Vehicle lamp and vehicle

Abstract

The application provides a vehicle lamp and a vehicle. The vehicle lamp comprises a radiator, a circuit board assembly and a heat-conducting adhesive. The radiator comprises a connecting portion and a heat-conducting portion which are connected together. The circuit board assembly comprises a circuit board having a first board surface facing the radiator. The connecting portion has a stop surface abutting against the first board surface. The heat-conducting portion has a heat-conducting surface facing the first board surface. The heat-conducting adhesive is filled between the heat-conducting surface and the first board surface. An overflow groove is further arranged on the radiator and surrounds the heat-conducting portion. The connecting portion surrounds the heat-conducting portion and the overflow groove. The vehicle lamp of the application is not easy to cause the heat-conducting adhesive to contaminate the LED, is not easy to cause the PCB to be deformed and damaged, and can reduce the mold cost and the adjustment difficulty.

Description

Technical Field

[0001] This application relates to the field of automotive lighting technology, and in particular to an automotive lighting fixture and a vehicle using the same lighting fixture. Background Technology

[0002] In vehicle lighting systems, the lighting performance and stability of headlights are directly related to driving safety. The printed circuit board (PCB) that houses the light-emitting diode (LED) chip is the core of the headlight's light emission, while the heat sink is a key component that ensures the long-term reliable operation of the LED. The coordinated work of the two is crucial to the headlight's performance and lifespan.

[0003] In related technologies, PCB boards and heat sinks are often assembled using a large flat surface positioning method. However, small gaps can easily exist in flat contact, hindering heat transfer. Therefore, thermally conductive adhesive or sealant is often applied to fill the gaps and build heat transfer channels.

[0004] However, in the above assembly methods, the squeezing during assembly can easily cause the thermal conductive adhesive to contaminate the LED and deform and damage the PCB board. In addition, the large plane positioning requires high precision in heat sink processing, which will increase mold costs and increase adjustment difficulty. Utility Model Content

[0005] This application provides a vehicle light and vehicle, wherein when assembling the heat sink and circuit board assembly, it is not easy to cause the thermal conductive adhesive to contaminate the LED, nor is it easy to cause the PCB board to deform and be damaged. It can also reduce mold costs and reduce adjustment difficulty.

[0006] On one hand, this application provides a vehicle light, including a radiator, a circuit board assembly, and thermally conductive adhesive; the radiator includes a connecting portion and a thermally conductive portion connected together; the circuit board assembly includes a circuit board having a first plate surface facing the radiator, the connecting portion having a stop surface abutting against the first plate surface, and the thermally conductive portion having a thermally conductive surface facing the first plate surface; thermally conductive adhesive is filled between the thermally conductive surface and the first plate surface; wherein, the radiator is further provided with an overflow groove, the overflow groove is disposed around the thermally conductive portion, and the connecting portion surrounds the thermally conductive portion and the overflow groove.

[0007] In this design, the stop surface of the connecting part abuts against the first plate surface of the circuit board for positioning, and the heat-conducting surface of the heat-conducting part mates with the first plate surface and is filled with heat-conducting adhesive, ensuring that the heat-conducting adhesive acts concentrated between the heat-conducting surface and the first plate surface, ensuring the effectiveness of the heat transfer channel and improving heat dissipation efficiency. Secondly, the overflow groove set around the heat-conducting part can accommodate the heat-conducting adhesive overflowing during assembly and extrusion, avoiding heat-conducting adhesive contamination of the LED. At the same time, the structural design of the connecting part and the heat-conducting part can reduce the force of assembly and extrusion on the circuit board, reducing the risk of circuit board deformation and damage. Moreover, the stop surface positioning method replaces the traditional large plane positioning, reducing the requirements for the overall processing accuracy of the heat sink, thereby reducing mold costs and simplifying the mold adjustment process.

[0008] As an optional implementation, the connecting part includes a connecting body and a stop boss connected to the connecting body, the connecting body being connected to the heat-conducting part; a stop surface is formed on the side of the stop boss facing the first plate surface.

[0009] In this way, the boss-shaped stop boss can make the stop surface and the first surface of the circuit board form a precise and concentrated contact, which improves the positioning accuracy and reduces the contact area between the stop structure and the circuit board, avoiding the concentration of assembly stress caused by excessive contact area.

