A waterproof heat sink for stage lights

Abstract

The utility model relates to the technical field of stage lighting equipment discloses a waterproof radiator for stage lamp, including base, the top of base is glued with chip, the bottom of base is fixed with heat conduction base, the surface of heat conduction base is equipped with heat conduction component, heat conduction component includes a plurality of first heat pipe and second heat pipe, a plurality of first heat pipe equidistance fixed in the side of heat conduction base, a plurality of second heat pipe equidistance fixed in the bottom of heat conduction base, a plurality of first heat pipe and second heat pipe away from the one end fixed with taper tube of heat conduction base, the surface of heat conduction component is equipped with a plurality of radiating fins equidistance, the side of base is equipped with waterproof groove in four corners, and the inclination angle of waterproof groove is 30~45 DEG. This one is used for stage lamp's waterproof radiator, and through the material characteristics of base and heat conduction base, high heat fusion ratio contacts chip, and the heat energy of chip can be quickly transferred.

Description

Technical Field

[0001] This utility model relates to the technical field of stage lighting equipment, and in particular to a waterproof radiator for stage lights. Background Technology

[0002] As people pursue a higher quality of life, stage lighting functions are constantly increasing, and power consumption is rising significantly, placing higher demands on heat dissipation. To address this issue, manufacturers have adopted various advanced heat dissipation technologies, such as high-efficiency fans, thermally conductive materials, optimized heat sinks, and liquid cooling systems, to ensure the stability and safety of high-power lighting fixtures under prolonged high loads. Especially with the widespread application of LED lighting fixtures, heat dissipation technology has become particularly important while ensuring high efficiency and low energy consumption. In the future, stage lighting heat dissipation solutions will be more efficient and intelligent, supporting the lighting needs of various large-scale performances.

[0003] A search revealed an existing patent (publication number: CN206042635U) that discloses a chip heat sink with a reasonable structure. It conducts heat to the chip through a thermal pad, which facilitates assembly and layout. It can reduce the messy layout caused by traditional heat pipe heat dissipation, making the entire heat dissipation layout compact and reasonable, greatly improving space utilization, and has good heat dissipation performance and strong operability.

[0004] However, in the above solution, due to the excessive power demand, there is a risk of chip overload, which may lead to chip damage and thus seriously affect the stability and reliability of the system. When the power exceeds the chip's carrying capacity, it may not only cause the chip to overheat, but may even cause circuit failure or system collapse. Utility Model Content

[0005] In view of the overheating problem of the existing chips, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a waterproof heat sink for stage lights, which aims to achieve a high heat-to-melt ratio contact chip through the material characteristics of the base and the heat-conducting base, so that the heat energy of the chip can be transferred quickly.

[0007] To solve the above technical problems, this utility model provides the following technical solution: a waterproof heat sink for stage lights, including a base, the top of the base is bonded to a chip, the bottom of the base is fixed with a heat-conducting base, the surface of the heat-conducting base is provided with a heat-conducting component, and the surface of the heat-conducting component is provided with multiple heat dissipation fins at equal intervals. The base has waterproof grooves at the four corners of its side, and the inclination angle of the waterproof grooves is 30°~45°.

[0008] As a preferred embodiment of the waterproof radiator for stage lights described in this utility model, the base is shaped like a truncated cone, the area of ​​the top of the base is smaller than the area of ​​the bottom of the base, and the area of ​​the top of the heat-conducting base is the same as the area of ​​the top of the base.

[0009] In a preferred embodiment of the waterproof radiator for stage lights described in this utility model, the base is made of tungsten, and the heat-conducting base is made of copper.

[0010] As a preferred embodiment of the waterproof heat sink for stage lights described in this utility model, the heat-conducting component includes a plurality of first heat-conducting pipes and second heat-conducting pipes. The plurality of first heat-conducting pipes are fixed at equal intervals on the side of the heat-conducting base, and the plurality of second heat-conducting pipes are fixed at equal intervals on the bottom of the heat-conducting base. A tapered tube is fixed to one end of the plurality of first heat-conducting pipes and second heat-conducting pipes away from the heat-conducting base.

