A laminated busbar gluing and curing device

Abstract

The utility model belongs to tool fixture technical field discloses a laminated busbar gluing solidification device, including first cover and second cover, be provided with positioning structure on the first cover, the second cover is detachably connected with the first cover through fastener, the second cover is used for pressing busbar body on the first cover, the second cover is provided with the second positioning hole in the position corresponding with the positioning structure, and the positioning structure is penetrated through the first positioning hole and the second positioning hole on busbar body cooperation. The solidification device of the present application replaces the existing aluminum mould through setting first cover and second cover, and the processing efficiency is fast, and the cost is greatly reduced compared with the aluminum mould, compared with the existing aluminum mould, the tool is light and simple, and the staff is convenient to operate, and there is no use safety risk.

Description

Technical Field

[0001] This utility model belongs to the field of tooling and fixture technology, and specifically relates to a device for applying adhesive and curing laminated busbars. Background Technology

[0002] In the field of high-voltage power electronics, laminated busbars are core components for achieving efficient power transmission and circuit integration. Their structural stability and electrical performance directly determine the operational reliability of the entire system. In existing laminated busbar manufacturing processes, the overall forming process after the electrode plates are coated and bent generally adopts a technical route of "secondary bonding with non-woven double-sided adhesive + aluminum mold positioning + single-column press pressing." The specific process can be broken down as follows: First, the surface-treated electrode plates (such as degreasing and passivation) are bent at a preset angle using a CNC bending machine. Then, non-woven double-sided adhesive is applied to the bonding surfaces of the electrode plates for initial fixation. Next, the pre-assembled electrode plate assemblies are sequentially installed onto a customized aluminum lower mold with a busbar structural cavity. Then, the aluminum upper mold is manually placed onto the laminated busbar. The upper and lower molds need to be designed with cavity contours according to the specific dimensions of the busbar (such as length, width, aperture, bending radius, etc.). The overall solidification and forming of the busbar is achieved by rigidly pressing the upper and lower molds together with a press. However, in actual large-scale production, the aforementioned existing technical solutions have revealed multi-dimensional technical defects. The specific problems and their profound impacts are as follows: 1. High cost and long production cycle of aluminum pressing molds restrict production capacity and process flexibility: In existing technologies, aluminum pressing molds need to be milled as a whole using a high-precision CNC machining center. On the one hand, because the busbar cavity involves complex three-dimensional contours (such as multiple sets of bending steps, hole positioning holes, clearance grooves, etc.), the machining process requires multiple tool changes and layered milling, which is complex and time-consuming. On the other hand, to ensure structural strength and positioning accuracy during the pressing process, the aluminum mold needs to be made of high-strength aluminum alloy material (such as 6061-T6), which is inherently expensive. More importantly, when the busbar product model is iterated (such as changes in hole diameter or bending angle adjustment), the original aluminum mold must be scrapped and remade because the cavity is not adjustable. This not only increases the cost of product iteration but also causes production line downtime due to the new mold production cycle, severely restricting production capacity response speed and process flexibility. This problem is particularly prominent in the production of small-batch, multi-variety customized orders. 2. High manual labor intensity and serious safety hazards: In the existing pressing process, because the upper and lower dies of the single-column press are designed separately, before each pressing, the operator must manually move the aluminum upper die, weighing more than 10KG, to the top of the lower die and accurately align it. On the one hand, the operator needs to maintain repetitive bending and lifting movements, which is labor-intensive; on the other hand, the upper die lacks stable gripping and positioning auxiliary devices during the handling process. If the operator's hands are fatigued or there is an operational error, the upper die is very likely to slip, which may not only damage the press worktable but also cause serious injuries to the operator's feet and legs, posing a major safety hazard.

[0003] 3. Insufficient adhesion of non-woven double-sided adhesive affects product reliability: In existing technologies, the non-woven double-sided adhesive used on the electrode plates can cause continuous internal stress at the bonding surfaces of adjacent plates during the bending process due to angle control errors in the CNC bending machine and the elastic recovery characteristics of the electrode plate material itself. When using non-woven double-sided adhesive for bonding, its limited adhesive strength cannot resist this internal stress. After pressing, as the adhesive layer gradually cools and solidifies, the internal stress of the electrode plates is slowly released, leading to cracking and delamination at the bonded electrode plate interface. This results in substandard flatness of the busbar overlap surface, with a defect rate of approximately 70%. This not only wastes a large amount of raw materials but also leads to problems such as loose bolt connections and decreased conductivity during subsequent assembly, increasing the operational risk of the entire system. Especially under high-voltage and high-current conditions, poor contact at the overlap surface can easily cause localized overheating and even fires and other safety accidents. Utility Model Content

[0004] To address the aforementioned problems, this utility model provides a laminated busbar adhesive curing device, comprising a first cover plate and a second cover plate. The first cover plate is provided with a positioning structure, and the second cover plate is detachably connected to the first cover plate by fasteners. The second cover plate is used to press the motherboard body onto the first cover plate. The second cover plate is provided with a second positioning hole at a position corresponding to the positioning structure. The positioning structure penetrates the first positioning hole on the motherboard body and engages with the second positioning hole.