[0010] As an optional implementation, the stop bosses are spaced in multiples along the circumferential direction of the overflow groove, and the number of stop bosses is at least three.

[0011] In this way, by utilizing the stability principle of three or more points of positioning, the circuit board can be effectively prevented from shifting or tilting during assembly, ensuring that the heat-conducting surface of the heat-conducting part and the first board surface always maintain a uniform gap, providing a reliable guarantee for the uniform filling of thermally conductive adhesive, thereby stabilizing heat transfer efficiency; at the same time, the spaced arrangement will not block the overflow channel of the overflow groove, allowing the thermally conductive adhesive that is squeezed out to flow smoothly into the overflow groove, avoiding the accumulation of overflow adhesive and contamination of LEDs due to the obstruction of the stop boss, and also reducing the contact area between the stop boss and the circuit board, reducing the impact of assembly stress concentration on the circuit board.

[0012] As an optional implementation, the stop boss is a protruding post with a diameter greater than or equal to 1 mm.

[0013] Specifically, designing the stop boss as a protruding post allows the stop surface to form a regular circular contact area. Compared to irregular shapes, a circular contact surface allows for more even pressure distribution between the stop boss and the first surface of the circuit board, preventing damage to the circuit board caused by excessive local pressure. The diameter being greater than or equal to millimeters ensures the structural strength of the protruding post itself, preventing breakage or deformation during assembly and ensuring positioning stability over long-term use. It also achieves reliable contact through a reasonable contact area, avoiding stress concentration at the contact point that could damage the circuit board due to an excessively small protruding post diameter.

[0014] As an optional implementation, the longitudinal cross-sectional shape of the overflow groove is semi-circular, and the radius of the overflow groove is greater than or equal to 0.4 mm.

[0015] The semi-circular longitudinal section shape ensures a smooth transition of the inner wall of the adhesive overflow tray, avoiding the dead corners that can easily accumulate adhesive in right-angled or sharp-angled trays. This allows the thermally conductive adhesive that overflows during assembly to flow smoothly and be evenly distributed within the tray, and also facilitates easier cleaning of residual adhesive later. The size, with a radius greater than or equal to 0.4 mm, provides ample space for the thermally conductive adhesive, effectively accommodating the amount of adhesive overflow that may occur in different assembly scenarios, preventing the adhesive from overflowing outside the tray and contaminating the LEDs or other areas of the circuit board due to insufficient tray volume.

[0016] As an optional implementation, the flatness of the first plate surface is less than or equal to 0.1 mm.

[0017] This allows the first surface of the circuit board to fit more tightly with the thermally conductive surface of the heat-conducting part. Combined with the filling of thermally conductive adhesive, it can minimize the air residue in the gap, reduce thermal resistance and improve heat transfer efficiency, and avoid the problem of excessively thick or empty thermally conductive adhesive in some areas due to unevenness of the first surface, which would affect heat dissipation.

[0018] As an optional implementation, the circuit board assembly further includes a light-emitting element. The circuit board has a second surface disposed opposite to the first surface, and the light-emitting element is disposed on the second surface. The area covered by the thermally conductive adhesive is a thermally conductive area, which falls within a circular area. The outline of the circular area coincides with a circle, the center of which is the center of the light-emitting element, and the radius of the circle is greater than or equal to 5 millimeters.

[0019] The design of the heat-conducting area, centered on the core heat-generating light-emitting component, allows the thermally conductive adhesive to concentrate on covering the main heat-generating areas of the LED during operation, ensuring that heat is directly transferred from the source to the heat-conducting part through the adhesive. Secondly, the circular area with a radius greater than or equal to 5 mm ensures that the heat-conducting area completely covers the light-emitting component and surrounding high-heat-generating areas, while also achieving uniform distribution of the thermally conductive adhesive through its circular outline. Simultaneously, this concentrated and standardized heat-conducting area design complements the circumferential layout of the adhesive overflow tray, preventing excessive application of thermally conductive adhesive beyond the predetermined area, reducing overflow, and making it easier for any excess adhesive to be contained within the overflow tray.

[0020] As an alternative implementation, the heat sink and the circuit board are connected by fasteners; the heat sink has a first connection hole and the circuit board has a second connection hole, and the fasteners pass through the first connection hole and the second connection hole to connect the heat sink and the circuit board together.

