Semiconductor test equipment low-dust high-low temperature resistant bellows cylinder

Abstract

The utility model relates to the field of semiconductor testing equipment discloses a semiconductor testing equipment low dust high and low temperature corrugated pipe air cylinder of endurance, including reinforcing mechanism, heat abstractor, the reinforcing mechanism includes support, the support bottom is connected with the board no.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing equipment, and in particular to a low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment. Background Technology

[0002] Semiconductors are materials whose conductivity lies between that of conductors and insulators. Semiconductor testing equipment is a device used to test the quality of semiconductors. Low-dust, high- and low-temperature resistant bellows cylinders are devices designed to withstand clean and extreme operating conditions.

[0003] In the process of developing this application, the inventors discovered the following problems with the prior art: Existing low-dust, high- and low-temperature resistant bellows cylinders generally include a piston rod, bellows, end caps, and cylinder barrel. These structures are mostly used to install the cylinder as a whole on the equipment by bolts. Only a few bolts are used to fix the cylinder. Over a certain period of time, the bolts may loosen, causing the cylinder to become unstable. In addition, existing cylinders generate a lot of heat when operating at high temperatures, causing the internal structure, such as the seals, to overheat, which will affect the use of the cylinder.

[0004] Therefore, those skilled in the art have provided a low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment. The reinforcement mechanism can greatly extend the time during operation when the cylinder experiences significant vibrations. The heat dissipation mechanism can dissipate heat from the cylinder and also from the surrounding equipment.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment, comprising a reinforcement mechanism and a heat dissipation mechanism. The reinforcement mechanism includes a bracket, with a No. 1 plate connected to the bottom of the bracket via a bearing. A No. 2 plate is slidably connected to the inner wall of the No. 1 plate, and a No. 2 bolt is threadedly connected to the inner wall of the No. 2 plate. A base plate is fixedly connected to the bottom of the No. 2 plate, and multiple No. 1 bolts are slidably connected to the inner wall of the base plate away from the center. A fixing block is fixedly connected to the top of the bracket. The heat dissipation mechanism includes two fans and a cylinder body. A recessed block is fixedly connected to the center of the top of the two fans. A No. 3 bolt is slidably connected to the inner wall of the top of the two recessed blocks. A ring is threadedly connected to the outer wall of the two No. 3 bolts. The front and rear ends of the fixed block are fixedly connected to the outer wall of the bottom of the cylinder body.

[0007] Furthermore, each of the two rings is fixedly connected to a support rod at both ends, and the ends of the multiple support rods away from the two rings are fixedly connected to the outer wall of the cylinder body.

[0008] Furthermore, a plurality of screws are slidably connected to the inner wall of one side of the cylinder body away from the center, and the plurality of screws are threaded to the outside.

[0009] Furthermore, the outer wall of the second bolt is slidably connected to the inner wall of the first plate, and the second bolt penetrates the first plate.

[0010] Furthermore, the bottom outer wall of multiple No. 1 bolts is threaded to the outside.

[0011] Furthermore, a rod is fixedly connected to the center of the bottom of the two fans, and the bottom of the two rods is rotatably set on the inner wall of the center of the bottom of the two rings.

[0012] Furthermore, both of the aforementioned fans and cylinder bodies are connected to the outside world via electrical wires.

[0013] This utility model has the following beneficial effects: 1. This utility model proposes a low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment. The overall structure is fixed to the testing equipment by four screws on the right side. The first plate rotates along the bracket via bearings to adjust the angle, and then the second plate is pulled out. The length is adjusted according to the fixed position provided by the surrounding equipment. Finally, the second plate is fixed by the second bolt, and the base plate is fixed to the external equipment by multiple first bolts. The entire reinforcement mechanism, together with the multiple screws on the right side, and the near-triangular shape formed by the overall structure, increases the overall stability and extends the time when the cylinder becomes unusable due to shaking.