[0011] As a preferred embodiment of the waterproof heat sink for stage lights described in this utility model, the length of the first heat-conducting pipe is the same as the length of the second heat-conducting pipe, and the material of the first heat-conducting pipe and the second heat-conducting pipe is aluminum.

[0012] As a preferred embodiment of the waterproof heat sink for stage lights described in this utility model, the surface of the heat dissipation fins is provided with circular holes that are fixed to the surfaces of the first heat-conducting pipe and the second heat-conducting pipe, and the cross-sectional area of ​​the heat dissipation fins is one time the cross-sectional area of ​​the heat-conducting base.

[0013] Compared with the prior art, the present invention has at least the following beneficial effects: 1. This utility model, through the material characteristics of the base and the heat-conducting base, allows for high heat-to-melt ratio contact with the chip, enabling rapid heat transfer from the chip and preventing heat buildup, thus preventing chip burnout. It ensures that the chip operates within a safe temperature range, maintaining stable performance and preventing system failures or performance degradation due to overheating. It also prevents thermal degradation of the chip due to excessively high temperatures, extending the chip's lifespan and ensuring stable operation of stage lighting. Furthermore, it avoids safety hazards caused by overheating, especially in environments where stage lighting is frequently used, ensuring safety during stage performances.

[0014] 2. This utility model, through the combination of heat-conducting components and heat dissipation fins, can effectively absorb and dissipate the heat generated by the heat-conducting base. It can quickly absorb the heat transferred by the heat-conducting base, and the heat dissipation fins expand the heat dissipation surface area. The heat dissipation fins increase the contact area for air circulation, further accelerating the release of heat, thereby significantly improving the heat dissipation efficiency. It can effectively prevent the chips and other important electronic components of the stage lighting fixtures from being damaged due to overheating, ensuring the stable operation of the lighting fixtures for a long time. At the same time, it can not only reduce hardware damage caused by high temperature, but also reduce component aging caused by heat accumulation, thereby extending the service life of the stage lighting fixtures. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the waterproof radiator for stage lights according to this utility model; Figure 2 This is a schematic diagram of the base and heat-conducting base structure of the waterproof radiator for stage lights according to this utility model; Figure 3 This is a schematic diagram of the heat-conducting component structure of the waterproof radiator for stage lights according to this utility model; Figure 4 This is a schematic diagram of the heat dissipation fins (multiple) of the waterproof heat sink used in stage lights according to this utility model.

[0016] Explanation of reference numerals in the attached figures: 1. Base; 101. Waterproof groove; 2. Heat-conducting base; 3. Heat-conducting component; 301. First heat-conducting pipe; 302. Second heat-conducting pipe; 303. Tapered tube; 4. Heat dissipation fins; 401. Round hole. Detailed Implementation

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0018] Example 1 Reference Figures 1-2 This is the first embodiment of the present invention, which provides a waterproof heat sink for stage lights. The waterproof heat sink for stage lights includes a base 1, the top of the base 1 is bonded to a chip, and a heat-conducting base 2 is fixed to the bottom of the base 1 to increase the heat dissipation contact area and improve the heat conduction efficiency from the chip to the heat-conducting base. The conical structure facilitates gravity drainage, prevents liquid retention, and enhances waterproof performance. The surface of the heat-conducting base 2 is provided with a heat-conducting component 3, and the surface of the heat-conducting component 3 is provided with multiple heat dissipation fins 4 at equal intervals. Waterproof grooves 101 are provided at the four corners of the side of the base 1. The inclination angle of the waterproof grooves 101 is 30°~45°. The inclination angle optimizes the rapid flow of liquid and prevents water droplets from seeping into the internal circuit along the side of the base. Combined with the conical structure, a double waterproof barrier is formed to adapt to the high humidity environment of the stage lights.

[0019] The base 1 is shaped like a truncated cone. The area of ​​the top of the base 1 is smaller than the area of ​​the bottom of the base 1. The top area of ​​the heat-conducting base 2 is the same as the top area of ​​the base 1, which ensures the uniform transfer of heat from the base to the heat-conducting base and avoids local heat accumulation.