[0021] This fastener connection method rigidly fixes the heat sink and circuit board. Combined with the positioning bosses on the connecting parts, it effectively prevents relative displacement between the two under conditions such as vehicle vibration, ensuring that the heat-conducting surface of the heat-conducting part remains stably attached to the first surface of the circuit board. This maintains the consistency of the thermal adhesive filling gaps, ensuring that heat transfer efficiency is not affected by vibration. Furthermore, the fit between the first and second connecting holes provides a precise positioning benchmark for assembly, preventing misalignment between the heat-conducting area and the heat-conducting part due to assembly deviations, ensuring that the heat-conducting area of ​​the thermal adhesive accurately corresponds to the heat-generating core of the light-emitting component. In addition, this detachable fastener connection method not only facilitates the inspection and adjustment of the thermal adhesive application and overflow groove status during assembly, but also provides convenience for subsequent maintenance or component replacement.

[0022] As an optional implementation, a positioning post is provided on the connecting part, and a positioning hole is provided on the circuit board for the positioning post to pass through.

[0023] In the initial assembly stage, the positioning pins passing through the positioning holes enable pre-positioning of the heat sink and the circuit board, quickly aligning the first connecting hole of the connector with the second connecting hole of the circuit board. Simultaneously, it assists in calibrating the contact position between the stop surface and the first surface of the circuit board, improving assembly efficiency and avoiding initial alignment deviations. After pre-positioning, the cooperation between the positioning pins and the positioning holes restricts their relative sliding within the plane, ensuring that the heat-conducting surface of the heat-conducting part corresponds to the heat-conducting area of ​​the circuit board. This prevents misalignment between the thermally conductive adhesive coverage area and the heat-conducting surface, avoiding impacts on heat transfer efficiency. It also reduces the risk of the adhesive overflow tray failing to hold excess adhesive due to circuit board misalignment during assembly.

[0024] On the other hand, this application provides a vehicle, including a body and the aforementioned vehicle lights, the vehicle lights being mounted on the body.

[0025] The vehicle provided in this application has lower manufacturing costs and better performance by adopting the aforementioned headlights. Attached Figure Description

[0026] Figure 1 A schematic diagram of a partial structure of a vehicle lamp provided in an embodiment of this application; Figure 2 for Figure 1 Exploded view of the structure shown; Figure 3 A cross-sectional view of a partial structure of another vehicle lamp provided in an embodiment of this application; Figure 4 for Figure 1 A cross-sectional view along the AA direction; Figure 5 for Figure 4 Enlarged schematic diagram of the local structure at point B; Figure 6 for Figure 3A schematic diagram of another part of the headlight structure shown.

[0027] Explanation of reference numerals in the attached figures: 1. Heat sink; 2. Circuit board assembly; 3. Thermal adhesive; 11. Connecting part; 12. Heat-conducting part; 13. Glue overflow groove; 14. First connecting hole; 15. Positioning post; 21. Circuit board; 22. Light-emitting component; 111. Stop surface; 112. Connecting body; 113. Stop boss; 121. Heat-conducting surface; 211. First plate surface; 212. Second plate surface; 213. Second connecting hole; 214. First sub-plate; 215. Second sub-plate; 216. Positioning hole; 2131, First borehole section; 2132, Second borehole section. Detailed Implementation

[0028] The technical solutions in this application will be clearly and thoroughly described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B. "And / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more than two.

[0029] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0030] In related technologies, PCB boards and heat sinks are often assembled using a large-plane positioning method. However, small gaps can easily exist in planar contact, hindering heat transfer. Therefore, thermally conductive adhesive or sealant is often applied to fill the gaps and create heat transfer channels. However, in the above assembly method, the squeezing during assembly can easily cause the thermally conductive adhesive to contaminate the LED and deform and damage the PCB board. Furthermore, large-plane positioning requires high precision in heat sink processing, which increases mold costs and adjustment difficulty.

[0031] Based on this, the present application provides a vehicle light and vehicle, which, when assembling the heat sink and circuit board assembly, is less likely to cause thermal conductive adhesive to contaminate the LED, less likely to cause PCB board deformation and damage, and can also reduce mold costs and reduce adjustment difficulty.

[0032] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific implementation details.

