A plating bath structure for integrated circuit manufacturing

Abstract

The utility model relates to integrated circuit manufacturing technical field especially relates to a kind of electroplating bath structures of integrated circuit manufacturing, including the box of top opening setting, partition plate is set in the box, the box is divided into electroplating bath and drying groove, electroplating solution is installed in the electroplating bath, and the both ends of electroplating bath are respectively installed with anode piece, and in the upper side of drying groove installation has cross-flow fan;Linear motor is installed in the length direction of the box in the side of the box, support column is installed on linear motor, strip slot is opened in the side of support column close to the box, screw rod is equipped in strip slot, and the end of screw rod is rotatably connected with the end of strip slot.The utility model divides the box into electroplating bath and drying groove by partition plate, realizes the integrated operation of electroplating and drying, avoids the step that integrated circuit board needs to be manually transferred in traditional process, significantly shortens manufacturing time, and improves production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and in particular to an electroplating tank structure for integrated circuit manufacturing. Background Technology

[0002] An integrated circuit is a miniature electronic device or component. Using specific processes, the transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnecting wiring, are fabricated on one or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a casing to form a miniature structure with the required circuit function.

[0003] In the manufacturing of integrated circuits, electroplating tanks are used for electroplating. During operation, an electroplating solution is placed in the tank, and the integrated circuit is then immersed in the solution. Electroplating is completed through the movement of ions caused by the application of current to the positive and negative electrodes. After the electroplated integrated circuit is removed, its surface is covered with a large amount of solution, requiring operators to transfer it to a drying oven for drying. However, this process is time-consuming, delaying the manufacturing progress of the integrated circuit, and the solution on the integrated circuit can easily spill outside the electroplating tank during transfer, causing contamination. Therefore, we propose an electroplating tank structure for integrated circuit manufacturing. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing an electroplating tank structure for integrated circuit manufacturing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an electroplating tank structure for integrated circuit manufacturing, comprising a box with an opening at the top, a partition plate inside the box dividing the box into an electroplating tank and a drying tank, an electroplating solution in the electroplating tank, and anode components installed at both ends of the electroplating tank, while crossflow fans are installed on both sides above the drying tank. A linear motor is installed on one side of the box along the length of the box. A support column is installed on the linear motor. A strip groove is opened on the side of the support column near the box. A lead screw is installed in the strip groove. The end of the lead screw is rotatably connected to the end of the strip groove. The end of the lead screw passes through the top of the support column and is connected to a first drive motor. The first drive motor is fixed on the top of the support column. A movable seat is connected to the lead screw via a nut thread. A support frame is connected to the side of the movable seat near the housing. A second drive motor is installed at the other end of the support frame. A connecting shaft is installed at the bottom of the second drive motor. A placement basket for placing integrated circuit boards is connected to the bottom of the connecting shaft via a connecting frame.

[0006] Preferably, a control box is installed on the outer wall of the housing, and a controller is installed inside the control box. The controller is connected to the anode, the crossflow fan, the linear motor, the first drive motor, and the second drive motor respectively via wires.

[0007] Preferably, the placement basket has an opening on one side and a cover plate at the opening. The cover plate is detachably connected to the placement basket. Multiple support plates are arranged at intervals inside the placement basket. Each support plate has a frame on top. The corners of the frame are connected to the support plate by support legs. Multiple slots are arranged at intervals on the frame. The slot is made of a conductive plate. The slip ring includes a stator and a rotor. The stator is fixed on the support frame and connected to the controller via wires. The rotor is rotatably mounted on the connecting shaft and connected to the slot via wires.

[0008] Preferably, multiple slots are provided on the side wall and support plate of the basket.

[0009] Preferably, a guide shaft is provided on the side of the linear motor, the guide shaft slides through the support column, and the ends of the guide shaft are all mounted on a fixed seat, and the fixed seat is fixed to the outer wall of the housing.

[0010] Preferably, the surface of the support column is smooth, and the end of the support frame near the support column is clearance-fitted with the outer wall of the support column.

[0011] Preferably, two drain pipes are installed at the lower end of the outer wall of the box, and the two drain pipes correspond to the electroplating tank and the drying tank respectively.

[0012] The design scheme proposed in this utility model has the following beneficial effects in application: 1. This utility model divides the box into an electroplating tank and a drying tank by using a partition plate, realizing the integrated operation of electroplating and drying. This avoids the step of manually transferring integrated circuit boards in the traditional process, significantly shortens the manufacturing time, and improves production efficiency.

