A double-sided heat dissipating device and a light emitting apparatus

Abstract

The utility model relates to the technical field of heat dissipation discloses a double -sided heat dissipation device and light emitting device, and the double -sided heat dissipation device is used for the multi -heat source lamp board, and a plurality of light emitting units are arranged in array on the multi -heat source lamp board, the double -sided heat dissipation device includes radiator and diaphragm heat dissipation board, and diaphragm heat dissipation board and radiator are arranged respectively at the both sides of multi -heat source lamp board, the side of diaphragm heat dissipation board is projected and is provided with the heat dissipation grid to the multi -heat source lamp board, and the heat dissipation grid is used for abutting the multi -heat source lamp board, and, the heat dissipation grid divides a plurality of squares on the surface of diaphragm heat dissipation board, and a plurality of squares and a plurality of light emitting units correspond one to one, and every square is provided with the light outlet hole, and the light outlet hole is located on the light path of light emitting unit. Through setting up radiator and diaphragm heat dissipation board respectively at the both sides of multi -heat source lamp board and limiting and conducting heat, make the heat dissipation speed of lamp board accelerate, and reduce the deformation problem.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a double-sided heat dissipation device and a light-emitting device. Background Technology

[0002] Currently, the heat dissipation method for array-type multi-heat source devices involves directly locking the metal lamp plate onto the surface of the heat sink and applying thermal paste to the contact gaps to fill the air gaps and increase heat dissipation efficiency. Specifically, corresponding through holes are set on both the heat sink and the metal lamp plate, and they are connected and fixed with screws or bolts.

[0003] However, with technological advancements, the size of LED panels has gradually increased, and the number of heat sources integrated on them has also grown. During operation, the rapid heating rate of the LED panel easily leads to deformation and warping. Furthermore, because the LED panel is only secured by a limited number of connectors, only localized contact can be guaranteed. At locations farther from the connectors, the LED panel is prone to detaching from the heatsink surface. Moreover, since the thermal paste itself lacks resilience, deformation of the LED panel can cause the heatsink to completely separate from the panel, resulting in overheating of the LED chips.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a double-sided heat dissipation device and a light-emitting device, which aims to solve the problem that the lamp board and heat sink are prone to separate during the use of existing array-type multi-heat source devices, resulting in lamp overheating and affecting normal use.

[0006] The technical solution of this utility model is as follows: A double-sided heat dissipation device is used for a multi-heat source lamp panel, wherein a plurality of light-emitting units are arrayed on the multi-heat source lamp panel; wherein the double-sided heat dissipation device includes: heat sink; A light-blocking heat sink, wherein the light-blocking heat sink and the heat sink are respectively disposed on both sides of the multi-heat source lamp plate; The aperture heat dissipation plate has a heat dissipation grille protruding from one side facing the multi-heat source lamp plate, and the heat dissipation grille is used to abut against the multi-heat source lamp plate; and the heat dissipation grille divides the surface of the aperture heat dissipation plate into several squares, and each of the squares corresponds to a number of light-emitting units; each square is provided with a light-emitting hole, and the light-emitting hole is located in the light-emitting path of the light-emitting unit.

[0007] In the aforementioned double-sided heat dissipation device, a plurality of heat dissipation fins are protruding from the side of the aperture heat dissipation plate opposite to the multi-heat source lamp plate, and the projection of the heat dissipation fins on the aperture heat dissipation plate at least partially overlaps with the projection of the heat dissipation grille on the aperture heat dissipation plate.

[0008] The aforementioned double-sided heat dissipation device, wherein the heat sink is an air-cooled heat sink or a semiconductor heat sink.

[0009] The aforementioned double-sided heat dissipation device includes a first region and a second region surrounding the first region, wherein the first region is used to house the multi-heat source lamp plate.

[0010] The double-sided heat dissipation device further includes a first heat-conducting component, which is disposed between the aperture heat dissipation plate and the heat sink, located on the side of the multi-heat source lamp plate; one side of the first heat-conducting component is in contact with the second area, and the other side is in contact with the heat sink.