[0033] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of a partial structure of a vehicle lamp provided in an embodiment of this application. Figure 2 for Figure 1 Exploded view of the structure shown. Figure 3 This is a cross-sectional view of a partial structure of another vehicle lamp provided in an embodiment of this application. As shown in the figure, this embodiment provides a vehicle lamp including a heat sink 1, a circuit board assembly 2, and thermally conductive adhesive 3; the heat sink 1 includes a connecting portion 11 and a thermally conductive portion 12 connected together.

[0034] Furthermore, please combine Figure 4 and Figure 5 , Figure 4 for Figure 1 Cross-sectional view along the AA direction. Figure 5 for Figure 4 A magnified view of the partial structure at point B. The circuit board assembly 2 includes a circuit board 21, which has a first surface 211 facing the heat sink 1. A connecting portion 11 has a stop surface 111 that abuts against the first surface 211. A heat-conducting portion 12 has a heat-conducting surface 121 facing the first surface 211. Thermally conductive adhesive 3 fills the space between the heat-conducting surface 121 and the first surface 211. The heat sink 1 also has an overflow groove 13 surrounding the heat-conducting portion 12, and the connecting portion 11 surrounds both the heat-conducting portion 12 and the overflow groove 13.

[0035] In this design, the stop surface 111 of the connecting part 11 abuts against the first plate surface 211 of the circuit board 21 for positioning. The heat-conducting surface 121 of the heat-conducting part 12 cooperates with the first plate surface 211 and is filled with heat-conducting adhesive 3, ensuring that the heat-conducting adhesive 3 acts concentrated between the heat-conducting surface 121 and the first plate surface 211, ensuring the effectiveness of the heat transfer channel and improving heat dissipation efficiency. Secondly, the overflow groove 13 set around the heat-conducting part 12 can accommodate the heat-conducting adhesive 3 overflowing during assembly and extrusion, preventing the heat-conducting adhesive 3 from contaminating the LED 22. At the same time, the structural design of the connecting part 11 and the heat-conducting part 12 can reduce the force of assembly and extrusion on the circuit board 21, reducing the risk of deformation and damage to the circuit board 21. Moreover, the positioning method of the stop surface 111 replaces the traditional large plane positioning, reducing the requirements for the overall processing accuracy of the heat sink 1, thereby reducing mold costs and simplifying the mold adjustment process.

[0036] like Figure 3 As shown, the circuit board assembly 2 also includes a light-emitting element 22. The circuit board 21 has a second plate surface 212 disposed opposite to the first plate surface 211, and the light-emitting element 22 is disposed on the second plate surface 212. The light-emitting element 22 can be an LED; however, in other embodiments, it can also be a light bulb or the like. The type of light-emitting element 22 is not specifically limited here.

[0037] The area covered by the thermally conductive adhesive 3 is defined as the thermally conductive region, which falls within a circular area. The outline of the circular region coincides with a circle, the center of which is the center of the light-emitting element 22, and the radius of the circle is greater than or equal to 5 millimeters. By defining the thermally conductive region with the heat-generating core light-emitting element 22 as the center, the thermally conductive adhesive 3 can concentrate on covering the main heat-generating area of ​​the LED during operation, ensuring that heat is directly transferred from the source to the thermally conductive part 12 through the thermally conductive adhesive 3.

[0038] Secondly, the circular range with a radius greater than or equal to 5 mm ensures that the heat-conducting area can completely cover the light-emitting element 22 and the surrounding high-heat-generating area, while also achieving uniform distribution of the thermally conductive adhesive 3 through the circular outline.

[0039] Meanwhile, this centralized and standardized heat-conducting area design can work in conjunction with the circumferential layout of the overflow groove 13 to prevent the thermal conductive adhesive 3 from being applied excessively beyond the preset area, reducing the amount of overflow while making it easier for the overflowing thermal conductive adhesive to be contained by the overflow groove 13.

[0040] In some embodiments, the flatness of the first plate surface 211 is less than or equal to 0.1 mm. This allows the first plate surface 211 of the circuit board 21 to fit more tightly with the heat-conducting surface 121 of the heat-conducting part 12. Combined with the filling of the gap with thermally conductive adhesive 3, it can minimize the air residue in the gap, reduce thermal resistance and improve heat transfer efficiency, and avoid the unevenness of the first plate surface 211 causing local excessive thickness or gaps in the thermally conductive adhesive 3, which would affect heat dissipation.