[0005] Furthermore, the fasteners include a press-fit screw and a nut on the first cover plate, and a mounting hole on the second cover plate. The press-fit screw passes through the through hole and mounting hole on the mother plate body and is threadedly connected to the nut.

[0006] Furthermore, the nut is a flange nut, and the flange face of the flange nut is in contact with the side of the second cover plate facing away from the mother plate body.

[0007] Furthermore, the shapes of the first cover plate and the second cover plate are adapted to the shape of the mother plate body.

[0008] Furthermore, the first cover plate includes a first support plate portion, a second support plate portion, and a third support plate portion; The first support plate and the third support plate are parallel to each other and spaced apart. One end of the second support plate is connected to one end of the first support plate, and the other end of the second support plate is connected to one end of the third support plate.

[0009] Furthermore, the positioning structure includes two positioning pins disposed on the third support plate, the two positioning pins being spaced apart, and the two positioning pins engaging with the first positioning hole on the mother plate body.

[0010] Furthermore, the second cover plate includes a first pressure plate portion, a second pressure plate portion, and a third pressure plate portion; The first pressure plate portion and the third pressure plate portion are parallel to each other and spaced apart. One end of the second pressure plate portion is connected to one end of the first pressure plate portion, and the other end of the second pressure plate portion is connected to one end of the third pressure plate portion.

[0011] Furthermore, the first support plate is provided with a plurality of press-fit screws spaced apart along the first direction, and the third support plate is provided with a plurality of press-fit screws spaced apart between the positioning pin and the second support plate along the first direction. The first pressure plate presses the end of the mother plate body with the pins onto the first support plate, and the first pressure plate is provided with mounting holes at positions corresponding to the press-fit screws. The third pressure plate presses the mother plate body onto the third support plate, and the third pressure plate is provided with mounting holes at positions corresponding to the press-fit screws.

[0012] Furthermore, the third pressure plate has a second positioning hole at the position corresponding to each positioning pin.

[0013] Furthermore, there is a gap between the second support plate and the mother plate body, and there is a gap between the second pressure plate and the mother plate body.

[0014] The beneficial effects of this utility model are: 1. The curing device of this application replaces the existing aluminum mold by setting a first cover plate and a second cover plate, which improves processing efficiency and significantly reduces costs compared to aluminum molds. Compared to existing aluminum molds, the tooling is lightweight and easy to use, making it convenient for employees to operate and eliminating safety risks.

[0015] 2. The spaced distribution of the multiple rivet screws in this application can form a uniform clamping force field between the mother plate body and the first cover plate and the second cover plate through the tightening force of the subsequent flange nuts. This "area-type clamping" can ensure that the multiple pole plates of the laminated busbar are tightly attached. Even if there is a slight error in the bending angle of the mother plate body, it will not delaminate after curing, and can effectively ensure that the flatness of the overlapping surface of the mother plate body is within the qualified range.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of an existing laminated busbar structure is shown; Figure 2 A schematic diagram of a laminated busbar adhesive curing device according to an embodiment of the present invention is shown; Figure 3 A schematic diagram of the structure of the first cover plate according to an embodiment of the present utility model is shown; Figure 4 A schematic diagram of the structure of the second cover plate according to an embodiment of the present invention is shown; Figure 5 A schematic diagram of the structure of the curing device according to an embodiment of the present invention for locking and curing the laminated busbars is shown.

[0019] In the figure: 1. Laminated busbar; 101. Motherboard body; 102. Connecting plate; 103. Pin; 104. First positioning hole; 105. Through hole; 2. First cover plate; 3. Second cover plate; 201. Positioning structure; 202. Press-fit screw; 203. First support plate; 204. Second support plate; 205. Third support plate; 301. Second positioning hole; 302. Nut; 303. First pressure plate; 304. Second pressure plate; 305. Third pressure plate. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] It should be noted that the terms "first," "second," etc., used in this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," "longitudinal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings.