[0011] In the aforementioned double-sided heat dissipation device, a semiconductor cooling chip is provided in the second region, and the cold side of the semiconductor cooling chip is attached to the aperture heat dissipation plate.

[0012] In the aforementioned double-sided heat dissipation device, the interior of the aperture heat dissipation plate is provided with a fluid channel for injecting a heat-conducting medium.

[0013] The aforementioned double-sided heat dissipation device, wherein the heat sink is a liquid-cooled heat sink with an internal liquid-cooling channel; the inlet and outlet of the fluid channel are both connected to the liquid-cooling channel through connecting pipes.

[0014] In the aforementioned double-sided heat dissipation device, a semiconductor cooler is provided on the side of the heat sink facing the aperture heat dissipation plate, the cold side of the semiconductor cooler is in contact with the multi-heat source lamp plate, and the hot side of the semiconductor cooler is in contact with the heat sink.

[0015] In the aforementioned double-sided heat dissipation device, the aperture heat dissipation plate is an aluminum alloy heat dissipation plate, a copper alloy heat dissipation plate, or a ceramic heat dissipation plate; and / or, the light-emitting unit is a light-emitting diode lamp bead, an OLED lamp bead, a Mini LED lamp bead, or a MicroLED lamp bead.

[0016] This application also discloses a light-emitting device, which includes a housing, a conical rod structure, a multi-heat source lamp plate, and a double-sided heat dissipation device as described above.

[0017] Compared with the prior art, the present invention has the following beneficial effects: This utility model discloses a double-sided heat dissipation device for multi-heat source lamp panels. By attaching the heat sink and the aperture heat dissipation plate to both sides of the multi-heat source lamp panel, it can simultaneously perform heat conduction, rapidly dissipating heat from the multi-heat source lamp panel, improving the heat dissipation rate, and reducing the possibility of expansion and arching of the multi-heat source lamp panel due to temperature rise. In addition, the heat sink and the aperture heat dissipation plate limit the deformation of the multi-heat source lamp panel from both sides. In summary, the double-sided heat dissipation device disclosed in this utility model combines heat dissipation efficiency and limiting function, which helps to reduce the deformation problem of multi-heat source lamp panels and the overheating problem of lamp beads, and maintains the uniformity of light output of the multi-heat source lamp panel during long-term operation. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the light-emitting device in this utility model; Figure 2 This is a schematic diagram of the structure of the aperture heat sink in this utility model; Figure 3 This is a schematic diagram of the aperture heat sink from another angle in this utility model; Figure 4 This is a simplified structural diagram of the double-sided heat dissipation device and the multi-heat source lamp board in the assembled state in one embodiment of the present invention; Figure 5 This is a simplified structural diagram of the double-sided heat dissipation device and the multi-heat source lamp board in the assembled state in another embodiment of the present invention; Figure 6 This is a simplified structural diagram of the double-sided heat dissipation device and the multi-heat source lamp board in the assembled state in another embodiment of the present invention; Figure 7 This is a simplified structural diagram of the double-sided heat dissipation device and the multi-heat source lamp board in the assembled state in another embodiment of the present invention; Figure 8 This is a simplified structural diagram of the double-sided heat dissipation device and the multi-heat source lamp board in the assembled state in another embodiment of the present invention; Figure 9 This is a simplified structural diagram of the double-sided heat dissipation device and the multi-heat source lamp board in the assembled state in another embodiment of the present invention.

[0020] Among them, 10, double-sided heat dissipation device; 11, heat sink; 111, liquid cooling channel; 112, semiconductor cooler; 12, light aperture heat dissipation plate; 121, heat dissipation grille; 122, grid; 123, light outlet hole; 124, heat dissipation fins; 125, first zone; 126, second zone; 127, fluid channel; 13, first heat conduction component; 14, second heat conduction component; 15, semiconductor cooler chip; 16, connecting pipe; 20, multi-heat source lamp board; 21, light-emitting unit; 30, shell; 40, conical rod structure component. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0023] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0024] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0025] For ease of description, spatial relational terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relational terms are intended to encompass not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways, and the spatial relational terms used herein will be interpreted accordingly.