[0041] In a specific embodiment of this invention, the flatness of the first plate surface 211 is 0.1 mm. This flatness allows the first plate surface 211 of the circuit board 21 to fit closely with the heat-conducting surface 121 of the heat-conducting part 12, reducing thermal resistance caused by residual air and ensuring efficient heat transfer from the area where the light-emitting element 22 is located to the heat sink 1.

[0042] like Figure 5 As shown, in some specific embodiments, the longitudinal cross-sectional shape of the overflow groove 13 is semi-circular, and the radius of the overflow groove 13 is greater than or equal to 0.4 mm. The semi-circular longitudinal cross-sectional shape makes the inner wall of the overflow groove 13 smoothly transition, avoiding the dead corners of glue accumulation that are easily found in right-angled or acute-angled grooves. This allows the thermally conductive adhesive that overflows during assembly to flow smoothly and be evenly distributed within the groove, and also facilitates easier cleaning of residual adhesive in the groove later.

[0043] The size setting with a radius greater than or equal to 0.4 mm provides ample space for thermally conductive adhesive, which can effectively accommodate the amount of adhesive overflow that may occur in different assembly scenarios, and avoid the thermally conductive adhesive overflowing outside the tank due to insufficient tank volume and contaminating other areas of LED22 or circuit board 21.

[0044] like Figure 3As shown, in some optional embodiments, the connecting part 11 includes a connecting body 112 and a stop boss 113 connected to the connecting body 112. The connecting body 112 is connected to the heat-conducting part 12. A stop surface 111 is formed on the side of the stop boss 113 facing the first plate surface 211. In this way, the stop boss 113 in the form of a boss can make the stop surface 111 and the first plate surface 211 of the circuit board 21 form a precise and concentrated abutment, which improves the positioning accuracy and reduces the contact area between the stop structure and the circuit board 21, avoiding the concentration of assembly stress caused by excessive contact area.

[0045] In a specific embodiment of this invention, the distance between the stop surface 111 and the thermally conductive surface 121 is 0.05 mm. This ensures that the thermally conductive adhesive 3 forms a uniform and appropriate filling thickness between the thermally conductive surface 121 and the first surface 211 of the circuit board 21. This avoids the risk of excessive overflow of the thermally conductive adhesive 3 due to excessive pressure caused by too small a spacing, which would increase the risk of contaminating the LED 22. It also prevents the thermally conductive adhesive 3 from being filled too thickly due to too large a spacing, which would increase thermal resistance and affect heat dissipation efficiency.

[0046] Please continue to combine Figure 6 , Figure 6 for Figure 3 The diagram shows another partial structure of the vehicle headlight. As shown, in some embodiments, the stop bosses 113 are spaced apart circumferentially along the overflow groove 13, and the number of stop bosses 113 is at least three.

[0047] In this way, by utilizing the stability principle of three or more points of positioning, the circuit board 21 can be effectively prevented from shifting or tilting during assembly, ensuring that the heat-conducting surface of the heat-conducting part 12 and the first plate surface 211 always maintain a uniform gap, providing a reliable guarantee for the uniform filling of the thermally conductive adhesive 3, thereby stabilizing the heat transfer efficiency; at the same time, the spaced arrangement will not block the overflow channel of the overflow groove 13, allowing the thermally conductive adhesive 3 that is squeezed out to flow smoothly into the overflow groove 13, avoiding the accumulation of overflow adhesive and contamination of the LED due to the obstruction of the stop boss 113, and also reducing the contact area between the stop boss 113 and the circuit board 21, reducing the impact of assembly stress concentration on the circuit board 21.

[0048] In some specific embodiments, the stop boss 113 is a protruding post with a diameter greater than or equal to 1 mm. Specifically, designing the stop boss 113 as a protruding post allows the stop surface 111 to form a regular circular contact area. Compared to an irregular shape, a circular contact surface allows for more uniform pressure between the stop boss 113 and the first surface 211 of the circuit board 21, avoiding excessive local pressure that could damage the circuit board 21.

[0049] The size setting of 1 mm or more in diameter not only ensures the structural strength of the protrusion itself, preventing it from breaking or deforming during assembly and ensuring positioning stability during long-term use, but also achieves reliable contact through a reasonable contact area, avoiding stress concentration at the contact point that could damage the circuit board 21 due to the protrusion diameter being too small.

