An imaging system having a heat dissipation assembly

Abstract

The application relates to the technical field of light source heat dissipation, and particularly discloses an imaging system with a heat dissipation assembly, which comprises a device main body, a light source assembly and a heat dissipation assembly. The heat dissipation assembly comprises a radiator, a cooling box, a circulating pump and a heat dissipation flow channel plate. The circulating pump is arranged on a damping pad on the device main body. The cooling box is provided with a liquid outlet and a liquid inlet. The radiator is arranged in the cooling box and is used for dissipating heat for the circulating cooling medium in the cooling box. The light source assembly is arranged on the device main body. The heat dissipation flow channel plate abuts against the light source assembly, and the heat dissipation flow channel plate is provided with a liquid inlet and a liquid outlet which are in communication with each other. The liquid outlet is connected with the liquid inlet end of the circulating pump through a pipeline. The liquid outlet end of the circulating pump is connected with the liquid inlet through a pipeline. The liquid outlet is connected with the liquid inlet through a pipeline. In the scheme, the circulating pump can drive the circulating cooling medium in the cooling box to circulate and flow, so that the light source assembly is rapidly cooled through the circulating cooling medium, and a continuous and stable heat dissipation effect is achieved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for light sources, and more particularly to an imaging system with heat dissipation components. Background Technology

[0002] In laboratory and testing equipment, in certain scenarios, the light source used for imaging needs to emit high-power light in a short period of time, causing rapid heat accumulation. For example, when observing the structure of droplets, cells, or microorganisms flowing at high speed within the channels of a microfluidic chip, more than 1,000 cells flow through the channels per second. For each object being observed, the time it takes to pass through the objective lens is less than 1 / 1000 of a second. At this time, it is necessary to identify the observed object through gate exposure and high-brightness and high-power light sources in an extremely short time, resulting in rapid heat accumulation in the light source. Under long-term testing, the accumulated heat can cause problems such as passive disconnection of the light source current (e.g., reaching 80°C), circuit softening, and short circuits.

[0003] To dissipate heat from the light source, existing methods generally involve air convection and increasing the heat dissipation area. The former uses forced convection mechanisms such as fans, while the latter increases the heat dissipation area by installing fins on the light source. However, in the aforementioned scenarios, biological tests typically require one hour or more of continuous operation, meaning the light source needs to operate continuously for an extended period. Existing heat dissipation methods can only slow down the rate of heat accumulation in the light source; in prolonged operating scenarios, the risk of overheating still exists. Utility Model Content

[0004] In view of this, the purpose of this application is to provide an imaging system with a heat dissipation component to solve the problem of poor heat dissipation effect of existing light source heat dissipation methods in long-term, high-power operation scenarios.

[0005] To achieve the above technical objectives, this application provides an imaging system with a heat dissipation component, comprising: a device body, a light source component, and a heat dissipation component;

[0006] The heat dissipation components include: a radiator, a cooling tank, a circulating pump, and a heat dissipation channel plate;

[0007] The circulating pump is mounted on a shock-absorbing pad on the main body of the device.

[0008] The cooling tank is equipped with a liquid outlet and a liquid inlet;

[0009] The radiator is installed in the cooling box and is used to dissipate heat for the circulating cooling medium in the cooling box.

[0010] The light source assembly is disposed on the main body of the device;

[0011] The heat dissipation channel plate abuts against the light source assembly, and the heat dissipation channel plate is provided with a liquid inlet and a liquid outlet that are interconnected.

[0012] The outlet is connected to the inlet of the circulation pump via a pipe;

[0013] The outlet of the circulating pump is connected to the liquid inlet via a pipeline;

[0014] The liquid outlet is connected to the liquid inlet via a pipe.

[0015] Furthermore, the heat sink includes: a TEC module and fins;

[0016] The cooling box is equipped with a flow channel plate;

[0017] The flow channel plate is provided with a flow channel for the circulation cooling medium to flow.

[0018] The cold end of the TEC module is connected to the flow channel plate;

[0019] The fins are connected to the hot end of the TEC module.

[0020] Furthermore, the radiator also includes a convection fan;

[0021] The convection fan is located in the cooling box and faces the fins.