[0026] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0027] See Figure 1 and Figure 4 In one embodiment of this utility model application, a double-sided heat dissipation device 10 is disclosed for use on a multi-heat source lamp board 20, wherein a plurality of light-emitting units 21 are arrayed on the multi-heat source lamp board 20. The light-emitting units 21 disclosed in this embodiment are light-emitting diode (LED) beads, OLED beads, Mini LED beads, or Micro LED beads. It is understood that the multi-heat source lamp board 20 disclosed in this embodiment can be equipped with one type of LED bead, or multiple types of LED beads can be arranged according to the light emission requirements.

[0028] On the multi-heat source lamp panel 20 disclosed in this embodiment, several light-emitting units 21 are arranged in an array. Therefore, there are several heat sources on the entire multi-heat source lamp panel 20. The traditional heat dissipation method is to set a heat sink 11 on the backlight surface and lock the multi-heat source lamp panel 20 on the heat sink 11 by screws on the edge. This method cannot guarantee the fit between the multi-heat source lamp panel 20 and the heat sink 11 and is prone to warping.

[0029] like Figure 1 , Figure 2 and Figure 4As shown, the double-sided heat dissipation device 10 disclosed in this embodiment includes a heat sink 11 and an aperture heat sink 12. The aperture heat sink 12 and the heat sink 11 are respectively disposed on both sides of the multi-heat source lamp plate 20. A heat dissipation grille 121 is provided on the side of the aperture heat sink 12 facing the multi-heat source lamp plate 20. The heat dissipation grille 121 is used to abut against the multi-heat source lamp plate 20.

[0030] In this embodiment, by attaching the heat sink 11 and the aperture heat sink 12 to both sides of the multi-heat source lamp plate 20, the heat conduction function can be performed simultaneously, and the heat on the multi-heat source lamp plate 20 can be quickly dissipated, thereby improving the heat dissipation rate and reducing the situation where the multi-heat source lamp plate 20 expands and bulges due to temperature rise.

[0031] In addition, mounting through holes can be provided on the aperture heat sink 12, and the aperture heat sink 12, the multi-heat source lamp plate 20 and the heat sink 11 can be connected in sequence by bolts or screws to achieve fixation. The heat sink 11 and the aperture heat sink 12 limit the multi-heat source lamp plate 20 from both sides, and restrict the deformation of the multi-heat source lamp plate 20 from a physical level.

[0032] Overall, the double-sided heat dissipation device 10 disclosed in this embodiment takes into account both heat dissipation efficiency and limiting function, which helps to reduce the deformation problem of the multi-heat source lamp board 20 and the overheating problem of the lamp beads, and enables the multi-heat source lamp board 20 to maintain the uniformity of light output during long-term operation.

[0033] Specifically, in this embodiment, the heat dissipation grille 121 increases the strength of the aperture heat dissipation plate 12, giving it bending resistance. When in contact with the multi-heat source lamp plate 20, the aperture heat dissipation plate 12 can withstand the thrust generated by the expansion of the multi-heat source lamp plate 20 and generate a reaction force on it, reducing the deformation of the multi-heat source lamp plate 20. Furthermore, the back of the multi-heat source lamp plate 20 fits tightly against the heat sink 11, and the thermal paste filling between the heat sink 11 and the multi-heat source lamp plate 20 achieves uniform heat transfer. Overall, both sides of the multi-heat source lamp plate 20 can maintain efficient heat transfer, which helps to improve the overall heat transfer efficiency.