[0050] The connection between the heat sink 1 and the circuit board 21 can be achieved by fasteners. The connecting part 11 has a first connecting hole 14 and the circuit board 21 has a second connecting hole 213. The fasteners pass through the first connecting hole 14 and the second connecting hole 213 to connect the heat sink 1 and the circuit board 21 together.

[0051] This fastener connection method can rigidly fix the heat sink 1 and the circuit board 21. With the positioning function of the stop boss 113 of the connecting part 11, it can effectively prevent the relative displacement of the two under the condition of vehicle driving vibration, and ensure that the heat conduction surface of the heat conduction part 12 and the first plate surface 211 of the circuit board 21 always remain stably attached, thereby maintaining the consistency of the gap filling of the thermal adhesive 3 and ensuring that the heat transfer efficiency is not affected by vibration.

[0052] Moreover, the cooperation between the first connecting hole 14 and the second connecting hole 213 provides a precise positioning reference for assembly, avoiding misalignment between the heat-conducting area and the heat-conducting part 12 due to assembly offset, and ensuring that the heat-conducting area of ​​the thermally conductive adhesive 3 accurately corresponds to the heat-generating core of the light-emitting component 22.

[0053] In addition, this detachable fastener connection method not only facilitates the inspection and adjustment of the application of thermal conductive adhesive 3 and the state of the overflow groove 13 during the assembly process, but also provides convenience for subsequent maintenance or replacement of parts.

[0054] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments, the circuit board 21 includes a first sub-board 214 and a second sub-board 215 spliced ​​together. The end face of the first sub-board 214 facing the heat sink 1 and the end face of the second sub-board 215 facing the heat sink 1 together form a first board surface 211. The end face of the first sub-board 214 away from the heat sink 1 and the end face of the second sub-board 215 away from the heat sink 1 together form a second board surface 212. A second connecting hole 213 is provided on both the first sub-board 214 and the second sub-board 215. One of the second connecting holes 213 includes a first hole segment 2131 and a second hole segment 2132 that are fastened together. The first hole segment 2131 is formed on the first sub-board 214 and the second hole segment 2132 is formed on the second sub-board 215.

[0055] The splicing structure allows the circuit board 21 to be flexibly disassembled and designed according to the lighting requirements of the vehicle lights, which facilitates the optimization of the sub-board circuit design for the LED layout in different areas (such as the distribution of the light-emitting components 22). At the same time, the first board surface 211 formed by splicing can be precisely matched with the heat-conducting part 12 and the stop boss 113 of the heat sink 1, ensuring that the overall board surface flatness meets the requirements to ensure the heat conduction and positioning effect.

[0056] Secondly, both sub-boards have second connecting holes 213 that, together with the first connecting hole 14 of the heat sink 1, are used to achieve fastener connection. This allows the assembled circuit board 21 to be fixed to the heat sink 1 at multiple points, preventing loosening at the sub-board splicing points due to uneven force. One of the second connecting holes 213 is formed by the engagement of the first hole segment 2131 of the first sub-board 214 and the second hole segment 2132 of the second sub-board 215. This split hole structure allows for positioning between sub-boards during splicing by aligning the hole segments, which helps improve the flatness of the overall first board surface 211. At the same time, this connection point can simultaneously constrain the displacement of the two sub-boards, enhancing splicing stability.

[0057] In order to improve the assembly efficiency between the heat sink 1 and the circuit board assembly 2, in some embodiments, the connecting part 11 is provided with a positioning post 15, and the circuit board 21 is provided with a positioning hole 216 for the positioning post 15 to pass through.

[0058] In the initial stage of assembly, the positioning post 15 passes through the positioning hole 216 to achieve the pre-positioning of the heat sink 1 and the circuit board 21, quickly aligning the first connecting hole 14 of the connecting part 11 with the second connecting hole 213 of the circuit board 21, and at the same time assisting in calibrating the contact position between the stop surface 111 and the first plate surface 211 of the circuit board 21, improving assembly efficiency and avoiding initial alignment deviation.

[0059] After the positioning is completed, the cooperation between the positioning post 15 and the positioning hole 216 can restrict the relative sliding of the two in the plane, which can ensure that the heat-conducting surface 121 of the heat-conducting part 12 corresponds to the heat-conducting area of ​​the circuit board 21, avoid the misalignment of the area covered by the heat-conducting adhesive 3 and the heat-conducting surface 121, which affects the heat transfer efficiency, and at the same time reduce the risk of the overflow groove 13 failing to receive the overflow adhesive due to the offset of the circuit board 21 during the assembly process.