[0014] 2. The present invention proposes a low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment. Two fans are activated to dissipate heat from the cylinder body. The fans and rod No. 1 can also rotate along the inner wall of the ring, allowing direct heat dissipation from any part of the front and rear ends of the cylinder body, as well as heat dissipation from other external equipment. After adjustment, the two No. 3 bolts are reset to fix the two concave blocks and the two fans, reducing the probability of internal structural damage to the cylinder body due to high temperature and increasing the practicality of the overall device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the overall structure of this utility model from another perspective; Figure 3 This is a partially exploded structural diagram of the present invention; Figure 4This is a partial structural diagram of the present invention.

[0016] Legend: 1. Reinforcing mechanism; 2. Heat dissipation mechanism; 101. Plate No. 1; 102. Plate No. 2; 103. Base plate; 104. Bolt No. 1; 105. Bolt No. 2; 106. Bracket; 107. Fixing block; 201. Cylinder body; 202. Fan; 203. Bolt No. 3; 204. Concave block; 205. Ring; 206. Support rod; 207. Rod No. 1. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Reference Figures 1-4 This utility model provides an embodiment of a low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment, comprising a reinforcement mechanism 1 and a heat dissipation mechanism 2. The reinforcement mechanism 1 includes a bracket 106, with a first plate 101 connected to the bottom of the bracket 106 via a bearing. A second plate 102 is slidably connected to the inner wall of the first plate 101, and a second bolt 105 is threadedly connected to the inner wall of the second plate 102. A base plate 103 is fixedly connected to the bottom of the second plate 102, and multiple first bolts 104 are slidably connected to the inner wall of the base plate 103 away from the center. A fixing block 107 is fixedly connected to the top of the bracket 106. The heat dissipation mechanism 2 includes two fans 202 and a cylinder body 201. A recess 204 is fixedly connected to the center of the top of the two fans 202, and a third bolt 203 is slidably connected to the inner wall of the top of the two recesses 204. A ring 205 is threadedly connected to the outer wall of the two third bolts 203. The front and rear ends of the fixing block 107 are fixedly connected to the outer wall of the bottom of the cylinder body 201.

[0019] Specifically, the entire structure is fixed to the testing equipment using four screws on the right side. Plate 101 rotates along bracket 106 via bearings to adjust the angle. Then, bolt 105 is removed, allowing plate 102 to move outward along the inner wall of plate 101. The length is adjusted according to the available fixing positions provided by surrounding equipment. Plate 102 is then fixed using bolt 105. Finally, the reinforcing mechanism 1 is fixed to the outer casing using multiple bolts 104. The reinforcing mechanism 1, in conjunction with the multiple screws on the right side, forms a triangle, increasing overall stability. When the cylinder body 201 vibrates, because of the multiple screws... The constraint of bolt 104 and multiple screws on the right side, combined with the overall near-triangular shape, can prolong the time when the cylinder body 201 shakes. The two fans 202 can dissipate heat from the cylinder body 201. After the two bolts 203 are rotated and the concave block 204 is no longer fixed, the fans 202 and rod 207 can be rotated along the inner wall of the bottom of the ring 205, which can directly dissipate heat from any part of the front and rear ends of the cylinder body 201, and can also dissipate heat from external equipment. Finally, the two concave blocks 204 and the two fans 202 are fixed by the two bolts 203, which makes the equipment more practical.

[0020] Reference Figures 1-4 Both ends of the two rings 205 are fixedly connected to support rods 206. The ends of the multiple support rods 206 away from the two rings 205 are fixedly connected to the outer wall of the cylinder body 201. Multiple screws are slidably connected to the inner wall of one side of the cylinder body 201 away from the center. The multiple screws are threaded to the outside. The outer wall of the second bolt 105 is slidably connected to the inner wall of the first plate 101. The second bolt 105 penetrates the first plate 101. The bottom outer wall of multiple first bolts 104 is threaded to the outside. The bottom center of the two fans 202 is fixedly connected to the first rod 207. The bottom of the two first rods 207 is rotatably set on the inner wall of the bottom center of the two rings 205. The two fans 202 and the cylinder body 201 are all connected to the outside through wires.