[0034] like Figure 2 As shown in the figure, the heat dissipation grille 121 disclosed in this embodiment divides the surface of the aperture heat dissipation plate 12 into several squares 122, and each of the several squares 122 corresponds to one of the several light-emitting units 21. The heat dissipation grille 121 is arranged between adjacent light-emitting units 21, which can quickly conduct heat from the multi-heat source lamp plate 20 and also separate adjacent light-emitting units 21 to avoid heat interference between adjacent light-emitting units 21. At the same time, the heat dissipation grille 121 also serves to block light and prevent light interference between adjacent light-emitting units 21.

[0035] Based on this, such as Figure 2 and Figure 3 As shown, each of the squares 122 disclosed in this embodiment is provided with a light-emitting hole 123, which is located in the light-emitting optical path of the light-emitting unit 21. The light-emitting hole 123 disclosed in this embodiment can also be used to filter stray light, so as to perform the function of limiting the light beam and prevent stray light from hitting the corners of optical elements in the subsequent optical path, such as the corners of the conical rod structure.

[0036] Specifically, as another embodiment of this application, the aperture heat sink 12 is disclosed as an aluminum alloy heat sink, a copper alloy heat sink, or a ceramic heat sink. In this embodiment, the aperture heat sink 12 is manufactured using a material with high thermal conductivity, such as 6063 aluminum alloy, copper alloy, or ceramic plate. This is beneficial for improving temperature uniformity, reducing localized high temperatures, ensuring a balanced heat dissipation rate across the entire multi-heat source lamp panel 20, and minimizing temperature differences among the various light-emitting units 21, thereby improving the optical performance of the product.

[0037] like Figure 3 As shown, in another embodiment of this application, a plurality of heat dissipation fins 124 are provided on the side of the aperture heat dissipation plate 12 opposite to the multi-heat source lamp plate 20. The projection of the heat dissipation fins 124 on the aperture heat dissipation plate 12 at least partially overlaps with the projection of the heat dissipation grille 121 on the aperture heat dissipation plate 12.

[0038] In this embodiment, the heat dissipation fins 124 are provided to increase the surface area of ​​the aperture heat sink 12, thereby increasing the heat dissipation area and further improving the heat dissipation efficiency of the aperture heat sink 12. On the side of the aperture heat sink 12 that contacts the multi-heat source lamp plate 20, the heat dissipation grille 121 directly contacts the multi-heat source lamp plate 20.

[0039] Preferably, in this embodiment, the aperture heat sink 12 can dissipate heat naturally, or fan blades can be provided on the side away from the multi-heat source lamp panel 20 to accelerate airflow through air cooling and improve the heat dissipation speed of the aperture heat sink 12 through forced convection. It should be noted that this embodiment is only an example of the aperture heat sink 12 being cooled by air cooling, but the protection scope of this utility model is not limited to this. Other types of cooling methods, as long as they can achieve the technical effects disclosed in this application, can be considered as equivalent replacements for the concept of this utility model and should also be within the protection scope of this application.

[0040] Specifically, as another embodiment of this application, the aperture heat sink 12, the heat dissipation grille 121, and the heat dissipation fins 124 are disclosed as integrally formed. Integral forming simplifies the manufacturing process, increases structural stability, reduces production costs, and improves the speed of heat conduction.

[0041] Specifically, as another embodiment of this application, the heat sink 11 is disclosed as either an air-cooled heat sink 11 or a semiconductor heat sink 11. In this embodiment, the heat sink 11 is disposed on the back side of the multi-heat source lamp panel 20, and multiple fins can be arranged on the side of the heat sink 11 facing away from the multi-heat source lamp panel 20 to accelerate heat dissipation through air cooling. Alternatively, the heat sink 11 disclosed in this embodiment can also be configured as a semiconductor heat sink 11, with the cold side facing the multi-heat source lamp panel 20 and the hot side cooled by air cooling. In summary, the heat sink 11 disclosed in this embodiment has high heat dissipation efficiency, which is beneficial for rapid cooling and reduces the risk of the multi-heat source lamp panel 20 expanding and arching.