[0022] Furthermore, the cooling box is mounted on a second shock-absorbing pad on the main body of the device.

[0023] Furthermore, the flow channel plate is a metal plate.

[0024] Furthermore, the flow channel plate is disposed on one side of the cooling box;

[0025] A heat insulation plate is provided on the other side of the cooling box.

[0026] Furthermore, the main body of the device includes an upper region and a lower region;

[0027] The light source assembly is disposed in the upper region;

[0028] The heat dissipation component is located in the lower layer area.

[0029] Furthermore, the main body of the device is provided with a wire guide tube and a support plate in the upper region;

[0030] The support plate is disposed on the wire guide spool;

[0031] The light source assembly is disposed on the support plate.

[0032] Furthermore, the outside of the pipe is covered with insulating cotton.

[0033] Furthermore, the pipe is a PVC pipe, a PU pipe, or a PTFE pipe.

[0034] As can be seen from the above technical solutions, this application provides an imaging system with a heat dissipation component, including: a device body, a light source component, and a heat dissipation component; the heat dissipation component includes: a radiator, a cooling tank, a circulating pump, and a heat dissipation channel plate; the circulating pump is disposed on a shock-absorbing pad on the device body; the cooling tank is provided with an outlet and an inlet; the radiator is disposed on the cooling tank for dissipating heat from the circulating cooling medium inside the cooling tank; the light source component is disposed on the device body; the heat dissipation channel plate abuts against the light source component, and the heat dissipation channel plate is provided with a liquid inlet and a liquid outlet that are interconnected; the outlet is connected to the inlet of the circulating pump through a pipe; the outlet of the circulating pump is connected to the liquid inlet through a pipe; the liquid outlet is connected to the inlet through a pipe.

[0035] In this solution, the circulating pump drives the circulating cooling medium in the cooling tank to circulate and quickly cool the light source components. At the same time, the heat sink can dissipate the heat of the circulating cooling medium, achieving a continuous and stable heat dissipation effect. This allows the light source components to maintain a stable temperature during high-power, long-term operation, effectively solving the problem of poor heat dissipation effect of existing light source heat dissipation methods in long-term, high-power operation scenarios. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A schematic diagram of an imaging system with a heat dissipation component provided in an embodiment of this application;

[0038] Figure 2 A schematic diagram illustrating the heat dissipation principle of an imaging system with a heat dissipation component, provided for an embodiment of this application;

[0039] In the picture:

[0040] 100. Main body of the device; 101. Upper area; 102. Lower area; 110. Vibration damping pad; 120. Second vibration damping pad; 130. Cable guide spool; 140. Support plate;

[0041] 200. Light source assembly;

[0042] 300. Heat dissipation assembly; 310. Radiator; 311. TEC module; 312. Fins; 313. Convection fan; 320. Cooling tank; 321. Liquid outlet; 322. Liquid inlet; 323. Flow channel plate; 324. Heat insulation plate; 330. Circulation pump; 340. Heat dissipation flow channel plate; 341. Liquid outlet; 342. Liquid inlet. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0044] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0045] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0046] Please see Figure 1 and Figure 2 An imaging system with a heat dissipation component is provided in the embodiments of this application, characterized in that it includes: a device body 100, a light source component 200 and a heat dissipation component 300.

[0047] The heat dissipation assembly 300 includes a radiator 310, a cooling box 320, a circulating pump 330, and a heat dissipation channel plate 340. The circulating pump 330 is mounted on a shock-absorbing pad 110 on the main body 100 of the device. The circulating pump 330 can be a diaphragm pump or a peristaltic pump. The mounting of the circulating pump 330 on the shock-absorbing pad 110 prevents vibrations from being transmitted to the main body 100 of the device, ensuring stable operation of the light source assembly 200 during the startup of the circulating pump 330.