[0022] First, let me briefly introduce the structure of the stacked busbar 1. The stacked busbar 1 includes multiple stacked electrode plates. Each electrode plate can be used as a positive electrode plate or a negative electrode plate. Adjacent electrode plates are bonded together by an epoxy resin adhesive layer.

[0023] like Figure 1 As shown, the laminated busbar 1 includes a mother plate body 101, which is Z-shaped. A connecting plate 102, which is L-shaped, is provided on one side of the mother plate body 101. Multiple press-fit nuts 302 are riveted to the connecting plate 102. The mother plate body 101 is connected and installed with other accessories through the connecting plate 102. Pins 103 are provided on the other side of the mother plate body 101 for connecting with other accessories. The mother plate body 101 has two first positioning holes 104 and multiple through holes 105.

[0024] like Figure 2 As shown in the figure, this application provides a glue-applying and curing device for a laminated busbar 1, including a first cover plate 2 and a second cover plate 3. The first cover plate 2 is provided with a positioning structure 201, which is used to position the laminated busbar 1 for easy operation.

[0025] The second cover plate 3 is detachably connected to the first cover plate 2 by fasteners. The second cover plate 3 is used to press the mother plate body 101 onto the first cover plate 2.

[0026] The second cover plate 3 is provided with a second positioning hole 301 at a position corresponding to the positioning structure 201. The positioning structure 201 penetrates the first positioning hole 104 on the mother plate body 101 and cooperates with the second positioning hole 301. The cooperation between the positioning structure 201 and the second positioning hole 301 realizes the precise engagement of the first cover plate 2 and the second cover plate 3.

[0027] The curing device of this application replaces the existing aluminum mold by setting a first cover plate 2 and a second cover plate 3. According to the bending structure of the stacked busbar 1, the first cover plate 2 and the second cover plate 3 can also be made of bent sheet metal parts. For example, the first cover plate 2 and the second cover plate 3 are made of aluminum-zinc coated sheet with a thickness of 2-3mm, which has a fast processing efficiency and significantly reduces costs compared to aluminum molds.

[0028] like Figure 3and Figure 4 As shown, for example, the fasteners include a press-fit screw 202 and a nut 302 provided on the first cover plate 2. The second cover plate 3 is provided with a mounting hole. The press-fit screw 202 passes through the through hole 105 and the mounting hole on the mother plate body 101 and is threadedly connected to the nut 302. The model of the press-fit screw 202 is selected according to the specific application scenario. The length of the press-fit screw 202 is determined according to the total thickness of the mother plate body and the curing device. For example, when the press-fit screw 202 is FH-M6-20, an M6 flange nut 302 can be used.

[0029] Each press-fit screw 202 is connected to a nut 302. The press-fit screw 202 passes through the through hole 105 on the mother plate body 101 and is threaded to the nut 302. The press-fit screw 202 is connected to the first cover plate 2 by press-fitting process, which can form a rigid fixed relationship and avoid the problem of screws being easy to loosen in traditional threaded connections.

[0030] like Figure 4 As shown, for example, the nut 302 can be a flange nut 302. The flange face of the flange nut 302 fits against the side of the second cover plate 3 facing away from the mother plate body 101. At the same time, the flange structure of the flange nut 302 increases the contact area with the second cover plate 3, which can effectively disperse the fastening pressure, reduce the local stress concentration of the cover plate, and enable the second cover plate 3 to fit tightly against the mother plate body 101, ensuring the pressing effect.

[0031] like Figure 3 As shown, for example, the shape of the first cover plate 2 is adapted to the shape of the mother plate body 101. For example, when the mother plate body 101 is Z-shaped, the first cover plate 2 is Z-shaped. The first cover plate 2 includes a first support plate portion 203, a second support plate portion 204 and a third support plate portion 205. The first support plate portion 203 and the third support plate portion 205 are parallel to each other and spaced apart. One end of the second support plate portion 204 is connected to one end of the first support plate portion 203, and the other end of the second support plate portion 204 is connected to one end of the third support plate portion 205.

[0032] like Figure 4 As shown, for example, the shape of the second cover plate 3 is adapted to the shape of the mother plate body 101. When the mother plate body 101 is Z-shaped, the second cover plate 3 is Z-shaped. The second cover plate 3 includes a first pressure plate portion 303, a second pressure plate portion 304 and a third pressure plate portion 305. The first pressure plate portion 303 and the third pressure plate portion 305 are parallel to each other and spaced apart. One end of the second pressure plate portion 304 is connected to one end of the first pressure plate portion 303, and the other end of the second pressure plate portion 304 is connected to one end of the third pressure plate portion 305.