[0042] like Figure 5 As shown, in another embodiment of this application, the aperture heat sink 12 includes a first region 125 and a second region 126 disposed around the first region 125. The first region 125 is used to house the multi-heat source lamp panel 20. By setting the area of ​​the aperture heat sink 12 to be larger than that of the multi-heat source lamp panel 20, and forming the second region 126 at the edge of the first region 125, the heat dissipation area is increased, which is beneficial to further improve the heat dissipation efficiency.

[0043] Specifically, the double-sided heat dissipation device 10 further includes a first heat-conducting element 13, which is disposed between the aperture heat dissipation plate 12 and the heat sink 11, and located on the side of the multi-heat source lamp plate 20; one side of the first heat-conducting element 13 contacts the second area 126, and the other side contacts the heat sink 11.

[0044] In this embodiment, the aperture heat sink 12 and the radiator 11 are integrated by the first heat-conducting component 13, enabling heat conduction between the aperture heat sink 12 and the radiator 11. Therefore, more heat dissipation solutions can be developed based on production costs, production conditions, etc. For example, a fan can be used to cool the radiator 11, and the aperture heat sink 12 will cool down synchronously with the radiator 11, eliminating the need for a separate fan for the aperture heat sink 12; conversely, only the aperture heat sink 12 can be cooled; of course, when a higher cooling rate is required, both the aperture heat sink 12 and the radiator 11 can be cooled by air cooling simultaneously.

[0045] In addition, in this embodiment, the aperture heat sink 12 and the heat sink 11 are integrated, which is also conducive to balancing the temperature of the two, making the heat dissipation speed on both sides of the multi-heat source lamp board 20 more consistent, and improving the temperature uniformity on the multi-heat source lamp board 20.

[0046] Specifically, as another embodiment of this application, the first heat-conducting element 13 is disclosed, including but not limited to heat-conducting materials such as aluminum alloy, copper alloy, and ceramic plate.

[0047] like Figure 6As shown in another embodiment of this application, a second heat-conducting element 14 is provided on the side of the heat sink 11 facing the multi-heat source lamp plate 20. One side of the second heat-conducting element 14 contacts the multi-heat source lamp plate 20, and the other side contacts the heat sink 11, thus playing a heat transfer role. Furthermore, the size of the second heat-conducting element 14 can be the same as the size of the multi-heat source lamp plate 20 to cover the entire surface of the multi-heat source lamp plate 20 and maximize the contact area. The size of the second heat-conducting element 14 can also be different from the size of the multi-heat source lamp plate 20, depending on the needs. Preferably, the second heat-conducting element 14 can be a semiconductor cooling chip, with the cold side of the second heat-conducting element 14 attached to the multi-heat source lamp plate 20 and the hot side attached to the heat sink 11, to further improve the heat dissipation speed of the multi-heat source lamp plate 20.

[0048] like Figure 7 As shown, in another embodiment of this application, a thermoelectric cooler 15 is provided in the second region 126, with the cold side of the thermoelectric cooler 15 attached to the aperture heat sink 12. In this embodiment, the heat dissipation speed of the aperture heat sink 12 is further improved by providing the thermoelectric cooler 15. The thermoelectric cooler 15 can be provided alone in the second region 126, or the thermoelectric cooler 15 and the first heat-conducting element 13 can be provided simultaneously.

[0049] Specifically, the semiconductor cooling chip 15 is disposed in the second region 126, which can both avoid the multi-heat source lamp board 20 and improve the heat dissipation speed of the second region 126. During the heat dissipation process, the temperature of the second region 126 is lower than that of the first region 125, and the temperature of the first region 125 will be accelerated to be conducted to the second region 126, reducing the accumulation near the multi-heat source lamp board 20, further improving the heat dissipation efficiency and reducing the probability of deformation of the multi-heat source lamp board 20.