[0060] In a specific embodiment of this invention, both the first sub-plate 214 and the second sub-plate 215 are provided with at least two positioning holes 216, with each positioning hole 216 corresponding to a positioning post 15. Furthermore, each of the first sub-plate 214 and the second sub-plate 215 has a slotted positioning hole 216. This provides a stable pre-positioning reference for each sub-plate, preventing deflection during assembly and ensuring that the splicing surfaces of the first sub-plate 214 and the second sub-plate 215 are aligned. This, in turn, ensures that the flatness of the first plate surface 211 formed by the two sub-plates meets the requirements, providing a foundation for the uniform filling of the thermally conductive adhesive 3 and efficient heat transfer.

[0061] Secondly, the strip hole design on the sub-board provides reasonable adjustment margin for assembly. It can accommodate minor dimensional deviations that may occur during processing or assembly, avoid assembly jamming or sub-board deformation caused by rigid positioning, and also allow for fine adjustment of the sub-board position during splicing through the adjustable range of the strip hole, ensuring that the second connecting hole 213 formed by snapping is aligned with the first connecting hole 14 of the heat sink 1.

[0062] This embodiment also provides a vehicle, including a body and the headlights described in the above embodiments, wherein the headlights are mounted on the body. The specific structure of the headlights has been described in detail in the above embodiments and will not be repeated here.

[0063] It should be noted that the vehicle provided in this embodiment should also include other modules or components that enable the vehicle to drive and work normally. Here, other modules or components will not be described one by one.

[0064] The vehicle provided in this embodiment has lower manufacturing costs and better performance by using the aforementioned headlights.

[0065] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vehicle light, characterized in that, include: A heat sink, comprising a connecting part and a heat-conducting part that are joined together; A circuit board assembly includes a circuit board having a first plate surface facing the heat sink, a connecting portion having a stop surface abutting the first plate surface, and a heat-conducting portion having a heat-conducting surface facing the first plate surface. as well as Thermally conductive adhesive is used to fill the space between the thermally conductive surface and the first plate surface; The radiator is also provided with an overflow groove, which surrounds the heat-conducting part, and the connecting part surrounds the heat-conducting part and the overflow groove.

2. The vehicle light according to claim 1, characterized in that, The connecting part includes a connecting body and a stop boss connected to the connecting body, and the connecting body is connected to the heat-conducting part; The side of the stop boss facing the first plate surface forms the stop surface.

3. The vehicle light according to claim 2, characterized in that, The stop bosses are arranged in multiple intervals along the circumference of the overflow groove, and the number of stop bosses is at least three.

4. The vehicle light according to claim 2, characterized in that, The stop boss is a protruding post, and the diameter of the protruding post is greater than or equal to 1 mm.

5. The vehicle lamp according to any one of claims 1 to 4, characterized in that, The longitudinal section of the overflow groove is semi-circular, and the radius of the overflow groove is greater than or equal to 0.4 mm.

6. The vehicle lamp according to any one of claims 1 to 4, characterized in that, The flatness of the first plate surface is less than or equal to 0.1 mm.

7. The vehicle lamp according to any one of claims 1 to 4, characterized in that, The circuit board assembly further includes a light-emitting element, and the circuit board has a second plate surface disposed opposite to the first plate surface, and the light-emitting element is disposed on the second plate surface; The thermally conductive adhesive covers a thermally conductive area, which falls within a circular region. The outline of the circular region coincides with a circle, the center of which is the center of the light-emitting element, and the radius of the circle is greater than or equal to 5 millimeters.

8. The vehicle lamp according to any one of claims 1 to 4, characterized in that, The heat sink is connected to the circuit board via fasteners; The heat sink has a first connection hole, and the circuit board has a second connection hole. The fastener passes through the first connection hole and the second connection hole to connect the heat sink and the circuit board together.

9. The vehicle lamp according to any one of claims 1 to 4, characterized in that, The connecting part is provided with a positioning post, and the circuit board is provided with a positioning hole for the positioning post to pass through.

10. A vehicle, characterized in that, It includes a vehicle body and a vehicle lamp as described in any one of claims 1 to 9, wherein the vehicle lamp is mounted on the vehicle body.

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