[0033] In this embodiment, since the first cover plate 2, the second cover plate 3 are perfectly matched with the shape of the mother plate body 101, the first support plate portion 203 and the third support portion are precisely matched with the corresponding areas of the mother plate body 101, and the first pressure plate portion 303 and the third pressure plate portion 305 can provide stable clamping force to different areas of the mother plate body 101, ensuring the curing effect of the epoxy resin adhesive layer between the electrode plates.

[0034] like Figure 5 As shown, for example, there is a gap A between the second support plate portion 204 and the mother plate body 101, and a gap A between the second pressure plate portion 304 and the mother plate body 101. For example, the gap A is at least 2 mm, which facilitates installation and disassembly.

[0035] For example, the positioning structure 201 includes two positioning pins disposed on the third support plate portion 205. The two positioning pins are spaced apart and cooperate with the first positioning hole 104 on the mother plate body 101 to realize the positioning of the lower cover plate and the stacked busbar 1.

[0036] Two spaced-apart locating pins form a "two-point positioning" structure with the first locating hole 104 of the mother plate body 101. Compared with a single locating pin, this effectively prevents the lower cover plate and the laminated busbar 1 from rotating around the locating pins during assembly, significantly improving the coaxiality and positional accuracy of their assembly. For example, the locating pins can be threaded to the second support plate 204 or riveted. When the locating pins are worn and unusable, they can be replaced by disassembling them without damaging the overall structure, reducing maintenance difficulty and cost.

[0037] like Figure 3 As shown, for example, the first support plate portion 203 is provided with a plurality of rivet screws 202 spaced apart along the first direction, for example, three rivet screws 202 are provided. The third support plate portion 205 is provided with a plurality of rivet screws 202 spaced apart between the locating pin and the second support plate portion 204 along the first direction, for example, three rivet screws 202 are provided. The third support plate portion 205 is also provided with a plurality of rivet screws 202 spaced apart on the side of the locating pin away from the second support plate portion 204 along the first direction, for example, three rivet screws 202 are provided.

[0038] like Figure 4 As shown, for example, the third pressure plate 305 is provided with a second positioning hole 301 at the position corresponding to each positioning pin, the first pressure plate 303 presses the end of the mother plate body 101 with the pin 103 onto the first support plate 203, the first pressure plate 303 is provided with a mounting hole at the position corresponding to the rivet screw 202, the third pressure plate 305 presses the mother plate body 101 onto the third support plate 205, and the third pressure plate 305 is provided with a mounting hole at the position corresponding to the rivet screw 202.

[0039] It should be noted that the number of rivet screws 202 is determined according to the size of the motherboard body 101 to ensure the bonding effect between multiple plates of the stacked busbar 1.

[0040] In this embodiment, the spaced distribution of multiple rivet screws 202 allows for the formation of a uniform clamping force field between the mother plate body 101 and the first cover plate 2 and the second cover plate 3 through the tightening force of the subsequent flange nuts 302. This "area-based clamping" ensures that the multiple electrode plates of the laminated busbar 1 are tightly bonded, eliminating gaps caused by insufficient local clamping force. Gaps not only increase contact resistance and lead to heat loss, but may also cause electrode plate corrosion due to air humidity. The uniform clamping of multiple rivet screws 202 effectively ensures the sealing and bonding strength of the adhesive layer, reducing the risk of electrical performance degradation due to electrode plate loosening during long-term use.

[0041] The working principle of the adhesive curing device for the laminated busbar 1 in this embodiment is as follows: After applying an epoxy resin adhesive layer to the blank space between two adjacent electrode plates of the stacked busbar 1, the stacked busbar 1 is placed on the first cover plate 2, and the first positioning hole 104 is fitted onto the positioning structure 201. Then, the second cover plate 3 is placed on the stacked busbar 1, and the second positioning hole 301 is fitted onto the positioning structure 201, thereby positioning the first cover plate 2, the stacked busbar 1, and the second cover plate 3. Then, the first cover plate 2 and the second cover plate 3 are locked with fasteners, that is, the rivet screws 202 and the flange nuts 302 are locked in a diagonal sequence. After being locked by the curing device, it is left to stand and cure for more than 4 hours before being removed, thus completing the adhesive curing of the stacked busbar 1.

