the entire edge of the tank. This wiring method requires crossing at least the entire tank, resulting in a huge amount of copper busbars and high costs. More importantly, excessively long copper busbars introduce significant line resistance, causing unnecessary power loss.

[0005] Third, the voltage drop caused by long-distance copper busbars can lead to severely uneven current distribution within the electroplating tank, a phenomenon known as "current bias" or "edge effect." This results in significant differences in current density across different workpiece locations within the tank, and even across different surfaces of the same workpiece, directly causing uneven plating thickness and compromising the quality of the electroplated products. Furthermore, areas of concentrated current can cause localized overload and overheating of the copper busbars, even resulting in red-hot areas, posing a serious safety hazard.

[0006] Fourth, from a process control perspective, a single rectifier can only provide a uniform output current for the entire electroplating tank, and cannot independently regulate the current in different areas of the tank or on different surfaces of the workpiece. When the workpiece has a complex geometry with high-potential and low-potential surfaces, in order to ensure that the low-potential surface meets the minimum plating thickness requirement, the overall tank current is often forced to be increased. This "accommodating" process method not only results in excessively thick plating on the high-potential surface and waste of raw materials, but may also cause problems such as rough plating crystals and decreased performance.

[0007] Fifth, limited by a single current output, existing systems are fundamentally unable to achieve automated, differentiated electroplating. That is, they cannot intentionally deposit coatings of varying thicknesses on different surfaces of a workpiece according to product design requirements. Traditional techniques are insufficient for workpieces with such specific requirements, thus limiting the application scope of electroplating technology.

[0008] In summary, existing electroplating power supply systems based on a single high-power rectifier have significant shortcomings in terms of equipment size, material cost, current distribution uniformity, process control flexibility, and safety. Utility Model Content

[0009] The purpose of this invention is to address the shortcomings of existing technologies by providing an electroplating power supply system based on a split-type unit rectifier, thereby solving the problems mentioned in the background art.

[0010] To achieve this objective, the present invention adopts the following technical solution: An electroplating power supply system based on a split-type unit rectifier includes an electroplating tank and at least two unit rectifiers. Each unit rectifier is equipped with at least one set of output copper busbars, which are evenly distributed on both sides of the electroplating tank. Two anode plates are arranged vertically and horizontally within the electroplating tank. A connecting copper busbar group is arranged on the side of the anode plates that is far apart from each other. The two connecting copper busbar groups protrude from the upper and lower ends of the electroplating tank and are connected to at least one busbar. The busbars at the upper and lower ends extend toward both sides of the electroplating tank and are connected to the positive terminal of the output copper busbar on the same side. The electroplating tank is also equipped with a cathode roller, and the two ends of the cathode roller are connected to the negative terminals of the output copper busbars on both sides.

[0011] As a preferred embodiment of the electroplating power supply system based on a split-type unit rectifier, there are two unit rectifiers, each of which is equipped with a set of output copper busbars. The two sets of output copper busbars are distributed on both sides of the electroplating tank. The positive terminals of the output copper busbars are connected to the busbars on the same side, and the negative terminals of the output copper busbars are connected to the adjacent end of the cathode roller.

[0012] As a preferred embodiment of the electroplating power supply system based on a split-type unit rectifier, there are four unit rectifiers, each of which is equipped with a set of output copper busbars. The four sets of output copper busbars are distributed in pairs on both sides of the electroplating tank. The positive terminals of the output copper busbars are all connected to the busbar on the same side, and the negative terminals of the output copper busbars are all connected to the adjacent end of the cathode roller.

[0013] As a preferred embodiment of the electroplating power supply system based on a split-type unit rectifier, there are two unit rectifiers, each of which is equipped with two sets of output copper busbars. The four sets of output copper busbars are distributed in pairs on both sides of the electroplating tank. The positive terminals of the output copper busbars are all connected to the busbar on the same side, and the negative terminals of the output copper busbars are all connected to the adjacent end of the cathode roller.

[0014] As a preferred embodiment of the electroplating power supply system based on a split-type unit rectifier, it also includes a control unit. The control unit is connected to the signal of all the unit rectifiers via an R485 line. One of the unit rectifiers is set as the master, and the remaining unit rectifiers are set as slaves. Parallel rectification is achieved among the unit rectifiers.