[0048] The cooling tank 320 is provided with an outlet 321 and an inlet 322; the radiator 310 is provided in the cooling tank 320 for dissipating heat from the circulating cooling medium inside the cooling tank 320; the light source assembly 200 is provided in the main body 100 of the device; the heat dissipation channel plate 340 abuts against the light source assembly 200, and the heat dissipation channel plate 340 is provided with a liquid inlet 342 and a liquid outlet 341 that are interconnected; the outlet 321 is connected to the inlet end of the circulating pump 330 through a pipe; the outlet end of the circulating pump 330 is connected to the liquid inlet 342 through a pipe; and the liquid outlet 341 is connected to the inlet 322 through a pipe.

[0049] In applications, the circulating cooling medium can be ultrapure water or refrigerant. In this embodiment, the circulating cooling medium is refrigerant. After the circulating pump 330 is started, the circulating cooling medium can circulate between the heat dissipation channel plate 340, the cooling tank 320, and the circulating pump 330. After absorbing the heat generated during the operation of the light source assembly 200, the circulating cooling medium flows into the cooling tank 320, and then the heat sink 310 conducts the heat out of the cooling tank 320, thereby achieving continuous cooling of the light source assembly 200 and ensuring the stability of the light source assembly under high power and experimental operation.

[0050] In this embodiment, the light source assembly 200 may include a bright-field component, which is composed of an LED chip, a substrate, a lens, and a sleeve to form a structure capable of parallel light focusing. The power of the LED chip can range from 0.5W to 100W. The substrate of the LED chip can be made of metal, such as aluminum alloy or copper alloy. The heat dissipation channel plate 340 abuts against the substrate of the LED chip.

[0051] The main body 100 of the device also includes an imaging component. The imaging component may include a camera, lens, dichroic mirror, objective lens, signal acquisition device (PD, PMT, MPPC), etc. The objective lens may be 4X to 50X, and the imaging magnification of the objective lens may be 30X-50X.

[0052] The heat dissipation channel plate 340 is provided with a channel for the circulation of cooling medium, with liquid inlet 342 and liquid outlet 341 at both ends. The inner diameter of the channel can be 0.5-4mm; the arrangement shape of the channel can be S-shaped.

[0053] In one implementation, the heat dissipation channel plate 340 can also be a component formed by bending a pipe, wherein the material of the pipe can be aluminum alloy, copper alloy, pure copper, etc.

[0054] A thermally conductive layer can be provided between the heat dissipation channel plate 340 and the substrate of the LED bead. The thickness of the thermally conductive layer varies from 0.1 to 2 mm. The thermally conductive layer can be a thermally conductive structure such as thermal grease.

[0055] In this design, the pipes can be PVC, PU, ​​or PTFE pipes. The pipes are externally covered with insulation material. This insulation helps retain the cooling capacity of the circulating cooling medium within the pipes.

[0056] In a more specific embodiment, the heat sink 310 includes: a TEC module 311 and fins 312; a flow channel plate 323 is provided inside the cooling box 320; the flow channel plate 323 is provided with a flow channel for circulating cooling medium; the cold end of the TEC module 311 is connected to the flow channel plate 323; and the fins 312 are connected to the hot end of the TEC module 311.

[0057] The TEC module 311 is a semiconductor cooling device that can conduct heat from the flow channel plate 323 to the fins 312, thereby achieving rapid heat dissipation from the flow channel plate 323. In this embodiment, the flow channel plate 323 is a metal plate, and its metal material can be aluminum alloy, copper alloy, etc.

[0058] In practical applications, the TEC module 311 and the flow channel plate 323 can be connected through a heat-conducting layer, and the TEC module 311 and the fins 312 can be connected through a heat-conducting layer.

[0059] Furthermore, the radiator 310 also includes a convection fan 313; the convection fan 313 is disposed in the cooling box 320 and faces the fins 312.

[0060] The heat dissipation rate of the fins 312 can be accelerated by the convection fan 313.

[0061] Optionally, the cooling box 320 is disposed on the second shock-absorbing pad 120 on the main body 100 of the device, so that the slight vibration generated by the cooling box 320 after the convection fan 313 is started can be absorbed by the second shock-absorbing pad 120 and not transmitted to the main body 100 of the device.

[0062] In one embodiment, a flow channel plate 323 is disposed on one side of the cooling box 320; a heat insulation plate 324 is disposed on the other side of the cooling box 320.