[0050] like Figure 8 As shown in another embodiment of this application, the aperture heat sink 12 is provided with a fluid channel 127 inside, which is used to inject a heat-conducting medium. The fluid channel 127 disclosed in this embodiment can be manufactured using microfluidic technology. A gaseous medium or a liquid medium can be injected into the fluid channel 127. Through an external circulation pipeline, the gaseous medium or liquid medium can quickly remove the heat from the aperture heat sink 12, accelerating the cooling process.

[0051] like Figure 9As shown, in another embodiment of this application, the radiator 11 is disclosed as a liquid-cooled radiator 11 with an internal liquid-cooling channel 111; the inlet and outlet of the fluid channel 127 are both connected to the liquid-cooling channel 111 via connecting pipes 16. The radiator 11 disclosed in this embodiment can also be configured as a liquid-cooled radiator 11, that is, cooling is achieved by removing heat through the liquid-cooling channel 111. Connecting the liquid-cooling channel 111 to the fluid channel 127 via connecting pipes 16 reduces the number of inlets and outlets of the channel, achieving synchronous cooling of the aperture heat sink 12 and the radiator 11 through only one inlet and one outlet, further simplifying the double-sided heat dissipation device 10, reducing production and processing costs, and facilitating operation.

[0052] Specifically, the connecting pipe 16 disclosed in this embodiment can be an internal cavity formed within the first heat-conducting element 13. That is, the first heat-conducting element 13 connects the aperture heat sink 12 and the heat sink 11, and itself plays the role of conducting heat. At the same time, a cavity is opened inside the first heat-conducting element 13 to connect the liquid cooling channel 111 and the fluid channel 127 to realize the transmission of liquid medium.

[0053] For example Figure 9 As shown, in another embodiment of this application, a semiconductor cooler 112 is provided on the side of the heat sink 11 facing the aperture heat sink 12. The cold side of the semiconductor cooler 112 is in contact with the multi-heat source lamp plate 20, and the hot side of the semiconductor cooler 112 is in contact with the heat sink 11. In this embodiment, the semiconductor cooler 112 is provided to further improve the heat conduction speed, so that the heat on the multi-heat source lamp plate 20 can be conducted to the heat sink 11 more quickly.

[0054] like Figure 1 As shown, another embodiment of this application discloses a light-emitting device, which includes a housing 30, a conical rod structure 40, a multi-heat source lamp plate 20, and a double-sided heat dissipation device 10 as described above. In this embodiment, the double-sided heat dissipation device 10 is integrated with the overall structure, and heat dissipation solutions such as air cooling, liquid cooling, and semiconductor cooling can be adopted. It has scalability and can be adapted to the production requirements of the product, with broad application prospects.

[0055] In summary, this application discloses a double-sided heat dissipation device 10 for a multi-heat source lamp panel 20, on which a plurality of light-emitting units 21 are arrayed. The double-sided heat dissipation device 10 includes a heat sink 11 and an aperture heat sink 12, with the aperture heat sink 12 and the heat sink 11 respectively disposed on opposite sides of the multi-heat source lamp panel 20. A heat dissipation grille 121 protrudes from the side of the aperture heat sink 12 facing the multi-heat source lamp panel 20, and the heat dissipation grille 121 abuts against the multi-heat source lamp panel 20. Furthermore, the heat dissipation grille 121 divides the surface of the aperture heat sink 12 into a plurality of squares 122, with each square 122 corresponding to one of the light-emitting units 21. Each square 122 contains a light-emitting hole 123, which is located in the light-emitting path of the light-emitting unit 21.

[0056] The double-sided heat dissipation device 10 disclosed in this embodiment is used for a multi-heat source lamp panel 20. By attaching the heat sink 11 and the aperture heat sink 12 to both sides of the multi-heat source lamp panel 20, it can simultaneously perform heat conduction, quickly dissipating heat from the multi-heat source lamp panel 20, improving the heat dissipation rate, and reducing the possibility of expansion and arching of the multi-heat source lamp panel 20 due to temperature rise. In addition, the heat sink 11 and the aperture heat sink 12 limit the multi-heat source lamp panel 20 from both sides, which can also limit the deformation of the multi-heat source lamp panel 20. In summary, the double-sided heat dissipation device 10 disclosed in this embodiment takes into account both heat dissipation efficiency and limiting function, which helps to reduce the deformation problem of the multi-heat source lamp panel 20 and the overheating problem of the lamp beads, and keeps the light emission uniformity of the multi-heat source lamp panel 20 during long-term operation.