[0015] As a preferred embodiment of an electroplating power supply system based on a split-type unit rectifier, the anode plate includes a plurality of anodes, which are spliced ​​together by insulating strips to form the anode plate.

[0016] As a preferred embodiment of an electroplating power supply system based on a split-type unit rectifier, the connecting copper busbar group includes several first connecting copper busbars, each of which is connected to the anode in a one-to-one correspondence. The end of the first connecting copper busbar furthest from the anode is connected via a second connecting copper busbar, which is fixedly connected to the busbar.

[0017] As a preferred embodiment of the electroplating power supply system based on a split-type unit rectifier, each of the connecting copper busbar groups is connected to a busbar, and the busbar is connected to the positive terminal of the output copper busbar on the same side.

[0018] As a preferred embodiment of the electroplating power supply system based on a split-type unit rectifier, each of the connecting copper busbar groups is connected to two busbars, and the busbars are respectively connected to the positive terminals of the output copper busbars on the same side.

[0019] Compared with the prior art, the present invention has the following beneficial effects: (1) This utility model replaces a single high-power rectifier with multiple smaller power unit rectifiers, which significantly reduces the size and weight of a single unit rectifier. This not only reduces the requirements for installation space, but also makes the handling, installation and subsequent maintenance and replacement operations simpler and more flexible, effectively overcoming the disadvantages of traditional large-volume rectifiers that are difficult to handle and occupy a lot of space.

[0020] (2) The unit rectifiers of this utility model can be distributed around the electroplating tank, and the current output point is closer to the power consumption point, thereby greatly shortening the length of the copper busbar. At the same time, this utility model distributes the total current to multiple unit rectifiers, and the current carrying capacity required by each busbar is reduced, so thinner and smaller busbars can be used. Under the combined effect of these two factors, this utility model not only greatly reduces the amount and specifications of busbars, but also reduces the material cost and manufacturing cost of the system, and effectively reduces the line resistance and voltage drop. In addition, the length of each busbar connected to the anode and cathode of the electroplating tank is basically consistent, thereby ensuring that the current can be evenly distributed to all parts of the tank, significantly improving the uniformity of the current distribution in the tank, fundamentally eliminating the safety hazards such as local overheating and reddening of the busbar caused by bias current, so that the plated parts can obtain a coating with uniform thickness and stable quality, and improve the product yield.

[0021] (3) Each unit rectifier of this utility model can be independently set and adjusted by the control unit, such as current and voltage, so that the operator can apply precise and independent current intensity according to the specific needs of different surfaces of the workpiece. On the one hand, it can optimize the electroplating effect of complex-shaped workpieces without blindly increasing the overall current to accommodate low potential surfaces, thus saving energy and raw materials; on the other hand, it can actively realize the advanced process of depositing different thicknesses of plating on different surfaces of the same workpiece, which greatly expands the application range of electroplating technology and meets the diverse product design requirements. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly described below. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0023] Figure 1 This is a schematic diagram of the planar structure of an electroplating power supply system based on a single high-power rectifier, which is a current technology.

[0024] Figure 2 This is a schematic diagram of the planar structure of the electroplating power supply system based on a split-type unit rectifier as described in Embodiment 1 of this utility model.

[0025] Figure 3 This is a three-dimensional structural diagram of the electroplating power supply system based on a split-type unit rectifier as described in Embodiment 1 of this utility model.

[0026] Figure 4 This is a schematic diagram of the combined structure of the anode plate, connecting copper busbar and busbar as described in Embodiment 1 of this utility model.

[0027] Figure 5 This is a schematic diagram showing the disassembled structure of the anode plate, connecting copper busbar assembly, and busbar as described in Embodiment 1 of this utility model.

[0028] Figure 6 This is a schematic diagram of the control structure of the control unit and unit rectifier described in Embodiment 1 of this utility model.

[0029] Figure 7 This is a partial three-dimensional structural schematic diagram of the continuous electroplating production line for steel strips described in Embodiment 1 of this utility model.

[0030] Figure 8 This is a partial planar structural schematic diagram of the continuous electroplating production line for steel strips described in Embodiment 1 of this utility model.

[0031] Figure 9 This is a schematic diagram of the planar structure of the electroplating power supply system based on a split-type unit rectifier as described in Embodiment 2 of this utility model.

[0032] Figure 10 This is a three-dimensional structural diagram of the electroplating power supply system based on a split-type unit rectifier as described in Embodiment 2 of this utility model.