[0063] The heat insulation plate 324 can provide heat insulation for the heat dissipation and cooling medium flowing inside the cooling box 320, reducing the impact of the heat generated by the fins 312 and the ambient temperature on the heat dissipation and cooling medium.

[0064] In one embodiment, the device body 100 includes an upper region 101 and a lower region 102; a light source assembly 200 is disposed in the upper region 101; and a heat dissipation assembly 300 is disposed in the lower region 102.

[0065] By arranging the light source assembly 200 and the heat dissipation assembly 300 in layers, it is easy to classify different components, thereby facilitating maintenance by staff.

[0066] In one embodiment, the main body 100 of the device is provided with a wire guide 130 and a support plate 140 in the upper region 101; the support plate 140 is disposed on the wire guide 130; and the light source assembly 200 is disposed on the support plate 140.

[0067] In this embodiment, the aforementioned pipe can be installed inside the conduit 130.

[0068] In practical applications, a temperature sensor can be installed on the light source component 200. The temperature sensor can be an NTC probe, a PT1000 probe, etc., to monitor the temperature of the light source component 200 in real time.

[0069] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An imaging system with a heat dissipation component, characterized in that, include: The device consists of a main body (100), a light source assembly (200), and a heat dissipation assembly (300). The heat dissipation assembly (300) includes: a radiator (310), a cooling box (320), a circulation pump (330), and a heat dissipation flow channel plate (340). The circulating pump (330) is mounted on a shock-absorbing pad (110) on the main body (100) of the device; The cooling tank (320) is provided with a liquid outlet (321) and a liquid inlet (322). The radiator (310) is disposed in the cooling box (320) and is used to dissipate heat for the circulating cooling medium in the cooling box (320); The light source assembly (200) is disposed on the main body of the device (100). The heat dissipation channel plate (340) abuts against the light source assembly (200), and the heat dissipation channel plate (340) is provided with a liquid inlet (342) and a liquid outlet (341) that are interconnected. The outlet (321) is connected to the inlet of the circulating pump (330) via a pipe; The outlet of the circulating pump (330) is connected to the liquid inlet (342) through a pipeline. The liquid outlet (341) is connected to the liquid inlet (322) via a pipe.

2. The imaging system with a heat dissipation component according to claim 1, characterized in that, The radiator (310) includes: a TEC module (311) and fins (312). The cooling box (320) is provided with a flow channel plate (323); The flow channel plate (323) is provided with a flow channel for the circulation cooling medium to flow; The cold end of the TEC module (311) is connected to the flow channel plate (323). The fin (312) is connected to the hot end of the TEC module (311).

3. The imaging system with a heat dissipation component according to claim 2, characterized in that, The radiator (310) also includes: a convection fan (313); The convection fan (313) is disposed in the cooling box (320) and faces the fins (312).

4. The imaging system with a heat dissipation component according to claim 3, characterized in that, The cooling box (320) is mounted on the second shock-absorbing pad (120) on the main body (100) of the device.

5. The imaging system with a heat dissipation component according to claim 2, characterized in that, The flow channel plate (323) is a metal plate.

6. The imaging system with a heat dissipation component according to any one of claims 2 to 5, characterized in that, The flow channel plate (323) is disposed on one side of the cooling box (320); A heat insulation plate (324) is provided on the other side of the cooling box (320).

7. The imaging system with a heat dissipation component according to claim 1, characterized in that, The main body of the device (100) includes an upper region (101) and a lower region (102). The light source assembly (200) is disposed in the upper region (101); The heat dissipation component (300) is disposed in the lower region (102).

8. The imaging system with a heat dissipation component according to claim 7, characterized in that, The main body of the device (100) is provided with a wire tube (130) and a support plate (140) in the upper region (101). The support plate (140) is disposed on the wire guide (130); The light source assembly (200) is disposed on the support plate (140).

9. The imaging system with a heat dissipation component according to claim 1, characterized in that, The pipe is covered with thermal insulation cotton.

10. The imaging system with a heat dissipation component according to claim 1, characterized in that, The pipe is a PVC pipe, a PU pipe, or a PTFE pipe.

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