[0042] The first cover plate 2 and the second cover plate 3 of the curing device in this embodiment are made of aluminum-zinc coated steel sheet, which has fast processing efficiency and low cost. Compared with existing aluminum molds, the tooling is lightweight and simple, easy for employees to operate, and has no safety risks.

[0043] The spaced distribution of the multiple rivet screws 202 in this embodiment of the application can form a uniform clamping force field between the mother plate body 101 and the first cover plate 2 and the second cover plate 3 through the locking force of the subsequent flange nut 302. This "area-based clamping" can ensure that the multiple pole plates of the laminated busbar 1 are tightly attached. Even if there is a slight error in the bending angle of the mother plate body 101, it will not delaminate after curing, and can effectively ensure that the flatness of the overlapping surface of the mother plate body 101 is within the qualified range.

[0044] The application scope of this application embodiment is wide. The first cover plate 2 and the second cover plate 3 are bent parts. All busbar bodies that need to be bent and then bonded, such as right-angle bends and Z-shaped bends, can use the curing device of this application embodiment.

[0045] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for applying adhesive and curing laminated busbars, characterized in that, The system includes a first cover plate (2) and a second cover plate (3). The first cover plate (2) is provided with a positioning structure (201). The second cover plate (3) is detachably connected to the first cover plate (2) by fasteners. The second cover plate (3) is used to press the mother plate body (101) onto the first cover plate (2). The second cover plate (3) is provided with a second positioning hole (301) at a position corresponding to the positioning structure (201). The positioning structure (201) penetrates the first positioning hole (104) on the mother plate body (101) and cooperates with the second positioning hole (301).

2. The laminated busbar adhesive curing device according to claim 1, characterized in that, The fasteners include a rivet screw (202) and a nut (302) provided on the first cover plate (2). The second cover plate (3) is provided with a mounting hole. The rivet screw (202) passes through the through hole (105) on the mother plate body (101) and the mounting hole and is threadedly connected to the nut (302).

3. The laminated busbar adhesive curing device according to claim 2, characterized in that, The nut (302) is a flange nut (302), and the flange face of the flange nut (302) is in contact with the side of the second cover plate (3) facing away from the mother plate body (101).

4. The laminated busbar adhesive curing device according to claim 2, characterized in that, The shapes of the first cover plate (2) and the second cover plate (3) are adapted to the shape of the mother plate body (101).

5. The laminated busbar adhesive curing device according to claim 4, characterized in that, The first cover plate (2) includes a first support plate portion (203), a second support plate portion (204), and a third support plate portion (205); The first support plate portion (203) and the third support plate portion (205) are parallel to each other and spaced apart. One end of the second support plate portion (204) is connected to one end of the first support plate portion (203), and the other end of the second support plate portion (204) is connected to one end of the third support plate portion (205).

6. The laminated busbar adhesive curing device according to claim 5, characterized in that, The positioning structure (201) includes two positioning pins disposed on the third support plate (205), the two positioning pins being spaced apart, and the two positioning pins engaging with the first positioning hole (104) on the mother plate body (101).

7. The laminated busbar adhesive curing device according to claim 6, characterized in that, The second cover plate (3) includes a first pressure plate portion (303), a second pressure plate portion (304), and a third pressure plate portion (305); The first pressure plate (303) and the third pressure plate (305) are parallel to each other and spaced apart. One end of the second pressure plate (304) is connected to one end of the first pressure plate (303), and the other end of the second pressure plate (304) is connected to one end of the third pressure plate (305).

8. The laminated busbar adhesive curing device according to claim 7, characterized in that, The first support plate portion (203) is provided with a plurality of rivet screws (202) spaced apart along a first direction. The third support plate portion (205) is provided with a plurality of rivet screws (202) spaced apart between the positioning pin and the second support plate portion (204) along the first direction. The first pressure plate portion (303) presses one end of the mother plate body (101) with the pin (103) onto the first support plate portion (203). The first pressure plate portion (303) is provided with the mounting hole at the position corresponding to the rivet screw (202). The third pressure plate portion (305) presses the mother plate body (101) onto the third support plate portion (205). The third pressure plate portion (305) is provided with the mounting hole at the position corresponding to the rivet screw (202).

9. The laminated busbar adhesive curing device according to claim 7, characterized in that, The third pressure plate (305) is provided with a second positioning hole (301) at a position corresponding to each of the positioning pins.

10. The laminated busbar adhesive curing device according to any one of claims 7-9, characterized in that, There is a gap between the second support plate portion (204) and the mother plate body (101), and there is a gap between the second pressure plate portion (304) and the mother plate body (101).

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