[0033] Figure 11 This is a three-dimensional structural diagram of the electroplating power supply system based on a split-type unit rectifier as described in Embodiment 3 of this utility model.

[0034] Explanation of reference numerals in the attached figures: 1. Electroplating tank; 2. Unit rectifier; 3. Output copper busbar; 4. Anode plate; 41. Anode; 42. Insulating strip; 5. Connecting copper busbar assembly; 51. First connecting copper busbar; 52. Second connecting copper busbar; 6. Busbar; 7. Cathode roller; 8. Control unit. Detailed Implementation

[0035] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0036] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this utility model, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0037] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0038] In the description of this utility model, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating the connection relationship between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example

[0039] like Figures 2 to 4 As shown, this embodiment provides an electroplating power supply system based on a split-type unit rectifier, including an electroplating tank 1 and two unit rectifiers 2. Each unit rectifier 2 is equipped with a set of output copper busbars 3. The two sets of output copper busbars 3 are distributed on both sides of the electroplating tank 1. Two anode plates 4 are arranged vertically and horizontally in the electroplating tank 1. A connecting copper busbar group 5 is arranged on the side of the anode plates 4 that is far apart from each other. The two connecting copper busbar groups 5 protrude from the upper and lower ends of the electroplating tank 1 and are connected to busbars 6. The busbars 6 at the upper and lower ends extend towards both sides of the electroplating tank 1, that is, the two busbars 6 extend in opposite directions to the positions of the two output copper busbars 3 and are connected to the positive terminals of the output copper busbars 3 on the same side. At the same time, the electroplating tank 1 is also equipped with a cathode roller 7, which is placed towards the positions of the two output copper busbars 3, and the two ends of the cathode roller 7 are connected to the negative terminals of the output copper busbars 3 on both sides, thereby forming an electroplating power supply system.

[0040] This embodiment replaces a single high-power rectifier with multiple smaller-power unit rectifiers 2. The size and weight of a single unit rectifier 2 are significantly reduced, which not only reduces the requirements for installation space, but also makes the handling, installation and subsequent maintenance and replacement operations simpler and more flexible. It effectively overcomes the disadvantages of traditional large-volume rectifiers, such as difficulty in handling and large space occupation.

[0041] Furthermore, in this embodiment, the unit rectifiers 2 can be distributed around the electroplating tank 1, with the current output point closer to the power consumption point, thereby greatly shortening the length of the busbar 6. At the same time, this embodiment distributes the total current to multiple unit rectifiers 2, reducing the current carrying capacity required for each busbar 6, allowing the use of thinner and smaller busbars 6. Under the combined effect of these two factors, this utility model not only significantly reduces the amount and specifications of busbars 6, lowering the material and manufacturing costs of the system, but also effectively reduces line resistance and voltage drop. In addition, the length of each section of busbar 6 connected to the anode plate 4 and cathode roller 7 of the electroplating tank 1 is basically consistent, thereby ensuring that the current can be evenly distributed to all parts of the tank, significantly improving the uniformity of current distribution in the tank, fundamentally eliminating safety hazards such as local overheating and reddening of the busbar 6 caused by biased current, enabling the plated parts to obtain a coating with uniform thickness and stable quality, and improving product yield.

[0042] like Figure 5 As shown, the anode plate 4 in this embodiment includes several anodes 41. The anodes 41 can be made of titanium metal. The anodes 41 are spliced ​​together by insulating strips 42 to form the anode plate 4. The modular structure design adopted by the anode plate 4 allows for quick removal and replacement of one anode 41 when it is over-consumed, without the need to replace the entire anode plate 4, thereby effectively saving maintenance costs.

[0043] Meanwhile, the connecting copper busbar group 5 in this embodiment includes several first connecting copper busbars 51, which are connected to the anode 41 one by one. The end of the first connecting copper busbar 51 away from the anode 41 is connected by a second connecting copper busbar 52, which is fixedly connected to the busbar 6, thereby realizing the function of current conduction.

[0044] like Figure 6 As shown, the electroplating power supply system of this embodiment also includes a control unit 8. The control unit 8 can be in the form of a host computer or a control head, and is connected to all unit rectifiers 2 via an R485 line to adjust and control the working state of each unit rectifier 2. In use, the control unit 8 can set one unit rectifier 2 as the master and the other unit rectifiers 2 as slaves. The unit rectifier 2 set as the master is in voltage regulation mode, and the unit rectifier 2 set as the slave is in current regulation mode. By setting the master and slave, this embodiment can realize parallel rectification, thereby avoiding current fluctuations that could lead to poor plating quality.