[0057] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0058] It should be noted that this utility model uses a double-sided heat dissipation device and a light-emitting device as examples to introduce the specific structure and working principle of this utility model. However, the application of this utility model is not limited to double-sided heat dissipation devices and light-emitting devices, and can also be applied to the production and use of other similar workpieces.

[0059] It should be understood that this invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this invention is limited only by the appended claims.

[0060] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A double-sided heat dissipation device for a multi-heat source lamp panel, wherein a plurality of light-emitting units are arrayed on the multi-heat source lamp panel; characterized in that, The double-sided heat dissipation device includes: heat sink; A light-blocking heat sink, wherein the light-blocking heat sink and the heat sink are respectively disposed on both sides of the multi-heat source lamp plate; The aperture heat dissipation plate has a heat dissipation grille protruding from one side facing the multi-heat source lamp plate, and the heat dissipation grille is used to abut against the multi-heat source lamp plate; and the heat dissipation grille divides the surface of the aperture heat dissipation plate into several squares, and each of the squares corresponds to a number of light-emitting units; each square is provided with a light-emitting hole, and the light-emitting hole is located in the light-emitting path of the light-emitting unit.

2. The double-sided heat dissipation device according to claim 1, characterized in that, The aperture heat dissipation plate has several heat dissipation fins protruding from the side opposite to the multi-heat source lamp plate. The projection of the heat dissipation fins on the aperture heat dissipation plate at least partially overlaps with the projection of the heat dissipation grille on the aperture heat dissipation plate.

3. The double-sided heat dissipation device according to claim 1, characterized in that, The heat sink is either an air-cooled heat sink or a semiconductor heat sink.

4. The double-sided heat dissipation device according to claim 1, characterized in that, The aperture heat dissipation plate includes a first area and a second area arranged around the first area, wherein the first area is used to arrange the multi-heat source lamp plate.

5. The double-sided heat dissipation device according to claim 4, characterized in that, The double-sided heat dissipation device further includes a first heat-conducting component, which is disposed between the aperture heat dissipation plate and the heat sink, located on the side of the multi-heat source lamp plate; one side of the first heat-conducting component is in contact with the second area, and the other side is in contact with the heat sink.

6. The double-sided heat dissipation device according to claim 4, characterized in that, The second region is provided with a semiconductor cooling chip, and the cold side of the semiconductor cooling chip is attached to the aperture heat sink.

7. The double-sided heat dissipation device according to claim 1, characterized in that, The aperture heat sink has a fluid channel inside, which is used to inject a heat-conducting medium.

8. The double-sided heat dissipation device according to claim 7, characterized in that, The radiator is a liquid-cooled radiator with an internal liquid-cooling channel; the inlet and outlet of the fluid channel are both connected to the liquid-cooling channel through connecting pipes.

9. The double-sided heat dissipation device according to claim 8, characterized in that, A semiconductor cooler is provided on the side of the heat sink facing the aperture heat sink plate. The cold side of the semiconductor cooler is in contact with the multi-heat source lamp plate, and the hot side of the semiconductor cooler is in contact with the heat sink.

10. The double-sided heat dissipation device according to claim 1, characterized in that, The aperture heat sink is an aluminum alloy heat sink, a copper alloy heat sink, or a ceramic heat sink; and / or, the light-emitting unit is a light-emitting diode (LED) bead, an OLED bead, a Mini LED bead, or a Micro LED bead.

11. A light-emitting device, characterized in that, It includes a housing, a conical rod structure, a multi-heat source lamp plate, and a double-sided heat dissipation device as described in any one of claims 1 to 10.

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