A directional reinforced phenolic resin composite sandwich vertical adhesive board

Abstract

The utility model discloses a kind of vertically reinforced phenolic resin composite sandwich vertical adhesive board material, belong to the thermal insulation fireproof board material technical field of track, aviation field. It aims to solve the problem of insufficient vertical strength of existing phenolic resin composite foam board, easy to be pressed and deformed and poor surface smooth bonding stability. The board material includes several long strips cut from phenolic resin composite foam board, the long strip is turned over 90 degrees after numerical control processing cutting, and the overall upper and lower surfaces are rough surface by structural adhesive layer (adhesion into integral structure. Its preparation is divided into two kinds of processes of small batch and large batch. The utility model directionally improves vertical strength, enhances bonding stability, structure process is simple, and retains original thermal insulation, fireproof performance, and is suitable for thermal insulation fireproof scene with vertical strength requirement in track, aviation field.

Description

Technical Field

[0001] This utility model relates to a directionally reinforced phenolic resin composite sandwich vertical bonding board. Background Technology

[0002] Phenolic resin composite foam boards possess excellent thermal insulation and fireproofing properties, making them a commonly used thermal insulation and fireproofing material in the rail and aerospace industries. Existing phenolic resin composite foam boards are manufactured using multi-layer glass fiber preimpregnated felt as the base material through a multi-layer lay-up molding process. Their surface is relatively smooth, while their internal structure is relatively rough.

[0003] Due to the layup molding process, the vertical interlayer strength of existing phenolic resin composite foam boards is significantly weaker than their horizontal interlayer strength. When the application requires slightly higher vertical strength, existing phenolic resin composite foam boards are prone to deformation under pressure, failing to meet practical application needs. Utility Model Content

[0004] The purpose of this invention is to provide a phenolic resin composite sandwich vertical adhesive core board, which solves the problems of insufficient vertical strength and easy deformation of existing phenolic resin composite foam boards, while achieving the effects of simple structure, convenient installation and manufacturing.

[0005] A directional reinforced phenolic resin composite sandwich vertical bonding board, wherein the density of the phenolic resin composite foam board is 200-800 kg / m³ and the original thickness is 8-15 mm, comprising several strips prepared by cutting from the phenolic resin composite foam board.

[0006] Several long strips are rotated 90 degrees and then assembled into an integral structure. The upper and lower surfaces of the integral structure are rough surfaces, and adjacent long strips are bonded together by a structural adhesive layer.

[0007] Furthermore, the density of the phenolic resin composite foam board is 300-600 kg / m³. This density of 300-600 kg / m³ ensures the vertical strength after vertical bonding while fully preserving the original thermal insulation and fire-resistant properties of the phenolic resin composite foam board, allowing the board to meet the dual requirements of "high strength" and "lightweight + core functionality".

[0008] Furthermore, the original thickness of the phenolic resin composite foam board is 10-12 mm. This original thickness of 10-12 mm balances the independent structural strength of the long strip with the overall thinness after vertical bonding, ensuring uniform force transmission in the vertical direction and avoiding localized stress concentration.

[0009] Furthermore, the structural adhesive is a two-component epoxy structural adhesive. Compared to ordinary epoxy or polyurethane structural adhesives, two-component epoxy structural adhesives have higher bonding strength, weather resistance, and vibration resistance. Their curing time is controllable, making them suitable for both small-batch manual bonding and large-scale automated production, balancing reliability and production flexibility.

[0010] Furthermore, the width of the strip is 5-20mm, and its length is consistent with the length of the finished board. The width of 5-20mm allows for even distribution of adhesive seams, balancing overall strength and ease of processing.

[0011] Furthermore, the thickness of the structural adhesive layer is 0.5-1.2 mm.

[0012] Furthermore, in mass production, the strips are obtained by cutting cubes formed by bonding phenolic resin composite foam boards. This process design addresses the efficiency and precision requirements of mass production: compared to cutting individual strips, bonding the foam boards into cubes before cutting allows for the production of hundreds of uniformly sized strips at once, increasing production efficiency by 3-5 times. Simultaneously, the adhesive layer distribution is more uniform during cube bonding, and the slicing process is automated using CNC saw blades, avoiding the accumulation of errors from individual cuts. This ensures that the width and thickness deviations of the strips are controlled within ±0.2mm, guaranteeing consistent stress on all strips during subsequent vertical bonding and further improving the vertical strength and stability of the finished board.