[0013] 2. This utility model features a rotatable basket design to ensure that the integrated circuit board is evenly contacted with ions on all sides in the electroplating solution. At the same time, the slot is made of conductive material and powered by an electric slip ring to ensure stable current and improve electroplating quality. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the support column structure of this utility model; Figure 4 This is a schematic diagram of the basket structure of this utility model.

[0015] In the diagram: 1. Box body; 2. Electroplating tank; 3. Control box; 4. Drying tank; 5. Crossflow fan; 6. Support column; 7. Linear motor; 8. Guide shaft; 9. Strip groove; 10. Lead screw; 11. First drive motor; 12. Moving seat; 13. Support frame; 14. Connecting shaft; 15. Second drive motor; 16. Connecting frame; 17. Placement basket; 18. Cover plate; 19. Support plate; 20. Frame; 21. Support leg; 22. Slot; 23. Drain pipe. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0017] Example 1 Reference Figures 1-4 An electroplating tank structure for integrated circuit manufacturing includes a box 1 with a top opening, a partition plate inside the box 1 dividing the box 1 into an electroplating tank 2 and a drying tank 4, an electroplating solution in the electroplating tank 2, and anode components installed at both ends of the electroplating tank 2, while crossflow fans 5 are installed on both sides above the drying tank 4. like Figure 2 and Figure 3 As shown, a linear motor 7 is installed on one side of the housing 1 along the length of the housing 1. A support column 6 is installed on the linear motor 7. The linear motor 7 can control the support column 6 to perform linear reciprocating motion along the length of the housing 1.

[0018] like Figure 1 and Figure 3 As shown, a strip groove 9 is provided on the side of the support column 6 near the box body 1. A lead screw 10 is provided in the strip groove 9. The end of the lead screw 10 is rotatably connected to the end of the strip groove 9. The end of the lead screw 10 passes through the top of the support column 6 and is connected to a first drive motor 11. The first drive motor 11 is fixed on the top of the support column 6. A movable seat 12 is connected to the lead screw 10 by a threaded nut. Under the operation of the first drive motor 11, the movable seat 12 can be raised and lowered along the axial direction of the lead screw 10.

[0019] The movable base 12 is connected to a support frame 13 on the side near the housing 1. A second drive motor 15 is installed at the other end of the support frame 13. A connecting shaft 14 is installed at the bottom of the second drive motor 15. The bottom of the connecting shaft 14 is connected to a placement basket 17 for placing integrated circuit boards through a connecting frame 16. In use, the integrated circuit board is taken out and placed in the placement basket 17. Then the first drive motor 11 operates to place the placement basket 17 into the electroplating solution in the electroplating tank 2.

[0020] Specifically, when placing the integrated circuit board in the placement basket 17, the placement basket 17 has an opening on one side, and a cover plate 18 is provided at the opening. The cover plate 18 is detachably connected to the placement basket 17. Multiple spaced support plates 19 are provided inside the placement basket 17. Each support plate 19 has a frame 20 above it. The corners of the frame 20 are connected to the support plate 19 through support legs 21. Multiple spaced slots 22 are provided on the frame 20. Open the cover plate 18, take out the integrated circuit board and insert it into the slot 22 one by one, and then close the cover plate 18. In actual use, multiple spaced slots are provided on the side wall of the placement basket 17 and on the support plates 19. Because the support legs 21 support the support plates 19, the electroplating solution can fully contact the integrated circuit board, ensuring the ion ionization in the electroplating solution.

[0021] Specifically, a control box 4 is installed on the outer wall of the housing 1. A controller is installed inside the control box 4. The controller is connected to the anode, the crossflow fan 5, the linear motor 7, the first drive motor 11, and the second drive motor 15 via wires. In actual use, the controller is one of the following: a PLC logic controller, a control motherboard, or a control host.

[0022] It should be noted that in electroplating, since the integrated circuit board needs to be used as the cathode during electroplating, the slot 22 is made of a conductive plate. The slip ring includes a stator and a rotor. The stator is fixed on the support frame 13 and is connected to the controller through wires. The rotor is rotatably mounted on the connecting shaft 14 and is connected to the slot 22 through wires to conduct electricity to the slot 22, thereby forming the required closed circuit loop with the anode in the electroplating tank 2 to ensure the normal progress of electroplating. During electroplating, the second drive motor 15 drives the placement basket 17 to rotate in the electroplating solution, so that all surfaces of the integrated circuit board can face the free ions for full contact. The integrated circuit board located in the slot 22 will also contact the slot 22 under the centrifugal force generated during rotation, ensuring that the current flows normally and stably between the anode and the integrated circuit board.