[0045] Furthermore, each unit rectifier 2 in this embodiment can also have its parameters (such as current and voltage) set and adjusted independently via the control unit 8, allowing operators to apply precise and independent current intensities to meet the specific needs of the upper and lower surfaces of the workpiece. On the one hand, this optimizes the electroplating effect on workpieces with complex shapes, eliminating the need to blindly increase the overall current to accommodate low-potential surfaces, thus saving energy and raw materials. On the other hand, it enables the advanced process of depositing coatings of different thicknesses on different surfaces of the same workpiece, greatly expanding the application range of electroplating technology and meeting diverse product design requirements.

[0046] This embodiment of the electroplating power supply system based on a split-type unit rectifier is compatible with most existing electroplating production lines, such as continuous steel strip electroplating production lines (see reference). Figure 7 The electroplating production line is equipped with an uncoiler at the starting end. The uncoiler carries the steel coil to be electroplated and can controllably unwind the steel strip. The steel strip first passes through the cathode roller 7, which serves as the cathode conductive point of the steel strip and is usually made of copper or stainless steel. Current is transmitted to the cathode roller 7 through carbon brushes or rollers. An auxiliary roller is also installed below the cathode roller 7. Guided by the cathode roller 7 and the auxiliary roller, the steel strip passes between them and enters the electroplating tank 1. The electroplating tank 1 is located between two anode plates 4 and contains electroplating solution. When the steel strip passes between the two anode plates 4, a coating will be plated on both the top and bottom sides of the steel strip (see reference). Figure 8 This electroplating production line can be equipped with multiple electroplating tanks to repeatedly electroplat the workpieces. Subsequently, the steel strip needs to undergo chemical treatment of the plating layer in a passivation tank, be cleaned by a spray system, be dried by a drying device, and have rust-preventive oil evenly applied to the workpiece by an oiling machine. Finally, it is wound up by a winding machine, thus completing the entire electroplating process. All of the above are existing technologies and will not be described in detail in this embodiment. Example

[0047] This embodiment is basically the same as the electroplating power supply system based on the split-type unit rectifier in Embodiment 1, the main difference being the setting of the unit rectifier 2.

[0048] like Figure 9 and Figure 10 As shown, in this embodiment, four unit rectifiers 2 are configured, each of which is equipped with a set of output copper busbars 3. The four sets of output copper busbars 3 are distributed in pairs on both sides of the electroplating tank 1. The positive terminals of the output copper busbars 3 are all connected to the busbars 6 on the same side, and the negative terminals of the output copper busbars 3 are all connected to the adjacent end of the cathode roller 7. This embodiment increases the number of unit rectifiers 2. When one of the unit rectifiers 2 on the same side fails, the other unit rectifier 2 can ensure that the electroplating power supply system continues to operate stably, thus improving the stability of the system.

[0049] In this embodiment, the busbar 6 can also be set to four. Each connecting copper busbar group 5 is connected to two busbars 6. The two busbars 6 are connected one-to-one with the positive terminals of the two output copper busbars 3 on the same side. This embodiment increases the number of busbars 6, which can further reduce the thickness of the busbars 6. Example

[0050] This embodiment is basically the same as the electroplating power supply system based on the split-type unit rectifier in Embodiment 1, the main difference being the setting of the unit rectifier 2.

[0051] like Figure 11 As shown, in this embodiment, two unit rectifiers 2 are configured, each of which is equipped with two sets of output copper busbars 3. The two sets of output copper busbars 3 are located on both sides of the unit rectifier 2. Therefore, the unit rectifier 2 can be placed at the bottom of the electroplating tank 1 and correspond to the busbars 6 on both sides. The positive terminals of the output copper busbars 3 are all connected to the busbars 6 on the same side, and the negative terminals of the output copper busbars 3 are all connected to the adjacent end of the cathode roller 7. This embodiment increases the number of output copper busbars 3. When one of the unit rectifiers 2 on the same side fails, the other unit rectifier 2 can ensure that the electroplating power supply system continues to operate stably, thus improving the stability of the system.