[0013] Furthermore, the strips are cut using CNC machining, with a cutting accuracy error not exceeding ±0.2mm.

[0014] The beneficial effects of this utility model are as follows:

[0015] By cutting the phenolic resin composite foam board, rotating it 90°, and then vertically gluing it, the angle between the stress direction of the board and its layered structure is changed. This makes the vertical stress consistent with the original horizontal layered structure of the board, greatly improving the vertical strength and preventing deformation during use.

[0016] The increased surface roughness of the phenolic resin composite foam board after cutting increases the contact area with the adhesive during subsequent use, resulting in a stronger bond and improved overall structural stability.

[0017] The overall structure consists of foam board and structural adhesive, with no complex parts; the manufacturing process involves only simple steps such as cutting, applying adhesive, bonding, and rotating, making it easy to manufacture and install, and adaptable to different batch production needs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a directional reinforced phenolic resin composite sandwich vertical bonding board.

[0019] Figure 2 It is a process roadmap for small to medium batch production scenarios;

[0020] Figure 3 It is a process roadmap for mass production scenarios;

[0021] In the diagram: 1. Strip, 2. Structural adhesive layer. Detailed Implementation

[0022] To enhance understanding of this utility model, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. These embodiments are only used to explain the present utility model and do not constitute a limitation on the scope of protection of the present utility model.

[0023] Example 1: As Figure 2 As shown, this method is suitable for small-batch production, and the production steps are as follows:

[0024] Cutting steps: Using CNC machining, the phenolic resin composite foam board is cut into strips that meet the design requirements in terms of thickness. CNC machining can ensure that the dimensions of the strips are consistent.

[0025] Adhesive application steps: Apply structural adhesive evenly to the cut strip surface, ensuring complete coverage of the adhesive layer on the bonding surface.

[0026] Bonding and molding steps: After applying structural adhesive, rotate the strip 90° so that the original horizontal layered structure is perpendicular to the direction of force. Then, bond the strips together in sequence to form a sandwich panel with a vertical bonding structure.

[0027] Example 2: Figure 3 As shown, this method is suitable for mass production, and the production steps are as follows:

[0028] Adhesive application steps: First, apply structural adhesive evenly to the surface of the original phenolic resin composite foam board.

[0029] Cube forming steps: Adhesive-coated phenolic resin composite foam boards are bonded together to form cubes, ensuring a firm bond.

[0030] Rotary cutting steps: After the cube is glued and formed, rotate it 90° and cut it to the required thickness using a blade saw to obtain a sandwich panel with a vertically bonded structure.

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A directionally reinforced phenolic resin composite sandwich vertically bonded board, wherein the density of the phenolic resin composite foam board is 200-800 kg / m³, and the original thickness is 8-15 mm; characterized in that, It includes several strips prepared by cutting from phenolic resin composite foam board; Several long strips are rotated 90 degrees and then assembled into an integral structure. The upper and lower surfaces of the integral structure are rough surfaces, and adjacent long strips are bonded together by a structural adhesive layer.

2. The directionally reinforced phenolic resin composite sandwich vertical bonding board according to claim 1, characterized in that, The density of the phenolic resin composite foam board is 300-600 kg / m³.

3. The directionally reinforced phenolic resin composite sandwich vertical bonding board according to claim 1, characterized in that, The original thickness of the phenolic resin composite foam board is 10-12 mm.

4. The directionally reinforced phenolic resin composite sandwich vertical bonding board according to claim 3, characterized in that, The structural adhesive is a two-component epoxy structural adhesive.

5. The directionally reinforced phenolic resin composite sandwich vertical bonding board according to claim 3, characterized in that, The width of the strip is 5-20mm, and its length is the same as that of the finished board.

6. The directionally reinforced phenolic resin composite sandwich vertical bonding board according to claim 3, characterized in that, The thickness of the structural adhesive layer is 0.5-1.2 mm.

7. The directionally reinforced phenolic resin composite sandwich vertical bonding board according to claim 3, characterized in that, In mass production, the strip is cut from cubic blocks formed by bonding phenolic resin composite foam boards.

8. The directionally reinforced phenolic resin composite sandwich vertical bonding board according to claim 3, characterized in that, The strips are cut using CNC machining, with a cutting accuracy error not exceeding ±0.2mm.

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