[0020] The base 1 is made of tungsten, and the heat-conducting base 2 is made of copper. Tungsten has a melting point of 3422°C, the highest among all metals, making it suitable for high-temperature environments. It can maintain good mechanical properties at extremely high temperatures and has strong resistance to chemicals such as acids and alkalis. Copper has good thermal conductivity and can withstand oxidation and humid environments, making it suitable for a variety of harsh conditions. It is also easy to process, weld and form, adapting to a variety of manufacturing needs.

[0021] Example 2 Reference Figures 1-4 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the heat-conducting component 3 includes a plurality of first heat-conducting pipes 301 and second heat-conducting pipes 302. The plurality of first heat-conducting pipes 301 are fixed at equal distances on the side of the heat-conducting base 2, and the plurality of second heat-conducting pipes 302 are fixed at equal distances on the bottom of the heat-conducting base 2. The three-dimensional heat dissipation path design expands the heat exchange area and improves the heat dissipation efficiency. The ends of the plurality of first heat-conducting pipes 301 and second heat-conducting pipes 302 away from the heat-conducting base 2 are fixed with tapered tubes 303 to guide heat to be concentrated and transferred to the far-end heat dissipation fins and avoid heat backflow.

[0022] The length of the first heat pipe 301 is the same as the length of the second heat pipe 302. The first heat pipe 301 and the second heat pipe 302 are made of aluminum. Aluminum is suitable for heat dissipation applications and maintains good performance in high-temperature environments. It is also easy to recycle, energy-saving, environmentally friendly, economical and practical.

[0023] The surface of the heat dissipation fin 4 is provided with a circular hole 401 that is fixed to the surface of the first heat pipe 301 and the second heat pipe 302. The cross-sectional area of ​​the heat dissipation fin 4 is twice the cross-sectional area of ​​the heat conduction base 2, which increases the contact area between the pipe and the fin, improves the heat conduction efficiency, expands the heat dissipation surface area, accelerates air convection heat dissipation, and matches the heat load of the heat conduction base.

[0024] The remaining structure is the same as that in Example 1.

[0025] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A waterproof radiator for stage lights, comprising a base (1), characterized in that: The top of the base (1) is bonded to the chip, and the bottom of the base (1) is fixed with a heat-conducting base (2). The surface of the heat-conducting base (2) is provided with a heat-conducting component (3), and the surface of the heat-conducting component (3) is provided with multiple heat dissipation fins (4) at equal intervals. Waterproof grooves (101) are provided at the four corners of the side of the base (1), and the inclination angle of the waterproof grooves (101) is 30°~45°.

2. The waterproof radiator for stage lights according to claim 1, characterized in that: The base (1) is shaped like a truncated cone. The area of ​​the top of the base (1) is smaller than the area of ​​the bottom of the base (1). The area of ​​the top of the heat-conducting base (2) is the same as the area of ​​the top of the base (1).

3. The waterproof radiator for stage lights according to claim 2, characterized in that: The base (1) is made of tungsten, and the heat-conducting base (2) is made of copper.

4. The waterproof radiator for stage lights according to claim 3, characterized in that: The heat-conducting component (3) includes a plurality of first heat-conducting pipes (301) and second heat-conducting pipes (302). The plurality of first heat-conducting pipes (301) are fixed at equal distances on the side of the heat-conducting base (2), and the plurality of second heat-conducting pipes (302) are fixed at equal distances at the bottom of the heat-conducting base (2). A tapered tube (303) is fixed at the end of the plurality of first heat-conducting pipes (301) and second heat-conducting pipes (302) away from the heat-conducting base (2).

5. The waterproof radiator for stage lights according to claim 4, characterized in that: The length of the first heat pipe (301) is the same as the length of the second heat pipe (302), and the first heat pipe (301) and the second heat pipe (302) are made of aluminum.

6. The waterproof radiator for stage lights according to claim 5, characterized in that: The surface of the heat dissipation fin (4) is provided with a circular hole (401) that is fixed to the surface of the first heat pipe (301) and the second heat pipe (302). The cross-sectional area of ​​the heat dissipation fin (4) is twice the cross-sectional area of ​​the heat-conducting base (2).

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