[0021] Specifically, multiple support rods 206 are fixed together with the cylinder body 201 to provide support for the two rings 205. Bolt No. 2 105 can fix the moved plate No. 2 102. Motor boxes are set on the two fans 202, and motors are installed inside to provide power for the rotation of the fans 202. The multiple bolts No. 1 104, bolts No. 2 105, two bolts No. 3 203 and multiple screws in this application all need to be maintained and replaced after damage. The rest of the structure of this equipment also needs to be maintained and repaired regularly.

[0022] Working principle: The overall structure is fixed to the other equipment by the four screws on the right side. Then, plate 101 is rotated along bracket 106 to adjust the angle according to the fixed position provided by the surrounding equipment. Then, bolt 105 is removed and plate 102 is pulled out. The length is adjusted according to the fixed position provided by the surrounding equipment. Then, bolt 105 is reset to fix plate 102. Finally, multiple bolts 104 on the base plate 103 are fixed to the external equipment. Together with the multiple screws on the right side, the whole structure forms a triangle, which increases the overall stability and makes the whole structure less prone to shaking. Secondly, starting the two fans 202 can effectively dissipate heat from the cylinder body 201. Rotating the two No. 3 bolts 203 allows the fans 202 to drive the rod 207 to rotate along the inner wall of the ring 205, directly dissipating heat from any point at the front or rear end of the cylinder body 201. The two fans 202 can also be rotated 90° to dissipate heat from other external equipment. Finally, the two No. 3 bolts 203 are rotated back to their original positions, fixing the two recesses 204 and further securing the two fans 202. Power is provided through the air inlets on both sides of the cylinder body 201, allowing air to enter the cylinder. The bellows expands and elongates, pushing the piston. When the air is expelled, the bellows contracts under its own elasticity, causing the piston to return to its original position. This is the general working principle of the bellows cylinder, which is existing public technology and will not be elaborated further here.

[0023] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment, comprising a reinforcement mechanism (1) and a heat dissipation mechanism (2), characterized in that: The reinforcement mechanism (1) includes a bracket (106), the bottom of the bracket (106) is connected to a No. 1 plate (101) via a bearing, the inner wall of the No. 1 plate (101) is slidably connected to a No. 2 plate (102), the inner wall of the No. 2 plate (102) is threadedly connected to a No. 2 bolt (105), the bottom of the No. 2 plate (102) is fixedly connected to a base plate (103), the inner wall of the base plate (103) away from the center is slidably connected to multiple No. 1 bolts (104), and the top of the bracket (106) is fixedly connected to a fixing block (107). The heat dissipation mechanism (2) includes two fans (202) and a cylinder body (201). A recess (204) is fixedly connected to the top center of the two fans (202). A No. 3 bolt (203) is slidably connected to the inner wall of the top of the two recesses (204). A ring (205) is threadedly connected to the outer wall of the two No. 3 bolts (203). The front and rear ends of the fixing block (107) are fixedly connected to the bottom outer wall of the cylinder body (201).

2. The low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment according to claim 1, characterized in that: Both ends of the two rings (205) are fixedly connected to support rods (206), and the ends of the multiple support rods (206) away from the two rings (205) are fixedly connected to the outer wall of the cylinder body (201).

3. The low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment according to claim 1, characterized in that: Multiple screws are slidably connected to the inner wall of one side of the cylinder body (201) away from the center, and the multiple screws are threaded to the outside.

4. The low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment according to claim 1, characterized in that: The outer wall of the second bolt (105) is slidably connected to the inner wall of the first plate (101), and the second bolt (105) penetrates the first plate (101).

5. A low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment according to claim 1, characterized in that: The bottom outer wall of multiple No. 1 bolts (104) is threaded to the outside.

6. The low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment according to claim 1, characterized in that: A rod (207) is fixedly connected to the center of the bottom of the two fans (202), and the bottom of the two rods (207) is rotatably set on the inner wall of the center of the bottom of the two rings (205).

7. The low-dust, high- and low-temperature resistant bellows cylinder for semiconductor testing equipment according to claim 1, characterized in that: Both of the aforementioned fans (202) and cylinder bodies (201) are connected to the outside via electrical wires.

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