[0052] In this embodiment, the busbar 6 can also be set to four. Each connecting copper busbar group 5 is connected to two busbars 6. The two busbars 6 are connected one-to-one with the positive terminals of the two output copper busbars 3 on the same side. This embodiment increases the number of busbars 6, which can further reduce the thickness of the busbars 6.

[0053] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles employed. Those skilled in the art should understand that various modifications, equivalent substitutions, and variations can be made to this utility model. However, such variations, as long as they do not depart from the spirit of this utility model, should be within the protection scope of this utility model. Furthermore, some terminology used in this application specification and claims is not limiting, but merely for ease of description.

Claims

1. An electroplating power supply system based on a split-type unit rectifier, characterized in that, The electroplating tank (1) includes at least two unit rectifiers (2). Each unit rectifier (2) is provided with at least one set of output copper busbars (3). The output copper busbars (3) are evenly distributed on both sides of the electroplating tank (1). Two anode plates (4) are arranged vertically and horizontally in the electroplating tank (1). A connecting copper busbar group (5) is provided on the side of the anode plates (4) that is far away from each other. The two connecting copper busbar groups (5) protrude from the upper and lower ends of the electroplating tank (1) and are connected to at least one busbar (6). The busbars (6) at the upper and lower ends extend toward both sides of the electroplating tank (1) and are connected to the positive pole of the output copper busbar (3) on the same side. The electroplating tank (1) is also provided with a cathode roller (7). The two ends of the cathode roller (7) are connected to the negative pole of the output copper busbars (3) on both sides.

2. The electroplating power supply system based on a split-type unit rectifier according to claim 1, characterized in that, There are two unit rectifiers (2). Each unit rectifier (2) is equipped with a set of output copper busbars (3). The two sets of output copper busbars (3) are distributed on both sides of the electroplating tank (1). The positive poles of the output copper busbars (3) are connected to the busbars (6) on the same side. The negative poles of the output copper busbars (3) are connected to the adjacent end of the cathode roller (7).

3. The electroplating power supply system based on a split-type unit rectifier according to claim 1, characterized in that, There are four unit rectifiers (2). Each unit rectifier (2) is equipped with a set of output copper busbars (3). The four sets of output copper busbars (3) are distributed in pairs on both sides of the electroplating tank (1). The positive pole of each output copper busbar (3) is connected to the busbar (6) on the same side. The negative pole of each output copper busbar (3) is connected to the adjacent end of the cathode roller (7).

4. The electroplating power supply system based on a split-type unit rectifier according to claim 1, characterized in that, There are two unit rectifiers (2), each of which is equipped with two sets of output copper busbars (3). The four sets of output copper busbars (3) are distributed in pairs on both sides of the electroplating tank (1). The positive poles of the output copper busbars (3) are all connected to the busbars (6) on the same side, and the negative poles of the output copper busbars (3) are all connected to the adjacent end of the cathode roller (7).

5. The electroplating power supply system based on a split-type unit rectifier according to any one of claims 1 to 4, characterized in that, It also includes a control unit (8), which is connected to all the unit rectifiers (2) via an R485 line. One of the unit rectifiers (2) is set as the master and the other unit rectifiers (2) are set as slaves. The unit rectifiers (2) are rectified in parallel.

6. The electroplating power supply system based on a split-type unit rectifier according to claim 1, characterized in that, The anode plate (4) includes a plurality of anodes (41), which are spliced ​​together by insulating strips (42) to form the anode plate (4).

7. The electroplating power supply system based on a split-type unit rectifier according to claim 6, characterized in that, The connecting copper busbar group (5) includes a plurality of first connecting copper busbars (51), each of which is connected to the anode (41) in a one-to-one correspondence. The end of the first connecting copper busbar (51) away from the anode (41) is connected through a second connecting copper busbar (52), which is fixedly connected to the busbar (6).

8. The electroplating power supply system based on a split-type unit rectifier according to claim 2 or 4, characterized in that, Each of the connecting copper busbar groups (5) is connected to a busbar (6), which is connected to the positive terminal of the output copper busbar (3) on the same side.

9. The electroplating power supply system based on a split-type unit rectifier according to claim 3, characterized in that, Each of the connecting copper busbar groups (5) is connected to two busbars (6), and the busbars (6) are respectively connected to the positive terminals of the output copper busbars (3) on the same side.

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