[0023] After electroplating is completed, the first drive motor 11 will operate again to lift the placement basket 17 from the electroplating solution. Then, the linear motor 7 will send the placement basket 17 to the top of the drying tank 4, and the lead screw 10 will rotate again to send it into the drying tank 4. At this time, the crossflow fan 5 will start to operate to dry the integrated circuit board. In actual use, a heating component is provided at the air outlet of the crossflow fan 5. The heating component is one of electric heating wire or electric heating rod, and the heating component is connected to the controller through wires.

[0024] Furthermore, such as Figure 2 As shown, a guide shaft 8 is provided on the side of the linear motor 7. The guide shaft 8 slides through the support column 6. The ends of the guide shaft 8 are all mounted on the fixed seat, and the fixed seat is fixed to the outer wall of the housing 1. While providing support for the support column 6, it also guides the linear movement of the support column 6, ensuring the stability of the support column 6 on the linear motor 7.

[0025] Furthermore, the surface of the support column 6 is smooth, and the end of the support frame 13 near the support column 6 is fitted with the outer wall of the support column 6 with a clearance to limit the movement of the movable seat 12 on the lead screw 10, thereby ensuring the stability of the lifting and lowering of the basket 17.

[0026] When electroplating is not required, two drain pipes 23 are installed at the lower end of the outer wall of the box 1. The two drain pipes 23 correspond to the electroplating tank 2 and the drying tank 4 respectively. The drain pipes 23 can be opened to drain the unused electroplating solution in the electroplating tank 2. The drain pipes 23 at the drying tank 4 can be kept open to drain the water remaining in the drying tank 4 in a timely manner.

[0027] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An electroplating tank structure for integrated circuit manufacturing, characterized in that: The box (1) with a top opening is provided. A partition plate is provided inside the box (1) to divide the box (1) into an electroplating tank (2) and a drying tank (4). The electroplating tank (2) is filled with electroplating liquid, and anodes are installed at both ends of the electroplating tank (2). Crossflow fans (5) are installed on both sides above the drying tank (4). A linear motor (7) is installed on one side of the box (1) along the length of the box (1). A support column (6) is installed on the linear motor (7). A strip groove (9) is opened on the side of the support column (6) near the box (1). A lead screw (10) is provided in the strip groove (9). The end of the lead screw (10) is rotatably connected to the end of the strip groove (9). The end of the lead screw (10) passes through the top of the support column (6) and is connected to a first drive motor (11). The first drive motor (11) is fixed on the top of the support column (6). A movable seat (12) is connected to the lead screw (10) via a threaded nut. A support frame (13) is connected to the side of the movable seat (12) near the housing (1). A second drive motor (15) is installed at the other end of the support frame (13). A connecting shaft (14) is installed at the bottom of the second drive motor (15). A placement basket (17) for placing the integrated circuit board is connected to the bottom of the connecting shaft (14) via a connecting frame (16).

2. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: A control box (3) is installed on the outer wall of the housing (1). A controller is installed inside the control box (3). The controller is connected to the anode, the crossflow fan (5), the linear motor (7), the first drive motor (11), and the second drive motor (15) respectively via wires.

3. The electroplating tank structure for integrated circuit manufacturing according to claim 2, characterized in that: The placement basket (17) has an opening on one side and a cover plate (18) at the opening. The cover plate (18) is detachably connected to the placement basket (17). Multiple support plates (19) are arranged at intervals inside the placement basket (17). Each support plate (19) has a frame (20) above it. The corners of the frame (20) are connected to the support plate (19) through support legs (21). Multiple slots (22) are arranged at intervals on the frame (20). The slot (22) is made of a conductive plate. The electric slip ring includes a stator and a rotor. The stator is fixed on the support frame (13) and connected to the controller via a wire. The rotor is rotatably mounted on the connecting shaft (14) and connected to the slot (22) via a wire.

4. The electroplating tank structure for integrated circuit manufacturing according to claim 3, characterized in that: Multiple slots are provided on the side wall of the basket (17) and the support plate (19).

5. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: A guide shaft (8) is provided on the side of the linear motor (7). The guide shaft (8) slides through the support column (6). The ends of the guide shaft (8) are all installed on the fixed seat, and the fixed seat is fixed to the outer wall of the housing (1).

6. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: The surface of the support column (6) is smooth, and the end of the support frame (13) near the support column (6) is fitted with the outer wall of the support column (6) with a clearance.

7. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: Two drain pipes (23) are installed at the lower end of the outer wall of the box (1), and the two drain pipes (23) correspond to the electroplating tank (2) and the drying tank (4) respectively.

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